CN115135026A - LED circuit board lamp strip made of copper-aluminum composite material and manufacturing method - Google Patents

LED circuit board lamp strip made of copper-aluminum composite material and manufacturing method Download PDF

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Publication number
CN115135026A
CN115135026A CN202110369811.9A CN202110369811A CN115135026A CN 115135026 A CN115135026 A CN 115135026A CN 202110369811 A CN202110369811 A CN 202110369811A CN 115135026 A CN115135026 A CN 115135026A
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CN
China
Prior art keywords
copper
aluminum
layer
circuit board
led
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Pending
Application number
CN202110369811.9A
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Chinese (zh)
Inventor
王定锋
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Individual
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Individual
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Publication date
Application filed by Individual filed Critical Individual
Priority to CN202110369811.9A priority Critical patent/CN115135026A/en
Publication of CN115135026A publication Critical patent/CN115135026A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The invention relates to an LED circuit board lamp strip made of copper-aluminum composite material and a manufacturing method thereof, in particular to an LED circuit board lamp strip made of copper-aluminum composite material, which is manufactured by overlapping aluminum and copper, rolling and pressing the aluminum and the copper for multiple times through a rolling rod to form alloy fusion between copper and aluminum interfaces, combining a copper layer and an aluminum layer to form a copper-aluminum composite foil, gluing the aluminum surface, then adhering the copper layer on a resin film, removing unnecessary metal by an etching method or a die cutting method according to circuit design to form a circuit, manufacturing a solder mask layer by using cover film or printing ink to manufacture a circuit board, and welding an LED or an LED and a control element on the circuit board.

Description

LED circuit board lamp strip made of copper-aluminum composite material and manufacturing method
Technical Field
The invention relates to the field of LEDs, in particular to an LED circuit board lamp strip made of copper-aluminum composite materials and a manufacturing method thereof.
Background
In the LED circuit board lamp strip in the prior art, the circuit board is made of copper foil, the copper cost is high, the circuit is directly made of copper foil, the copper cost is high, the circuit board is directly made of aluminum, although the cost is low, the component welding is not firm due to poor aluminum soldering tin property, and the circuit board cannot be used all the time.
How to use low-cost aluminum for manufacturing the circuit of the circuit board and solve the problem of soldering tin?
The invention uses the following method to manufacture the LED circuit board lamp strip made of copper-aluminum composite material, solves the problems, overcomes the defects of the prior art, and comprises the following steps:
the method comprises the steps of overlapping aluminum and copper, rolling and pressing for multiple times through a rolling rod to form alloy fusion between the copper and aluminum interfaces, combining a copper layer and an aluminum layer together to form a copper-aluminum composite foil, gluing the aluminum surface, then adhering the aluminum surface on a resin film, removing unnecessary metal by an etching method or a die cutting method according to circuit design to form a circuit, manufacturing a solder resist layer by using a cover film or printing ink to manufacture a circuit board, welding an LED or an LED and a control element on the circuit board, and manufacturing the LED circuit board lamp strip made of the copper-aluminum composite material.
The problems that the cost of copper is too high, elements such as LEDs are welded on the copper, and pure aluminum is used as a circuit element and is not firmly welded on the aluminum are solved.
Disclosure of Invention
The invention relates to an LED circuit board lamp belt made of copper-aluminum composite material and a manufacturing method thereof, in particular to an LED circuit board lamp belt made of copper-aluminum composite material and manufactured by overlapping aluminum and copper, rolling and pressing for multiple times through a rolling rod to form alloy fusion between the copper and aluminum interfaces, combining a copper layer and an aluminum layer together to form a copper-aluminum composite foil, gluing the aluminum surface, then adhering the copper layer on a resin film, removing unnecessary metal by using an etching method or a die cutting method according to circuit design to form a circuit, manufacturing a solder mask layer by using cover film or ink to manufacture a circuit board, and welding an LED or an LED and a control element on the circuit board.
The invention provides a method for manufacturing an LED circuit board lamp strip made of copper-aluminum composite material, which comprises the following steps of overlapping aluminum and copper, rolling for multiple times through a rolling rod to form alloy fusion between the copper and aluminum interfaces, combining a copper layer and an aluminum layer to form a copper-aluminum composite foil, gluing the aluminum surface, adhering the copper-aluminum composite foil on a resin film, removing unnecessary metal by an etching method or a die cutting method according to circuit design to form a circuit, manufacturing a solder mask layer by using cover film or ink to manufacture a circuit board, and welding an LED or an LED and a control element on the circuit board to manufacture the LED circuit board lamp strip made of the copper-aluminum composite material.
The invention also provides an LED circuit board lamp strip made of the copper-aluminum composite material, which comprises the following components: a resin film layer; an adhesive layer; a copper aluminum composite foil circuit layer; a surface solder mask layer; LED or LED and control element; the copper-aluminum composite circuit is characterized in that the aluminum surface of the copper-aluminum composite circuit layer is combined with a resin film layer through an adhesive layer, all circuits of the copper-aluminum composite circuit layer are circuits formed by combining copper and aluminum, the upper layer and the lower layer of each circuit are copper layers, the other layer of each circuit is an aluminum layer, the thickness of each aluminum layer is larger than that of each copper layer, a surface solder resist layer covers the surfaces of the copper layers, pads on the surface of the circuit board are copper pads, the copper pad part or all the copper pad part is covered by tin, the surface solder resist layer is an ink solder resist layer or a cover film solder resist layer, and the LEDs or the LEDs and control elements are welded on the copper pads of the circuit board.
According to a preferred embodiment of the invention, the LED circuit board strip made of copper-aluminum composite material is characterized in that a hole is formed at a pad of the flexible circuit for use, and at the hole, a front surface welding point of the strip circuit board is communicated with a back surface conductor.
According to a preferred embodiment of the invention, the LED circuit board lamp strip made of the copper-aluminum composite material is characterized in that the thickness of copper is A, and A is more than or equal to 2um and less than or equal to 15 um.
According to a preferred embodiment of the invention, the LED circuit board lamp strip made of the copper-aluminum composite material is characterized in that the thickness of aluminum is B, and B is more than or equal to 10um and less than or equal to 400 um.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a partial schematic view of a whole roll of copper aluminum composite foil.
FIG. 2 is a partial schematic view of a whole-roll single-side copper-aluminum composite substrate with copper leaking from one side.
Fig. 3 is a schematic plan view of a circuit board semi-finished product with a circuit pattern.
Fig. 4 is a schematic plan view of the semi-finished circuit board with copper partially exposed in the front side insulating layer.
Fig. 5 is a schematic plan view of a connected circuit board with pre-breaking connection points.
Fig. 6 is a partial schematic cross-sectional view of a connected circuit board with pre-breaking connection points.
Fig. 7 is a schematic plan view of a connected circuit board with pre-breaking connection points.
Fig. 8 is a schematic plan view of a LED circuit board strip made of copper-aluminum composite material divided into individual strips along pre-broken connection points.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
Examples
1, preparation of copper-aluminum composite foil
The copper strip 1.1a and the aluminum strip 1.1B are overlapped together, and are rolled into a copper-aluminum composite foil by cold pressing for multiple times by a roller, wherein the thickness of copper of the composite foil is A, and the thickness of aluminum of the composite foil is B, and the whole roll of copper-aluminum composite foil (shown in figure 1) is manufactured.
2, substrate preparation
Coating 1.2 of the aluminum surface 1.1b of the copper-aluminum composite foil with glue by a coating machine, drying the solvent, and then adhering the solvent and the PET film 1.3 together to prepare the whole roll of single-sided copper-aluminum composite substrate with copper leaking on one side (shown in figure 2).
Description of the drawings: (PI film is also possible, but this example is described as PET film).
3, circuit fabrication
Firstly, the whole roll of single-sided copper-aluminum composite base material with copper leaking on one side is cut into single pieces, and then the unnecessary copper of the circuit is completely removed by using an etching process or a die cutting process, so as to manufacture a circuit board semi-finished product with a circuit pattern (shown in figure 3).
4, solder mask preparation
Applying an insulating layer 3.1 on the circuit board semi-finished product with the circuit pattern, manufacturing a screen printing screen, printing solder resist ink on the semi-finished product of the circuit board, or punching a PET film with glue and then attaching the PET film on the semi-finished product of the circuit board to manufacture the circuit board semi-finished product with the copper partially exposed in the insulating layer on the front surface (shown in figure 4).
5, OSP preparation
The semi-finished circuit board with partially exposed copper in the front insulating layer is coated with an oxidation preventing film 4.1 (shown in fig. 5) at the position where copper is exposed by the OSP.
6, forming
And cutting the circuit board with the anti-oxidation film into a connected circuit board with pre-cut connection points by using a cutting die (shown in figures 5 and 6).
7, sticking sheet
The tin paste is printed on the conjoined circuit board with the pre-breaking connecting point through the customized steel mesh, then the LED5.1 is pasted on the tin paste of the circuit board, the tin paste is melted by reflow soldering equipment and then the LED5.1 is welded on the circuit board, and after the test is lightened, the solder paste is divided into single strips along the pre-breaking connecting point to form the LED circuit board lamp strip made of the copper-aluminum composite material (shown in figures 7 and 8).
The invention is described in detail with reference to the accompanying drawings by using a specific embodiment of the copper-aluminum composite material LED circuit board strip and the manufacturing method thereof. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.

Claims (5)

1. A method for manufacturing LED circuit board lamp belt made of copper-aluminum composite material includes such steps as stacking aluminum and copper together, rolling for several times by rolling rod to fuse the interface between copper and aluminum, combining copper layer with aluminum layer to form copper-aluminum composite foil, coating adhesive on aluminum surface, adhering it to resin film, removing unnecessary metal by etching or die cutting to form circuit, making solder mask layer with cover film or ink, welding LED or LED and control element on circuit board, and making LED circuit board lamp belt made of copper-aluminum composite material.
2. The utility model provides a LED circuit board lamp area of making with copper aluminium combined material, includes:
a resin film layer;
an adhesive layer;
a copper aluminum composite foil circuit layer;
a surface solder mask layer;
LED or LED and control element;
the copper-aluminum composite circuit is characterized in that the aluminum surface of the copper-aluminum composite circuit layer is combined with a resin film layer through an adhesive layer, all circuits of the copper-aluminum composite circuit layer are circuits formed by combining copper and aluminum, the upper layer and the lower layer of each circuit are copper layers, the other layer is an aluminum layer, the thickness of the aluminum layer is larger than that of the copper layer, a surface solder mask layer covers the surface of the copper layer, pads on the surface of the circuit board are all copper pads, the part or all of a copper welding pad part is covered by tin, the surface solder mask layer is an ink solder mask layer or a cover film solder mask layer, and the LED or the LED and a control element are welded on the copper pads of the circuit board.
3. The LED circuit board strip made of copper-aluminum composite material according to claim 1 or 2, wherein holes are formed at the bonding pads of the flexible circuit for use, and at the holes, the front-side bonding pads of the strip circuit board are communicated with the back-side conductors.
4. The LED circuit board lamp strip made of copper-aluminum composite material according to claim 1 or 2, wherein the thickness of copper is A, 2um is more than or equal to A and less than or equal to 15 um.
5. The LED circuit board lamp strip made of copper-aluminum composite material according to claim 1 or 2, wherein the thickness of aluminum is B, and B is more than or equal to 10um and less than or equal to 400 um.
CN202110369811.9A 2021-03-29 2021-03-29 LED circuit board lamp strip made of copper-aluminum composite material and manufacturing method Pending CN115135026A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110369811.9A CN115135026A (en) 2021-03-29 2021-03-29 LED circuit board lamp strip made of copper-aluminum composite material and manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110369811.9A CN115135026A (en) 2021-03-29 2021-03-29 LED circuit board lamp strip made of copper-aluminum composite material and manufacturing method

Publications (1)

Publication Number Publication Date
CN115135026A true CN115135026A (en) 2022-09-30

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ID=83375680

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110369811.9A Pending CN115135026A (en) 2021-03-29 2021-03-29 LED circuit board lamp strip made of copper-aluminum composite material and manufacturing method

Country Status (1)

Country Link
CN (1) CN115135026A (en)

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Addressee: Wang Dingfeng

Document name: Review Business Special Letter