CN114823441A - Wafer anti-slipping protection device and method for transmission mechanism of probe testing machine - Google Patents
Wafer anti-slipping protection device and method for transmission mechanism of probe testing machine Download PDFInfo
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- CN114823441A CN114823441A CN202210739073.7A CN202210739073A CN114823441A CN 114823441 A CN114823441 A CN 114823441A CN 202210739073 A CN202210739073 A CN 202210739073A CN 114823441 A CN114823441 A CN 114823441A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
The invention relates to the technical field of semiconductor element detection equipment, in particular to a wafer anti-slip protection device of a transmission mechanism of a probe tester and a protection method thereof, which comprises a frame, wherein the frame comprises a top cover, two vertical plates and two side plates, the frame is also provided with a conveyor belt, a rotary driving motor, two rotary shafts and a plurality of carrying disks, the rotary shafts are driven by the rotary driving motor to drive the conveyor belt to move the carrying disks, the carrying disks are aligned with first transverse grooves on the vertical plates, a manipulator of the probe tester is inserted into the first transverse grooves to clamp wafers on the carrying disks, and the height of the first transverse grooves is fixed, so that the manipulator does not need to frequently adjust the height of the manipulator to match with the wafers on a wafer boat, the clamping of the wafers is convenient, the time for the manipulator to adjust the height is shortened, the clamping efficiency is improved, and the wafer can be prevented from touching other wafers due to the misoperation of the manipulator due to the arrangement of the first transverse grooves, causing the wafer to slip out or be damaged.
Description
Technical Field
The invention relates to the technical field of semiconductor element detection equipment, in particular to a wafer anti-slipping protection device and a wafer anti-slipping protection method for a transmission mechanism of a probe testing machine.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, in the process of semiconductor production and manufacturing, the test of the wafer is particularly important for controlling the cost of the chip, the test of the wafer can find out the chip with functional defects, so that the chip does not enter the packaging link with higher cost in the later period, the overall cost can be saved, and an improvement direction can be provided for the manufacture of the wafer, therefore, the wafer test is an essential important link in the whole manufacturing process of the semiconductor, the wafer test equipment is changed from manual operation to semi-automatic operation and then is changed into the existing full-automatic probe tester, and the efficiency, the stability and the safety are improved in multiples.
In the prior art, a probe tester is generally used when wafers are tested, the wafers are stored in a wafer boat, the wafer boat is generally provided with a plurality of layers of sockets for storing the wafers, each layer of wafer on the wafer boat is clamped one by a manipulator when the wafer boat is tested, so that the wafers are placed on a test table for testing, the wafers are inserted back to the corresponding sockets of the wafer boat after the testing is completed, but in order to store more wafers, the clearance between each layer of wafer on the wafer boat is smaller, in the process of clamping the wafers by the manipulator, when a locking mechanism is not arranged on the wafer boat, the wafers above or below the clamping layer are disturbed, so that the wafers are damaged, and meanwhile, as the manipulator clamps each layer of wafer one by one, the height of the manipulator needs to be frequently adjusted, and the locking of the wafers clamped by the manipulator needs to be released according to the height of the manipulator, the operation is complicated, the precision requirement of the equipment on the manipulator is high, and the input cost is high.
Disclosure of Invention
Therefore, it is necessary to provide a device and a method for protecting a wafer from slipping out of a transmission mechanism of a prober, in order to solve the problems in the prior art.
In order to solve the problems of the prior art, the invention adopts the technical scheme that:
a wafer anti-slip protection device of a transmission mechanism of a needle measuring machine comprises a frame, wherein the frame comprises a top cover with an arc-shaped structure, two vertical plates and two side plates, the two side plates are arranged side by side, the two vertical plates are respectively positioned at two sides of the two side plates, the top cover is fixedly connected between the tops of the two vertical plates, a first transverse groove is formed in the top of one vertical plate, a first slide rail along the outline of the top cover is arranged on the inner wall of the top cover, second slide rails are respectively arranged at the opposite sides of the two vertical plates and are communicated with the first slide rail, a first bending part is arranged on the second slide rail of the vertical plate with the first transverse groove and is close to the first transverse groove, a conveyor belt, a rotary driving motor, two rotary shafts and a plurality of bearing plates are further arranged on the frame, the two rotary shafts are respectively positioned between the two side plates in a rotatable manner in a horizontal state, and are respectively positioned at the tops and the bottoms of the two side plates, the conveying belt is sleeved on the two rotating shafts, the rotary driving motor is fixedly connected to the bottom of one side plate, an output shaft of the rotary driving motor penetrates through the side plate and is fixedly connected with the rotating shaft located at the bottom of the side plate, all the bearing discs are fixedly connected to the conveying belt at equal distances, all the bearing discs are provided with circular-arc grooves towards one side of the vertical plate, bearing plates are arranged in the grooves, all the bearing discs are provided with protection assemblies on one sides far away from the grooves, and the protection assemblies are in sliding fit with the first sliding rails and the second sliding rails.
Preferably, the both sides of accepting the dish all are provided with the support arm that extends to the curb plate, and two support arms all are the horizontality, and the one side of keeping away from the drive belt on two support arms all is provided with the spout, and the protection subassembly includes two dogs, and two baffles are slidable respectively and lie in the spout of two support arms, and the opposite side of two dogs all is provided with the circular-arc edge of agreeing with that matches each other with the recess.
Preferably, the two stoppers are provided with cushion pads made of elastic materials on the fitting edges.
Preferably, the one end of keeping away from on two dogs and accepting the dish all is provided with first roller, all overlaps on the first roller of two dogs and is equipped with first pulley, first pulley and first slide rail and second slide rail sliding fit.
Preferably, the one end that is close to the curb plate on two support arms all is provided with the second roller, all overlaps on the second roller of two support arms to be equipped with the second pulley, and the opposite side of two curb plates all is provided with the third slide rail that sets up along its profile, and the second pulley on two support arms is respectively in the third slide rail sliding fit of two curb plate upper covers.
Preferably, a sensor is arranged beside the first transverse groove.
Preferably, the receiving plate is of an arc-shaped plate structure, the receiving plate is horizontally located in the center of the receiving disc, a second transverse groove flush with the first transverse groove is formed in the vertical plate located on the opposite side of the first transverse groove, and a second bending portion in mirror symmetry with the first bending portion of the second slide rail is formed in the second transverse groove.
Preferably, the bottom of the rack is provided with a rotating disk which is placed in a horizontal state, and the bottom of the rotating disk is provided with a mounting hole for connecting with an external rotating mechanism.
Preferably, a clamping groove matched with the conveying belt is formed in one side, close to the conveying belt, of the bearing plate, and limiting bosses are arranged at the top and the bottom of the clamping groove.
The protection method of the wafer anti-slipping protection device of the transmission mechanism of the probe testing machine is characterized by comprising the following steps of:
s1, starting a rotary driving motor, driving a rotary shaft by the rotary driving motor, driving a conveyor belt by the rotary shaft, and driving a plurality of carrying trays to move by the rotation of the conveyor belt;
s2a, the carrying disc drives the protection component to move when moving, so that two stop blocks of the protection component move along with the first slide rail and the second slide rail, when the carrying disc moves to the first transverse groove or the second transverse groove, the two stop blocks of the protection component are located at the first bending part or the second bending part of the second slide rail, so that the two stop blocks are far away from each other, the groove on the carrying disc is opened, and a manipulator of the probe tester can conveniently stretch into the first transverse groove or the second transverse groove to take out the wafer on the carrying disc;
s2b, after the wafer is taken out, the empty receiving disc moves towards the other side of the conveying belt, the receiving disc moves to the position of the opposite side of the first transverse groove or the second transverse groove, at the moment, the two stop blocks of the protection assembly are located at the first bending part or the second bending part of the second sliding rail, so that the two stop blocks are far away from each other, the groove on the receiving disc is opened, and a manipulator of the needle measuring machine conveniently stretches into the position from the first transverse groove or the second transverse groove to place the wafer back on the receiving disc.
Compared with the prior art, the beneficial effect of this application is:
1. the rotary driving motor drives the rotary shaft, the rotary shaft drives the conveying belt, the conveyor belt drives the plurality of bearing plates to move, when the bearing plates are aligned with the first transverse grooves on the vertical plate, the manipulator of the probe measuring machine inserts the wafer on the bearing plate from the first transverse groove for clamping, because the height of the first transverse groove is fixed, the manipulator of the probe card does not need to frequently adjust the height of the manipulator to match with the multilayer wafers on the wafer boat, only the manipulator is aligned with the height of the first transverse groove, thereby clamping the wafer on the bearing plate aligned with the first transverse groove, reducing the time for adjusting the height of the manipulator, the clamping efficiency of the manipulator of the probe testing machine is improved, and through the arrangement of the first transverse groove, the situation that the manipulator touches other wafers due to misoperation to cause the wafers to slide out or be damaged can be avoided; through the setting of protection subassembly for two dogs of protection subassembly can slide on the spout of two support arms respectively, make the wafer can be by two dog centre grippings when going up and down along with accepting the dish, thereby avoid the roll-off of wafer.
2. This application is through the setting of blotter, and reducible dog avoids the damage of the side of wafer to the centre gripping dynamics of wafer side when sliding to the wafer, through elastic material's setting, can further cushion the impact force to the centre gripping of wafer side, still can make the side of wafer more inseparable with the laminating of the agreeing with limit of dog during expert, and the stability of very high wafer on accepting the dish.
3. This application is through the alternative use's of first horizontal groove and second horizontal groove mode, and after the wafer of one of them side was filled, just can take out inside wafer one by one through upset rotary driving motor to the convenience is to taking out and putting back of wafer.
4. This application passes through the setting of rotary disk and mounting hole, and the outside rotary mechanism of accessible drives the rotary disk through the mounting hole and rotates to make the manipulator carry out alternate use to first cross slot and second cross slot, thereby be convenient for get the wafer and put.
5. This application is through the setting of draw-in groove for it can the conveyer belt protection fixed connection to accept the dish, through the setting of spacing boss, makes a plurality of distances of accepting between the dish keep equaling, conveniently accepts the installation of dish, improves the inside wafer quantity that can hold of device, ensures to accept and is used for the manipulator that sufficient clearance makes things convenient for the needle to survey between the dish and can insert, thereby takes out the wafer.
Drawings
FIG. 1 is a perspective view of the present application in its entirety;
FIG. 2 is a schematic perspective view of the entire structure of the present application;
FIG. 3 is a perspective view of the interior of the housing of the present application;
FIG. 4 is a side view of the interior of the housing of the present application;
FIG. 5 is a perspective view of a plurality of receiving pans and a conveyor belt of the present application;
FIG. 6 is a first perspective view of the tray and guard assembly of the present application;
FIG. 7 is a second perspective view of the adaptor and guard assembly of the present application;
FIG. 8 is an enlarged view at A of FIG. 7 of the present application;
FIG. 9 is a perspective view of the stop of the present application;
fig. 10 is a schematic perspective view of a riser of the present application;
fig. 11 is an elevation view of a riser of the present application;
FIG. 12 is a perspective view of the top cover of the present application;
FIG. 13 is a perspective view of the side wall and the rotational axis of the present application;
the reference numbers in the figures are:
1-a frame; 1 a-a top cover; 1a1 — first slide; 1 b-side plate; 1b 1-third slide rail; 1 c-a riser; 1c1 — second slide; 1c2 — first fold; 1c 3-second bend; 1c4 — first transverse slot; 1c 5-second transverse groove; 1c 6-sensor; 1 d-a rotary drive motor; 1d 1-axis of rotation; 1d 2-conveyor belt; 1 e-rotating disk; 1e 1-mounting holes;
2-carrying tray; 2 a-a groove; 2 b-bearing plate; 2 c-a protective component; 2c 1-stop; 2c 2-cushion; 2c3 — first roller; 2c4 — first pulley; 2 d-a support arm; 2d 1-chute; 2d2 — second roller; 2d3 — second pulley; 2 e-a card slot; 2e 1-limit boss.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1-13, the present application provides:
a wafer anti-slip protection device of a transmission mechanism of a needle measuring machine comprises a rack 1, wherein the rack 1 comprises a top cover 1a, two vertical plates 1c and two side plates 1b which are of an arc-shaped structure, the two side plates 1b are arranged side by side, the two vertical plates 1c are respectively positioned at two sides of the two side plates 1b, the top cover 1a is fixedly connected between the tops of the two vertical plates 1c, a first transverse groove 1c4 is formed in the top of one vertical plate 1c, a first sliding rail 1a1 along the outline of the top cover 1a is arranged on the inner wall of the top cover 1a, second sliding rails 1c1 are arranged on the opposite sides of the two vertical plates 1c, the second sliding rails 1c1 are communicated with the first sliding rails 1a1, a first bending part 1c2 is arranged on the second sliding rail 1c1 of the vertical plate 1c with the first transverse groove 1c4 and close to the first transverse groove 1c4, a rotary driving motor 1d, two rotary shafts 1d 5 and a plurality of carrying discs 3872 are further arranged on the rack 1d2, two rotation axis 1d1 all are rotatable being located between two curb plates 1b of horizontal state, and two rotation axis 1d1 are located the top and the bottom of two curb plates 1b respectively, conveyer belt 1d2 is located on two rotation axis 1d1 in the cover, rotary drive motor 1d fixed connection is in the bottom of one of them curb plate 1b, rotary drive motor 1 d's output shaft runs through curb plate 1b and is located the rotation axis 1d1 fixed connection of curb plate 1b bottom, the equal distance fixed connection of all accepting the dishes 2 is on conveyer belt 1d2, all be provided with circular-arc recess 2a towards riser 1c one side on the accepting dish 2, be provided with accepting the board 2b in the recess 2a, the one side of keeping away from recess 2a on all accepting dishes 2 is provided with protection component 2c, protection component 2c and first slide rail 1a1 and second slide rail 1c1 sliding fit.
Based on the above embodiment, the technical problem that this application wants to solve is preventing the roll-off of wafer when making things convenient for the manipulator of needle measuring machine to press from both sides the clamp to the wafer. Therefore, the application starts the rotary driving motor 1d, the output shaft of the rotary driving motor 1d drives the rotary shaft 1d1 fixedly connected with the rotary driving motor to rotate, the rotary shaft 1d1 drives the conveyor belt 1d2 connected with the rotary driving motor to move, in order to ensure the transmission effect, synchronous wheels or chain wheels matched with the conveyor belt 1d2 are arranged on the two rotary shafts 1d1, the movement of the conveyor belts 1d2 drives the plurality of bearing disks 2 to move, when the bearing disks 2 are aligned with the first transverse grooves 1c4 on the vertical plate 1c, the manipulator of the prober inserts the first transverse grooves 1c4 to clamp the wafers on the bearing disks 2, and because the height of the first transverse grooves 1c4 is fixed, the manipulator of the prober does not need to frequently adjust the height of the manipulator to match the multi-layer wafers on the wafer boat, and only needs to be aligned with the height of the first transverse grooves 1c4, therefore, the wafer on the bearing disc 2 aligned with the first transverse groove 1c4 is clamped, the time for adjusting the height of the manipulator is reduced, the clamping efficiency of the manipulator of the probe card is improved, and the wafer can be prevented from sliding out or being damaged due to the fact that the manipulator touches other wafers due to misoperation through the arrangement of the first transverse groove 1c 4; in order to ensure that the wafer does not slip out in the moving process of the tray 2, the tray 2 will drive the protection component 2c to move when moving, because the protection component 2c is in sliding fit with the first slide rail 1a1 and the second slide rail 1c1, the protection component 2c will be driven by the tray 2 and slide along the first slide rail 1a1 and the second slide rail 1c1, so that the wafer on the tray 2 is blocked by the protection component 2c, the wafer is prevented from slipping out of the groove 2a of the tray 2, the stability of the wafer when moving the tray 2 is improved, for the convenience of clamping of the prober manipulator, the protection component 2c needs to be opened at the groove 2a on the tray 2, when the tray 2 is level with the first transverse groove 1c4, because the first bending part 1c2 of the second slide rail 1c1 is located beside the first transverse groove 1c4, and the protection component 2c is in sliding fit with the tray 2, so that the protection component 2c sliding to the first bending part 1c2 slides laterally on the tray 2, and the protection component 2c cannot block the wafer on the tray 2, thereby facilitating the picking of the wafer on the tray 2 by the manipulator of the prober.
As shown in fig. 3-9, further:
the both sides of accepting dish 2 all are provided with the support arm 2d that extends to curb plate 1b, two support arms 2d all are the horizontality, the one side of keeping away from the drive belt on two support arms 2d all is provided with spout 2d1, protection component 2c includes two dog 2c1, two baffles are slidable respectively and are located the spout 2d1 of two support arms 2d, the opposite side of two dog 2c1 all is provided with the circular-arc edge of agreeing with that matches each other with recess 2 a.
Based on the above-mentioned embodiments, the technical problem that the present application intends to solve is how the stopper 2c1 slides on the tray 2. For this purpose, the present application, through the arrangement of the sliding slot 2d1, makes the two stoppers 2c1 of the protection component 2c slide on the sliding slots 2d1 of the two supporting arms 2d respectively, when the two stoppers 2c1 slide to the first bending portion 1c2 of the second slide rail 1c1 along with the tray 2, the two stoppers 2c1 slide along the sliding groove 2d1 to both sides of the first transverse groove 1c4, so that the two stoppers 2c1 move away from each other, thereby opening the groove 2a on the bearing plate 2, facilitating the mechanical hand of the probe tester to clamp the wafer on the bearing plate 2, when the two stoppers 2c1 are separated from the first bent portion 1c2, the two stoppers 2c1 approach each other along the sliding groove 2d1, therefore, the axis of the fitting edge of the block 2c1 is coaxial with the axis of the groove 2a, so that the wafer is clamped by the two blocks 2c1 when the wafer is lifted along with the tray 2, and the wafer is prevented from slipping out.
As shown in fig. 9, further:
the two stoppers 2c1 are provided with cushion pads 2c2 made of elastic material on the matching edges.
Based on the above embodiments, the technical problem to be solved by the present application is how to better fix the wafer. Therefore, the setting of blotter 2c2 is passed through in this application, reducible dog 2c1 is to the centre gripping dynamics of wafer side when sliding to the wafer, avoids the damage of the side of wafer, through elastic material's setting, can further cushion the impact force to the centre gripping of wafer side, still can make the side of wafer and dog 2c 1's the laminating of agreeing with the limit more closely during expert, the stability of very high wafer on accepting dish 2.
As shown in fig. 7 and 9, further:
one end of the two stoppers 2c1 far away from the tray 2 is provided with a first roller shaft 2c3, the first roller shaft 2c3 of the two stoppers 2c1 is sleeved with a first pulley 2c4, and the first pulley 2c4 is in sliding fit with the first slide rail 1a1 and the second slide rail 1c 1.
Based on the above embodiments, the technical problem to be solved by the present application is how to slidingly cooperate the protection component 2c with the first slide rail 1a1 and the second slide rail 1c 1. Therefore, the first roller shaft 2c3 is used for supporting the first pulley 2c4, and the arrangement of the first pulley 2c4 can reduce the sliding friction between the stopper 2c1 and the first slide rail 1a1 and the second slide rail 1c1, thereby improving the sliding effect and the stability of the operation of the protection component 2 c.
As shown in fig. 8, further:
one end of each of the two support arms 2d close to the side plate 1b is provided with a second roller shaft 2d2, the second roller shafts 2d2 of the two support arms 2d are sleeved with second pulleys 2d3, the opposite sides of the two side plates 1b are provided with third slide rails 1b1 arranged along the profile of the second slide rails, and the second pulleys 2d3 of the two support arms 2d are in sliding fit with the third slide rails 1b1 of the upper covers of the two side plates 1b respectively.
Based on the above embodiment, when the tray 2 rotates along with the conveyor belt 1d2, considering that the two stoppers 2c1 on the tray 2 slide on the sliding grooves 2d1 of the support arms 2d while sliding along with the first sliding rails 1a1 and the second sliding rails 1c1, when the stoppers 2c1 pass through the first bending portions 1c2, the stoppers 2c1 may be jammed, which affects the stability of the device operation, and the technical problem to be solved in the present application is to improve the stability of the tray 2 sliding. Therefore, the second roller shaft 2d2 is arranged to support the second pulley 2d3, and the second pulley 2d3 is arranged, so that the sliding friction between the support arm 2d and the third slide rail 1b1 can be reduced, the sliding effect of the bearing disc 2 can be improved, and more supporting force can be provided for the bearing disc 2, so that the bearing disc 2 is more stable when rotating along with the conveyor belt 1d2, and the stopper 2c1 is more stable when passing through the first bending part 1c2 of the second slide rail 1c1, and is not easy to jam and can lift the running stability of the device.
As shown in fig. 10, further:
the sensor 1c6 is arranged beside the first transverse groove 1c 4.
Based on the above embodiments, the technical problem that the present application intends to solve is how to make the alignment of the receiving tray 2 and the first horizontal groove 1c4 more accurate. Therefore, two stoppers 2c1 of the protection component 2c of the present application will be away from each other when passing through the first bending of the second slide rail 1c1, and at this time, the sensor 1c6 located at the side of the first transverse groove 1c4 will be triggered, and the sensor 1c6 will send a signal to the controller, and send a signal to the rotary driving motor 1d through the controller, so that the stop rotation of the rotary driving motor 1d is realized, and the tray 2 is aligned with the first transverse groove 1c4, which facilitates the clamping of the wafer on the tray 2 by the prober.
As shown in fig. 11, further:
the receiving plate 2b is an arc-shaped plate-shaped structure, the receiving plate 2b is horizontally positioned in the center of the receiving tray 2, a vertical plate 1c positioned on the opposite side of the first transverse groove 1c4 is provided with a second transverse groove 1c5 which is flush with the first transverse groove 1c4, and the second transverse groove 1c5 is provided with a second bent part 1c3 which is mirror-symmetrical to the first bent part 1c2 of the second slide rail 1c 1.
Based on the above embodiment, after the wafer is taken out, the empty tray 2 moves to the other side of the conveyor belt 1d2, so that the other side of the conveyor belt 1d2 accumulates a plurality of empty trays 2, and when the wafer needs to be put back on the tray 2, it needs to wait for all the wafers to be taken out, and then the wafers can be put back into the apparatus again. Therefore, the wafer can be received by the top surface and the bottom surface of the tray 2 through the arrangement that the tray 2b is located at the center of the tray 2, so that the wafer can still be received by the tray 2 when the conveyor belt 1d2 is on the other side during the turnover, the empty tray 2 can continue to move after the wafer is taken out from the first transverse groove 1c4 through the arrangement of the second transverse groove 1c5 until the tray 2 moves to the other side of the conveyor belt 1d2 and is aligned with the second transverse groove 1c5, so that the detected wafer can be inserted through the second transverse groove 1c5 by the manipulator of the prober, because the first transverse groove 1c4 and the second transverse groove 1c5 are located at the same height, the wafer can be placed back on the tray 2 by the manipulator of the prober without adjusting the height, and through the arrangement of the second bending part 1c3, the two stoppers 2c1 can be far away from each other when moving to the second bending part 1c3, thereby make things convenient for the manipulator of needle measuring machine to place vacant tray 2, when tray 2 moved to conveyer belt 1d2 another side bottom simultaneously, make two dog 2c1 reset through second slide rail 1c1, thereby make two dog 2c1 on the tray 2 can prevent taking out of wafer, through the mode of first horizontal groove 1c4 and the alternate use of second horizontal groove 1c5, after the wafer of one of them side is filled up, just can take out inside wafer one by one through upset rotary drive motor 1d, thereby the convenience is to taking out and putting back of wafer.
As shown in fig. 1 and fig. 2, further:
the bottom of the frame 1 is provided with a rotating disk 1e placed in a horizontal state, and the bottom of the rotating disk 1e is provided with a mounting hole 1e1 for connecting with an external rotating mechanism.
Based on the above embodiments, the technical problem to be solved by the present application is how to facilitate taking and placing of a wafer. Therefore, the rotary disk 1e and the mounting hole 1e1 are arranged, the rotary disk 1e can be driven to rotate through the mounting hole 1e1 by the aid of an external rotating mechanism, so that the manipulator can be used for alternately using the first transverse groove 1c4 and the second transverse groove 1c5, and wafers can be taken and placed conveniently.
As shown in fig. 6 and 7, further:
one side of the bearing disc 2 close to the conveyor belt 1d2 is provided with a clamping groove 2e matched with the conveyor belt 1d2, and the top and the bottom of the clamping groove 2e are both provided with a limiting boss 2e 1.
Based on the above-described embodiments, the technical problem that the present application intends to solve is how to make the distances between the catch basins 2 equal. For this reason, this application is through the setting of draw-in groove 2e for accept set 2 can be conveyer belt 1d2 protection fixed connection, through the setting of spacing boss 2e1, make a plurality of distances of accepting between the set 2 keep equal, conveniently accept the installation of set 2, improve the inside wafer quantity that can hold of device, ensure to accept to be used for the manipulator that sufficient clearance made things convenient for the needle to survey the machine between the set 2 and can insert, thereby take out the wafer.
The protection method of the wafer anti-slipping protection device of the transmission mechanism of the probe testing machine is characterized by comprising the following steps of:
s1, by starting the rotary driving motor 1d, the rotary driving motor 1d drives the rotary shaft 1d1, the rotary shaft 1d1 drives the conveyor belt 1d2, and the conveyor belt 1d2 drives the plurality of bearing discs 2 to move;
s2a, the tray 2 will drive the protection component 2c to move when moving, so that the two stoppers 2c1 of the protection component 2c move along with the first slide rail 1a1 and the second slide rail 1c1, when the tray 2 moves to the first transverse groove 1c4 or the second transverse groove 1c5, the two stoppers 2c1 of the protection component 2c are located at the first bending portion 1c2 or the second bending portion 1c3 of the second slide rail 1c1, so that the two stoppers 2c1 are away from each other, the groove 2a on the tray 2 is opened, and the manipulator of the prober can extend into the first transverse groove 1c4 or the second transverse groove 1c5 to take out the wafer on the tray 2;
s2b, after the wafer is taken out, the empty tray 2 moves to the other side of the conveyor belt 1d2, so that the tray 2 moves to the opposite side of the first transverse groove 1c4 or the second transverse groove 1c5, and at this time, the two stoppers 2c1 of the protection component 2c are located at the first bending portion 1c2 or the second bending portion 1c3 of the second slide rail 1c1, so that the two stoppers 2c1 are separated from each other, and the groove 2a on the tray 2 is opened, so that the manipulator of the prober can extend from the first transverse groove 1c4 or the second transverse groove 1c5 to put the wafer back onto the tray 2.
The above examples, which are intended to represent only one or more embodiments of the present invention, are described in greater detail and with greater particularity, and are not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A wafer anti-slipping-out protection device of a transmission mechanism of a prober comprises a rack (1) and is characterized in that the rack (1) comprises a top cover (1 a) with an arc-shaped structure, two vertical plates (1 c) and two side plates (1 b), the two side plates (1 b) are arranged side by side, the two vertical plates (1 c) are respectively positioned at two sides of the two side plates (1 b), the top cover (1 a) is fixedly connected between the tops of the two vertical plates (1 c), a first transverse groove (1 c 4) is arranged at the top of one vertical plate (1 c), a first sliding rail (1 a 1) along the outline of the top cover (1 a) is arranged on the inner wall of the top cover (1 a), second sliding rails (1 c 1) are respectively arranged at the opposite sides of the two vertical plates (1 c), the second sliding rails (1 c 1) are communicated with the first sliding rail (1 a 1), a first bending part (2) is arranged at a position, close to the first transverse groove (1 c 4), on a second sliding rail (1 c 1) of the vertical plate (1 c) with the first transverse groove (1 c 4), the frame (1) is also provided with a conveyor belt (1 d 2), a rotary driving motor (1 d), two rotary shafts (1 d 1) and a plurality of bearing discs (2), wherein the two rotary shafts (1 d 1) are both positioned between the two side plates (1 b) in a horizontal state in a rotatable manner, the two rotary shafts (1 d 1) are respectively positioned at the top and the bottom of the two side plates (1 b), the conveyor belt (1 d 2) is sleeved on the two rotary shafts (1 d 1), the rotary driving motor (1 d) is fixedly connected with the bottom of one side plate (1 b), an output shaft of the rotary driving motor (1 d) penetrates through the side plates (1 b) and is fixedly connected with the rotary shafts (1 d 1) positioned at the bottom of the side plate (1 b), all bearing discs (2) are fixedly connected on the conveyor belt (1 d 2) at equal distances, and all bearing discs (2) are provided with arc-shaped grooves (2 a) facing one side of the vertical plate (1 c), be provided with in recess (2 a) and accept board (2 b), the one side of keeping away from recess (2 a) on all accepting dish (2) all is provided with protection component (2 c), protection component (2 c) and first slide rail (1 a 1) and second slide rail (1 c 1) sliding fit.
2. The wafer anti-slipping-out protection device for the transmission mechanism of the prober according to claim 1, wherein two sides of the bearing disc (2) are provided with support arms (2 d) extending towards the side plate (1 b), the two support arms (2 d) are horizontal, one sides of the two support arms (2 d) far away from the transmission belt are provided with sliding grooves (2 d 1), the protection assembly (2 c) comprises two stoppers (2 c 1), the two stoppers are slidably located on the sliding grooves (2 d 1) of the two support arms (2 d), and opposite sides of the two stoppers (2 c 1) are provided with arc-shaped fit edges matched with the grooves (2 a).
3. The wafer anti-slip protection device for the transmission mechanism of the prober as claimed in claim 2, wherein the two stoppers (2 c 1) are provided with a cushion pad (2 c 2) made of elastic material at the engaging edge.
4. The wafer anti-slipping-out protection device for the transmission mechanism of the prober as claimed in claim 2, wherein the ends of the two stoppers (2 c 1) far away from the tray (2) are respectively provided with a first roller shaft (2 c 3), the first roller shafts (2 c 3) of the two stoppers (2 c 1) are respectively sleeved with a first pulley (2 c 4), and the first pulleys (2 c 4) are in sliding fit with the first slide rail (1 a 1) and the second slide rail (1 c 1).
5. The wafer anti-slipping-out protection device for the transmission mechanism of the prober as claimed in claim 2, wherein the two support arms (2 d) are provided with a second roller shaft (2 d 2) at one end close to the side plate (1 b), the second roller shafts (2 d 2) of the two support arms (2 d) are sleeved with second pulleys (2 d 3), the opposite sides of the two side plates (1 b) are provided with third slide rails (1 b 1) arranged along the profile of the side plates, and the second pulleys (2 d 3) of the two support arms (2 d) are respectively in sliding fit with the third slide rails (1 b 1) on the upper covers of the two side plates (1 b).
6. The wafer anti-slip protection device for the transmission mechanism of the prober according to claim 5, wherein the first lateral groove (1 c 4) is flanked by a sensor (1 c 6).
7. The wafer slipping-off prevention device for the transmission mechanism of the prober as claimed in claim 1, wherein the receiving plate (2 b) is a circular arc plate-shaped structure, the receiving plate (2 b) is horizontally located at the center of the receiving tray (2), a second transverse groove (1 c 5) flush with the first transverse groove (1 c 4) is provided on a vertical plate (1 c) located at the opposite side of the first transverse groove (1 c 4), and a second bending portion (1 c 3) mirror-symmetrical to the first bending portion (1 c 2) of the second slide rail (1 c 1) is provided on the second transverse groove (1 c 5).
8. The wafer anti-slipping-out protection device for the transmission mechanism of the prober according to claim 7, wherein the bottom of the frame (1) is provided with a rotating disk (1 e) which is horizontally arranged, and the bottom of the rotating disk (1 e) is provided with a mounting hole (1 e 1) for connecting with an external rotating mechanism.
9. The wafer anti-slipping-out protection device for the transmission mechanism of the prober according to claim 1, wherein a clamping groove (2 e) matched with the conveyor belt (1 d 2) is formed in one side, close to the conveyor belt (1 d 2), of the bearing disc (2), and limiting bosses (2 e 1) are arranged at the top and the bottom of the clamping groove (2 e).
10. A method for protecting wafers of a transmission mechanism of a probe tester from slipping out is applied to the device for protecting wafers of the transmission mechanism of the probe tester, which is disclosed by any one of claims 1 to 9, and is characterized by comprising the following steps:
s1, by starting the rotary driving motor (1 d), the rotary driving motor (1 d) drives the rotary shaft (1 d 1), the rotary shaft (1 d 1) drives the conveyor belt (1 d 2), and the conveyor belt (1 d 2) rotates to drive the plurality of bearing discs (2) to move;
s2a, the tray (2) can drive the protection component (2 c) to move when moving, so that two stoppers (2 c 1) of the protection component (2 c) move along with the first slide rail (1 a 1) and the second slide rail (1 c 1), when the tray (2) moves to the first transverse groove (1 c 4) or the second transverse groove (1 c 5), the two stoppers (2 c 1) of the protection component (2 c) are located at the first bending part (1 c 2) or the second bending part (1 c 3) of the second slide rail (1 c 1), so that the two stoppers (2 c 1) are far away from each other, the groove (2 a) on the tray (2) is opened, and a manipulator of the needle measuring machine can extend into the tray from the first transverse groove (1 c 4) or the second transverse groove (1 c 5) to take out the wafer on the tray (2);
s2b, after the wafer is taken out, the empty tray (2) moves to the other side of the conveyor belt (1 d 2), so that the tray (2) moves to the opposite side of the first transverse groove (1 c 4) or the second transverse groove (1 c 5), at the moment, two stoppers (2 c 1) of the protection assembly (2 c) are positioned at the first bending part (1 c 2) or the second bending part (1 c 3) of the second slide rail (1 c 1), so that the two stoppers (2 c 1) are away from each other, the groove (2 a) on the tray (2) is opened, and a manipulator of the needle measuring machine can conveniently extend into the first transverse groove (1 c 4) or the second transverse groove (1 c 5) to place the wafer back on the tray (2).
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| CN202210739073.7A CN114823441B (en) | 2022-06-28 | 2022-06-28 | Wafer anti-slipping-out protection device for transmission mechanism of probe testing machine |
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| CN115872130A (en) * | 2022-12-30 | 2023-03-31 | 盐城家安乐自动化科技有限公司 | Lifting and overturning equipment for automobile spring plate |
| CN117059542A (en) * | 2023-10-12 | 2023-11-14 | 泓浒(苏州)半导体科技有限公司 | Wafer conveying device and method in ultra-clean environment |
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| CN115394698A (en) * | 2022-10-27 | 2022-11-25 | 泓浒(苏州)半导体科技有限公司 | Wafer transfer mechanical arm and wafer transfer method |
| CN115394698B (en) * | 2022-10-27 | 2022-12-23 | 泓浒(苏州)半导体科技有限公司 | Wafer transfer mechanical arm and wafer transfer method |
| CN115872130A (en) * | 2022-12-30 | 2023-03-31 | 盐城家安乐自动化科技有限公司 | Lifting and overturning equipment for automobile spring plate |
| CN117059542A (en) * | 2023-10-12 | 2023-11-14 | 泓浒(苏州)半导体科技有限公司 | Wafer conveying device and method in ultra-clean environment |
| CN117059542B (en) * | 2023-10-12 | 2024-01-26 | 泓浒(苏州)半导体科技有限公司 | Wafer conveying device and method in ultra-clean environment |
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