CN114762108A - 一种集成电路 - Google Patents
一种集成电路 Download PDFInfo
- Publication number
- CN114762108A CN114762108A CN201980102524.2A CN201980102524A CN114762108A CN 114762108 A CN114762108 A CN 114762108A CN 201980102524 A CN201980102524 A CN 201980102524A CN 114762108 A CN114762108 A CN 114762108A
- Authority
- CN
- China
- Prior art keywords
- inductor
- transistor
- pgs
- integrated circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Abstract
一种集成电路,其中,该集成电路包括:芯片(102)和用于封装所述芯片(102)的封装层(101)。其中,芯片(102)包括衬底(1022)和设于衬底(1022)之上的电感(1021),封装层(101)包括第一图案接地屏蔽结构(1011),第一图案接地屏蔽结构(1011)位于封装层(101)内的金属层,第一图案接地屏蔽结构(1011)由金属层的金属刻蚀而成,且第一图案接地屏蔽结构(1011)位于电感(1021)之上,第一图案接地屏蔽结构(1011)用于减少电感(1021)在金属层中引起的感应电流。当电感(1021)处于工作状态时,由于第一图案接地屏蔽结构(1011)的存在,电感(1021)上变化的电流在第一图案接地屏蔽结构(1011)中所产生的感应电流很小,能够减小电子元件的涡流效应,提高电子元件的性能。
Description
PCT国内申请,说明书已公开。
Claims (12)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2019/122063 WO2021102940A1 (zh) | 2019-11-29 | 2019-11-29 | 一种集成电路 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114762108A true CN114762108A (zh) | 2022-07-15 |
Family
ID=76129037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980102524.2A Pending CN114762108A (zh) | 2019-11-29 | 2019-11-29 | 一种集成电路 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN114762108A (zh) |
WO (1) | WO2021102940A1 (zh) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3792635B2 (ja) * | 2001-12-14 | 2006-07-05 | 富士通株式会社 | 電子装置 |
CN101483434A (zh) * | 2008-01-11 | 2009-07-15 | 上海锐协微电子科技有限公司 | 一种低调谐增益变化的压控振荡器 |
JP2009194302A (ja) * | 2008-02-18 | 2009-08-27 | Mitsubishi Electric Corp | 半導体集積回路 |
JP5551480B2 (ja) * | 2010-03-24 | 2014-07-16 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
CN102738124B (zh) * | 2012-06-29 | 2015-05-13 | 杭州电子科技大学 | 一种分形图案接地屏蔽结构 |
US10068856B2 (en) * | 2016-07-12 | 2018-09-04 | Mediatek Inc. | Integrated circuit apparatus |
TWI624113B (zh) * | 2016-11-03 | 2018-05-11 | 矽品精密工業股份有限公司 | 電子模組 |
-
2019
- 2019-11-29 CN CN201980102524.2A patent/CN114762108A/zh active Pending
- 2019-11-29 WO PCT/CN2019/122063 patent/WO2021102940A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2021102940A1 (zh) | 2021-06-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4024572B2 (ja) | インタディジタルキャパシタを有するデバイス | |
US5629553A (en) | Variable inductance element using an inductor conductor | |
KR101166032B1 (ko) | 집적된 반도체 인덕터 및 그를 위한 방법 | |
US5497028A (en) | LC element and semiconductor device having a signal transmission line and LC element manufacturing method | |
US9240390B2 (en) | Semiconductor packages having wire bond wall to reduce coupling | |
US6903459B2 (en) | High frequency semiconductor device | |
EP0653837B1 (en) | LC element, semiconductor device, and LC element manufacturing method | |
CN109285814B (zh) | 电元件,电装置和封装 | |
US7081799B2 (en) | Bipolar transistor, oscillation circuit, and voltage controlled oscillator | |
CN114762108A (zh) | 一种集成电路 | |
KR20070120059A (ko) | 반도체 필터 구조체 및 제조 방법 | |
KR20090021734A (ko) | 인덕터 및 그 제조 방법 | |
JP2002246476A (ja) | 絶縁デバイス、集積回路、発信器及び無線信号受信装置 | |
US11043485B2 (en) | Electronic device having semiconductor device with protective resistor | |
JP2014107417A (ja) | 半導体装置 | |
JP3390070B2 (ja) | Lc素子,半導体装置及びlc素子の製造方法 | |
KR100334004B1 (ko) | Lc소자,반도체장치및lc소자의제조방법 | |
JP3390065B2 (ja) | Lc素子,半導体装置及びlc素子の製造方法 | |
JPH07202134A (ja) | Lc素子,半導体装置及びlc素子の製造方法 | |
JP3597879B2 (ja) | Lc素子,半導体装置 | |
JP3482008B2 (ja) | インダクタ素子および半導体装置 | |
KR20220007022A (ko) | 전력 트랜지스터 및 dc 피드 경로를 포함하는 디바이스 및 방법 | |
JP4799150B2 (ja) | 回路基板装置 | |
JP2000223971A (ja) | 自己バイアス回路および自己バイアス回路の配置方法 | |
JP2002223104A (ja) | 整合回路および半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |