CN114700506A - Turning device and turning method of wafer polishing machine - Google Patents
Turning device and turning method of wafer polishing machine Download PDFInfo
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- CN114700506A CN114700506A CN202210426833.9A CN202210426833A CN114700506A CN 114700506 A CN114700506 A CN 114700506A CN 202210426833 A CN202210426833 A CN 202210426833A CN 114700506 A CN114700506 A CN 114700506A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B5/00—Turning-machines or devices specially adapted for particular work; Accessories specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B25/00—Accessories or auxiliary equipment for turning-machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a turning disc device and a turning disc method of a wafer polishing machine, wherein the turning disc device comprises: the turning disc mechanism comprises a turning tool holder, and at least one turning tool for turning the polishing disc is arranged on the turning tool holder; the driving mechanism comprises a box body, a mounting arm which is telescopically movable in the box body and a driving assembly for driving the mounting arm to reciprocate, and the turning disc mechanism is mounted at one end, far away from the driving assembly, of the mounting arm through a turning tool rest; the machine platform is used for bearing the driving mechanism and the chassis mechanism; the driving assembly comprises a driving motor and a reciprocating screw rod which is rotatably connected in the box body, two ends of the reciprocating screw rod are respectively connected to the driving motor and the mounting arm in a transmission mode, the mounting arm is driven to reciprocate along the axial direction of the reciprocating screw rod through the driving motor and the reciprocating screw rod, and therefore the polishing disc is driven to reciprocate to process the polishing disc. The polishing disc can solve the problem that the polishing quality cannot be met by re-mounting the polishing disc after the polishing disc is disassembled and processed in the prior art.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to a turning disc device and a turning disc method of a wafer polishing machine.
Background
At present, the main processing procedures of sapphire wafers are crystal bar cutting, double-sided grinding, annealing, copper polishing and Chemical Mechanical (CMP) polishing, wherein the CMP polishing is particularly important, the quality of the polishing directly determines the performance and yield of products, the CMP polishing mode is widely applied to the fields of microelectronics, semiconductors, photoelectronics and the like, and the ultra-flat and ultra-smooth mirror surface of the wafer is realized through the synergistic action of mechanical corrosion and chemical corrosion, and the method belongs to the ultra-high precision processing technology.
The traditional polishing mode is that a polishing pad with gum is attached to the surface of a metal polishing disk for polishing, a certain pressure is applied to a wafer during polishing to ensure that the surface of the wafer is in close contact with the polishing pad, the surface of the wafer is polished by CMP polishing solution, because of the action of the pressure, the polishing pad attached to the upper surface of the polishing disk and the surface of the wafer rub to generate heat during the polishing process, at the moment, the metal polishing disk is easy to generate thermal deformation, the middle part of the metal polishing disk gradually protrudes upwards along with the rise of the temperature and gradually diffuses towards the circumferential direction, the deformation of the middle part is the largest, the disk surface generally requires that the middle part of the whole disk surface is recessed by-50 to-110 mu m at the temperature of 18 ℃, when the polishing reaches the highest temperature, the middle part of the whole disk surface is heated to protrude upwards, the whole disk surface is in a relatively flat shape to ensure the TTV and LTV of the wafer during polishing, therefore, the quality of the wafer is ensured, and the surface of the polishing disk needs to be processed into a disk shape meeting the CMP process requirement according to the processing requirement.
Repair polishing dish surface, the way of generally taking at present in the trade is to pull down the burnishing machine quotation, places and carries out the quotation on the dedicated quotation equipment, and the quotation is to the dish type of needs after, the burnishing machine is returned to the repacking, and the mode shortcoming of doing so is that the dismouting time is long, and is inefficient, and the temperature of the dish type is unmatched with the burnishing machine behind the quotation, causes the unable dish type requirement that can not reach behind the polishing dish installation, consequently, carries out the quotation to the polishing dish after, the difficult polishing quality needs that satisfy.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a turning disc device and a turning disc method of a wafer polishing machine, aiming at carrying out turning disc processing on a polishing disc installed on the wafer polishing machine through the turning disc device so as to solve the problem that the polishing quality cannot be met when the existing polishing disc is installed again after being disassembled and processed.
An aspect of the present invention provides a turning disc device of a wafer polishing machine, the turning disc device being adapted to cooperate with the wafer polishing machine to perform turning disc processing on a polishing disc mounted on the wafer polishing machine, the turning disc device including:
the polishing disc turning mechanism comprises a disc turning mechanism, wherein the disc turning mechanism comprises a tool holder, and at least one turning tool for disc turning processing of the polishing disc is mounted on the tool holder;
the driving mechanism comprises a box body, a mounting arm which is telescopically movable in the box body and a driving assembly for driving the mounting arm to reciprocate, and the turning disc mechanism is mounted at one end, far away from the driving assembly, of the mounting arm through the turning tool rest;
the machine table is used for bearing the driving mechanism and the chassis mechanism;
the driving assembly comprises a driving motor and a reciprocating screw rod which is rotatably connected in the box body, two ends of the reciprocating screw rod are respectively connected to the driving motor and the mounting arm in a transmission mode, the mounting arm is driven to reciprocate along the axial direction of the reciprocating screw rod through the driving motor and the reciprocating screw rod, and therefore the polishing disc is driven to reciprocate by the disc turning mechanism mounted on the mounting arm so as to machine the polishing disc.
Compared with the prior art, adopt the turnplate device of wafer polishing machine shown in this embodiment, beneficial effect lies in:
through providing a hull device that can carry out the adaptation according to wafer burnishing machine, when using this hull device, install in the hull mechanism of installation arm front end through control drive assembly drive and carry out reciprocating motion to can carry out the hull processing to the polishing dish of installing on wafer burnishing machine through the lathe tool on the hull mechanism, so just no longer need dismantle processing with the polishing dish on the wafer burnishing machine, avoid dismantling the demand that can't satisfy the polishing quality with the polishing dish after processing once more.
According to one aspect of the technical scheme, the box body is rotatably connected to the machine table so as to change the working height of the turning tool, and a first limiting assembly is arranged on one side, far away from the rotating connection position of the box body and the machine table, of the machine table, so that the turning freedom degree of the box body on the machine table is limited through the first limiting assembly.
According to one aspect of the technical scheme, the machine table is respectively provided with hinged seats on two sides of the rotary joint of the box body, and the box body is hinged on the hinged seats through a preset rotary connecting piece.
According to an aspect of the above technical solution, the first limiting assembly includes a limiting member, the limiting member is rotatably connected to an outward-extending mounting plate on the machine, a top end of the limiting member abuts against a bottom surface of the box, and the limiting assembly further includes a first level gauge disposed on the box, so as to determine an inclination of the box on the machine through the first level gauge.
According to an aspect of the above technical scheme, the undercarriage device further includes a second limiting component, the second limiting component includes a first positioning seat and a second positioning seat which are arranged on the machine table and located on two sides of the box body respectively, and a first positioning piece and a second positioning piece which are connected to the first positioning seat and the second positioning seat respectively in a rotating mode, so that the box body is clamped through the first positioning piece and the second positioning piece, and the yaw freedom degree of the box body is limited.
According to an aspect of the above technical scheme, the turning disc mechanism further comprises a tool rest base, the tool rest base is fixedly connected to the mounting arm, the turning tool rest is slidably connected to the tool rest base, and the axial position of the turning tool rest on the tool rest base is limited by a locking piece arranged on the tool rest base.
According to the one hand of above-mentioned technical scheme, the bottom corner position of board is equipped with adjustable supporting legs respectively.
According to one aspect of the technical scheme, one end, far away from the turning plate mechanism, of the mounting arm is arranged in a hollow shape, a screw rod thread sleeve is fixedly arranged in the mounting arm, and the reciprocating screw rod penetrates into the mounting arm to be matched with the screw rod thread sleeve;
and a sliding assembly is arranged between the box body and the mounting arm, the sliding assembly comprises a sliding rail arranged in the box body and a sliding block arranged on the mounting arm, and the sliding rail is in sliding fit with the sliding block.
According to one aspect of the technical scheme, one end, far away from the turning disc mechanism, of the reciprocating screw rod penetrates out of the box body and is fixedly provided with a coupler, and transmission between the coupler and an output shaft of the driving motor is belt transmission.
Another aspect of the present invention provides a turning method for a wafer polishing machine, which is used for the turning device of the wafer polishing machine, and the turning method includes:
providing a wafer polishing machine, wherein a polishing disc to be turned is arranged on the wafer polishing machine;
the reciprocating screw rod is driven to rotate by the driving motor so as to drive the turning tool in the turning disc device arranged on the mounting arm to an initial position on the polishing disc;
controlling the polishing disc to rotate through the wafer polishing machine;
adjusting the working height of the turning tool to enable a tool bit of the turning tool to contact the polishing disc at a first position, and setting the moving direction and the moving speed of the turning tool;
according to the set moving direction and moving speed of the turning tool, the turning tool is driven to move towards a second direction on the surface of the polishing disc through the driving of the driving motor so as to finish disc turning of the polishing disc;
wherein one of the first position and the second position is located at the circumference of the central depression of the polishing disk, and the other is located at the circumference of the polishing disk.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a tray apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a tray device in a second view according to the first embodiment of the present invention;
FIG. 3 is a schematic structural view of a part of a structure of a disc device according to a first embodiment of the present invention;
FIG. 4 is an enlarged view of the portion A of FIG. 3;
FIG. 5 is a perspective view schematically showing a partial structure of a tray device according to a first embodiment of the present invention;
FIG. 6 is a schematic view of the combination of the turn table device and the wafer polishing machine according to the first embodiment of the present invention;
FIG. 7 is a flowchart illustrating a undercarriage method according to a second embodiment of the present invention;
the figure elements are illustrated in symbols:
the device comprises a disk turning device 100, a disk turning mechanism 10, a disk turning tool holder 11, a turning tool 12, a tool holder base 13, a locking piece 14, a driving mechanism 20, a box 21, a mounting arm 22, a driving assembly 23, a driving motor 230, a reciprocating screw rod 231, a coupler 232, a transmission belt 233, a screw rod thread sleeve 234, a slide rail 235, a slide block 236, a machine table 30, a hinged seat 31, a rotary connecting piece 310, a first positioning seat 32, a first positioning piece 320, a mounting plate 33, a limiting piece 330, a control mechanism 34, a base 35, an adjustable supporting leg 40, a wafer polisher 200 and a polishing sheet 201.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings, in order to make the objects, features and advantages of the invention more comprehensible. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "left," "right," "up," "down," and the like are used for descriptive purposes only and not for purposes of indicating or implying that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
Referring to fig. 1 to 5, there is shown a turning disc device 100 of a wafer polisher 200 according to a first embodiment of the present invention, as shown in fig. 6, the turning disc device 100 is used for cooperating with the wafer polisher 200 to turn a polishing disc 201 mounted on the wafer polisher 200, and the turning disc device 100 includes: the polishing machine comprises a turning disc mechanism 10 for processing the polishing disc 201, a driving mechanism 20 for driving the turning disc mechanism 10 to reciprocate, and a machine table 30 for bearing the driving mechanism 20 and the turning disc mechanism 10, wherein a corresponding control mechanism 34 is further arranged on the machine table 30 to control the movement of the driving mechanism 20.
Particularly, lathe 10 includes lathe tool rest 11, and this lathe tool rest 11 is made by metal material, has very good anti-seismic performance, install on lathe tool rest 11 at least one be used for right polishing dish 201 carries out lathe tool 12 of lathe processing, this lathe tool 12 is the same with the lathe tool 12 that uses on the lathe, and consequently the suitability is better, lathe tool 12 includes handle of a knife and tool bit, and wherein, the handle of a knife is used for the clamping on lathe tool rest 11, and the tool bit is used for carrying out lathe processing to polishing dish 201. In other embodiments, the turning tool 12 on the turning tool holder 11 can be replaced according to actual use requirements, for example, directly replaced by a tool changer, so as to perform turning disc processing on the polishing disc 201 through different types of turning tools 12, thereby completing rough processing, finish processing and the like on the polishing disc 201 through different turning tools 12 and matching with different control programs.
Further, the driving mechanism 20 includes a box 21, a mounting arm 22 telescopically movable in the box 21, and a driving assembly 23 for driving the mounting arm 22 to reciprocate, and the disc mechanism 10 is mounted on one end of the mounting arm 22 away from the driving assembly 23 through the carriage 11; the box body 21 is connected to the machine table 30, and when the driving component 23 is controlled to move, the driving component 23 can cause the mounting arm 22 to reciprocate in the box body 21, that is, in an actual use process, the mounting arm 22 can drive the turning disc mechanism 10 mounted at the front end to be close to or far away from the polishing disc 201 through the driving of the driving component 23, so that the turning disc processing of the polishing disc 201 is realized through the turning tool 12 which reciprocates.
If the mounting arm 22 and the chassis mechanism 10 mounted at the front end of the mounting arm 22 are driven to reciprocate by the driving assembly 23, the specific transmission structure is as follows:
the driving assembly 23 includes a driving motor 230 and a reciprocating screw rod 231 rotatably connected in the box 21, two ends of the reciprocating screw rod 231 are respectively connected to the driving motor 230 and the mounting arm 22 in a transmission manner, so that the mounting arm 22 is driven by the driving motor 230 and the reciprocating screw rod 231 to reciprocate along an axial direction of the reciprocating screw rod 231, and the disc turning mechanism 10 mounted on the mounting arm 22 is driven to reciprocate to turn the polishing disc 201.
Further, one end of the mounting arm 22, which is far away from the disc mechanism 10, is hollow, a lead screw thread sleeve 234 is fixedly arranged in the mounting arm 22, and the reciprocating lead screw 231 penetrates into the mounting arm 22 and is matched with the lead screw thread sleeve 234; one end of the reciprocating screw rod 231, which is far away from the chassis mechanism 10, penetrates through the box body 21 and is fixedly provided with a coupler 232, and the transmission between the coupler 232 and the output shaft of the driving motor 230 is belt transmission, such as a transmission belt 233; thus, after the driving motor 230 is controlled to rotate, the power of the driving motor 230 is transmitted to the coupler 232 connected with the reciprocating lead screw 231 through the transmission belt 233, and the reciprocating lead screw 231 rotates in the lead screw thread sleeve 234, so as to drive the mounting arm 22 to reciprocate in the box 21; in addition, in order to ensure the stability of the mounting arm 22 during the sliding process, a sliding assembly is arranged between the box body 21 and the mounting arm 22, the sliding assembly comprises a sliding rail 235 arranged in the box body 21 and a sliding block 236 arranged on the mounting arm 22, and the sliding rail 235 is in sliding fit with the sliding block 236.
Through the above-mentioned structural design, after the driving motor 230 is controlled to rotate, the power output by the driving motor 230 is transmitted to the installation arm 22 provided with the screw thread sleeve 234 sequentially through the transmission belt 233, the coupling 232 and the reciprocating screw 231, and the installation arm 22 can reciprocate in the box 21, that is, the installation arm 22 extends and retracts, so as to drive the turning tool 12 on the turning mechanism 10 to turn the polishing disc 201 mounted on the wafer polishing machine 200.
In this embodiment, considering that the polishing disc 201 of the wafer polishing machine 200 is easily deformed due to friction and heating when polishing the wafer, if the polishing disc 201 is turned to a flat state, the polishing disc 201 is easily deformed due to heating when the polishing disc 201 is driven to polish the wafer, the polishing disc 201 is deformed upward or downward, which mainly shows that a protrusion or a depression occurs in the middle area of the polishing disc 201, and the polishing disc 201 polishes the wafer after being deformed, so that the polishing effect on the wafer cannot be guaranteed;
therefore, when carrying out the hull processing to polishing dish 201 among this embodiment, the initiative with polishing dish 201 hull processing to the regional undercut certain range in middle part, make it add man-hour to polishing dish 201 can be because being heated and produce ascending deformation to make polishing dish 201 arch up after the polishing is heated in order to offset the sunken of leaving during the hull processing, polishing dish 201 will keep comparatively level and smooth state this moment, thereby guarantee the polishing effect to the wafer.
In order to achieve the above object, in the present embodiment:
the box body 21 is rotatably connected to the machine table 30 to change the working height of the turning tool 12, that is, the box body 21 is rotatably connected to the machine table 30, and the tray mechanism 10 provided on the mounting arm 22 can generate a change in height due to the rotation of the box body 21. In order to limit the position of the box 21 after the box 21 rotates, a first limiting component is arranged on one side of the machine table 30, which is far away from the rotating connection position of the box 21 and the machine table 30, so as to limit the steering freedom degree of the box 21 on the machine table 30 through the first limiting component; specifically, the first position limiting assembly includes a position limiting member 330, the position limiting member 330 is rotatably connected to an outward extending mounting plate 33 on the machine 30, a top end of the position limiting member 330 abuts against a bottom surface of the box 21, and the position limiting assembly further includes a first level gauge (not shown) disposed on the box 21, so as to determine an inclination of the box 21 on the machine 30 through the first level gauge.
The machine table 30 is provided with hinge seats 31 at two sides of a rotary joint of the box body 21, and the box body 21 is hinged to the hinge seats 31 through a preset rotary connecting piece 310.
And in order to exert lateral pressure on the box body 21, avoid the box body 21 from shaking when the polishing disc 201 is machined, the undercarriage device 100 further comprises a second limiting component, the second limiting component comprises a first positioning seat 32 and a second positioning seat (not shown in the figure, symmetrical to the first positioning seat 32) which are arranged on the machine table 30 and are respectively positioned on two sides of the box body 21, and a first positioning piece 320 and a second positioning piece (not shown in the figure, symmetrical to the first positioning piece 320) which are respectively connected on the first positioning seat 32 and the second positioning seat in a rotating manner, so that the first positioning piece 320 and the second positioning piece are used for clamping the box body 21, the yaw freedom degree of the box body 21 is limited, and the stability of the undercarriage mechanism 10 arranged at the front end of the mounting arm 22 can be effectively guaranteed.
In this embodiment, another way is provided to adjust the working height of the turning tool 12, specifically:
the turning disc mechanism 10 further comprises a tool rest base 13, the tool rest base 13 is fixedly connected to the mounting arm 22, the turning tool rest 11 is slidably connected to the tool rest base 13, and the axial position of the turning tool rest 11 on the tool rest base 13 is limited by a locking piece 14 arranged on the tool rest base 13; and a second level gauge 15 for measuring the polishing disk 201 is also provided on the tool rest base 13.
When the position of the turning tool 12 on the tool rest 11 is too high or too low, the height of the turning tool 12 can be adjusted by adjusting the height of the tool rest 11 on the tool rest base 13.
In this embodiment, in order to improve the versatility of the turning device 100, the adjustable supporting legs 40 are respectively disposed at the bottom corners of the machine table 30, and the adjustable supporting legs 40 are disposed on the base 35 at the bottom of the machine table 30, so as to adjust the overall height of the turning device 100 through the adjustable supporting legs 40, thereby adapting to the wafer polishing machines 200 with more specifications.
Compared with the prior art, the turning disc device 100 adopting the wafer polisher 200 shown in the present embodiment has the following beneficial effects:
by providing the turning disc device 100 which can be adapted according to the wafer polishing machine 200, when the turning disc device 100 is used, the driving assembly 23 is controlled to drive the turning disc mechanism 10 installed at the front end of the installation arm 22 to reciprocate, so that the turning disc 201 installed on the wafer polishing machine 200 can be turned by the turning tool 12 on the turning disc mechanism 10, the polishing disc 201 on the wafer polishing machine 200 is not required to be detached and processed, and the requirement that the polishing quality cannot be met when the polishing disc 201 is installed again after detaching and processing is avoided.
Example two
Referring to fig. 7, a turning method of a wafer polisher according to a second embodiment of the present invention is shown, where the turning method is applied to a turning device of the wafer polisher according to the above embodiment, and the turning method includes steps S10-S50:
step S10, providing a wafer polishing machine, wherein a polishing disk to be turned is arranged on the wafer polishing machine;
step S20, the reciprocating screw rod is driven to rotate by the driving motor so as to drive the turning tool in the turning disc device arranged on the mounting arm to an initial position on the polishing disc;
step S30, controlling the polishing disk to rotate through the wafer polishing machine;
step S40, adjusting the working height of the turning tool to enable the tool bit of the turning tool to contact the polishing disc at a first position, and setting the moving direction and the moving speed of the turning tool;
step S50, according to the set moving direction and moving speed of the turning tool, the driving of the driving motor drives the turning tool to move towards a second direction on the surface of the polishing disc so as to complete the disc turning of the polishing disc;
wherein one of the first position and the second position is located at the circumference of the central depression of the polishing disk, and the other is located at the circumference of the polishing disk.
Specifically, the method for turning a disc shown in this embodiment includes the following steps in an actual operation process:
1. the disc-shaped measuring scale is firstly placed on a flat marble reference plane to calibrate the scale, wherein 4 supporting screws below the measuring scale are in contact with the reference plane, a pointer of the measuring scale fixed in the middle is in contact with the marble reference plane, and the numerical value of the measuring scale is reset to zero.
2. Place the dish type and measure the scale on the polishing dish that needs the hull, circular pit position in the middle of the quotation need be avoided, measure 4 supporting screws below the scale and all need contact the upper surface of polishing quotation with the pointer of measuring the scale on, observe the pointer position of measuring the scale this moment, confirm that dish type numerical value A is the dish type value of whole quotation diameter direction, the hull offset amount is dish type numerical value A/2, if the relative zero-bit forward direction of step 1 of pointer is inclined to one side, it is protruding type to explain the dish type, otherwise the dish type is concave type, according to unsmooth numerical value, confirm whether need how much of hull and hull.
3. The turning disc device is moved to a corresponding position of a wafer polishing machine, the front-back moving direction of the mounting arm is ensured to be consistent with the middle radius direction of the disc surface of the polishing machine, the mounting arm is required to be ensured to be forward at the position where the turning disc device is placed, the turning tool can contact the middle starting position of the polishing disc, the mounting arm is backward, the turning tool can contact the end point position of the outer ring of the polishing disc, and 4 horizontal adjusting screws are adjusted to enable the body of the turning disc device to be horizontal, wherein the levelness is generally required to be 0.02 mm/m.
4. Turning on a water chiller switch of a wafer polishing machine, setting the water temperature of cooling circulating water of a polishing disc to be 18 ℃, starting for ten minutes, observing a display table of the surface temperature of the polishing machine again, and if the temperature is above or below, correspondingly reducing or increasing the set temperature of the water chiller to adjust the surface temperature of the polishing machine, and confirming that the surface temperature is 18 +/-0.5 ℃.
5. On an operation screen interface of a control mechanism, setting the moving speed of a mounting arm to be 2.5 mm/min, selecting to move forwards, pressing a starting button of the mounting arm, moving the mounting arm forwards, observing a tool nose of a turning tool and a pointer of a front and back horizontal measuring scale of the mounting arm, preventing the tool nose from colliding with a polishing disk, if the position is too high or too low, pressing a stopping button to pause the mounting arm, adjusting 4 horizontal adjusting screws, and if the difference is not large, adjusting a locking piece to change the position of the turning tool on a tool rest base.
6. And moving the mounting arm forwards to enable the tool tip of the turning tool and the pointer of the front and rear horizontal measuring scale of the mounting arm to be above the upper surface of the polishing disk.
7. When the tool point of the turning tool moves forwards to the outer circumferential edge of the middle position of the disc surface, the position point is X at the moment, the stop button is pressed down to stop the mounting arm, the locking piece is adjusted at the moment, the pointer of the horizontal measuring scale around the mounting arm is pressed onto the polishing disc surface, the value of the scale is observed, the pointer needs to reach 2mm when being pressed down, then the value of the scale is reset to zero, the value is B at the moment, and the tool point of the turning tool cannot touch the polishing disc surface at the moment.
8. The mounting arm is set to move at a rate of 2.5 mm/min and the back movement is selected to stop until the pointer of the horizontal measuring gauge is moved about 2mm from the outer circumferential edge of the polishing disk, the position being Y, and the value of the measuring gauge is observed, the value being C.
9. If the value B is larger than the value C, the rear of the whole lathe tool box body is lower, the limiting part needs to be adjusted upwards, the rear of the whole lathe tool box body is lifted upwards, otherwise, the distance from the position point X to the position point Y is approximately equal to the distance from the rotating connecting piece to the limiting part, the pointer of the first level scale of the lathe tool box body is reset to zero, then, when the limiting part is adjusted, the pointer display of the first level scale of the lathe tool box body is observed, and the adjusting direction and the adjusting amount are consistent with the direction and the adjusting amount of the value C-the value B.
10. And (4) repeating the steps 6-9, generally 1-2 times until the numerical value B and the numerical value C are equal to 0, and at the moment, adjusting the parallelism of the mounting arm and the surface of the polishing disk.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A turning disc device of a wafer polishing machine, wherein the turning disc device is used for cooperating with the wafer polishing machine to perform turning disc processing on a polishing disc installed on the wafer polishing machine, and the turning disc device comprises:
the polishing disc turning mechanism comprises a disc turning mechanism, wherein the disc turning mechanism comprises a tool holder, and at least one turning tool for disc turning processing of the polishing disc is mounted on the tool holder;
the driving mechanism comprises a box body, a mounting arm which is telescopically movable in the box body and a driving assembly for driving the mounting arm to reciprocate, and the turning disc mechanism is mounted at one end, far away from the driving assembly, of the mounting arm through the turning tool rest;
the machine platform is used for bearing the driving mechanism and the chassis mechanism;
the driving assembly comprises a driving motor and a reciprocating screw rod which is rotatably connected in the box body, two ends of the reciprocating screw rod are respectively connected to the driving motor and the mounting arm in a transmission mode, the mounting arm is driven to reciprocate along the axial direction of the reciprocating screw rod through the driving motor and the reciprocating screw rod, and therefore the polishing disc is driven to reciprocate by the disc turning mechanism mounted on the mounting arm so as to machine the polishing disc.
2. The turning disc device of the wafer polishing machine as claimed in claim 1, wherein the box body is rotatably connected to the machine table to change the working height of the turning tool, and a first limiting component is disposed on a side of the machine table away from a rotational connection position of the box body and the machine table to limit the degree of freedom of the turning of the box body on the machine table through the first limiting component.
3. The turning disc device of the wafer polishing machine as claimed in claim 2, wherein the machine table is provided with hinge seats at two sides of a rotary joint with the box body, and the box body is hinged to the hinge seats through a preset rotary connecting piece.
4. The apparatus of claim 2, wherein the first position-limiting assembly comprises a position-limiting member rotatably connected to an outwardly extending mounting plate of the machine, a top end of the position-limiting member abutting against a bottom surface of the box, and a first level gauge disposed on the box for determining a tilt of the box on the machine by the first level gauge.
5. The disc device of the wafer polishing machine according to claim 2, further comprising a second limiting component, wherein the second limiting component comprises a first positioning seat and a second positioning seat which are arranged on the machine table and respectively located at two sides of the box body, and a first positioning member and a second positioning member which are respectively rotatably connected to the first positioning seat and the second positioning seat, so that the box body is clamped by the first positioning member and the second positioning member, and the yaw degree of freedom of the box body is limited.
6. The turning device of the wafer polishing machine according to claim 1, wherein the turning mechanism further comprises a tool post base fixedly connected to the mounting arm, the turning tool post is slidably connected to the tool post base, and an axial position of the turning tool post on the tool post base is limited by a locking member provided on the tool post base.
7. The turning disc device of the wafer polishing machine as claimed in claim 1, wherein the bottom corners of the machine platform are respectively provided with adjustable supporting legs.
8. The turning disc device of the wafer polishing machine according to any one of claims 1 to 7, wherein one end of the mounting arm far away from the turning disc mechanism is hollow, a screw rod thread sleeve is fixedly arranged in the mounting arm, and the reciprocating screw rod penetrates into the mounting arm to be matched with the screw rod thread sleeve;
and a sliding assembly is arranged between the box body and the mounting arm, the sliding assembly comprises a sliding rail arranged in the box body and a sliding block arranged on the mounting arm, and the sliding rail is in sliding fit with the sliding block.
9. The turning disc device of the wafer polishing machine according to claim 8, wherein one end of the reciprocating screw rod, which is far away from the turning disc mechanism, penetrates out of the box body and is fixedly provided with a coupler, and transmission between the coupler and an output shaft of the driving motor is belt transmission.
10. A turning method of a wafer polisher, for use in the turning apparatus of the wafer polisher according to any one of claims 1 to 9, the turning method comprising:
providing a wafer polishing machine, wherein a polishing disc to be turned is arranged on the wafer polishing machine;
the reciprocating screw rod is driven to rotate by the driving motor so as to drive the turning tool in the turning disc device arranged on the mounting arm to an initial position on the polishing disc;
controlling the polishing disc to rotate through the wafer polishing machine;
adjusting the working height of the turning tool to enable a tool bit of the turning tool to contact the polishing disc at a first position, and setting the moving direction and the moving speed of the turning tool;
according to the set moving direction and moving speed of the turning tool, the driving motor drives the turning tool to move towards a second direction on the surface of the polishing disc so as to finish disc turning of the polishing disc;
wherein one of the first position and the second position is located at the circumference of the central depression of the polishing disk, and the other is located at the circumference of the polishing disk.
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| CN202210426833.9A CN114700506A (en) | 2022-04-22 | 2022-04-22 | Turning device and turning method of wafer polishing machine |
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| CN202210426833.9A CN114700506A (en) | 2022-04-22 | 2022-04-22 | Turning device and turning method of wafer polishing machine |
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| CN202210426833.9A Pending CN114700506A (en) | 2022-04-22 | 2022-04-22 | Turning device and turning method of wafer polishing machine |
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| JPS62162460A (en) * | 1986-01-07 | 1987-07-18 | Toshiba Mach Co Ltd | One-side polishing machine |
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