CN116652724A - Multi-station diamond substrate polishing device and processing method thereof - Google Patents
Multi-station diamond substrate polishing device and processing method thereof Download PDFInfo
- Publication number
- CN116652724A CN116652724A CN202310703069.XA CN202310703069A CN116652724A CN 116652724 A CN116652724 A CN 116652724A CN 202310703069 A CN202310703069 A CN 202310703069A CN 116652724 A CN116652724 A CN 116652724A
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- grinding head
- grinding
- polishing device
- grinding disc
- driving
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 47
- 239000010432 diamond Substances 0.000 title claims abstract description 47
- 238000005498 polishing Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 title claims abstract description 21
- 238000003672 processing method Methods 0.000 title abstract description 5
- 230000007246 mechanism Effects 0.000 claims abstract description 55
- 230000003044 adaptive effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 12
- 239000002699 waste material Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 7
- 230000001360 synchronised effect Effects 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract 1
- 230000006872 improvement Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 3
- 241001365789 Oenanthe crocata Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009931 pascalization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
- B24B49/165—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load for grinding tyres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention provides a multi-station diamond substrate polishing device and a processing method thereof, which relate to the technical field of precision machining and comprise a base, a main shaft mechanism and a plurality of feeding mechanisms, wherein the main shaft mechanism and the feeding mechanisms are arranged on the base; the main shaft mechanism comprises a grinding disc and a first driving piece used for driving the grinding disc to rotate; the feeding mechanism comprises a frame, a grinding head, a second driving piece and a third driving piece, wherein the second driving piece is used for driving the frame to move along the vertical direction, and the third driving piece is arranged on the frame, is used for being connected with the grinding head in an adaptive manner and can drive the grinding head to rotate; the surface of the grinding head facing the grinding disc is stuck with a plurality of diamond sheets to be processed; wherein, each driving piece is connected with the control piece electricity, and each feed mechanism is along the circumferencial direction array distribution of mill, and burnishing device is constructed to drive main shaft mechanism and feed mechanism cooperation operation through the control piece to the processing diamond piece of waiting on each bistrique is synchronous to polish processing on the mill, thereby promotes machining efficiency, optimizes the processing orbit.
Description
Technical Field
The invention relates to the technical field of precision machining, in particular to a multi-station diamond substrate polishing device and a machining method thereof.
Background
Diamond is an excellent engineering material, and is widely used because of its excellent properties of high hardness, stability, thermal conductivity, elastic modulus, electrical resistance, wide light transmission wavelength range, low friction coefficient, etc. Such as megawatt applications, modern machine tools, scalpels, polishing tools, etc., that raise the effective temperature of the fusion reaction. As the requirements of industrial applications on diamond size, surface precision and surface quality continue to increase, higher requirements are also being placed on polishing techniques. The existing single-chip diamond sheet has low processing efficiency, is difficult to meet market demands, and in addition, the grinding head of the existing diamond substrate polishing device cannot rotate, cannot optimize processing tracks, and is unfavorable for improving surface precision.
Disclosure of Invention
The invention discloses a multi-station diamond substrate polishing device, and aims to solve the problems that the existing diamond substrate polishing device is low in processing efficiency and cannot optimize processing track.
The invention adopts the following scheme:
a multi-station diamond substrate polishing device comprises a base, a main shaft mechanism and a plurality of feeding mechanisms, wherein the main shaft mechanism and the feeding mechanisms are arranged on the base; the main shaft mechanism comprises a grinding disc and a first driving piece used for driving the grinding disc to rotate; the feeding mechanism comprises a frame, a grinding head, a second driving piece and a third driving piece, wherein the second driving piece is used for driving the frame to move along the vertical direction, and the third driving piece is arranged on the frame, is used for being connected with the grinding head in an adaptive manner and can drive the grinding head to rotate; the surface of the grinding head facing the grinding disc is stuck with a plurality of diamond sheets to be processed;
each driving piece is electrically connected with a control piece, each feeding mechanism is distributed along the circumferential direction of the grinding disc in an array mode, and the polishing device is configured to drive the main shaft mechanism and the feeding mechanisms to work cooperatively through the control piece so that diamond sheets to be processed on each grinding head can be polished and processed on the grinding disc synchronously.
As a further improvement, a thickness gauge for detecting the consumption of the grinding disc is arranged on the base.
As a further improvement, an installation groove is penetrated and arranged along the center of the base, a collecting barrel is arranged in the installation groove, a waste outlet is arranged at the bottom of the collecting barrel, and the grinding disc is arranged at the top of the collecting barrel and is exposed out of the base.
As a further improvement, the first driving piece is arranged in the collecting barrel and comprises a motor I, and a motor I rotating shaft is connected with the grinding disc through a connecting piece.
As a further improvement, the second driving piece comprises a second motor, a ball screw and a coupler for connecting the second motor and the ball screw, wherein a moving block is sleeved on the ball screw and used for being connected with an assembly part of the frame, so that the second motor drives the ball screw to rotate and drives the frame to move up and down.
As a further improvement, the two sides of the frame are provided with assembling parts, and two second driving parts are symmetrically arranged along the center of the frame.
As a further improvement, the third driving piece comprises a third motor and a gear box, and a pressure sensor is arranged in the gear box.
As a further improvement, one end of the grinding head is sleeved on the output shaft of the gear box, and a plurality of diamond sheets to be processed are adhered to the other end of the grinding head.
As a further improvement, the feeding mechanism is provided with a water pipe, and the outlet of the water pipe is limited by a fixer so as to be opposite to the millstone.
The processing method applied to the multi-station diamond substrate polishing device comprises the following steps:
s1: adhering a diamond sheet to be processed to the bottom of the grinding head;
s2: the grinding head is connected with a third driving piece in an adapting way;
s3: the control part drives the feeding mechanism to operate, so that the grinding head moves downwards and contacts with the grinding disc, and the position height during contact is recorded;
s4: lifting the grinding head, and setting parameters of grinding thickness, grinding disc rotating speed, feeding speed and grinding head pressure;
s5: the control part drives the spindle mechanism to operate, the grinding disc rotates, and the grinding head descends and grinds at a preset feeding speed;
s6: when the pressure detected by the pressure sensor reaches a preset threshold value, the feeding mechanism stops descending, and the millstone continues to rotate for 15s;
s7: the grinding disc and the grinding head are stopped, and the polished diamond sheet is taken down.
By adopting the technical scheme, the invention can obtain the following technical effects:
1. through the feed mechanism that sets up a plurality of bistriques on the circumferencial direction array at the mill, and all paste a plurality of diamond pieces that wait to process on each bistrique, drive in order to make each diamond piece that wait to process synchronous processing of polishing on the mill through the control to improve polishing device's machining efficiency. In addition, the third driving piece can drive the grinding head to rotate, namely, in the grinding process of the grinding disc, the grinding head can optimize the processing track through rotation so as to improve the processing quality and the processing precision of the grinding surface.
2. A thickness gauge is provided to monitor the wear of the abrasive disc in real time to ensure the accuracy of the grinding.
3. The second driving parts are symmetrically arranged on two sides of the frame, so that the rigidity of the output shaft can be improved, high-pressure processing can be realized, and stable movement is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIGS. 1 and 2 are schematic views of an embodiment of the present invention at different viewing angles;
FIG. 3 is a cross-sectional view of one embodiment of the present invention;
FIG. 4 is a schematic view of a hidden feed mechanism according to one embodiment of the present invention;
FIG. 5 is a cross-sectional view of FIG. 4 along one of the cross-sections;
fig. 6 to 8 are schematic structural views of a feeding mechanism according to an embodiment of the present invention at different viewing angles;
fig. 9 and 10 are cross-sectional views of a feed mechanism according to one embodiment of the present invention taken along different cross-sections.
Icon:
1-a base; 11-collecting barrels; 111-waste outlet;
2-a spindle mechanism; 21-grinding disc; 22-motor number one; 23-connecting piece;
3-a feeding mechanism; 31-a frame; 311-fitting part; 32-grinding head; 33-motor number two; 34-ball screw; 341-a moving block; 35-coupling; 36-a base; 361-a guide rail; 37-motor number three; 38-a gearbox; 381-output shaft; 39-nut;
4-diamond chips;
5-a water pipe; 51-a holder;
6-a thickness measuring instrument;
7-console.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.
Examples
Referring to fig. 1 to 10, the present embodiment provides a multi-station diamond substrate polishing apparatus including a base 1, and a spindle mechanism 2 and a plurality of feed mechanisms 3 arranged on the base 1. The spindle mechanism 2 comprises a grinding disc 21 and a first driving piece for driving the grinding disc 21 to rotate; the feeding mechanism 3 comprises a frame 31, a grinding head 32, a second driving piece and a third driving piece, wherein the second driving piece is used for driving the frame 31 to move along the vertical direction, and the third driving piece is arranged on the frame 31, is used for being connected with the grinding head 32 in an adapting way and can drive the grinding head 32 to rotate; the surface of the grinding head 32 facing the grinding disc 21 is coated with a plurality of diamond chips 4 to be processed. Wherein each driving piece is electrically connected with the control piece, each feeding mechanism 3 is distributed along the circumferential direction array of the grinding disc 21, and the polishing device is configured to drive the main shaft mechanism 2 and the feeding mechanism 3 to work cooperatively through the control piece so as to synchronously grind and process the diamond sheet 4 to be processed on each grinding head 32 on the grinding disc 21.
Specifically, run through along the center of base 1 and be equipped with the mounting groove, be equipped with in the mounting groove and be used for collecting the bucket 11 that gathers materials of polishing waste material, the bottom of bucket 11 that gathers materials is equipped with waste outlet 111, mill 21 is installed at the top of bucket 11 that gathers materials, and expose in base 1, waste materials such as the abrasive dust that the process of polishing produced fall to the bucket along the inner wall of bucket 11 that gathers materials along with mill 21 pivoted in-process receives centrifugal force, and set up transparent viewing aperture on the outer wall of bucket 11 that gathers materials, when the waste material reaches certain height, open waste outlet 111, so that the waste material flows, the waste material clearance in the convenient course of working.
The first driving part is arranged in the collecting barrel 11 and comprises a first motor 22, and the rotating shaft of the first motor 22 is connected with the grinding disc 21 through a connecting part 23. The second drive member includes a motor No. 33, a ball screw 34, and a coupling 35 for connecting the two. For example, the second motor 33 is mounted on the top of the base 36, the ball screw 34 is disposed below the second motor 33 and connected to the second motor 33 through the coupling 35, the ball screw 34 is sleeved with a moving block 341, the moving block 341 has a threaded hole adapted to the ball screw 34, two sides of the base 36 are provided with guide rails 361, and the mounting portion 311 of the frame 31 is adapted to the guide rails 361 and fixedly connected to the moving block 341, so that when the second motor 33 drives the ball screw 34 to rotate, the circular motion is converted into the up-down movement of the frame 31. The two sides of the frame 31 are respectively provided with an assembling part 311, and two second driving parts are symmetrically arranged along the center of the frame 31 so as to ensure that the frame 31 moves stably and is stressed uniformly.
The third driving member includes a motor No. 37 and a gear case 38, and a pressure sensor is disposed in the gear case 38. One end of the grinding head 32 is sleeved on an output shaft 381 of the gear box 38, and a plurality of diamond plates 4 to be processed are stuck on the other end. The output shaft 381 is provided with a limiting part, the grinding head 32 is provided with a limiting groove corresponding to the limiting part, the limiting part is clamped and limited with the limiting groove, and the periphery of the grinding head 32 is locked with the output shaft 381 through a nut 39. It should be noted that, the gear box 38 may amplify or reduce the rotation speed of the third motor 37 to achieve the stability of the rotation speed, and the pressure sensor is electrically connected to the control element to feed back the pressure in real time. The circuit principle of the pressure sensor is the prior art, and is not described herein.
Further, the feeding mechanism 3 is provided with the water pipe 5, the outlet of the water pipe 5 is limited by the fixer 51 to be opposite to the grinding disc 21, and the water pipe 5 can drop water to reduce the temperature during grinding and improve the grinding quality.
In the embodiment, the feeding mechanism 3 of the grinding heads 32 is arranged in the circumferential direction of the grinding disc 21 in an array manner, and a plurality of diamond sheets 4 to be processed are adhered to each grinding head 32, so that each diamond sheet 4 to be processed is driven by a control member to synchronously polish and process on the grinding disc 21, and the processing efficiency of the polishing device is improved. In addition, the third driving member can drive the grinding head 32 to rotate, namely, during the grinding process of the grinding disc 21, the grinding head 32 can optimize the machining track through rotation so as to improve the machining quality and precision of the grinding surface. It should be mentioned that the circuit principle between the control element and each driving element is the prior art, and will not be described herein.
In an alternative embodiment of the present invention, based on the above embodiment, the thickness gauge 6 for detecting the consumption of the grinding disc 21 is provided on the base 1, so as to control the processing process of the diamond sheet 4.
The processing method applied to the multi-station diamond substrate polishing device comprises the following steps:
s1: attaching a diamond sheet 4 to be processed to the bottom of the grinding head 32;
s2: the grinding head 32 is connected with the third driving piece in an adapting way;
s3: the control member drives the feeding mechanism 3 to operate, so that the grinding head 32 moves downwards and contacts the grinding disc 21, and the position height when in contact is recorded;
s4: lifting the grinding head 32, and setting parameters such as grinding thickness, grinding disc 21 rotating speed, feeding speed, grinding head 32 pressure and rotating speed;
s5: the control part drives the main shaft mechanism 2 to operate, the grinding disc 21 rotates, meanwhile, the grinding head 32 descends according to a preset feeding speed to grind, and the grinding head 32 descends along with the frame 31 and synchronously rotates under the drive of the third driving part;
s6: when the pressure detected by the pressure sensor reaches a preset threshold value, the feeding mechanism 3 stops descending, and the grinding disc 21 continues to rotate the polishing mill for 15s;
s7: the grinding table 21 and the grinding head 32 are stopped and the ground diamond sheet 4 is removed.
Further, step S6 further includes, when the pressure detected by the pressure sensor does not reach the preset threshold, judging whether the polishing thickness is reached, if so, stopping the polishing 15S, and if not, continuing to lower the feeding mechanism 3 until the detected pressure reaches the threshold or the polishing thickness reaches the requirement. Thereby avoiding excessive sanding. It should be noted that, each feeding mechanism 3 may be controlled by a console 7 in a one-to-one correspondence or by an integrally combined control panel, which is not particularly limited.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention.
Claims (10)
1. The multi-station diamond substrate polishing device is characterized by comprising a base, a main shaft mechanism and a plurality of feeding mechanisms, wherein the main shaft mechanism and the feeding mechanisms are arranged on the base; the main shaft mechanism comprises a grinding disc and a first driving piece used for driving the grinding disc to rotate; the feeding mechanism comprises a frame, a grinding head, a second driving piece and a third driving piece, wherein the second driving piece is used for driving the frame to move along the vertical direction, and the third driving piece is arranged on the frame, is used for being connected with the grinding head in an adaptive manner and can drive the grinding head to rotate; the surface of the grinding head facing the grinding disc is stuck with a plurality of diamond sheets to be processed;
each driving piece is electrically connected with a control piece, each feeding mechanism is distributed along the circumferential direction of the grinding disc in an array mode, and the polishing device is configured to drive the main shaft mechanism and the feeding mechanisms to work cooperatively through the control piece so that diamond sheets to be processed on each grinding head can be polished and processed on the grinding disc synchronously.
2. The multi-station diamond substrate polishing device according to claim 1, wherein a thickness gauge for detecting a consumption amount of the abrasive disc is provided on the base.
3. The multi-station diamond substrate polishing device according to claim 1, wherein an installation groove is penetrated along the center of the base, a collecting barrel is arranged in the installation groove, a waste outlet is arranged at the bottom of the collecting barrel, and the grinding disc is arranged at the top of the collecting barrel and is exposed out of the base.
4. A multi-station diamond substrate polishing device according to claim 3, wherein the first driving member is disposed in the collecting barrel and comprises a motor, and a rotating shaft of the motor is connected with the grinding disc through a connecting member.
5. The multi-station diamond substrate polishing device according to claim 2, wherein the second driving member comprises a second motor, a ball screw and a coupling for connecting the second motor and the ball screw, the ball screw is sleeved with a moving block, and the moving block is used for being connected with an assembly part of the frame, so that when the second motor drives the ball screw to rotate, the frame is driven to move up and down.
6. A multi-station diamond substrate polishing device according to claim 4, wherein the two sides of the frame are provided with assembling portions, and two second driving members are symmetrically arranged along the center of the frame.
7. A multi-station diamond substrate polishing device according to claim 4, wherein the third driving member comprises a No. three motor and a gear box, and a pressure sensor is disposed in the gear box.
8. The multi-station diamond substrate polishing device according to claim 7, wherein one end of the grinding head is sleeved on the output shaft of the gear box, and a plurality of diamond sheets to be processed are adhered to the other end of the grinding head.
9. A multi-station diamond substrate polishing device according to claim 1, wherein a water pipe is arranged on the feeding mechanism, and an outlet of the water pipe is limited by a fixer so as to be opposite to the grinding disc.
10. A method for processing a multi-station diamond substrate polishing apparatus according to claim 8, comprising the steps of:
s1: adhering a diamond sheet to be processed to the bottom of the grinding head;
s2: the grinding head is connected with a third driving piece in an adapting way;
s3: the control part drives the feeding mechanism to operate, so that the grinding head moves downwards and contacts with the grinding disc, and the position height during contact is recorded;
s4: lifting the grinding head, and setting parameters of grinding thickness, grinding disc rotating speed, feeding speed and grinding head pressure;
s5: the control part drives the spindle mechanism to operate, the grinding disc rotates, and the grinding head descends and grinds at a preset feeding speed;
s6: when the pressure detected by the pressure sensor reaches a preset threshold value, the feeding mechanism stops descending, and the millstone continues to rotate for 15s;
s7: the grinding disc and the grinding head are stopped, and the polished diamond sheet is taken down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310703069.XA CN116652724A (en) | 2023-06-14 | 2023-06-14 | Multi-station diamond substrate polishing device and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310703069.XA CN116652724A (en) | 2023-06-14 | 2023-06-14 | Multi-station diamond substrate polishing device and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116652724A true CN116652724A (en) | 2023-08-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310703069.XA Pending CN116652724A (en) | 2023-06-14 | 2023-06-14 | Multi-station diamond substrate polishing device and processing method thereof |
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| CN (1) | CN116652724A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117381640A (en) * | 2023-12-11 | 2024-01-12 | 湖南戴斯光电有限公司 | Automatic polishing device for laser gyroscope cavity |
-
2023
- 2023-06-14 CN CN202310703069.XA patent/CN116652724A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117381640A (en) * | 2023-12-11 | 2024-01-12 | 湖南戴斯光电有限公司 | Automatic polishing device for laser gyroscope cavity |
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