CN114683227B - Wafer carrying platform - Google Patents
Wafer carrying platform Download PDFInfo
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- CN114683227B CN114683227B CN202210318982.3A CN202210318982A CN114683227B CN 114683227 B CN114683227 B CN 114683227B CN 202210318982 A CN202210318982 A CN 202210318982A CN 114683227 B CN114683227 B CN 114683227B
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- Prior art keywords
- carrier
- adapter plate
- fork
- carrying platform
- piston
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/14—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting the bench top
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer loading platform, which belongs to the field of high-precision machines, and a centering fork mechanism comprises a limiting fork, a guide wheel shaft, a push plate, a piston adapter plate, a piston rod, a cylinder body and a driving cylinder adapter plate; the guide wheel shaft is driven by the piston rod to move up and down relative to the limiting fork through the piston adapter plate and the push plate; the wafer carrying platform comprises a carrying platform main shaft, a carrying disk, a carrying platform base, a carrying platform air floatation anchor, a carrying disk brake assembly, a main shaft elastic support assembly and a centering assembly; the aligning component adopts the aligning fork mechanism, is arranged between the carrier platform base and the carrier disc and is used for passive aligning resetting of the carrier disc; through the centering fork mechanism and the wafer carrying platform, wafers and silicon wafers can be flexibly supported in a suspending manner to wait for detection or wait for processing, and the passively rotating carrying disk is reset, so that the cost is reduced, the precision and the stability of the carrying platform are ensured, and the centering fork mechanism and the wafer carrying platform are convenient to popularize and apply in the fields of semiconductor quantity detection and high-precision processing with moving tables.
Description
Technical Field
The invention belongs to the field of high-precision machines, and particularly relates to a wafer carrier.
Background
In the detection and processing technology, a stable workbench is generally required, the workbench is generally supported on the bottom surface through a rack or feet and serves as a carrying disc of a material bearing part, and an auxiliary mechanism is required to reset and return to the right under the condition of non-active driving. However, in the conventional stage, passive rotation (no rotation drive shaft) does not occur, and therefore, an auxiliary mechanism for returning to the positive position needs to be provided for the passively rotating carrier disk.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a centering fork mechanism and a wafer carrier, which can solve the problems.
A centering fork mechanism comprises a limiting fork, a guide wheel shaft, a push plate, a piston adapter plate, a piston rod, a cylinder body and a driving cylinder adapter plate; the upper end of the limiting fork is fixed to the part to be corrected, and the lower end of the limiting fork is provided with a guide port; the guide wheel shaft is vertically fixed to the upper end of the push plate, and the axis of the guide wheel shaft is over against the guide port of the limiting fork; the lower part of the push plate is connected with the tail end of the piston rod through the piston adapter plate; the rod body of the piston rod is sleeved in the cylinder body, and the tail end of the cylinder body is fixedly connected to the driving cylinder adapter plate; the guide wheel shaft is driven by the piston rod to move up and down relative to the limiting fork through the piston adapter plate and the push plate.
Further, return and just fork mechanism still includes the support subassembly that slides that sets up between push pedal and drive cylinder keysets, the support subassembly that slides includes linear rail and slider, the bottom surface of linear rail is fixed extremely on the drive cylinder keysets, what the track of linear rail slided cup joints to in the guide slot of slider, the upper surface of slider is fixed extremely the bottom surface of push pedal.
Furthermore, the aligning fork mechanism further comprises an in-place sensor, an induction sheet is arranged on the push plate or the piston adapter plate, and the induction sheet and the in-place sensor are matched to induce the lifting height of the piston rod.
The invention also provides a wafer carrier, which comprises a carrier main shaft, a carrier disc, a carrier base, a carrier air floatation anchor, a carrier disc brake component, a main shaft elastic supporting component and a correcting component; wherein the main shaft of the carrier adopts a lifting shaft; the carrier spindle is vertically arranged in a bearing hole formed in the carrier base; the carrier base is supported on the frame in a floating or sliding manner through a plurality of carrier air floatation anchors; the middle part of the bottom surface of the carrier disc is fixed to the top surface of the carrier table main shaft, and the carrier disc is driven to move up and down through the carrier table main shaft; the plurality of carrying disc brake assemblies are arranged between the carrying platform base and the carrying disc and are used for braking the carrying disc; the main shaft elastic support assembly is used for elastically connecting the carrier main shaft with the carrier base so as to enhance the stability of the carrier main shaft;
the aligning component adopts the aligning fork mechanism, is arranged between the carrier base and the carrier disc and is used for passive aligning resetting of the carrier disc.
Compared with the prior art, the invention has the beneficial effects that: through the aligning fork mechanism and the wafer carrying platform, wafers and silicon wafers can be flexibly supported in a suspended mode to wait for detection or to-be-processed parts, aligning reset is provided for the passively rotating carrying disk, cost is reduced, precision and stability of the carrying platform are guaranteed, and the aligning fork mechanism and the wafer carrying platform are convenient to popularize and apply in the fields of semiconductor mass detection and high-precision processing with moving platforms.
Drawings
FIG. 1 is an assembly schematic of a centering fork mechanism;
FIG. 2 is a schematic view of another embodiment of a centering fork mechanism;
FIG. 3 is a front view of the return fork mechanism;
FIG. 4 is a schematic view of one embodiment of a wafer carrier;
FIG. 5 is a schematic view of another embodiment of a wafer carrier;
in the figure:
100. a return fork mechanism;
1. a limiting fork;
2. a guide wheel shaft;
3. pushing the plate;
4. a piston adapter plate; 41. a Z-shaped extension;
5. a piston rod;
6. a cylinder body;
7. a drive cylinder adapter plate; 71. a sensor mounting portion;
8. a wire track;
9. a slider;
10. an in-position sensor;
10000. a wafer carrier;
1000. a stage main shaft;
2000. a carrying tray;
3000. a carrier base;
4000. carrying platform air floatation anchor;
5000. a carrier disc brake assembly;
6000. a main shaft elastic support component;
7000. a correcting component;
8000. a bearing platform outer end component;
9000. the carrier closing plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Centering fork mechanism
In an example of a centering fork mechanism, referring to fig. 1, a centering fork mechanism 100 includes a limit fork 1, a guide wheel shaft 2, a push plate 3, a piston adapter plate 4, a piston rod 5, a cylinder body 6, and a drive cylinder adapter plate 7.
The upper end of the limiting fork 1 is fixed to a part to be corrected, and the lower end of the limiting fork 1 is provided with a guide opening.
The guide wheel shaft 2 is vertically fixed to the upper end of the push plate 3, and the axis of the guide wheel shaft is over against the guide opening of the limiting fork 1.
The lower part of the push plate 3 is connected with the tail end of the piston rod 5 through the piston adapter plate 4.
The rod body of the piston rod 5 is sleeved in the cylinder body 6, and the tail end of the cylinder body 6 is fixedly connected to the driving cylinder adapter plate 7. The guide wheel shaft 2 is driven by the piston rod 5 to move up and down relative to the limit fork 1 through the piston adapter plate 4 and the push plate 3.
Wherein, the guide opening of the spacing fork 1 is V-shaped or Y-shaped.
Wherein, the driving mode of the cylinder body 6 comprises an air cylinder, a hydraulic cylinder or an electric cylinder, and the air cylinder is preferentially adopted.
In order to improve the lifting stability, the centering fork mechanism 100 further comprises a supporting sliding assembly arranged between the push plate 3 and the driving cylinder adapter plate 7, the supporting sliding assembly comprises a linear rail 8 and a sliding block 9, the bottom surface of the linear rail 8 is fixed on the driving cylinder adapter plate 7, the rail of the linear rail 8 is slidably sleeved in a guide groove of the sliding block 9, and the upper surface of the sliding block 9 is fixed on the bottom surface of the push plate 3.
Referring to fig. 2 and 3, in another embodiment, the centering fork mechanism 100 further includes an in-position sensor 10, and a sensing piece is disposed on the push plate 3 or the piston adapter plate 4, and cooperates with the in-position sensor 10 to sense the lifting height of the piston rod 5.
The piston adapter plate 4 is L-shaped and is connected with the push plate 3 and the piston rod 5 through bolts; the main body of the driving cylinder adapter plate 7 is L-shaped, the bottom surface of the driving cylinder adapter plate is connected to the rack or the base, and the driving cylinder adapter plate is connected with the cylinder body 6 through bolts. In order to install the position sensor 10, a Z-shaped extension part 41 is integrally arranged on the side edge of the piston adapter plate 4 to form the sensing piece; correspondingly, the driving cylinder adapter plate 7 and the sensing piece extend in the same direction to form a sensor mounting part 71.
Wafer carrying platform
A wafer carrier 10000, see fig. 4, which includes a carrier spindle 1000, a carrier disc 2000, a carrier base 3000, a carrier air floatation anchor 4000, a carrier disc brake assembly 5000, a spindle elastic support assembly 6000, and a return-to-center assembly 7000; wherein, the aligning unit 7000 adopts the aforementioned aligning fork mechanism 100
Arrangement relation: the carrier main shaft 1000 adopts a lifting shaft; the carrier spindle 1000 is vertically arranged in a bearing hole formed in the carrier base 3000; the stage base 3000 is supported on the frame by floating or sliding via a plurality of stage air floatation anchors 4000; the middle part of the bottom surface of the carrier disc 2000 is fixed to the top surface of the carrier spindle 1000, and the carrier disc 2000 is driven to move up and down by the carrier spindle 1000; a plurality of carrier disc brake assemblies 5000 are arranged between the carrier table base 3000 and the carrier disc 2000, and are used for braking the carrier disc 2000; the spindle elastic support assembly 6000 is used for elastically connecting the stage spindle 1000 with the stage base 3000 so as to enhance the stability of the stage spindle 1000; the aligning member 7000 is disposed between the stage base 3000 and the boat 2000, and is used for passive aligning and resetting of the boat 2000.
Further, the wafer carrier 10000 further includes two horizontal limiting members, and the two horizontal limiting members are disposed at two horizontal ends of the carrier base.
In another embodiment, referring to fig. 5, wafer carrier 10000 further comprises a carrier outer end component 8000 and a carrier closure plate 9000.
The stage closing plate 9000 is connected to the stage base 3000 and the stage outer end component 8000 in a straddling manner from the top, and the lower space is used for arranging an X-axis beam.
Other functional structures, not shown, such as brake band assemblies, may be mounted on the stage closure plate 9000 in this embodiment.
Further, two sets of beam stop air-floating pads are arranged on two opposite surfaces of the stage base 3000 and the stage outer end assembly 8000, and are used for supporting beams and the like arranged below the stage closing plate 9000.
The carrier can be used for not only wafers but also high-precision support of other similar plate products, and can be applied to high-precision detection and processing machines, such as machines of quantity detection machines of semiconductor wafers and photovoltaic wafers, high-precision measuring mechanisms, three-coordinate measuring machines and the like, so that stable supporting, vibration absorption and positioning effects are improved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A wafer carrier is characterized in that: the wafer carrier (10000) comprises a carrier spindle (1000), a carrying disc (2000), a carrier base (3000), carrier air floatation feet (4000), a carrying disc brake assembly (5000), a spindle elastic support assembly (6000) and a correcting assembly (7000);
wherein the carrier main shaft (1000) adopts a lifting shaft; the carrier spindle (1000) is vertically arranged in a bearing hole formed in the carrier base (3000);
the carrier base (3000) is supported on the frame in a floating or sliding manner through a plurality of carrier air floatation anchors (4000);
the middle part of the bottom surface of the carrier disc (2000) is fixed to the top surface of the carrier spindle (1000), and the carrier disc (2000) is driven to move up and down through the carrier spindle (1000);
the carrier disc brake assemblies (5000) are arranged between the carrier table base (3000) and the carrier disc (2000) and used for braking the carrier disc (2000);
the main shaft elastic supporting assembly (6000) is used for elastically connecting the carrying platform main shaft (1000) with the carrying platform base (3000) so as to enhance the stability of the carrying platform main shaft (1000);
the aligning component (7000) is arranged between the carrier base (3000) and the carrier disc (2000) and is used for passive aligning and resetting of the carrier disc (2000); the correcting assembly (7000) is provided with a correcting fork mechanism (100), and the correcting fork mechanism (100) comprises a limiting fork (1), a guide wheel shaft (2), a push plate (3), a piston adapter plate (4), a piston rod (5), a cylinder body (6) and a driving cylinder adapter plate (7);
the upper end of the limiting fork (1) is fixed to a to-be-righted piece, and the lower end of the limiting fork (1) is provided with a guide opening; the guide wheel shaft (2) is vertically fixed to the upper end of the push plate (3), and the axis of the guide wheel shaft is over against the guide opening of the limiting fork (1); the lower part of the push plate (3) is connected with the tail end of the piston rod (5) through the piston adapter plate (4); the rod body of the piston rod (5) is sleeved in the cylinder body (6), and the tail end of the cylinder body (6) is fixedly connected to the driving cylinder adapter plate (7); the guide wheel shaft (2) is driven by the piston rod (5) through the piston adapter plate (4) and the push plate (3) to move up and down relative to the limiting fork (1).
2. The wafer carrier of claim 1, wherein: the guide opening of the limiting fork (1) is V-shaped or Y-shaped.
3. The wafer carrier of claim 1, wherein: the driving mode of the cylinder body (6) comprises an air cylinder, a hydraulic cylinder or an electric cylinder.
4. The wafer carrier of claim 1, wherein: the centering fork mechanism (100) further comprises a supporting sliding assembly arranged between the push plate (3) and the driving cylinder adapter plate (7), the supporting sliding assembly comprises a linear rail (8) and a sliding block (9), the bottom surface of the linear rail (8) is fixed to the driving cylinder adapter plate (7), the rail of the linear rail (8) slides and is sleeved in a guide groove of the sliding block (9), and the upper surface of the sliding block (9) is fixed to the bottom surface of the push plate (3).
5. The wafer carrier of claim 1, wherein: the aligning fork returning mechanism (100) further comprises an in-place sensor (10), an induction sheet is arranged on the push plate (3) or the piston adapter plate (4), and the induction sheet and the in-place sensor (10) are matched to induce the lifting height of the piston rod (5).
6. The wafer carrier as claimed in claim 5, wherein: and a Z-shaped extension part (41) is integrally arranged on the side edge of the piston adapter plate (4) to form the sensing piece.
7. The wafer carrier as claimed in claim 6, wherein: the driving cylinder adapter plate (7) and the sensing sheet extend in the same direction and are arranged on the sensor mounting portion (71).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210318982.3A CN114683227B (en) | 2022-03-29 | 2022-03-29 | Wafer carrying platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210318982.3A CN114683227B (en) | 2022-03-29 | 2022-03-29 | Wafer carrying platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114683227A CN114683227A (en) | 2022-07-01 |
| CN114683227B true CN114683227B (en) | 2023-01-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210318982.3A Active CN114683227B (en) | 2022-03-29 | 2022-03-29 | Wafer carrying platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114683227B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116525515A (en) * | 2023-05-30 | 2023-08-01 | 苏州天准科技股份有限公司 | Carrier device with circumferential positioning function |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB923864A (en) * | 1960-05-12 | 1963-04-18 | Secr Aviation | Aircraft ground handling equipment |
| US8446569B2 (en) * | 2009-06-19 | 2013-05-21 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
| CN204339630U (en) * | 2014-12-10 | 2015-05-20 | 烟台汇众汽车底盘***有限公司 | A kind of tensioner positioner |
| CN208826560U (en) * | 2018-07-27 | 2019-05-07 | 冯肃钢 | A kind of rotary table |
| CN215525889U (en) * | 2021-07-06 | 2022-01-14 | 深圳市森美协尔科技有限公司 | Turntable fine adjustment mechanism and probe station comprising same |
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2022
- 2022-03-29 CN CN202210318982.3A patent/CN114683227B/en active Active
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| Publication number | Publication date |
|---|---|
| CN114683227A (en) | 2022-07-01 |
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