CN114683226B - Disc brake mechanism and wafer carrying platform - Google Patents
Disc brake mechanism and wafer carrying platform Download PDFInfo
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- CN114683226B CN114683226B CN202210317570.8A CN202210317570A CN114683226B CN 114683226 B CN114683226 B CN 114683226B CN 202210317570 A CN202210317570 A CN 202210317570A CN 114683226 B CN114683226 B CN 114683226B
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- disc
- brake
- base
- carrier
- disc brake
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
- B25H1/14—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby with provision for adjusting the bench top
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H1/00—Work benches; Portable stands or supports for positioning portable tools or work to be operated on thereby
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a disc brake mechanism and a wafer carrier, belonging to the field of high-precision machines.A disc brake mechanism comprises a base brake actuating unit and a carrier disc lower connecting unit which are arranged in an overlapped manner, wherein the base brake actuating unit is fixed above a base; the base brake actuating unit is used for actuating the attraction or separation of the lower connecting unit of the carrying disc so as to realize whether the carrying disc is braked or not; the wafer carrying platform comprises a carrying platform main shaft, a carrying disk, a carrying platform base, a carrying platform air floatation anchor, a carrying disk brake assembly, a main shaft elastic support assembly and a centering assembly; the disc brake mechanism is arranged between the carrier platform base and the carrier disc and used for passive braking and positioning of the carrier disc; the invention provides a brake positioning function for the passively rotating carrier disc, reduces the cost, ensures the precision and the stability of the carrier table, and is convenient to popularize and apply in the fields of semiconductor quantity detection and high-precision processing with moving tables.
Description
Technical Field
The invention belongs to the field of high-precision machines, and particularly relates to a disc brake mechanism and a wafer carrying platform.
Background
In the detection and processing technology, a stable workbench is generally required, the workbench is generally supported on a bottom surface through a rack or a foot, and is used as a carrying disc of a material carrying part, and an auxiliary mechanism is required to perform braking positioning under the condition of non-active driving. However, in the conventional stage, passive rotation (no rotation drive shaft) does not occur, and therefore, a brake positioning assist mechanism needs to be provided for the passively rotating carrier plate.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a disk brake mechanism and a wafer carrier, which can solve the problems.
A disc brake mechanism comprises a base brake actuating unit and a carrying disc lower connecting unit which are arranged in an overlapped mode, wherein the base brake actuating unit is fixed above a base, and the carrying disc lower connecting unit is connected with a carrying disc from the lower side of the carrying disc; the base brake actuating unit is used for actuating to attract or separate the lower connecting unit of the carrying disc so as to realize whether the carrying disc is braked or not.
Further, the base brake actuating unit comprises a disc brake base, a disc brake reed, a reed clamp and a disc brake actuating piece; the disc brake base is concave in the middle and convex at two ends, the outer ends of disc brake reeds are fixed to two ends of the disc brake base, and the disc brake reeds are connected with the disc brake actuator through the reed clamps so that the disc brake actuator is elastically supported above the middle of the disc brake base.
Furthermore, the lower connection unit of the carrier disc comprises a brake pad and a brake pad adapter; and the two ends of the brake pad are fixedly connected with the carrying disc through the brake pad adapter.
Furthermore, base brake actuating unit still includes two brake stoppers the one end of brake stopper sets up limiting flange the spacing groove is seted up to the side of reed clamp, and the bottom surface of brake stopper is fixed to the both ends of dish base of stopping inboard to make limiting flange gomphosis extremely in the spacing groove.
Furthermore, the side edge of the plate of the brake pad is an arc-shaped edge matched with the carrying disc.
The invention also provides a wafer carrier, which comprises a carrier main shaft, a carrier disc, a carrier base, carrier air floatation feet, a carrier disc brake component, a main shaft elastic support component and a correcting component; wherein the main shaft of the carrier adopts a lifting shaft; the carrier spindle is vertically arranged in a bearing hole formed in the carrier base; the carrier base is supported on the frame in a floating or sliding manner through a plurality of carrier air floatation feet; the middle part of the bottom surface of the carrier disc is fixed to the top surface of the carrier table main shaft, and the carrier disc is driven to move up and down through the carrier table main shaft; the plurality of carrying disc brake assemblies are arranged between the carrying platform base and the carrying disc and used for braking the carrying disc; the main shaft elastic supporting assembly is used for elastically connecting the main shaft of the carrying platform with the base of the carrying platform so as to enhance the stability of the main shaft of the carrying platform; the carrier disc brake assembly adopts the disc brake mechanism, and the disc brake mechanism is arranged between the carrier base and the carrier disc and used for passive brake positioning of the carrier disc.
Compared with the prior art, the invention has the beneficial effects that: by the aid of the disc brake mechanism and the wafer carrying platform, wafers and silicon wafers can be flexibly supported in a suspended mode to wait for detection or wait for processing, the passively rotating carrying disc is provided with a brake positioning function, cost is reduced, precision and stability of the carrying platform are guaranteed, and the disc brake mechanism and the wafer carrying platform are convenient to popularize and apply in the field of semiconductor quantity detection and high-precision processing with moving tables.
Drawings
FIG. 1 is an assembled schematic view of a disc brake mechanism;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a schematic view of an overlapping manner of another embodiment;
FIG. 4 is a schematic view of one embodiment of a wafer carrier;
FIG. 5 is a schematic view of another embodiment of a wafer carrier;
in the figure:
100. a disc brake mechanism;
1. a disc brake base;
2. a disc brake spring plate;
3. a reed clip; 31. a limiting groove;
4. a disc brake actuator; 41. an air faucet;
5. a brake pad;
6. a brake pad adapter;
7. a brake limiting block; 71. a limiting flange;
10000. a wafer carrier;
1000. a stage main shaft;
2000. a carrying disc;
3000. a carrier base;
4000. carrying platform air floatation anchor;
5000. a carrier disc brake assembly;
6000. a main shaft elastic support component;
7000. a correcting component;
8000. a bearing platform outer end component;
9000. the carrier closing plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Disc brake mechanism
A disc brake mechanism, referring to fig. 1 and 3, a disc brake mechanism 100 includes a base brake actuating unit and a carrier disc lower connecting unit, which are overlapped, the base brake actuating unit is fixed above a base, and the carrier disc lower connecting unit is connected with a carrier disc from below the carrier disc; the base brake actuating unit is used for actuating to attract or separate the lower connecting unit of the carrying disc so as to realize whether the carrying disc is braked or not.
The base brake actuating unit comprises a disc brake base 1, a disc brake reed 2, a reed clamp 3 and a disc brake actuating piece 4. The specific connection relationship is as follows.
The disc brake base 1 is concave in the middle and convex at two ends, the outer ends of the disc brake reeds 2 are fixed at two ends of the disc brake base 1, and the disc brake reeds 2 are connected with the disc brake actuating piece 4 through the reed clips 3, so that the disc brake actuating piece 4 is elastically supported above the middle of the disc brake base 1.
The lower carrier disc connecting unit comprises a brake pad 5 and a brake pad adapter 6; and two ends of the brake pad 5 are fixedly connected with the carrying disc through the brake pad adapter 6.
The disc brake base 1 is in a shape of '65082', and the brake pad 5 and the brake pad adapters 6 at two ends form the shape of the clamping device.
In a specific example, the disc brake actuator 4 is a pneumatic brake air-float pad and is connected to the vacuum source assembly through an air nozzle 41.
Further, the base brake actuating unit further comprises two brake limiting blocks 7, one ends of the brake limiting blocks 7 are provided with limiting flanges 71, the side surfaces of the reed clips 3 are provided with limiting grooves 31, the bottom surfaces of the brake limiting blocks 7 are fixed to the inner sides of the two ends of the disc brake base 1, and the limiting flanges 71 are embedded into the limiting grooves 31.
Furthermore, the side edge of the plate of the brake block 5 is an arc-shaped edge matched with the carrying disc.
Base brake actuating unit and under-load discOverlapping mode of unit
The first method is as follows: referring to fig. 1 and 2, the base brake actuating unit comprises two disc brake reeds 2, two reed clamps 3 and a disc brake actuating piece 4, the outer ends of the two disc brake reeds 2 are fixed to the two ends of the disc brake base 1, the upper surfaces of the inner ends of the two disc brake reeds 2 are connected with the disc brake actuating piece 4 through the reed clamps 3, and the brake piece 5 penetrates through the bottom surface of the disc brake actuating piece 4 and the top surface of the middle part of the disc brake base 1 to form the spatial arrangement of the disc brake actuating piece 4 for attracting and braking from the lower part.
The second method comprises the following steps: referring to fig. 3, the base brake actuating unit includes a disc brake spring 2, two spring clips 3 and a disc brake actuating member 4; two ends of the top surface of the disc brake actuating piece 4 are fixedly connected with the bottom surface of the middle part of the disc brake reed 2 through the two reed clamps 3; the brake block 5 penetrates between the lower surface of the middle part of the disc brake reed 2 and the top surface of the disc brake actuating piece 4 to form the spatial arrangement of the disc brake actuating piece 4 for attracting the brake from the upper part.
Wafer carrying platform
Referring to fig. 4 and 5, wafer stage 10000 includes a stage spindle 1000, a carrier plate 2000, a stage base 3000, a stage air-floating foot 4000, a carrier plate brake assembly 5000, a spindle elastic support assembly 6000, and a centering assembly 7000.
The arrangement relation is as follows: the carrier main shaft 1000 adopts a lifting shaft; the carrier spindle 1000 is vertically arranged in a bearing hole formed in the carrier base 3000; the stage base 3000 is supported on the frame by floating or sliding via a plurality of stage air floatation feet 4000; the middle part of the bottom surface of the carrier disc 2000 is fixed to the top surface of the carrier spindle 1000, and the carrier disc 2000 is driven to move up and down by the carrier spindle 1000; a plurality of carrier disc brake assemblies 5000 are arranged between the carrier base 3000 and the carrier disc 2000, and are used for braking the carrier disc 2000; spindle spring support assembly 6000 is used to resiliently couple stage spindle 1000 to stage base 3000 to enhance the stability of stage spindle 1000.
The carrier disc brake assembly 5000 adopts the disc brake mechanism 100, and the disc brake mechanism 100 is arranged between the carrier base 3000 and the carrier disc 2000 and used for passive brake positioning of the carrier disc 2000.
Further, the wafer carrier 10000 further includes two horizontal limiting members, and the two horizontal limiting members are disposed at two horizontal ends of the carrier base.
In another embodiment, referring to fig. 5, wafer carrier 10000 further comprises a carrier outer end component 8000 and a carrier closure plate 9000.
The stage closing plate 9000 is connected to the stage base 3000 and the stage outer end assembly 8000 in a straddling manner from the top, and the lower space is used for arranging an X-axis beam.
Other functional structures, not shown, such as brake band assemblies, may be mounted on the stage closure plate 9000 in this embodiment.
Further, two sets of beam stop air-floating pads are arranged on two opposite surfaces of the stage base 3000 and the stage outer end assembly 8000, and are used for supporting beams and the like arranged below the stage closing plate 9000.
The carrier can be used for not only wafers but also high-precision support of other similar plate products, and can be applied to high-precision detection and processing machines, such as machines of quantity detection machines of semiconductor wafers and photovoltaic wafers, high-precision measuring mechanisms, three-coordinate measuring machines and the like, so that stable supporting, vibration absorption and positioning effects are improved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. A disc brake mechanism, its characterized in that: the disc brake mechanism (100) comprises a base brake actuating unit and a carrying disc lower connecting unit which are arranged in an overlapped mode, the base brake actuating unit is fixed above the base, and the carrying disc lower connecting unit is connected with the carrying disc from the lower side of the carrying disc; the base brake actuating unit is used for actuating attraction or separation of the lower connection unit of the carrier disc so as to realize whether the carrier disc brakes or not;
the base brake actuating unit comprises a disc brake base (1), a disc brake reed (2), a reed clamp (3) and a disc brake actuating piece (4); the disc brake base (1) is concave in the middle and convex at two ends, the outer ends of disc brake reeds (2) are fixed at two ends of the disc brake base (1), and the disc brake reeds (2) are connected with the disc brake actuating piece (4) through the reed clips (3), so that the disc brake actuating piece (4) is elastically supported above the middle part of the disc brake base (1);
the lower carrier disc connecting unit comprises a brake pad (5) and a brake pad adapter (6); two ends of the brake pad (5) are fixedly connected with the carrying disc through the brake pad adapter (6);
base brake actuating unit includes that two dishes stop reed (2), two reed presss from both sides (3) and a dish brake actuating piece (4), and the outer end of two dishes reed (2) of stopping is fixed to the dish is stopped the both ends of base (1), and the inner upper surface that two dishes stopped reed (2) passes through reed clamp (3) with dish brake actuating piece (4) are connected, brake block (5) pass dish brake actuating piece (4) bottom surface and dish are stopped between base (1) middle part top surface, form the spatial arrangement of dish brake actuating piece (4) from below actuation brake.
2. A disc brake mechanism, its characterized in that: the disc brake mechanism (100) comprises a base brake actuating unit and a carrying disc lower connecting unit which are arranged in an overlapped mode, the base brake actuating unit is fixed above the base, and the carrying disc lower connecting unit is connected with the carrying disc from the lower side of the carrying disc; the base brake actuating unit is used for actuating to attract or separate the lower connecting unit of the carrying disc so as to realize whether the carrying disc is braked or not;
the base brake actuating unit comprises a disc brake base (1), a disc brake reed (2), a reed clamp (3) and a disc brake actuating piece (4); the disc brake base (1) is concave in the middle and convex at two ends, the outer ends of disc brake reeds (2) are fixed at two ends of the disc brake base (1), and the disc brake reeds (2) are connected with the disc brake actuating piece (4) through the reed clips (3), so that the disc brake actuating piece (4) is elastically supported above the middle part of the disc brake base (1);
the lower carrier disc connecting unit comprises a brake pad (5) and a brake pad adapter (6); two ends of the brake pad (5) are fixedly connected with the carrying disc through the brake pad adapter (6);
the base brake actuating unit comprises a disc brake reed (2), two reed clamps (3) and a disc brake actuating piece (4); two ends of the top surface of the disc brake actuating piece (4) are fixedly connected with the bottom surface of the middle part of the disc brake reed (2) through the two reed clamps (3); the brake block (5) penetrates through the lower surface of the middle part of the disc brake reed (2) and the top surface of the disc brake actuating piece (4) to form the spatial arrangement of the disc brake actuating piece (4) for attracting the brake from the upper part.
3. The disc brake mechanism according to claim 1 or 2, characterized in that: the disc brake base (1) is in a shape of '65082', and the brake pad (5) and the brake pad adapters (6) at two ends form the shape of 'the fast'.
4. The disc brake mechanism according to claim 1 or 2, characterized in that: the disc brake actuating piece (4) adopts a pneumatic brake air floating pad and is connected with a vacuum source component through an air nozzle (41).
5. The disc brake mechanism according to claim 1 or 2, characterized in that: the base brake actuating unit further comprises two brake limiting blocks (7), one ends of the brake limiting blocks (7) are provided with limiting flanges (71), the side faces of the reed clips (3) are provided with limiting grooves (31), the bottom faces of the brake limiting blocks (7) are fixed to the inner sides of the two ends of the disc brake base (1), and the limiting flanges (71) are embedded into the limiting grooves (31).
6. The disc brake mechanism according to claim 1 or 2, characterized in that: the side edge of the plate of the brake block (5) is an arc-shaped edge matched with the carrying disc.
7. A wafer carrier is characterized in that: the wafer carrier (10000) comprises a carrier spindle (1000), a carrying disc (2000), a carrier base (3000), carrier air floatation feet (4000), a carrying disc brake assembly (5000), a spindle elastic support assembly (6000) and a correcting assembly (7000);
wherein the carrier main shaft (1000) adopts a lifting shaft; the carrier spindle (1000) is vertically arranged in a bearing hole formed in the carrier base (3000);
the carrier base (3000) is supported on the frame in a floating or sliding manner through a plurality of carrier air-floating feet (4000);
the middle part of the bottom surface of the carrier disc (2000) is fixed to the top surface of the carrier spindle (1000), and the carrier disc (2000) is driven to move up and down through the carrier spindle (1000);
the carrier disc brake assemblies (5000) are arranged between the carrier table base (3000) and the carrier disc (2000) and used for braking the carrier disc (2000);
the main shaft elastic support assembly (6000) is used for elastically connecting the carrier main shaft (1000) with the carrier base (3000) so as to enhance the stability of the carrier main shaft (1000);
the carrier disc brake assembly (5000) adopts the disc brake mechanism (100) as claimed in any one of claims 1 to 6, and the disc brake mechanism (100) is arranged between the carrier base (3000) and the carrier disc (2000) and used for passive brake positioning of the carrier disc (2000).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210317570.8A CN114683226B (en) | 2022-03-29 | 2022-03-29 | Disc brake mechanism and wafer carrying platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210317570.8A CN114683226B (en) | 2022-03-29 | 2022-03-29 | Disc brake mechanism and wafer carrying platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114683226A CN114683226A (en) | 2022-07-01 |
| CN114683226B true CN114683226B (en) | 2022-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210317570.8A Active CN114683226B (en) | 2022-03-29 | 2022-03-29 | Disc brake mechanism and wafer carrying platform |
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| CN (1) | CN114683226B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210866134U (en) * | 2019-09-25 | 2020-06-26 | 湖北光安伦芯片有限公司 | Wafer carrying disc bearing device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1304035B1 (en) * | 1998-07-15 | 2001-03-02 | Gd Spa | METHOD AND DEVICE FOR THE FEEDING OF BLINDS IN A PACKAGING MACHINE. |
| JP2004042197A (en) * | 2002-07-12 | 2004-02-12 | Komatsu Ltd | Working platform |
| JP5960370B1 (en) * | 2015-02-24 | 2016-08-02 | ファナック株式会社 | Rotary table device |
| CN105370774B (en) * | 2015-11-30 | 2017-10-10 | 常州中车铁马科技实业有限公司 | Rail vehicle braking clamp |
| CN212240352U (en) * | 2020-05-20 | 2020-12-29 | 清华大学 | Grinding workbench and wafer thinning equipment |
| CN214238068U (en) * | 2020-10-26 | 2021-09-21 | 上海卿颐电子科技有限公司 | A rotatory plummer for chip processing |
| CN215370691U (en) * | 2021-03-15 | 2021-12-31 | 浙江诸暨万宝机械有限公司 | Brake caliper friction disc return means and brake caliper |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210866134U (en) * | 2019-09-25 | 2020-06-26 | 湖北光安伦芯片有限公司 | Wafer carrying disc bearing device |
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| CN114683226A (en) | 2022-07-01 |
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