CN114474722B - Transparent flexible film surface fine circuit processing method and device based on 3D printing - Google Patents
Transparent flexible film surface fine circuit processing method and device based on 3D printing Download PDFInfo
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- 238000010146 3D printing Methods 0.000 title claims abstract description 101
- 238000003672 processing method Methods 0.000 title claims description 10
- 238000012545 processing Methods 0.000 claims abstract description 82
- 238000000034 method Methods 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 54
- 238000007639 printing Methods 0.000 claims abstract description 34
- 238000004458 analytical method Methods 0.000 claims abstract description 33
- 238000012986 modification Methods 0.000 claims abstract description 12
- 230000004048 modification Effects 0.000 claims abstract description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 11
- 239000001301 oxygen Substances 0.000 claims abstract description 11
- 239000002352 surface water Substances 0.000 claims abstract description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 16
- 238000001179 sorption measurement Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 8
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- -1 polyethylene Polymers 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 239000011135 tin Substances 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 238000012549 training Methods 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 4
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004831 Hot glue Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229920006332 epoxy adhesive Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 40
- 239000010408 film Substances 0.000 description 202
- 229920002799 BoPET Polymers 0.000 description 22
- 239000000758 substrate Substances 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 9
- 239000007769 metal material Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000004590 computer program Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000000976 ink Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003062 neural network model Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Civil Engineering (AREA)
- Composite Materials (AREA)
- Structural Engineering (AREA)
Abstract
The application provides a method and a device for processing a fine circuit on the surface of a transparent flexible film based on 3D printing. The method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing comprises the following steps: carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce oxygen-containing polar groups; collecting a transparent flexible film three-dimensional super-depth-of-field image; inputting the transparent flexible film three-dimensional super depth image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model; and 3D printing the printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film with the fine circuit. The application realizes the large-area stable and rapid processing and manufacturing of fine lines with the surface precision of up to 1 mu m of the transparent flexible film, ensures the efficient production efficiency and the green production process, and meets the manufacturing requirement of processing any-shape structured patterns on the surface of the flexible film.
Description
Technical Field
The application relates to the technical field of flexible electronics, in particular to a method and a device for processing fine circuits on the surface of a transparent flexible film based on 3D printing, electronic equipment and the transparent flexible film with fine circuits on the surface.
Background
Flexible electronics is a technique of forming a circuit by fabricating an organic electronic device or an inorganic thin film device on a flexible substrate. Flexible electronic devices are becoming more and more interesting in the scientific and industrial world, due to their properties comparable to conventional microelectronic devices, portability, transparency, light weight, stretch/bend, and ease of rapid large area printing. The potential of the method is verified in the fields of flexible display and illumination, electronic paper, electronic skin, printed RFID, thin film solar panels and the like, and the method has a wide application prospect in the fields of information, energy, medical treatment, national defense and the like.
In the prior art, the ITO conductive film is a mainstream conductive film with the advantages of low resistivity, high visible light transmittance, firm combination with a glass matrix, scratch resistance, good chemical stability and the like. However, with the development of technology, ITO conductive films are becoming increasingly weak for flexible electronic applications. In this context, patterned electrodes based on nano-metal materials are of interest.
However, there are problems with either ITO conductive films or patterned electrodes based on nano-metal materials. For example, the ITO conductive film has poor mechanical property, and can not meet the requirement of the current flexible device on the folding property after being folded; secondly, patterning electrodes are needed in most practical applications, and the ITO conductive film is often required to be treated through processes such as exposure, development, etching, cleaning and the like, so that the production efficiency is low, and a large amount of etching pollution exists; finally, the electrode line width of the ITO conductive film is difficult to be below 2 microns, which forms a great barrier for the integration and interconnection of fine electronic microcell elements. For another example, the resolution of the patterned electrode based on the nano-metal material is 15 μm or more, and a high-resolution electrode pattern cannot be fabricated. Even the conductive polymer materials, carbon nanotubes, graphene and other materials cannot be produced in mass and applied to industrial scenes due to the limitations of various factors such as manufacturing cost, poor material stability, process cost and the like.
Disclosure of Invention
The application provides a method and a device for processing a fine circuit on the surface of a transparent flexible film based on 3D printing, electronic equipment and the transparent flexible film with the fine circuit on the surface, which aim to solve the problems of low resolution, low production efficiency, serious pollution in the production process, high production cost, low conductivity and unsatisfied substrate folding performance of an ITO conductive film, a patterned electrode based on nano metal materials and other material electrodes in the prior art, realize stable and rapid processing and manufacturing of the fine circuit with the surface precision of 1 mu m in large area, ensure high-efficiency production efficiency and green production process, and meet the manufacturing requirements of processing any shape structured pattern on the surface of the flexible film. In addition, the application can also select different clamping modes according to different substrates to realize the most efficient and stable large-area patterning fine circuit processing, and select different substrates and printing materials according to different performances and application scenes to optimize and display the design performance.
Specifically, the embodiment of the application provides the following technical scheme:
in a first aspect, embodiments of the present application provide a method for processing fine lines on a surface of a transparent flexible film based on 3D printing, the method for processing the transparent flexible film having fine lines, and comprising:
carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce oxygen-containing polar groups;
collecting a transparent flexible film three-dimensional super-depth-of-field image; and
inputting the transparent flexible film three-dimensional super-depth image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on a sample transparent flexible film three-dimensional super-depth image and a sample transparent flexible film label of the sample transparent flexible film three-dimensional super-depth image;
and 3D printing a printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film processed with the fine circuit.
Further, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the transparent flexible film comprises at least one of polyester PET, cycloolefin polymer COP, polyimide PI, liquid crystal polymer LCP, polyethylene PE, polyurethane PU or polydimethylsiloxane PDMS.
Further, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the material type of the printing material comprises at least one of gold, silver, platinum, copper, tin, aluminum, epoxy resin, silica gel or ceramic.
Further, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the method for acquiring the transparent flexible film three-dimensional super depth image comprises the following steps:
and clamping the transparent flexible film in any one of a plurality of clamping modes, and moving the clamped transparent flexible film to the range of the sensor range.
Further, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the 3D printed print nozzles employ at least one array spray head.
Further, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the fine wiring has a machining accuracy of 1 μm, and
in the case where the printing material is gold, silver, platinum, copper, tin or aluminum, the fine line includes a conductive structure pattern of an arbitrary shape;
in the case where the printing material is epoxy, silicone, or ceramic, the fine line includes an insulating structure pattern of an arbitrary shape.
Further, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the clamping modes comprise a roll shaft clamping mode, a clamping frame clamping mode, an attaching mode, an electrostatic adsorption mode or a sucker adsorption mode.
Further, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the attaching mode comprises the following steps: hot melt adhesive attachment, electrostatic adsorption, optical adhesive attachment and epoxy adhesive attachment.
In a second aspect, an embodiment of the present application further provides a device for processing a fine circuit on a surface of a transparent flexible film based on 3D printing, including:
the film modifying unit is used for carrying out surface modification treatment on the transparent flexible film so as to reduce the surface water contact angle and introduce oxygen-containing polar groups;
the film image acquisition unit is used for acquiring a transparent flexible film three-dimensional super-depth image;
the film analysis unit is used for inputting the transparent flexible film three-dimensional super-depth image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on a sample transparent flexible film three-dimensional super-depth image and a sample transparent flexible film label of the sample transparent flexible film three-dimensional super-depth image through training; and
and the 3D printing unit is used for 3D printing a printing material on the transparent flexible film based on the 3D printing information so as to obtain the transparent flexible film with the fine circuit.
In a third aspect, an embodiment of the present application further provides a transparent flexible film having fine lines on a surface thereof, where the transparent flexible film having fine lines on a surface thereof is processed by the above-mentioned 3D printing-based transparent flexible film surface fine line processing method and the above-mentioned 3D printing-based transparent flexible film surface fine line processing apparatus.
In a fourth aspect, an embodiment of the present application further provides an electronic device, including a memory, a processor, and a computer program stored in the memory and capable of running on the processor, where the steps of the above method for processing fine lines on a surface of a transparent flexible film based on 3D printing are implemented when the processor executes the program.
In a fifth aspect, an embodiment of the present application further provides a non-transitory computer readable storage medium, on which a computer program is stored, wherein the computer program, when executed by a processor, implements the steps of the above-described method for processing fine lines on a surface of a transparent flexible film based on 3D printing.
According to the technical scheme, the application provides a method, a device and electronic equipment for processing fine circuits on the surface of a transparent flexible film based on 3D printing, and the transparent flexible film with the fine circuits on the surface, which aim to solve the problems of low resolution, low production efficiency, serious pollution in the production process, high production cost, low conductivity and unsatisfied substrate winding performance of an ITO conductive film, a patterned electrode based on nano metal materials and other material electrodes in the prior art, realize stable and rapid processing and manufacturing of the fine circuits with the surface precision of 1 mu m on the transparent flexible film in a large area, ensure efficient production efficiency and green production process, and meet the manufacturing requirements of processing structured patterns with any shape on the surface of the flexible film. In addition, the application can also select different clamping modes according to different substrates to realize the most efficient and stable large-area patterning fine circuit processing, and select different substrates and printing materials according to different performances and application scenes to optimize and display the design performance.
Drawings
In order to more clearly illustrate the application or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for processing fine circuits on a surface of a transparent flexible film based on 3D printing according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a roller clamping manner according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a clamping manner of a clamping frame according to an embodiment of the present application;
FIG. 4 is a schematic diagram of an attaching method according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a sucking manner of a sucking disc according to an embodiment of the present application;
fig. 6 is a schematic diagram of a sample processed by the attaching method according to an embodiment of the present application.
FIG. 7 is a schematic view of a transparent flexible film with fine lines on the surface according to an embodiment of the present application;
FIG. 8 is a schematic view of a transparent flexible film with fine lines on the surface according to another embodiment of the present application;
fig. 9 is a schematic structural diagram of a device for processing fine circuits on a surface of a transparent flexible film based on 3D printing according to an embodiment of the present application; and
fig. 10 is a schematic diagram of an electronic device according to an embodiment of the application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The various terms or phrases used herein have the ordinary meaning known to those of ordinary skill in the art, but rather the application is intended to be more fully described and explained herein. If the terms and phrases referred to herein have a meaning inconsistent with the known meaning, the meaning expressed by the present application; and if not defined in the present application, have meanings commonly understood by those of ordinary skill in the art.
In the prior art, the ITO conductive film has poor mechanical property, and can not meet the requirement of the current flexible device on the folding property after being folded; secondly, patterning electrodes are needed in most practical applications, and the ITO conductive film is often required to be treated through processes such as exposure, development, etching, cleaning and the like, so that the production efficiency is low, and a large amount of etching pollution exists; finally, the electrode line width of the ITO conductive film is difficult to be below 2 microns, which forms a great barrier for the integration and interconnection of fine electronic microcell elements. In contrast, the resolution of the patterned electrode based on the nano-metal material is 15 μm or more, and thus a high-resolution electrode pattern cannot be fabricated. Even the conductive polymer materials, carbon nanotubes, graphene and other materials cannot be produced in mass and applied to industrial scenes due to the limitations of various factors such as manufacturing cost, poor material stability, process cost and the like.
In view of this, in a first aspect, an embodiment of the present application proposes a method for processing fine lines on a surface of a transparent flexible film based on 3D printing, which aims to overcome the problems of low resolution, low production efficiency, serious pollution in a production process, high production cost, low conductivity, and unsatisfied substrate winding performance existing in an ITO conductive film, a patterned electrode based on a nano metal material, and other material electrodes in the prior art, and to realize stable and rapid processing and manufacturing of large-area fine lines with a surface precision of up to 1 μm on the transparent flexible film, and simultaneously ensure efficient production efficiency and a green production process, and meet manufacturing requirements for processing structured patterns with arbitrary shapes on the surface of the flexible film. In addition, the application can also select different clamping modes according to different substrates to realize the most efficient and stable large-area patterning fine circuit processing, and select different substrates and printing materials according to different performances and application scenes to optimize and display the design performance.
The following describes the 3D printing-based transparent flexible film surface fine line processing method of the present application with reference to fig. 1.
Fig. 1 is a flowchart of a method for processing fine circuits on a surface of a transparent flexible film based on 3D printing according to an embodiment of the present application.
In this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing is used for processing the transparent flexible film with fine lines, and may include the following steps:
101: carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce oxygen-containing polar groups;
102: collecting a transparent flexible film three-dimensional super-depth-of-field image;
103: inputting the transparent flexible film three-dimensional super-depth image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on the sample transparent flexible film three-dimensional super-depth image and the sample transparent flexible film label training of the sample transparent flexible film three-dimensional super-depth image; and
104: based on the 3D printing information, the printing material is 3D printed onto the transparent flexible film to obtain the transparent flexible film processed with the fine line.
Specifically, the high-performance transparent flexible film manufacturing technology based on ultra-high-precision 3D printing is obtained by introducing the high-precision 3D printing technology into the field of high-performance transparent flexible film manufacturing, namely, the transparent flexible film surface fine circuit processing method based on 3D printing provided by the embodiment of the application. On the basis of the ultra-high precision 3D printer and the printing technology thereof, the application combines the related technology and requirements of the flexible electronic industry, and realizes the stable and rapid processing and manufacturing of the transparent flexible film in a large area.
More specifically, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing can comprise the following steps: clamping a transparent flexible film; moving the transparent flexible film surface to a proper height range (within the range of the sensor range); moving the transparent flexible film to a printing start point; selecting a surface scanning mode or a processing path scanning mode; collecting data; background data processing; printing is started; printing is completed.
In this embodiment, it should be noted that, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further includes: the material of the transparent flexible film comprises polyester PET, cycloolefin polymer COP, polyimide PI, liquid crystal polymer LCP, polyethylene PE, polyurethane PU or polydimethylsiloxane PDMS.
In the embodiment that the transparent flexible film is made of polyester PET, the PET film material has better fatigue resistance, toughness, high melting point, excellent isolation performance, solvent resistance and excellent crease resistance, but has poor wettability, adhesiveness, printability and other processing performances due to low free energy of the surface of the PET film material, which has great limitation on the practical production of the PET film. Therefore, in the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing, the plasma cleaning machine is used for carrying out surface modification treatment on the PET film material, so that the inherent performance of the PET material is maintained, and meanwhile, the material matrix is not damaged.
This example is further described below by showing the variation of experimental test PET films before and after plasma cleaning.
Specifically, first, by observing an SEM photograph at a magnification of 10000 times, the surface of the PET film which was not treated with the plasma cleaning machine was relatively smooth, and minute amounts of impurities were also adhered locally. And secondly, treating the PET film material by using an atmospheric jet spin-spray plasma cleaner. As the processing time of the plasma cleaner increases, some irregular lamellar structures present the surface of the PET film, and the roughness of the film surface also increases. The surface of the PET film also presents white fine grain structures in large areas, and the coarse structures are composed of nano-scale fine particles, and the plasma cleaning machine treatment plays a certain etching role on the PET film.
Specifically, for the influence of the surface energy of the PET film, the contact angle of the surface of the PET film before and after treatment by using a contact angle measuring instrument and a plasma cleaning machine is compared and observed, and the data is obtained by taking an average value from six points, wherein the data conditions are shown in table 1: the untreated PET film had a surface water contact angle of 81.2 °, and had poor hydrophilic properties. However, when treated by the plasma cleaner for 30 seconds, the water contact angle of the film surface was reduced to 48.9 °, and when treated by the plasma cleaner for 180 seconds, the contact angle of the film surface was routed to 37.6 °.
| PET film material | Water contact angle degree |
| Is not treated by a plasma cleaning machine | 81.2° |
| Plasma cleaning machine treatment for 30s | 48.9° |
| Plasma cleaning machine process 120s | 39.7° |
| Plasma cleaning machine 180s | 37.6° |
TABLE 1
Based on the above, the hydrophilic performance of the PET film material can be effectively improved through the treatment of the plasma cleaner.
In addition, besides improving the hydrophilic performance, the plasma cleaner also improves the surface energy of the PET film material.
Specifically, the application introduces a large amount of oxygen-containing polar groups on the surface of the PET film through treatment of a plasma cleaning machine, thereby improving the free energy of the surface of the PET film and further improving the usability of the PET film such as surface wettability, adhesiveness, printability and the like.
More specifically, the present application was verified by observation of PET film materials before and after a plasma cleaning machine using SEM and a contact angle measuring instrument. The plasma cleaning machine not only can improve the surface roughness of the film by etching, but also can introduce a large amount of oxygen-containing polar groups on the surface of the film to improve the hydrophilicity and the surface energy of the PET film, and can realize the surface modification of the PET film material under the condition of not damaging the film characteristics. The inks used in the 3D printing process are all aqueous inks, and have better adhesiveness on the modified PET surface.
It is apparent that the embodiments of the present application are not limited thereto, and as described above, the present application may include embodiments of materials of transparent flexible films of cycloolefin polymer COP, polyimide PI, liquid crystal polymer LCP, polyethylene PE, polyurethane PU, or polydimethylsiloxane PDMS, in addition to polyester PET. In addition, the person skilled in the art can select more films of different materials according to actual processing requirements, as long as the selected films meet the requirement of the flexible device on the substrate folding property.
For step 103, specifically, the transparent flexible film analysis model is used for analyzing the transparent flexible film information of the input transparent flexible film three-dimensional super-depth image to further obtain 3D printing information, so as to output and analyze the 3D printing information, that is, patterned 3D information obtained based on the transparent flexible film information of the transparent flexible film in the transparent flexible film three-dimensional super-depth image (for example, what scale or size of 3D printing the transparent flexible film can be used for, what area or position of the transparent flexible film is used for 3D printing, what 3D printing material is applied to the material of the transparent flexible film, and so on). Furthermore, the transparent flexible thin film analytical model may be a pre-trained neural network model.
Before the method, a transparent flexible film analysis model can be obtained through training in advance, and the transparent flexible film analysis model can be trained through the following steps: firstly, a large number of sample transparent flexible film three-dimensional super-depth images are acquired through an imaging system (comprising at least one image sensor, such as a CMOS sensor and the like) based on fine line processing of the surface of a 3D printed transparent flexible film, and sample transparent flexible film information in the sample transparent flexible film three-dimensional super-depth images, namely sample transparent flexible film labels, are acquired through a manual labeling mode. And training the initial model based on the sample transparent flexible film three-dimensional super-depth image and the sample transparent flexible film label of the sample transparent flexible film three-dimensional super-depth image, thereby obtaining a transparent flexible film analysis model.
In this embodiment, it should be noted that, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further includes: before acquiring the transparent flexible film three-dimensional super-depth image (step 102), the method further comprises the following steps: and clamping the transparent flexible film in any one of a plurality of clamping modes, and moving the clamped transparent flexible film to the range of the sensor.
The various clamping means provided by the present application are described below in connection with fig. 2, 3, 4 and 5.
FIG. 2 is a schematic diagram of a roller clamping manner according to an embodiment of the present application; FIG. 3 is a schematic diagram of a clamping manner of a clamping frame according to an embodiment of the present application; FIG. 4 is a schematic diagram of an attaching method according to an embodiment of the present application; fig. 5 is a schematic diagram of a suction manner of a suction cup according to an embodiment of the application.
Further, in this embodiment, it should be noted that, the method for processing fine circuit on the surface of the transparent flexible film based on 3D printing further includes: the clamping modes comprise a roll shaft clamping mode, a clamping frame clamping mode, an attaching mode, an electrostatic adsorption mode or a sucker adsorption mode.
The attaching manner provided by the present application is further described below with reference to fig. 6.
Fig. 6 is a schematic diagram of a sample processed by the attaching method according to an embodiment of the present application.
Further, in this embodiment, it should be noted that, the method for processing fine circuit on the surface of the transparent flexible film based on 3D printing further includes: the attaching mode comprises the following steps: hot melt adhesive attachment, electrostatic adsorption, optical adhesive attachment and epoxy adhesive attachment.
In this embodiment, it should be noted that, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further includes: the 3D printed print nozzles employ at least one array spray head.
In particular, the printing nozzle of the application employs an array type spray head to improve processing efficiency, and the number of spray heads can be customized according to specific processing requirements.
In this embodiment, it should be noted that, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing further includes: the printing material comprises at least one of gold, silver, platinum, copper, tin, aluminum, epoxy resin, silica gel or ceramic
Specifically, the printing material in the 3D printing-based transparent flexible film surface fine circuit processing method can include, but is not limited to, conductive materials such as gold, platinum, copper, tin, aluminum and the like, and dielectric materials such as epoxy resin, silica gel, ceramic and the like.
Further, in this embodiment, it should be noted that, the method for processing fine circuit on the surface of the transparent flexible film based on 3D printing further includes: the processing precision of the fine line is 1 μm, and in the case where the printing material is gold, silver, platinum, copper, tin or aluminum, the fine line includes a conductive structure pattern of an arbitrary shape; in the case where the printing material is epoxy, silicone, or ceramic, the fine line includes an insulating structure pattern of an arbitrary shape.
In particular, the processing accuracy of the fine line (i.e., the resolution of the patterned electrode) may be up to 1 μm, and may be infinitely compatible upward, which overcomes the defect of the prior art that the processing accuracy of the fine line is too low.
Correspondingly, if the printing material is a conductive material such as gold, platinum, copper, tin, aluminum and the like, the fine circuit on the surface of the flexible film is a conductive structure; if the printing material is epoxy resin, silica gel or ceramic, the fine circuit on the surface of the flexible film is a simple structured pattern, namely an insulating structured pattern.
In summary, the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing provided by the application overcomes the problems of low resolution, low production efficiency, serious pollution in the production process, high production cost, low conductivity and unsatisfied substrate folding performance of the ITO conductive film, the patterned electrode based on nano metal materials and other material electrodes in the prior art, realizes stable and rapid processing and manufacturing of the fine circuit with the surface precision of up to 1 mu m in a large area, ensures high-efficiency production efficiency and green production process, and meets the manufacturing requirement of processing structured patterns with arbitrary shapes on the surface of the flexible film. In addition, the application can also select different clamping modes according to different substrates to realize the most efficient and stable large-area patterning fine circuit processing, and select different substrates and printing materials according to different performances and application scenes to optimize and display the design performance.
Based on the same inventive concept, in another aspect, an embodiment of the present application provides a transparent flexible film having fine lines on a surface thereof, which is processed by the above-mentioned method for processing fine lines on a surface of a transparent flexible film based on 3D printing.
The transparent flexible film having fine lines on the surface thereof provided by the present application will be described with reference to fig. 7 and 8.
Fig. 7 is a schematic structural view of a transparent flexible film with fine lines on the surface according to an embodiment of the present application, and fig. 8 is a schematic structural view of a transparent flexible film with fine lines on the surface according to another embodiment of the present application.
Specifically, the transparent flexible film with fine lines on the surface is processed by the transparent flexible film surface fine line processing device based on 3D printing based on the transparent flexible film surface fine line processing method based on 3D printing.
More specifically, the transparent flexible film having fine lines on the surface may have a resistivity within 3.5 x 10-6Ω·m and a light transmittance of 80% or more at the light frequency of natural light conditions.
Based on the same inventive concept, in another aspect, an embodiment of the application provides a transparent flexible film surface fine circuit processing device based on 3D printing.
The transparent flexible film surface fine circuit processing device based on 3D printing provided by the application is described below with reference to fig. 9, and the transparent flexible film surface fine circuit processing device based on 3D printing and the transparent flexible film surface fine circuit processing method based on 3D printing described above can be referred to correspondingly.
Fig. 9 is a schematic structural diagram of a device for processing fine circuits on a surface of a transparent flexible film based on 3D printing according to an embodiment of the present application.
In this embodiment, the transparent flexible film surface fine line processing apparatus 1 based on 3D printing includes: a film modifying unit 10 for performing surface modification treatment on the transparent flexible film to reduce a surface water contact angle and introduce an oxygen-containing polar group; a film image acquisition unit 20 for acquiring a transparent flexible film three-dimensional super depth image; the film analysis unit 30 is configured to input the three-dimensional super-depth image of the transparent flexible film into a transparent flexible film analysis model, so as to obtain 3D printing information output by the transparent flexible film analysis model, where the transparent flexible film analysis model is obtained based on the three-dimensional super-depth image of the sample transparent flexible film and the sample transparent flexible film label training of the three-dimensional super-depth image of the sample transparent flexible film; and a 3D printing unit 40 for 3D printing a printing material onto the transparent flexible film based on the 3D printing information to obtain the transparent flexible film processed with the fine line.
It should be noted that, in an embodiment of the present application, the 3D printing unit further includes: the device comprises a clamping module, a visual alignment module, a sensor height measurement module/height compensation module, a printing module, a sintering module and the like.
Since the device for processing the fine circuit on the surface of the transparent flexible film based on 3D printing provided by the embodiment of the application can be used for executing the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing described in the above embodiment, the working principle and the beneficial effects are similar, so that details are not described herein, and the specific content can be seen in the description of the above embodiment.
In this embodiment, it should be noted that, each unit in the apparatus of the embodiment of the present application may be integrated into one body, or may be separately deployed. The above units may be combined into one unit or may be further split into a plurality of sub units.
In addition, the transparent flexible film surface fine line processing device based on 3D printing of the present application may include, but is not limited to, the following components: computer, motion controller, sensor, printing nozzle, marble Dan Longmen, high definition industrial camera, substrate clamp, voice coil motor.
Fig. 10 is a schematic diagram of an electronic device according to an embodiment of the application.
In this embodiment, it should be noted that the electronic device may include: a processor 1010, a communication interface (Communications Interface) 1020, a memory 1030, and a communication bus 1040, wherein the processor 1010, the communication interface 1020, and the memory 1030 communicate with each other via the communication bus 1040. Processor 1010 may invoke logic instructions in memory 1030 to perform a 3D printing-based transparent flexible film surface fine line processing method comprising: carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce oxygen-containing polar groups; collecting a transparent flexible film three-dimensional super-depth-of-field image; inputting the transparent flexible film three-dimensional super-depth image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on the sample transparent flexible film three-dimensional super-depth image and the sample transparent flexible film label training of the sample transparent flexible film three-dimensional super-depth image; and 3D printing the printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film with the fine circuit.
The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present application without undue burden.
From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on this understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the respective embodiments or some parts of the embodiments.
Further, the logic instructions in the memory 1030 described above may be implemented in the form of software functional units and stored in a computer readable storage medium when sold or used as a stand alone product. Based on this understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
In yet another aspect, the present application also provides a non-transitory computer readable storage medium having stored thereon a computer program which when executed by a processor is implemented to perform a method of 3D printing-based fine line processing of a surface of a transparent flexible film, the method comprising: carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce oxygen-containing polar groups; collecting a transparent flexible film three-dimensional super-depth-of-field image; inputting the transparent flexible film three-dimensional super-depth image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on the sample transparent flexible film three-dimensional super-depth image and the sample transparent flexible film label training of the sample transparent flexible film three-dimensional super-depth image; and 3D printing the printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film with the fine circuit.
Moreover, in the present application, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Furthermore, in the present application, the description of the terms "embodiment," "this embodiment," "yet another embodiment," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A method for processing a fine circuit on the surface of a transparent flexible film based on 3D printing, which is used for processing the transparent flexible film with the fine circuit, and comprises the following steps:
carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce oxygen-containing polar groups;
collecting a transparent flexible film three-dimensional super-depth-of-field image; and
inputting the transparent flexible film three-dimensional super-depth image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on a sample transparent flexible film three-dimensional super-depth image and a sample transparent flexible film label of the sample transparent flexible film three-dimensional super-depth image;
and 3D printing a printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film processed with the fine circuit.
2. The method for processing fine lines on the surface of a transparent flexible film based on 3D printing according to claim 1, wherein the material types of the transparent flexible film comprise at least one of polyester PET, cyclic olefin polymer COP, polyimide PI, liquid crystal polymer LCP, polyethylene PE, polyurethane PU or polydimethylsiloxane PDMS.
3. The method for processing fine lines on a surface of a transparent flexible film based on 3D printing according to claim 1, wherein the material type of the printing material comprises at least one of gold, silver, platinum, copper, tin, aluminum, epoxy resin, silica gel or ceramic.
4. The method for processing fine lines on a surface of a transparent flexible film based on 3D printing according to claim 1, wherein the step of acquiring a three-dimensional super depth image of the transparent flexible film further comprises:
and clamping the transparent flexible film in any one of a plurality of clamping modes, and moving the clamped transparent flexible film to the range of the sensor range.
5. The method for fine line processing of a surface of a transparent flexible film based on 3D printing according to claim 1, wherein at least one array type spray head is used for the printing nozzle of the 3D printing.
6. The method for processing fine circuit on surface of transparent flexible film based on 3D printing according to claim 3, wherein the processing precision of the fine circuit is 1 μm, and
in the case where the printing material is gold, silver, platinum, copper, tin or aluminum, the fine line includes a conductive structure pattern of an arbitrary shape;
in the case where the printing material is epoxy, silicone, or ceramic, the fine line includes an insulating structure pattern of an arbitrary shape.
7. The method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing according to claim 4, wherein the plurality of clamping modes comprise a roller clamping mode, a clamping frame clamping mode, an attaching mode, an electrostatic adsorption mode or a sucking disc adsorption mode.
8. The method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing according to claim 7, wherein the attaching mode comprises the following steps: hot melt adhesive attachment, electrostatic adsorption, optical adhesive attachment and epoxy adhesive attachment.
9. A transparent flexible film surface fine circuit processingequipment based on 3D prints includes:
the film modifying unit is used for carrying out surface modification treatment on the transparent flexible film so as to reduce the surface water contact angle and introduce oxygen-containing polar groups;
the film image acquisition unit is used for acquiring a transparent flexible film three-dimensional super-depth image;
the film analysis unit is used for inputting the transparent flexible film three-dimensional super-depth image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on a sample transparent flexible film three-dimensional super-depth image and a sample transparent flexible film label of the sample transparent flexible film three-dimensional super-depth image through training;
and the 3D printing unit is used for 3D printing a printing material on the transparent flexible film based on the 3D printing information so as to obtain the transparent flexible film with the fine circuit.
10. A transparent flexible film with fine lines on the surface, characterized in that the transparent flexible film with fine lines on the surface is processed by the 3D printing-based transparent flexible film surface fine line processing device according to claim 9 based on the 3D printing-based transparent flexible film surface fine line processing method according to claim 1.
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