CN114474722A - Transparent flexible film surface fine line processing method and device based on 3D printing - Google Patents
Transparent flexible film surface fine line processing method and device based on 3D printing Download PDFInfo
- Publication number
- CN114474722A CN114474722A CN202210074304.7A CN202210074304A CN114474722A CN 114474722 A CN114474722 A CN 114474722A CN 202210074304 A CN202210074304 A CN 202210074304A CN 114474722 A CN114474722 A CN 114474722A
- Authority
- CN
- China
- Prior art keywords
- flexible film
- transparent flexible
- printing
- processing
- fine lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010146 3D printing Methods 0.000 title claims abstract description 102
- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 82
- 238000000034 method Methods 0.000 claims abstract description 66
- 239000000463 material Substances 0.000 claims abstract description 60
- 238000007639 printing Methods 0.000 claims abstract description 38
- 238000004458 analytical method Methods 0.000 claims abstract description 34
- 238000012986 modification Methods 0.000 claims abstract description 14
- 230000004048 modification Effects 0.000 claims abstract description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 11
- 239000001301 oxygen Substances 0.000 claims abstract description 11
- 239000002352 surface water Substances 0.000 claims abstract description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 16
- 238000012549 training Methods 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 8
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- -1 polyethylene Polymers 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 239000011135 tin Substances 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 4
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000004831 Hot glue Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229920006332 epoxy adhesive Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 40
- 239000010408 film Substances 0.000 description 202
- 229920002799 BoPET Polymers 0.000 description 24
- 239000000758 substrate Substances 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 238000004590 computer program Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003062 neural network model Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Civil Engineering (AREA)
- Composite Materials (AREA)
- Structural Engineering (AREA)
Abstract
The invention provides a method and a device for processing fine lines on the surface of a transparent flexible film based on 3D printing. The transparent flexible film surface fine line processing method based on 3D printing comprises the following steps: carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce an oxygen-containing polar group; collecting a three-dimensional super field depth image of the transparent flexible film; inputting the three-dimensional super field depth image of the transparent flexible film into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model; and 3D printing the printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film processed with the fine lines. The invention realizes the large-area stable and rapid processing and manufacturing of the fine circuit with the surface precision of the transparent flexible film as high as 1 mu m, simultaneously ensures the high-efficiency production efficiency and the green production process, and meets the manufacturing requirement of processing structured patterns with any shapes on the surface of the flexible film.
Description
Technical Field
The invention relates to the technical field of flexible electronics, in particular to a method and a device for processing fine lines on the surface of a transparent flexible film based on 3D printing, electronic equipment and the transparent flexible film with the fine lines on the surface.
Background
Flexible electronics is a technology in which organic electronic devices or inorganic thin-film devices are fabricated on a flexible substrate to form a circuit. Because the performance of the flexible electronic device is equivalent to that of the traditional microelectronic device, and the flexible electronic device has the characteristics of portability, transparency, light weight, stretching/bending, easiness in rapid large-area printing and the like, the flexible electronic device is more and more concerned by the scientific research and industrial fields. The potential of the flexible display and lighting device is verified in the fields of flexible display and lighting, electronic paper, electronic skin, printed RFID (radio frequency identification devices), thin-film solar cell panels and the like, and the flexible display and lighting device has wide application prospects in the fields of information, energy, medical treatment, national defense and the like.
In the prior art, an ITO conductive film is a mainstream conductive film due to its advantages of low resistivity, high visible light transmittance, firm bonding with a glass substrate, scratch resistance, good chemical stability, and the like. However, with the development of technology, ITO conductive films are increasingly weak for flexible electronic applications. In this context, patterned electrodes based on nanometal materials are of interest.
However, both ITO conductive films and patterned electrodes based on nano-metallic materials have problems. For example, the ITO conductive film has poor mechanical properties, and cannot meet the requirement of the folding performance of the existing flexible device without folding; secondly, most practical applications need patterned electrodes, and the ITO conductive film is often processed by the processes of exposure, development, etching, cleaning and the like, so that the production efficiency is low, and a large amount of etching pollution exists; finally, the electrode line width of the ITO conductive film is difficult to be less than 2 microns, which forms a great obstacle for the integration and interconnection of fine electronic microcell elements. For another example, the resolution of a patterned electrode based on a nanometal material is 15 μm or more, and a high-resolution electrode pattern cannot be formed. Even materials such as conductive polymer materials, carbon nanotubes and graphene cannot be produced in large quantities and applied to industrial scenes due to the limitations of various factors such as manufacturing cost, poor material stability and process cost.
Disclosure of Invention
The invention provides a method and a device for processing a fine line on the surface of a transparent flexible film based on 3D printing, an electronic device and the transparent flexible film with the fine line on the surface, aiming at overcoming the problems of low resolution, low production efficiency, serious pollution in the production process, high production cost, low electric conductivity and unsatisfied substrate folding and winding performance of an ITO conductive film, a patterned electrode based on a nano metal material and other material electrodes in the prior art, realizing the large-area stable and rapid processing and manufacturing of the fine line with the surface precision of the transparent flexible film as high as 1 mu m, simultaneously ensuring the efficient production efficiency and the green production process, and meeting the manufacturing requirement of processing structured patterns with any shape on the surface of the flexible film. In addition, the invention can also select different clamping modes according to different substrates to realize the most efficient and stable large-area patterning fine line processing, and select different substrates and printing materials according to different performances and application scenes to optimally show the design performance.
Specifically, the embodiment of the invention provides the following technical scheme:
in a first aspect, an embodiment of the present invention provides a method for processing fine lines on a surface of a transparent flexible film based on 3D printing, the method being used for processing the transparent flexible film having fine lines and comprising:
carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce an oxygen-containing polar group;
collecting a three-dimensional super field depth image of the transparent flexible film; and
inputting the transparent flexible film three-dimensional super depth-of-field image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained by training a sample transparent flexible film label based on a sample transparent flexible film three-dimensional super depth-of-field image and the sample transparent flexible film three-dimensional super depth-of-field image;
and 3D printing a printing material on the transparent flexible film on the basis of the 3D printing information to obtain the transparent flexible film processed with fine lines.
Further, the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the material type of the transparent flexible film comprises at least one of polyester PET, cycloolefin polymer COP, polyimide PI, liquid crystal polymer LCP, polyethylene PE, polyurethane PU or polydimethylsiloxane PDMS.
Further, the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the material type of the printing material comprises at least one of gold, silver, platinum, copper, tin, aluminum, epoxy resin, silica gel or ceramic.
Further, the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the method for acquiring the three-dimensional super depth of field image of the transparent flexible film comprises the following steps:
the transparent flexible film is clamped through any one of a plurality of clamping modes, and the clamped transparent flexible film moves to the range of the sensor.
Further, the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the printing nozzle for 3D printing adopts at least one array type spray head.
Further, the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the processing precision of the fine line is 1 μm, an
In the case where the printing material is gold, silver, platinum, copper, tin, or aluminum, the fine lines include a conductive structure pattern of an arbitrary shape;
in the case where the printing material is epoxy, silicone, or ceramic, the fine lines include insulating structure patterns of arbitrary shapes.
Further, the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the multiple clamping modes comprise a roller shaft clamping mode, a clamping frame clamping mode, an attaching mode, an electrostatic adsorption mode or a sucker adsorption mode.
Further, the processing method for the fine lines on the surface of the transparent flexible film based on 3D printing further comprises the following steps:
the attaching mode comprises the following steps: hot melt adhesive attachment, electrostatic adsorption, optical adhesive attachment, and epoxy adhesive attachment.
In a second aspect, an embodiment of the present invention further provides a device for processing a fine line on a surface of a transparent flexible film based on 3D printing, including:
the film modification unit is used for carrying out surface modification treatment on the transparent flexible film so as to reduce the surface water contact angle and introduce oxygen-containing polar groups;
the film image acquisition unit is used for acquiring a three-dimensional super field depth image of the transparent flexible film;
the film analysis unit is used for inputting the transparent flexible film three-dimensional super depth-of-field image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on a sample transparent flexible film three-dimensional super depth-of-field image and sample transparent flexible film label training of the sample transparent flexible film three-dimensional super depth-of-field image; and
and the 3D printing unit is used for printing a printing material on the transparent flexible film in a 3D mode based on the 3D printing information so as to obtain the transparent flexible film with the fine lines.
In a third aspect, embodiments of the present invention further provide a transparent flexible film with fine lines on a surface, wherein the transparent flexible film with fine lines on a surface is processed by the above transparent flexible film surface fine line processing device based on 3D printing based on the above transparent flexible film surface fine line processing method based on 3D printing.
In a fourth aspect, an embodiment of the present invention further provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the above method for processing fine lines on the surface of the transparent flexible film based on 3D printing when executing the program.
In a fifth aspect, an embodiment of the present invention further provides a non-transitory computer readable storage medium, on which a computer program is stored, wherein the computer program is executed by a processor to implement the steps of the above-mentioned method for processing fine lines on the surface of the transparent flexible film based on 3D printing.
According to the technical scheme, the invention provides a method and a device for processing a fine line on the surface of a transparent flexible film based on 3D printing, an electronic device and the transparent flexible film with the fine line on the surface, and aims to overcome the problems that an ITO conductive film, a patterned electrode based on a nano metal material and an electrode made of other materials in the prior art are low in resolution, low in production efficiency, serious in pollution in a production process, high in production cost, low in conductivity and incapable of meeting the folding performance of a substrate, realize large-area stable and rapid processing and manufacturing of the fine line with the surface precision of the transparent flexible film as high as 1 mu m, guarantee efficient production efficiency and a green production process, and meet the manufacturing requirement for processing structured patterns with any shapes on the surface of the flexible film. In addition, the invention can also select different clamping modes according to different substrates to realize the most efficient and stable large-area patterning fine line processing, and select different substrates and printing materials according to different performances and application scenes to optimally show the design performance.
Drawings
In order to more clearly illustrate the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a flowchart of a method for processing fine lines on a surface of a transparent flexible film based on 3D printing according to an embodiment of the present invention;
FIG. 2 is a schematic view of a roller clamping method according to an embodiment of the present invention;
FIG. 3 is a schematic view of a clamping manner of the clamping frame according to an embodiment of the present invention;
FIG. 4 is a schematic view of an attaching method according to an embodiment of the present invention;
FIG. 5 is a schematic view of a sucking manner of a sucking disc according to an embodiment of the present invention;
fig. 6 is a schematic view of a finished sample processed by the attachment method according to an embodiment of the present invention.
FIG. 7 is a schematic structural diagram of a transparent flexible film with fine lines on its surface according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a transparent flexible film with fine lines on its surface according to another embodiment of the present invention;
fig. 9 is a schematic structural diagram of a device for processing a fine line on a surface of a transparent flexible film based on 3D printing according to an embodiment of the present invention; and
fig. 10 is a schematic diagram of an electronic device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The various terms or phrases used herein have the ordinary meaning as is known to those skilled in the art, and even then, it is intended that the present invention not be limited to the specific terms or phrases set forth herein. To the extent that the terms and phrases referred to herein have a meaning inconsistent with the known meaning, the meaning ascribed to the present invention controls; and have the meaning commonly understood by a person of ordinary skill in the art if not defined herein.
In the prior art, the ITO conductive film has poor mechanical property, and cannot meet the requirement of the folding property of the existing flexible device without folding; secondly, most practical applications require patterned electrodes, and often require processing of an ITO conductive film through processes such as exposure, development, etching, cleaning and the like, so that the production efficiency is low, and a large amount of etching pollution exists; finally, the electrode line width of the ITO conductive film is difficult to be less than 2 microns, which forms a great obstacle for the integration and interconnection of fine electronic microcell elements. The resolution of patterned electrodes based on nanometal materials is 15 μm or more, and high-resolution electrode patterns cannot be produced. Even materials such as conductive polymer materials, carbon nanotubes and graphene cannot be produced in large quantities and applied to industrial scenes due to the limitations of many factors such as manufacturing cost, poor material stability and process cost.
In view of the above, in a first aspect, an embodiment of the present invention provides a method for processing a fine line on a surface of a transparent flexible film based on 3D printing, which aims to overcome the problems in the prior art that ITO conductive films, patterned electrodes based on nano-metal materials, and other material electrodes have low resolution, low production efficiency, serious pollution in the production process, high production cost, low conductivity, and unsatisfactory substrate folding performance, and to achieve stable and rapid processing and manufacturing of a large area of a fine line with a surface accuracy of the transparent flexible film as high as 1 μm, while ensuring efficient production efficiency and a green production process, and meeting the manufacturing requirement for processing structured patterns of any shape on the surface of the flexible film. In addition, the invention can also select different clamping modes according to different substrates to realize the most efficient and stable large-area patterning fine line processing, and select different substrates and printing materials according to different performances and application scenes to optimally show the design performance.
The method for processing fine lines on the surface of the transparent flexible film based on 3D printing is described in the following with reference to FIG. 1.
Fig. 1 is a flowchart of a method for processing fine lines on a surface of a transparent flexible film based on 3D printing according to an embodiment of the present invention.
In this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing is used for processing the transparent flexible film with fine lines, and may include the following steps:
101: carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce an oxygen-containing polar group;
102: collecting a three-dimensional super field depth image of the transparent flexible film;
103: inputting the transparent flexible film three-dimensional super depth-of-field image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained by training a sample transparent flexible film label based on the sample transparent flexible film three-dimensional super depth-of-field image and the sample transparent flexible film three-dimensional super depth-of-field image; and
104: and 3D printing the printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film processed with the fine lines.
Specifically, a high-performance transparent flexible film manufacturing technology based on ultrahigh-precision 3D printing is obtained by introducing a high-precision 3D printing technology into the field of high-performance transparent flexible film manufacturing, that is, a method for processing fine lines on the surface of a transparent flexible film based on 3D printing provided by an embodiment of the present invention. The invention realizes large-area stable and rapid processing and manufacturing of the transparent flexible film by combining the related technology and requirements of the flexible electronic industry on the basis of the ultrahigh-precision 3D printer and the printing technology thereof.
More specifically, the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing can comprise the following steps: transparent flexible film clamping; moving the surface of the transparent flexible film to a proper height range (within the range of the measuring range of the sensor); moving the transparent flexible film to a printing starting point; selecting a surface scanning mode or a processing path scanning mode; collecting data; background data processing; starting printing; the printing is completed.
In this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing further includes: the material of the transparent flexible film comprises polyester PET, cycloolefin polymer COP, polyimide PI, liquid crystal polymer LCP, polyethylene PE, polyurethane PU or polydimethylsiloxane PDMS.
In the embodiment that the material of the transparent flexible film is polyester PET, although the PET film material has good fatigue resistance, toughness, high melting point, excellent isolation performance, solvent resistance and excellent wrinkle resistance, the surface free energy of the PET film material is low, and the processability such as wettability, adhesiveness and printability of the PET film material is poor, so that the application of the PET film in practical production is greatly limited. Therefore, in the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing, the surface of the PET film material is modified by using the plasma cleaning machine, so that the inherent performance of the PET material is maintained, and the material matrix is not damaged.
The present embodiment is further described below by showing the change of the experimental test PET film before and after the plasma cleaner treatment.
Specifically, first, by observing an SEM photograph at a magnification of 10000 times, the surface of the PET film which was not treated by the plasma cleaning machine was relatively smooth, and a trace amount of impurities was also adhered to a part of the surface. Secondly, the PET film material is treated by using an atmospheric jet rotary spraying plasma cleaning machine. As the treatment time of the plasma cleaner is increased, irregular sheet-like structures appear on the surface of the PET film, and the roughness of the surface of the film is increased. The surface of the PET film also presents a white fine grain structure in a large block area, the coarse structures are composed of nano-scale fine particles, and the plasma cleaning machine plays a certain role in etching the PET film.
Specifically, for the influence of the surface energy of the PET film, the contact angle measuring instrument is used for comparing and observing the contact angles of the surface of the PET film before and after the treatment of the plasma cleaning machine, and the data obtained by means of six-point averaging are shown in table 1: the surface water contact angle of the untreated PET film was 81.2 degrees, and the hydrophilic property was poor. However, when treated with the plasma cleaner for 30s, the water contact angle of the membrane surface decreased to 48.9 °, and when treated with the plasma cleaner for 180s, the contact angle of the membrane surface reached 37.6 °.
PET film material | Degree of water contact angle |
Without treatment by a plasma cleaner | 81.2° |
Plasma washer treatment for 30s | 48.9° |
Plasma washer Process 120s | 39.7° |
Plasma cleaner treatment for 180s | 37.6° |
TABLE 1
Based on this, the invention can effectively increase the hydrophilic performance of the PET film material through the treatment of the plasma cleaning machine.
In addition, the plasma cleaning machine can also improve the surface energy of the PET film material besides improving the hydrophilic performance.
Specifically, the surface of the PET film is treated by a plasma cleaning machine, and a large number of oxygen-containing polar groups are introduced to the surface of the PET film, so that the free energy of the surface of the PET film is improved, and the use performances such as surface wettability, adhesiveness and printability of the PET film are improved.
More specifically, the invention is verified by observing the PET film material before and after the plasma cleaning machine by using SEM and a contact angle measuring instrument. The plasma cleaning machine can not only improve the surface roughness of the film through etching, but also introduce a large amount of oxygen-containing polar groups on the surface of the film, improve the hydrophilicity and the surface energy of the PET film, and realize the surface modification of the PET film material under the condition of not damaging the characteristics of the film. The ink used in the 3D printing process is water-based ink, and has better adhesion on the surface of the modified PET.
It is apparent that the embodiments of the present invention are not limited thereto, and as described above, the present invention may include embodiments of materials of transparent flexible films of cycloolefin polymer COP, polyimide PI, liquid crystal polymer LCP, polyethylene PE, polyurethane PU, or polydimethylsiloxane PDMS, in addition to polyester PET. In addition, a person skilled in the art can select more films of different materials according to actual processing requirements as long as the selected films meet the requirement of the flexible device on the substrate folding performance.
With respect to step 103, specifically, the transparent flexible film analysis model is used to analyze the transparent flexible film information of the input transparent flexible film three-dimensional super depth-of-field image to further obtain 3D printing information, so as to output and analyze 3D printing information, that is, patterned 3D information obtained based on the transparent flexible film information of the transparent flexible film in the transparent flexible film three-dimensional super depth-of-field image (for example, what scale or size of 3D printing the transparent flexible film can be used for, at what area or position of the transparent flexible film can be used for, what kind of 3D printing material the material of the transparent flexible film is suitable for applying, etc.). In addition, the transparent flexible film analysis model may be a pre-trained neural network model.
Before the above, the transparent flexible film analysis model can be obtained by training in advance, and specifically, the transparent flexible film analysis model can be trained through the following steps: firstly, a large number of sample transparent flexible film three-dimensional super depth of field images are acquired through a camera system (comprising at least one image sensor, such as a CMOS sensor and the like) based on 3D printing for processing fine lines on the surface of a transparent flexible film, and sample transparent flexible film information, namely a sample transparent flexible film label, in the sample transparent flexible film three-dimensional super depth of field images is acquired through a manual labeling mode. And then training the initial model based on the sample transparent flexible film three-dimensional super depth-of-field image and the sample transparent flexible film label of the sample transparent flexible film three-dimensional super depth-of-field image, thereby obtaining a transparent flexible film analysis model.
In this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing further includes: before acquiring a three-dimensional super depth-of-field image of the transparent flexible film (step 102), the method further comprises the following steps: the transparent flexible film is clamped through any one of multiple clamping modes, and the clamped transparent flexible film moves to the range of the sensor.
The following describes various clamping manners provided by the present invention with reference to fig. 2, fig. 3, fig. 4 and fig. 5.
FIG. 2 is a schematic view of a roller clamping method according to an embodiment of the present invention; FIG. 3 is a schematic view of a clamping manner of the clamping frame according to an embodiment of the present invention; FIG. 4 is a schematic view of an attaching method according to an embodiment of the present invention; fig. 5 is a schematic view illustrating a suction manner of the suction cup according to an embodiment of the present invention.
Further, in this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing further includes: the multiple clamping modes comprise a roller shaft clamping mode, a clamping frame clamping mode, an attaching mode, an electrostatic adsorption mode or a sucker adsorption mode.
The attachment provided by the present invention is further described below in conjunction with fig. 6.
Fig. 6 is a schematic view of a finished sample processed by the attachment method according to an embodiment of the present invention.
Further, in this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing further includes: the attaching mode comprises the following steps: hot melt adhesive attachment, electrostatic adsorption, optical adhesive attachment, and epoxy adhesive attachment.
In this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing further includes: the printing nozzle for 3D printing adopts at least one array type spray head.
Specifically, the printing nozzle of the invention adopts array type spray heads to improve the processing efficiency, and the number of the spray heads can be customized according to specific processing requirements.
In this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing further includes: the printing material is prepared from at least one of gold, silver, platinum, copper, tin, aluminum, epoxy resin, silica gel or ceramic
Specifically, the printing material in the method for processing the fine circuit on the surface of the transparent flexible film based on 3D printing may include, but is not limited to, conductive materials such as gold, platinum, copper, tin, and aluminum, and dielectric materials such as epoxy resin, silica gel, and ceramic.
Further, in this embodiment, it should be noted that the method for processing fine lines on the surface of the transparent flexible film based on 3D printing further includes: the processing precision of the fine line is 1 μm, and in the case where the printing material is gold, silver, platinum, copper, tin, or aluminum, the fine line includes a conductive structure pattern of an arbitrary shape; in the case where the printing material is epoxy, silicone, or ceramic, the fine lines include insulating structure patterns of arbitrary shapes.
Specifically, the processing accuracy of the fine lines (i.e., the resolution of the patterned electrodes) can be up to 1 μm, and is infinitely compatible upward, which overcomes the drawback of the prior art that the processing accuracy of the fine lines is too low.
Correspondingly, if the printing material is a conductive material such as gold, platinum, copper, tin, aluminum and the like, the fine circuit on the surface of the flexible film is a conductive structure; if the printing material is epoxy, silicone or ceramic, the fine lines on the surface of the flexible film are simple structured patterns, i.e., insulated structured patterns.
In conclusion, the method for processing the fine lines on the surface of the transparent flexible film based on 3D printing provided by the invention overcomes the problems of low resolution, low production efficiency, serious pollution in the production process, high production cost, low conductivity and unsatisfied substrate folding performance of ITO conductive films, patterned electrodes based on nano metal materials and other material electrodes in the prior art, realizes the large-area stable and rapid processing and manufacturing of the fine lines with the surface precision of the transparent flexible film as high as 1 mu m, simultaneously ensures the efficient production efficiency and the green production process, and meets the manufacturing requirement for processing structured patterns with any shapes on the surface of the flexible film. In addition, the invention can also select different clamping modes according to different substrates to realize the most efficient and stable large-area patterning fine line processing, and select different substrates and printing materials according to different performances and application scenes to optimally show the design performance.
Based on the same inventive concept, in another aspect, an embodiment of the present invention provides a transparent flexible film with fine lines on a surface thereof, which is processed by the above method for processing fine lines on a surface of a transparent flexible film based on 3D printing.
The transparent flexible film having a fine line on the surface provided by the present invention will be described with reference to fig. 7 and 8.
Fig. 7 is one of the structural diagrams of a transparent flexible film having fine lines on a surface thereof according to an embodiment of the present invention, and fig. 8 is one of the structural diagrams of a transparent flexible film having fine lines on a surface thereof according to another embodiment of the present invention.
Specifically, the transparent flexible film with fine lines on the surface is processed by the following 3D printing-based transparent flexible film surface fine line processing device based on the above 3D printing-based transparent flexible film surface fine line processing method.
More specifically, the transparent flexible film having a fine line on the surface thereof may have a resistivity within 3.5 × 10-6 Ω · m and a light transmittance of 80% or more at a light frequency under natural light conditions.
Based on the same inventive concept, on the other hand, an embodiment of the invention provides a device for processing fine lines on the surface of a transparent flexible film based on 3D printing.
The device for processing fine lines on the surface of the transparent flexible film based on 3D printing provided by the present invention is described below with reference to fig. 9, and the device for processing fine lines on the surface of the transparent flexible film based on 3D printing and the method for processing fine lines on the surface of the transparent flexible film based on 3D printing described above can be referred to correspondingly.
Fig. 9 is a schematic structural diagram of a device for processing a fine line on a surface of a transparent flexible film based on 3D printing according to an embodiment of the present invention.
In this embodiment, it should be noted that the device 1 for processing fine lines on the surface of a transparent flexible film based on 3D printing includes: the film modification unit 10 is used for carrying out surface modification treatment on the transparent flexible film so as to reduce the surface water contact angle and introduce oxygen-containing polar groups; the film image acquisition unit 20 is used for acquiring a three-dimensional super field depth image of the transparent flexible film; the film analysis unit 30 is configured to input the transparent flexible film three-dimensional super depth-of-field image to a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, where the transparent flexible film analysis model is obtained by training a sample transparent flexible film label based on the sample transparent flexible film three-dimensional super depth-of-field image and the sample transparent flexible film three-dimensional super depth-of-field image; and the 3D printing unit 40 is used for 3D printing the printing material on the transparent flexible film to obtain the transparent flexible film processed with the fine lines based on the 3D printing information.
It should be noted that, in an embodiment of the present invention, the 3D printing unit further includes: the device comprises a clamping module, a visual alignment module, a sensor height measurement module/height compensation module, a printing module, a sintering module and the like.
Since the device for processing fine lines on the surface of the transparent flexible film based on 3D printing according to the embodiment of the present invention can be used for executing the method for processing fine lines on the surface of the transparent flexible film based on 3D printing according to the embodiment, the working principle and the beneficial effect are similar, so detailed descriptions are omitted here, and specific contents can be referred to the description of the embodiment.
In this embodiment, it should be noted that each unit in the apparatus according to the embodiment of the present invention may be integrated into a whole, or may be separately disposed. The units may be combined into one unit, or further divided into a plurality of sub-units.
In addition, the transparent flexible film surface fine line processing device based on 3D printing of the present invention may include, but is not limited to, the following components: computer, motion control ware, sensor, printing nozzle, marble longmen, high definition industry camera, base plate anchor clamps, voice coil motor.
Fig. 10 is a schematic diagram of an electronic device according to an embodiment of the invention.
In this embodiment, it should be noted that the electronic device may include: a processor (processor)1010, a communication Interface (Communications Interface)1020, a memory (memory)1030, and a communication bus 1040, wherein the processor 1010, the communication Interface 1020, and the memory 1030 communicate with each other via the communication bus 1040. The processor 1010 may invoke logic instructions in the memory 1030 to perform a method for 3D printing based fine line processing of a surface of a transparent flexible film, the method comprising: carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce an oxygen-containing polar group; collecting a three-dimensional super field depth image of the transparent flexible film; inputting the transparent flexible film three-dimensional super depth-of-field image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained by training a sample transparent flexible film label based on the sample transparent flexible film three-dimensional super depth-of-field image and the sample transparent flexible film three-dimensional super depth-of-field image; and 3D printing the printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film processed with the fine lines.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Furthermore, the logic instructions in the memory 1030 can be implemented in software functional units and stored in a computer readable storage medium when the logic instructions are sold or used as independent products. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
In yet another aspect, the present invention also provides a non-transitory computer readable storage medium having stored thereon a computer program, which when executed by a processor, is implemented to perform a method for 3D printing-based fine line processing of a surface of a transparent flexible thin film, the method including: carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce an oxygen-containing polar group; collecting a three-dimensional super field depth image of the transparent flexible film; inputting the transparent flexible film three-dimensional super depth-of-field image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained by training a sample transparent flexible film label based on the sample transparent flexible film three-dimensional super depth-of-field image and the sample transparent flexible film three-dimensional super depth-of-field image; and 3D printing the printing material on the transparent flexible film based on the 3D printing information to obtain the transparent flexible film processed with the fine lines.
Moreover, in the present invention, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Furthermore, in the present disclosure, reference to the description of the terms "embodiment," "this embodiment," "yet another embodiment," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for processing fine lines on the surface of a transparent flexible film based on 3D printing is characterized in that the method is used for processing the transparent flexible film with fine lines and comprises the following steps:
carrying out surface modification treatment on the transparent flexible film to reduce the surface water contact angle and introduce an oxygen-containing polar group;
collecting a three-dimensional super field depth image of the transparent flexible film; and
inputting the transparent flexible film three-dimensional super depth-of-field image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained by training a sample transparent flexible film label based on a sample transparent flexible film three-dimensional super depth-of-field image and the sample transparent flexible film three-dimensional super depth-of-field image;
and 3D printing a printing material on the transparent flexible film on the basis of the 3D printing information to obtain the transparent flexible film processed with fine lines.
2. The method for processing the fine circuit on the surface of the transparent flexible film based on the 3D printing as claimed in claim 1, wherein the material type of the transparent flexible film comprises at least one of polyester PET, cyclic olefin polymer COP, polyimide PI, liquid crystal polymer LCP, polyethylene PE, polyurethane PU or polydimethylsiloxane PDMS.
3. The transparent flexible film surface fine line processing method based on 3D printing as claimed in claim 1, wherein the material kind of the printing material comprises at least one of gold, silver, platinum, copper, tin, aluminum, epoxy resin, silica gel or ceramic.
4. The method for processing the fine lines on the surface of the transparent flexible film based on the 3D printing as claimed in claim 1, wherein the collecting of the three-dimensional super-depth-of-field image of the transparent flexible film further comprises:
the transparent flexible film is clamped through any one of a plurality of clamping modes, and the clamped transparent flexible film moves to the range of the sensor.
5. The transparent flexible film surface fine line processing method based on 3D printing as claimed in claim 1, wherein the printing nozzle of 3D printing adopts at least one array type nozzle.
6. The transparent flexible film surface fine line processing method based on 3D printing as claimed in claim 3, wherein the processing precision of the fine line is 1 μm, and
in the case where the printing material is gold, silver, platinum, copper, tin, or aluminum, the fine lines include a conductive structure pattern of an arbitrary shape;
in the case where the printing material is epoxy, silicone, or ceramic, the fine lines include insulating structure patterns of arbitrary shapes.
7. The method for processing the fine circuit on the surface of the transparent flexible film based on the 3D printing as claimed in claim 4, wherein the plurality of clamping manners comprise a roller clamping manner, a clamping frame clamping manner, an attaching manner, an electrostatic adsorption manner or a suction cup adsorption manner.
8. The method for processing the fine lines on the surface of the transparent flexible film based on the 3D printing as claimed in claim 7, wherein the attaching manner comprises: hot melt adhesive attachment, electrostatic adsorption, optical adhesive attachment, and epoxy adhesive attachment.
9. The utility model provides a transparent flexible film surface fine line processingequipment based on 3D prints, includes:
the film modification unit is used for carrying out surface modification treatment on the transparent flexible film so as to reduce the surface water contact angle and introduce oxygen-containing polar groups;
the film image acquisition unit is used for acquiring a three-dimensional super field depth image of the transparent flexible film;
the film analysis unit is used for inputting the transparent flexible film three-dimensional super depth-of-field image into a transparent flexible film analysis model to obtain 3D printing information output by the transparent flexible film analysis model, wherein the transparent flexible film analysis model is obtained based on a sample transparent flexible film three-dimensional super depth-of-field image and sample transparent flexible film label training of the sample transparent flexible film three-dimensional super depth-of-field image;
and the 3D printing unit is used for printing a printing material on the transparent flexible film in a 3D mode based on the 3D printing information so as to obtain the transparent flexible film with the fine lines.
10. A transparent flexible film with fine lines on the surface, which is manufactured by the 3D printing-based transparent flexible film surface fine line processing method according to claim 1 and the 3D printing-based transparent flexible film surface fine line processing device according to claim 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210074304.7A CN114474722B (en) | 2022-01-21 | 2022-01-21 | Transparent flexible film surface fine circuit processing method and device based on 3D printing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210074304.7A CN114474722B (en) | 2022-01-21 | 2022-01-21 | Transparent flexible film surface fine circuit processing method and device based on 3D printing |
Publications (2)
Publication Number | Publication Date |
---|---|
CN114474722A true CN114474722A (en) | 2022-05-13 |
CN114474722B CN114474722B (en) | 2023-12-01 |
Family
ID=81472849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210074304.7A Active CN114474722B (en) | 2022-01-21 | 2022-01-21 | Transparent flexible film surface fine circuit processing method and device based on 3D printing |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN114474722B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109041563A (en) * | 2018-09-03 | 2018-12-18 | 青岛理工大学 | Method for manufacturing flexible transparent electromagnetic shielding film by using 3D printing |
CN110307900A (en) * | 2019-06-15 | 2019-10-08 | 江苏南大五维电子科技有限公司 | A kind of rebuilding spectrum system and its method for reconstructing based on printing exposure mask |
CN110641018A (en) * | 2019-09-25 | 2020-01-03 | 青岛理工大学 | Device and method for manufacturing flexible transparent conductive films in batch based on micro-nano 3D printing |
CN112509747A (en) * | 2020-10-14 | 2021-03-16 | 青岛理工大学 | Manufacturing method of flexible transparent conductive film based on low-voltage-driven liquid film embedded electrospray 3D printing |
CN112743993A (en) * | 2020-09-16 | 2021-05-04 | 哈尔滨工业大学(深圳) | Method and device for safely outputting printing information, terminal equipment and medium |
US20210349299A1 (en) * | 2020-05-05 | 2021-11-11 | National Chung Cheng University | Method and system for analyzing 2d material thin film |
CN113822882A (en) * | 2021-11-22 | 2021-12-21 | 武汉飞恩微电子有限公司 | Circuit board surface defect detection method and device based on deep learning |
-
2022
- 2022-01-21 CN CN202210074304.7A patent/CN114474722B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109041563A (en) * | 2018-09-03 | 2018-12-18 | 青岛理工大学 | Method for manufacturing flexible transparent electromagnetic shielding film by using 3D printing |
CN110307900A (en) * | 2019-06-15 | 2019-10-08 | 江苏南大五维电子科技有限公司 | A kind of rebuilding spectrum system and its method for reconstructing based on printing exposure mask |
CN110641018A (en) * | 2019-09-25 | 2020-01-03 | 青岛理工大学 | Device and method for manufacturing flexible transparent conductive films in batch based on micro-nano 3D printing |
US20210349299A1 (en) * | 2020-05-05 | 2021-11-11 | National Chung Cheng University | Method and system for analyzing 2d material thin film |
CN112743993A (en) * | 2020-09-16 | 2021-05-04 | 哈尔滨工业大学(深圳) | Method and device for safely outputting printing information, terminal equipment and medium |
CN112509747A (en) * | 2020-10-14 | 2021-03-16 | 青岛理工大学 | Manufacturing method of flexible transparent conductive film based on low-voltage-driven liquid film embedded electrospray 3D printing |
CN113822882A (en) * | 2021-11-22 | 2021-12-21 | 武汉飞恩微电子有限公司 | Circuit board surface defect detection method and device based on deep learning |
Also Published As
Publication number | Publication date |
---|---|
CN114474722B (en) | 2023-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105758562B (en) | A kind of pliable pressure sensor and preparation method thereof | |
KR100984782B1 (en) | Method for fabricating conductive pattern on flexible substrate and protective ink usde therein | |
CN109855526A (en) | A kind of resistance-type flexibility strain transducer and preparation method thereof based on dry mediation self assembly | |
CN104637570A (en) | Flexible transparent conductive thin film and preparation method thereof | |
CN106298070B (en) | A kind of preparation method of patterned conductive film | |
CN112201408B (en) | Preparation method of flexible transparent conductive film | |
CN110416401A (en) | A kind of pressure sensor and production method | |
CN105353574A (en) | Ultrathin windable segment-code-type electronic ink screen and preparing method | |
CN110231056A (en) | Utilize the method and electronic skin sensor of ink jet printing flexibility micro-structure surface preparation micro-structure electrode | |
CN206116459U (en) | Flexible capacitanc pressure sensor of sandwich formula | |
CN205899520U (en) | Touch screen | |
CN109741881B (en) | Graphene flexible electrode and preparation method thereof | |
Eshkeiti et al. | A stretchable and wearable printed sensor for human body motion monitoring | |
CN108184310B (en) | Manufacturing method of transparent flexible multilayer PCB | |
CN114474722A (en) | Transparent flexible film surface fine line processing method and device based on 3D printing | |
CN106098927B (en) | A kind of sandwich style flexible capacitance type pressure sensor and preparation method thereof | |
CN206114155U (en) | Flexible capacitanc pressure sensor of type that gradually bursts at seams | |
CN106289591B (en) | Involute type flexible capacitive pressure sensor and preparation method thereof | |
TW201509673A (en) | Transparent conductor | |
US20120261172A1 (en) | Structure and pattern forming method of transparent conductive circuit | |
CN108920004B (en) | Preparation method of conductive laminated structure, conductive laminated structure and touch panel | |
CN213904318U (en) | Flexible touch capacitive screen | |
JP2017163085A (en) | Method for manufacturing bonded body | |
WO2014185330A1 (en) | Transparent conductor | |
CN205899519U (en) | Touch screen |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |