CN110641018A - Device and method for manufacturing flexible transparent conductive films in batch based on micro-nano 3D printing - Google Patents
Device and method for manufacturing flexible transparent conductive films in batch based on micro-nano 3D printing Download PDFInfo
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- CN110641018A CN110641018A CN201910912277.4A CN201910912277A CN110641018A CN 110641018 A CN110641018 A CN 110641018A CN 201910912277 A CN201910912277 A CN 201910912277A CN 110641018 A CN110641018 A CN 110641018A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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Abstract
The invention relates to the technical field of flexible transparent conductive films and micro-nano 3D printing, in particular to a device and a method for manufacturing flexible transparent conductive films in batches based on micro-nano 3D printing.
Description
Technical Field
The invention relates to the technical field of flexible transparent conductive films and micro-nano 3D printing, in particular to a device for manufacturing large-area metal mesh grid (grid) flexible transparent conductive films in batch based on micro-nano 3D printing and a working method thereof.
Background
The transparent conductive film is a film which can conduct electricity and has high light transmittance in a visible light range, and has very wide application in the photoelectronic fields of touch screens, displays, LEDs, OLEDs, LCDs, thin-film solar cells, electronic paper and the like. In addition, the transparent conductive film can also be applied to the fields of transparent electric heating, electromagnetic shielding optical windows, low-emissivity glass, wide-spectrum stealth and the like. The transparent conductive film material mainly comprises: compared with other existing transparent conductive films, the metal mesh flexible transparent conductive film, particularly the nano silver mesh flexible transparent conductive film, has better optical, electrical and physical (flexibility, bending and conformality, adhesion performance with a substrate and film stability) performances, and the light transmittance and the sheet resistance of the film can be randomly adjusted according to the performance requirements, so that the contradiction between high light transmittance and low sheet resistance can be solved, and the film has a wide industrial application prospect.
The manufacturing methods of the flexible transparent conductive thin film of the metal mesh grid, which have been proposed at present, are various and mainly include laser direct writing, ink-jet printing, nano imprinting, photoetching, precise screen printing and the like, but the existing manufacturing methods all have certain defects and limitations and cannot meet the requirements of the batch manufacturing actual production of the flexible transparent conductive thin film of the metal mesh grid. For example, photolithography and nanoimprint have the problems of complicated manufacturing process, high production cost and low efficiency, and especially, the material waste during the production process is serious, and a large amount of waste liquid is generated. In addition, the problems of difficulty in large-area manufacturing, high manufacturing cost of the mold and the mask, and the like are faced. The laser direct writing also has the problems of complicated manufacturing process, high production cost, low efficiency and serious waste of conductive materials, and in addition, has the problems of low processing precision, expensive equipment and the like. Precision screen printing on the one hand wastes almost 99% of the expensive conductive material and produces a low resolution pattern, and in particular suffers from the problem of being unsuitable for flexible substrates. Although the ink-jet printing has high material utilization rate, the printing pattern precision is low (the resolution is lower than 20 microns), the light transmittance requirement of the high-performance transparent conductive film cannot be met, and the viscosity requirement suitable for printing materials is very low (the piezoelectric type is below 30cp, which causes the content of conductive metal to be low), so that the transparent conductive film has large sheet resistance and poor electrical property and adhesion property. Therefore, a new large-area high-performance flexible transparent conductive film metal mesh grid large-scale manufacturing technology is urgently needed to be developed so as to realize the efficient low-cost batch manufacturing of the large-area metal mesh grid flexible transparent conductive film, and the manufactured metal mesh grid transparent conductive film has high light transmittance (more than 88%) and low sheet resistance (less than 5 omega/□), has a very good comprehensive quality factor, and can meet the requirements of industrial-grade application and actual production.
Disclosure of Invention
Aiming at the problems, the invention discloses a device for manufacturing flexible transparent conductive films in batches based on micro-nano 3D printing and a working method thereof, which can manufacture metal grids with large area, high precision, superfine line width and large aspect ratio on various flexible substrates in batches, realize the efficient and low-cost large-scale manufacturing of the high-performance metal grid flexible transparent conductive films, solve the bottleneck problem of industrial-grade batch manufacturing of the metal grid flexible transparent conductive films, and solve the pair of contradiction of light transmittance and conductivity of the transparent conductive films, so that the flexible transparent conductive films have high light transmittance and low sheet resistance.
In order to achieve the above object, one of the solutions proposed by the present invention is: the device for manufacturing the flexible transparent conductive films in batches based on micro-nano 3D printing is provided, and comprises: the device comprises a rack, an unreeling module, a tension adjusting module, a substrate surface processing module, a printing metal mesh grid module, a metal mesh grid sintering module, a protective film covering module, a deviation rectifying module and a reeling module; the unwinding module is arranged on the rack and is positioned at the initial position of the whole device; the tension adjusting module comprises a tension detecting sensor and a tension control controller, the tension adjusting module is arranged on the rack and higher than the winding module, and a shaft core of the tension adjusting module is parallel to a shaft core of the winding module; the substrate surface processing module is the next station of the tension adjusting module and is arranged on the frame; the printing metal mesh grid module comprises a printer frame, a Y-axis movement module, an X-axis movement module, a Z-axis movement module, a spray head bracket, a spray head module, a back pressure module, a high-voltage power supply, a laser range finder, a monitoring module and a sintering and curing module; the X-axis movement module is connected with the Y-axis movement module and is orthogonally arranged; the Z-axis movement module is fixed on the X-axis movement module, the spray head module is fixed on the Z-axis movement module through a spray head support, the spray head module at least comprises 10 spray heads, the spray heads are arranged in an array mode, and the number of the specifically used spray heads is determined according to the printing breadth; the back pressure module is connected with the upper part of the spray head module; the high-voltage power supply is connected with the conductive nozzle of the spray head module, and the laser range finder and the monitoring module are fixed on the spray head bracket and are respectively arranged on two sides of the spray head; the sintering and curing module is fixed at the rear part of the spray head bracket, and the spray head module, the laser range finder and the monitoring module are arranged at the front part of the spray head bracket; the metal mesh grid sintering module is positioned at the next station of the printed metal mesh grid module, a low-temperature thermal sintering device is selected to perform sintering conductive treatment on the printed metal mesh grid structure, and the printed metal mesh grid structure is arranged on the rack; the protective film coating module comprises a protective film winding roller and a roller-to-roller film coating device, the winding roller is positioned above the roller-to-roller film coating device and is arranged on the rack, the gap between two control rollers of the roller-to-roller film coating device is adjustable, and the gap position and the highest position of a roller of the tension adjusting module are kept at the same horizontal height; the deviation rectifying module is arranged on the rack, and the highest position of the roller of the deviation rectifying module and the highest position of the roller of the tension adjusting module are positioned at the same horizontal height; the winding module and the unwinding module are arranged on the frame, and the shaft cores of the winding module and the unwinding module are at the same horizontal height.
Furthermore, all the roller shaft cores in the unwinding module, the tension adjusting module, the protective film covering module, the deviation rectifying module and the winding module are kept parallel to each other.
The invention also provides a method for preparing the flexible transparent conductive film by using the device, which comprises the following steps:
a method for preparing flexible transparent conductive films by adopting a device for manufacturing the flexible transparent conductive films in batches based on micro-nano 3D printing comprises the following steps:
step 1: printing initialization;
step 2: processing the surface of the flexible film substrate;
and step 3: carrying out micro-nano 3D printing and pre-curing sintering on the metal mesh;
and 4, step 4: sintering the metal mesh grid;
and 5: coating a protective film;
step 6: rolling;
the working process of the step 1 is as follows: starting the unwinding module, the tension adjusting module, the deviation correcting module and the winding module to enable the flexible film substrate to be in a tensioned and horizontal state, keeping the same set height between a sprayer module array sprayer in the printing metal mesh grid module and the film substrate, and keeping the movement direction of the sprayer vertical to the plane of the film substrate; the substrate surface processing module, the printing metal mesh grid module, the metal mesh grid sintering module and the protective film covering module are all in a use state;
the working process of the step 2 is as follows: starting the substrate surface treatment module, treating the surface of the flexible film substrate, and treating the surface of the flexible film substrate by adopting any one of a UV ozone treatment device, a corona treatment device and a plasma treatment device to improve the surface energy of the flexible film substrate;
the working process of the step 3 is as follows: moving the flexible thin film substrate processed in the step (2) to a metal mesh grid printing station, printing the metal mesh grid by a metal mesh grid printing module according to set process parameters and paths, and performing single printing or multiple layer-by-layer accumulation printing according to the height required by the design of the metal mesh grid; after the first layer is printed, the second layer is printed until the set height of the metal mesh grid is reached; when the metal mesh grid is printed, a rear sintering and curing module fixed on the spray head support is started at the same time, and the printed metal mesh grid is subjected to in-situ rapid curing and pre-sintering; according to the requirements of a specific production process, after a group of metal grids are printed, the spray head module moves to the next position along the X direction to print; when the printing on the set area surface is completely finished, the spray head module returns to the initial printing station;
the working process of the step 4 is as follows: moving the metal mesh grid printed in the step 3 to a metal mesh grid sintering station, and performing rapid sintering and electric conduction treatment on the printed metal mesh grid by adopting one or more sintering modes of laser rapid low-temperature sintering, low-temperature thermal sintering and far-infrared sintering;
the working process of the step 5 is as follows: moving the sintered metal mesh grid to a film coating station, starting a protective film coating module, and attaching a layer of highly transparent protective film on the metal mesh grid;
the working process of the step 6 is as follows: in the whole process, the unreeling module, the tension adjusting module, the deviation correcting module and the reeling module are always in an opening state, and the unreeling and reeling operations are combined, so that after the film covering process in the step 5 is finished, the metal mesh grid after film covering is reeled to the reeling roller in the reeling module.
The steps 2 to 6 are continuously operated, the step 5 and the step 6 need to be closely matched, namely, the unwinding, the film covering and the winding are kept at the same speed, and meanwhile, the tension adjusting module and the deviation correcting module are matched with the operations of unwinding, film covering and winding so as to realize batch preparation; the process parameters comprise the distance between the spray head module spray head and the flexible film substrate, the moving speed of the spray head X, Y direction, and the voltage, the frequency, the duty ratio and the back pressure of a high-voltage power supply;
the printed metal mesh pattern includes, but is not limited to: various micro-nano patterns and micro-nano structures such as wire grids, squares, rhombuses, pyramids, hexagons, circles and the like.
The flexible transparent film substrate includes, but is not limited to: polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, polyvinyl chloride, polyimide, polyethersulfone, polyetherimide, polystyrene, polyphenylene oxide, polyurethane, epoxy resin, polyvinyl alcohol, or the like.
The printed metal mesh material includes, but is not limited to: micro-nano silver conductive paste, micro-nano copper conductive paste, nano silver wire conductive paste and the like, wherein the viscosity range is 500-.
The temperature of solidification and sintering in the printing metal mesh grid module and the metal mesh grid sintering module is 70-180 ℃. The sintering time is 1-5 minutes.
The height of the nozzle module of the printing metal mesh grid module from the thin film substrate is 20-200 mu m, the output voltage of the high-voltage power supply is 0-5kV continuously adjustable, and the output pulse frequency is 0Hz-3000 Hz.
The spray head module comprises a concealed needle head, a stainless steel needle head, a conductive treatment glass needle head and the like, and the inner diameter of the spray head module is 1-200 mu m. Preferably, a hypodermic needle is used.
The protective film covering module covers a layer of transparent plastic film with the thickness of 0.01-0.02 mm on the metal mesh grid, and the film comprises polyvinyl chloride, polypropylene, polyester film and the like.
The running speed of the flexible film substrate is 0-40m/min, and the tension of the film is controlled to be 5-200N.
Further, the step 2 of treating the surface of the substrate, the step 3 of printing the metal mesh grid and the step 4 of solidifying and presintering the metal mesh grid are carried out simultaneously. If the first work cycle is in, firstly executing the step 2, and keeping the steps 3 and 4 in a standby state; after the step 2 is finished, after the surface of the substrate is processed and the printing station is moved, the step 2 and the step 3 are simultaneously carried out, and the step 4 is in a standby state; and when the printed metal mesh grid moves to the sintering station, the step 2, the step 3 and the step 4 are carried out simultaneously. The operations subsequently performed, step 2, step 3 and step 4, are all performed simultaneously.
The invention has the following remarkable advantages: the method fully utilizes the advantages of technologies such as high-precision micro-nano 3D printing, roll-to-roll high-efficiency processing, array type multi-nozzle large-area high-efficiency printing, synchronous rapid curing and in-situ sintering, low-temperature sintering of high-solid-content nano metal conductive slurry and the like, realizes high-performance (low resistance, high light transmittance and good bending resistance) high-efficiency low-cost large-scale manufacturing of the metal mesh flexible transparent conductive film, solves the bottleneck problem of manufacturing of the metal mesh flexible transparent conductive film, and provides a brand-new industrial-level solution for high-efficiency and low-cost large-scale manufacturing of the large-area high-performance flexible transparent conductive film.
The invention has the beneficial effects that:
(1) the invention realizes the efficient low-cost large-scale manufacturing of the large-area metal mesh flexible transparent conductive film, has low production cost, does not need to use complicated processes such as photoetching, nano-imprinting, evaporation, sputtering, electroplating and the like and expensive equipment, particularly has the material utilization rate of almost 100 percent, has simple process steps, is suitable for film substrates and conductive materials with wide variety, does not generate waste liquid, waste gas, waste and the like in the production process, and avoids environmental pollution.
(2) The invention has simple production process and few process steps; the manufacturing of the metal mesh grid can be completed only by 6-10 process steps of traditional photoetching, laser direct writing, nano imprinting and the like; especially, the manufacturing problem of the large-area flexible transparent conductive film is solved by combining the technologies of roll-to-roll processing, array type multi-nozzle 3D printing, low-temperature rapid curing, synchronous sintering and the like.
(3) The flexible transparent conductive film of the metal mesh grid manufactured by the invention has the outstanding advantages of high light transmittance, low sheet resistance, low haze, high adhesive force and high bending resistance. The method has the advantages that the electric field is utilized to drive the jet deposition micro-nano 3D printing high-precision printing to realize the manufacturing of the ultra-fine metal mesh grid with the large height-width ratio, the contradiction between high light transmittance and low sheet resistance which cannot be solved in the prior art is solved, high transmittance and low sheet resistance can be simultaneously realized, the manufactured metal mesh grid and the flexible substrate film have excellent adhesive force and adhesive property, and the manufactured metal mesh grid and the flexible substrate film have very high adhesive force, excellent bending resistance and high stability by combining the high solid content nano metal conductive paste used by the method and the surface treatment of the flexible film substrate.
(4) The invention has strong adaptability and high flexibility degree, and is suitable for customized production; the manufacturing of the flexible transparent conductive film with different areas and different performances can be realized only by changing the printing process parameters; the flexible transparent conductive film is suitable for large-scale manufacturing of the flexible transparent conductive film, is suitable for medium and small-batch production, and can be particularly suitable for single-piece small-batch customized production.
(5) The invention can complete the instant sintering and curing of the printing structure by utilizing the laser real-time sintering process, and can adjust the curing degree by the process parameters such as laser energy density and the like to obtain a controllable section shape, thereby meeting the processing requirements of roll-to-roll production.
(6) The invention can realize the production of the high-performance flexible transparent conductive film, and the technical index light transmittance is higher than 90 percent; the sheet resistance is less than 2 omega/□; the haze is less than 1%, and the adhesion level is higher than 5B. The flexible transparent conductive film can be applied to the fields of flexible transparent conductive film electrodes, transparent electric heating films, transparent electromagnetic shielding films, thin film solar cells, wearable equipment, OLEDs (organic light emitting diodes), touch screens, flexible displays, LCDs (liquid crystal displays), low-emissivity glass, wide-spectrum stealth and the like.
Drawings
Fig. 1 is a schematic overall structure diagram of a device for manufacturing flexible transparent conductive films in batches based on micro-nano 3D printing.
FIG. 2 is a schematic structural diagram of a printing metal mesh grid module (electric field driven jet deposition micro-nano 3D printing) in the invention
Fig. 3 is a flow chart of a method for manufacturing a flexible transparent conductive film based on the device of the present invention.
Detailed Description
The invention is further described with reference to the following figures and examples.
Fig. 1 is a schematic general structural diagram of a device for manufacturing flexible transparent conductive films in batches based on micro-nano 3D printing according to an embodiment of the invention. It includes: the device comprises a rack 1, an unreeling module 2, a tension adjusting module 3, a substrate surface processing module 4, a printing metal mesh grid module 5, a metal mesh grid sintering module 6, a protective film covering module 7, a deviation correcting module 8 and a reeling module 9. The unreeling module 2 is arranged on the rack 1 and is positioned at the initial position of the whole device; the tension adjusting module 3 comprises a tension detecting sensor and a tension control controller, the tension adjusting module 3 is arranged on the rack 1 and is higher than the winding module 2, and the axial core of the tension adjusting module 3 is parallel to the axial core of the winding module 2; the substrate surface treatment module 4 is the next station of the tension adjustment module 3, and in the embodiment, a UV ozone treatment device is selected to perform surface treatment on the substrate and is installed on the machine frame 1; the printing metal mesh grid module 5 comprises a printer frame 501, a Y-axis movement module 502, an X-axis movement module 503, a Z-axis movement module 504, a spray head bracket 505, a spray head module 506, a back pressure module 507, a high-voltage power supply 508, a laser range finder 509, a monitoring module 510 and a sintering and curing module 511. The Y-axis motion module 502 is arranged on the printer frame 501, and the X-axis motion module 503 is connected with the Y-axis motion module 502 and is orthogonally arranged; the Z-axis movement module 504 is fixed on the X-axis movement module 503, the spray head module 506 is fixed on the Z-axis movement module 504 through a spray head support 505, the spray head module 506 at least comprises 10 spray heads, the spray heads are arranged in an array mode, and the number of the spray heads used specifically is determined according to the printing breadth. The back pressure module 507 is connected to the upper portion of the showerhead module 506. The high voltage power supply 508 is connected with the conductive nozzle of the nozzle module 506, and the laser range finder 509 and the monitoring module 510 are fixed on the nozzle bracket 505 and respectively arranged at two sides of the nozzle. The sintering and curing module 511 is fixed at the rear part of the spray head bracket 505, and the spray head module 506, the laser range finder 509 and the monitoring module 510 are arranged at the front part of the spray head bracket 505. The metal mesh grid sintering module 6 is positioned at the next station of the printing metal mesh grid module 5, a low-temperature thermal sintering device is selected to perform sintering conductive treatment on the printed metal mesh grid structure, and the printed metal mesh grid structure is arranged on the rack 1; the protective film coating module 7 comprises a protective film winding roller 701 and a roller-to-roller film coating device 702, the winding roller 701 is positioned above the roller-to-roller film coating device 702 and is arranged on the rack 1, the gap between two control rollers of the roller-to-roller film coating device 702 is adjustable, and the gap position and the highest position of the roller of the tension adjusting module 3 are kept at the same horizontal height; the deviation rectifying module 8 is arranged on the frame 1, and the highest position of the roller of the deviation rectifying module 8 and the highest position of the roller of the tension adjusting module 3 are positioned at the same horizontal height; the winding module 9 and the unwinding module 2 are arranged on the frame 1, and the shaft cores are at the same horizontal height. Particularly, all the roller shaft cores in the unreeling module 2, the tension adjusting module 3, the protective film covering module 7, the deviation rectifying module 8 and the reeling module 9 are kept parallel to each other.
The specific process for manufacturing the flexible transparent conductive film by adopting the structure shown in FIG. 1 is as follows:
step 1: print initialization
The flexible film substrate is made of a PET coiled material, the thickness of the PET coiled material is 0.3mm, and the width of the PET coiled material is 900 mm. The flexible transparent conductive film is characterized in that a flexible PET film substrate (base material) is wound (placed) on a unwinding roller of the unwinding module 2, sequentially passes through a tension adjusting module 3, a substrate surface processing module 4, a printing metal mesh grid module 5, a metal mesh grid sintering module 6, a protective film covering module 7 and a deviation rectifying module 8, and finally the manufactured flexible transparent conductive film is wound on the unwinding roller through a winding module 9. And (3) starting the unreeling module 2, the tension adjusting module 3, the deviation correcting module 8 and the reeling module 9 to enable the PET film substrate to be in a tensioned and horizontal state (the sprayer of the sprayer module array in the printing metal mesh grid module keeps the same set height with the film substrate, and the movement direction of the sprayer is vertical to the plane of the film substrate). The substrate surface processing module 4, the printing metal mesh grid module 5, the metal mesh grid sintering module 6 and the protective film covering module 7 are in an enabling state.
Step 2: flexible PET film substrate surface treatment
And starting the substrate surface treatment module 4, treating the surface of the flexible film substrate, and treating the surface of the flexible PET film substrate by using a UV ozone treatment device to improve the surface energy (surface tension) of the flexible PET film substrate, wherein the power of the UV lamp tube is 150W.
And step 3: micro-nano 3D printing and pre-curing sintering of metal mesh
The flexible PET film substrate processed in the step 2 is moved to a metal mesh grid printing station, nano silver paste is selected as a printing material (the content of the nano silver is 80%, the sintering temperature is 120 ℃), and printing parameters of the metal mesh grid module 5 are set: the distance between the spray head module and the flexible PET film substrate is 150 micrometers, the printing nozzle is a Wucang spray head, the diameter of the spray head is 150 micrometers, the printing speed is 6m/min, the voltage value of the high-voltage power supply 508 is 750V, the duty ratio is 50%, and the air pressure value of the back pressure module 507 is 50 MPa; the geometrical parameters of the printed metal grid structure are as follows: the line width is 20 μm, the period is 1000 μm, the number of printing layers is 5, and the printing pattern is square. And printing the metal mesh grid according to the set process parameters and paths, and after the first layer is printed, executing second layer printing until the set height of the metal mesh grid is reached. According to the height required by the design of the metal mesh grid, single printing or multiple layer-by-layer accumulation printing can be performed. When the metal mesh grid is printed, the rear sintering and curing module 511 fixed on the spray head bracket 505 is started at the same time, and the printed metal mesh grid is subjected to in-situ rapid curing and pre-sintering, wherein the curing temperature is 60 ℃. After printing a set of metal grids, the nozzle module 506 moves to the next position along the X-direction for printing according to the specific tact requirement. When printing is completed on all the set area surfaces, the head module 506 returns to the original printing station.
And 4, step 4: sintering of metal grids
And (3) moving the metal mesh grid printed in the step (3) to a metal mesh grid sintering station, starting a metal mesh grid sintering module 6, and carrying out rapid sintering and electric conduction treatment on the printed metal mesh grid by adopting a low-temperature thermal sintering process, wherein the sintering temperature is adjusted to be 120 ℃, and the sintering time is 2 min.
And 5: coating protective film
And moving the sintered metal mesh grid to a film laminating station, opening a protective film laminating module 7, attaching a layer of high-transparency protective film on the metal mesh grid, wherein the protective film is a PET (polyethylene terephthalate) film, and the thickness of the protective film is 0.02 mm.
Step 6: rolling-up device
In the whole process, the unwinding module 2, the tension adjusting module 3, the deviation correcting module 8 and the winding module 9 are simultaneously opened, unwinding and winding operations are combined, and after the film covering process in the step 5 is finished, the metal mesh grid after film covering is wound on the winding roller in the winding module 9.
And the step 2 of treating the surface of the substrate, the step 3 of printing the metal mesh grid and the step 4 of solidifying and presintering the metal mesh grid are carried out simultaneously. If the first work cycle is in, firstly executing the step 2, and keeping the steps 3 and 4 in a standby state; after the step 2 is finished, after the surface of the substrate is processed and the printing station is moved, the step 2 and the step 3 are simultaneously carried out, and the step 4 is in a standby state; and when the printed metal mesh grid moves to the sintering station, the step 2, the step 3 and the step 4 are carried out simultaneously. The operations subsequently performed, step 2, step 3 and step 4, are all performed simultaneously.
The step 5 and the step 6 need to be closely matched, namely, the unwinding, the film covering and the winding are kept at the same speed, and meanwhile, the tension adjusting module 3 and the deviation correcting module 8 are matched with the operations of unwinding, the film covering and the winding.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (10)
1. The utility model provides a device based on receive 3D printing batch manufacturing flexible transparent conductive film a little which characterized in that: the device comprises: the device comprises a rack, an unreeling module, a tension adjusting module, a substrate surface processing module, a printing metal mesh grid module, a metal mesh grid sintering module, a protective film covering module, a deviation rectifying module and a reeling module; the unwinding module is arranged on the rack and is positioned at the initial position of the whole device; the tension adjusting module comprises a tension detecting sensor and a tension control controller, the tension adjusting module is arranged on the rack and higher than the winding module, and a shaft core of the tension adjusting module is parallel to a shaft core of the winding module; the substrate surface processing module is the next station of the tension adjusting module and is arranged on the frame; the printing metal mesh grid module comprises a printer frame, a Y-axis movement module, an X-axis movement module, a Z-axis movement module, a spray head bracket, a spray head module, a back pressure module, a high-voltage power supply, a laser range finder, a monitoring module and a sintering and curing module; the X-axis movement module is connected with the Y-axis movement module and is orthogonally arranged; the Z-axis movement module is fixed on the X-axis movement module, the spray head module is fixed on the Z-axis movement module through a spray head support, the spray head module at least comprises 10 spray heads, the spray heads are arranged in an array mode, and the number of the specifically used spray heads is determined according to the printing breadth; the back pressure module is connected with the upper part of the spray head module; the high-voltage power supply is connected with the conductive nozzle of the spray head module, and the laser range finder and the monitoring module are fixed on the spray head bracket and are respectively arranged on two sides of the spray head; the sintering and curing module is fixed at the rear part of the spray head bracket, and the spray head module, the laser range finder and the monitoring module are arranged at the front part of the spray head bracket; the metal mesh grid sintering module is positioned at the next station of the printed metal mesh grid module, a low-temperature thermal sintering device is selected to perform sintering conductive treatment on the printed metal mesh grid structure, and the printed metal mesh grid structure is arranged on the rack; the protective film coating module comprises a protective film winding roller and a roller-to-roller film coating device, the winding roller is positioned above the roller-to-roller film coating device and is arranged on the rack, the gap between two control rollers of the roller-to-roller film coating device is adjustable, and the gap position and the highest position of a roller of the tension adjusting module are kept at the same horizontal height; the deviation rectifying module is arranged on the rack, and the highest position of the roller of the deviation rectifying module and the highest position of the roller of the tension adjusting module are positioned at the same horizontal height; the winding module and the unwinding module are arranged on the frame, and the shaft cores of the winding module and the unwinding module are at the same horizontal height.
The height of the nozzle module of the printing metal mesh grid module from the thin film substrate is 20-200 mu m, the output voltage of the high-voltage power supply is 0-5kV continuously adjustable, and the output pulse frequency is 0Hz-3000 Hz; the spray head of the spray head module is one of a hidden needle head, a stainless steel needle head and a conductive treated glass needle head, and the inner diameter of the spray head module is 1-200 mu m; preferably, a hypodermic needle is used.
2. The device for manufacturing flexible transparent conductive films in batches based on micro-nano 3D printing according to claim 1 is characterized in that: all the roller shaft cores in the unwinding module, the tension adjusting module, the protective film covering module, the deviation rectifying module and the winding module are kept parallel to each other.
3. A method for preparing flexible transparent conductive films by using the device for manufacturing flexible transparent conductive films in batches based on micro-nano 3D printing according to any one of claims 1-2 is characterized by comprising the following steps:
step 1: printing initialization;
step 2: processing the surface of the flexible film substrate;
and step 3: carrying out micro-nano 3D printing and pre-curing sintering on the metal mesh;
and 4, step 4: sintering the metal mesh grid;
and 5: coating a protective film;
step 6: rolling;
the working process of the step 1 is as follows: starting the unwinding module, the tension adjusting module, the deviation correcting module and the winding module to enable the flexible film substrate to be in a tensioned and horizontal state, keeping the same set height between a sprayer module array sprayer in the printing metal mesh grid module and the film substrate, and keeping the movement direction of the sprayer vertical to the plane of the film substrate; the substrate surface processing module, the printing metal mesh grid module, the metal mesh grid sintering module and the protective film covering module are all in a use state;
the working process of the step 2 is as follows: starting the substrate surface treatment module, treating the surface of the flexible film substrate, and treating the surface of the flexible film substrate by adopting any one of a UV ozone treatment device, a corona treatment device and a plasma treatment device to improve the surface energy of the flexible film substrate;
the working process of the step 3 is as follows: moving the flexible thin film substrate processed in the step (2) to a metal mesh grid printing station, printing the metal mesh grid by a metal mesh grid printing module according to set process parameters and paths, and performing single printing or multiple layer-by-layer accumulation printing according to the height required by the design of the metal mesh grid; after the first layer is printed, the second layer is printed until the set height of the metal mesh grid is reached; when the metal mesh grid is printed, a rear sintering and curing module fixed on the spray head support is started at the same time, and the printed metal mesh grid is subjected to in-situ rapid curing and pre-sintering; according to the requirements of a specific production process, after a group of metal grids are printed, the spray head module moves to the next position along the X direction to print; when the printing on the set area surface is completely finished, the spray head module returns to the initial printing station;
the working process of the step 4 is as follows: moving the metal mesh grid printed in the step 3 to a metal mesh grid sintering station, and performing rapid sintering and electric conduction treatment on the printed metal mesh grid by adopting one or more sintering modes of laser rapid low-temperature sintering, low-temperature thermal sintering and far-infrared sintering;
the working process of the step 5 is as follows: moving the sintered metal mesh grid to a film coating station, starting a protective film coating module, and attaching a layer of highly transparent protective film on the metal mesh grid;
the working process of the step 6 is as follows: in the whole process, the unreeling module, the tension adjusting module, the deviation correcting module and the reeling module are always in an opening state, and the unreeling and reeling operations are combined, so that after the film covering process in the step 5 is finished, the metal mesh grid after film covering is reeled to the reeling roller in the reeling module.
4. The method of preparing a flexible transparent conductive film according to claim 3, wherein: the flexible transparent film substrate is any one of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyvinyl chloride, polyimide, polyether sulfone, polyether imide, polystyrene, polyphenyl ether, polyurethane, epoxy resin and polyvinyl alcohol.
5. The method of preparing a flexible transparent conductive film according to claim 3, wherein: the printed metal mesh grid pattern is any one of a micro-nano pattern and a micro-nano structure of a wire grid, a square, a diamond, a pyramid, a hexagon and a circle.
6. The method of preparing a flexible transparent conductive film according to claim 3, wherein: the printing metal grid material is one or more of micro-nano silver conductive paste, micro-nano copper conductive paste and nano silver wire conductive paste, and the viscosity range of the printing metal grid material is 500-.
7. The method of preparing a flexible transparent conductive film according to claim 3, wherein: the curing and sintering temperature in the printing metal mesh grid module and the metal mesh grid sintering module is 70-180 ℃, and the sintering time is 1-5 minutes.
8. The method of preparing a flexible transparent conductive film according to claim 3, wherein: the protective film covering module is formed by covering a layer of transparent plastic film with the thickness of 0.01-0.02 mm on a metal mesh grid, wherein the film is any one of polyvinyl chloride, polypropylene and polyester film; the running speed of the flexible film substrate is 0-40m/min, and the tension of the film is controlled to be 5-200N.
9. The method of preparing a flexible transparent conductive film according to claim 3, wherein: step 2-step 6 are continuously operated, step 5 and step 6 need to be closely matched, namely, unwinding, film covering and winding are kept at the same speed, and meanwhile, the tension adjusting module and the deviation correcting module are matched with the operations of unwinding, film covering and winding to realize batch preparation; the process parameters include the distance between the showerhead module and the flexible film substrate, the moving speed of the showerhead X, Y, and the voltage, frequency, duty and back pressure of the high voltage power supply.
10. The method of preparing a flexible transparent conductive film according to claim 3, wherein: and the step 2 of treating the surface of the substrate, the step 3 of printing the metal mesh grid and the step 4 of solidifying and presintering the metal mesh grid are carried out simultaneously. If the first work cycle is in, firstly executing the step 2, and keeping the steps 3 and 4 in a standby state; after the step 2 is finished, after the surface of the substrate is processed and the printing station is moved, the step 2 and the step 3 are simultaneously carried out, and the step 4 is in a standby state; and when the printed metal mesh grid moves to the sintering station, the step 2, the step 3 and the step 4 are carried out simultaneously. The operations subsequently performed, step 2, step 3 and step 4, are all performed simultaneously.
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