CN114171914A

CN114171914A - Beidou antenna

Info

Publication number: CN114171914A
Application number: CN202210126824.8A
Authority: CN
Inventors: 任侃侃; 韦增旭; 张志龙; 刘士杰; 杨帅; 燕官锋
Original assignee: HEBEI JINGHE ELECTRONIC TECHNOLOGY CO LTD
Current assignee: HEBEI JINGHE ELECTRONIC TECHNOLOGY CO LTD
Priority date: 2022-02-11
Filing date: 2022-02-11
Publication date: 2022-03-11
Anticipated expiration: 2042-02-11
Also published as: CN114171914B

Abstract

This application is applicable to satellite communication technical field, provides a big dipper antenna, and this antenna includes: the antenna housing, the box body and the base form a closed cavity, the cavity comprises a first combination body formed by a passive antenna and an active module, and a second combination body formed by an L-shaped cavity filter, a B1 cavity filter, a baffle and a tray, and the first combination body is located above the second combination body. The passive antenna is arranged above the active module, the L cavity filter, the B1 cavity filter and the baffle are arranged above the tray, the L cavity filter and the B1 cavity filter are respectively arranged on two sides of the baffle, and components in the cavity are electrically connected through the cable assembly. This application when adopting high mechanical strength' S exterior structure, can promote the receptivity of S frequency point antenna to the stable work of B1 frequency point when the short message of transmission of big dipper antenna has further been ensured.

Description

Beidou antenna

Technical Field

The application belongs to the technical field of satellite communication, especially relates to a big dipper antenna.

Background

The Beidou navigation system in China has completed comprehensive construction and can provide satellite navigation service and short message service for military field and civil field in the global range. The Beidou antenna in the civil field is usually erected in the open air and is easy to suffer from the impact of severe weather such as rainstorm, hail and sand in the natural world, and the Beidou antenna in the military field also needs to have certain bulletproof capability and capability of resisting explosive fragments, so that the Beidou antenna needs to have higher mechanical strength.

At present, the big dipper antenna of high mechanical strength adopts outside high mechanical strength structure mostly, protects the inside subassembly of antenna and prevents to damage. However, such a high mechanical strength external structure may have a great influence on the internal signal transceiving performance, wherein the most significant influence is that the S-frequency receiving performance deteriorates and the B1 frequency receiving link often fails when the antenna transmits a short message.

Disclosure of Invention

For overcoming the problem that exists among the correlation technique, this application embodiment provides a big dipper antenna, when adopting high mechanical strength' S exterior structure, can promote the receiving and dispatching performance of S frequency point antenna to the stable work of B1 frequency point has further been ensured when the antenna transmission short message to big dipper antenna.

The application is realized by the following technical scheme:

the embodiment of the application provides a big dipper antenna, include: antenna house, box body and base, its characterized in that: the antenna housing, the box body and the base are sequentially and fixedly connected from top to bottom to form a closed cavity. The component in the cavity comprises a first assembly and a second assembly, the first assembly and the second assembly are respectively and fixedly connected with the box body, and the first assembly is positioned above the second assembly. The combined body one comprises a passive antenna and an active module, the passive antenna is positioned above the active module, and the passive antenna is tightly connected with the active module. The assembly II comprises an L-cavity filter, a B1-cavity filter, a baffle and a tray, wherein the L-cavity filter, the B1-cavity filter and the baffle are respectively and fixedly connected with the tray. The L cavity filter, the B1 cavity filter and the baffle are all located on the upper surface of the tray. The L cavity filter and the B1 cavity filter are respectively positioned on two sides of the baffle.

In one possible implementation, the Beidou antenna further comprises a cable assembly and a connector. The L cavity filter and the B1 cavity filter are electrically connected with the tray through cable components respectively, the active module, the tray and the connector are electrically connected through the cable components, and the cable components comprise various insulating cables, shielding cables and electric connectors.

In one possible implementation manner, the passive antenna is a multi-frequency antenna designed in a microstrip form, and a stack of the passive antenna sequentially includes, from a bottom layer to a top layer: the antenna comprises a B2 frequency point antenna body, a B3 frequency point antenna body, an S frequency point antenna body and a B1 and L shared antenna body.

In one possible implementation, the passive antenna further includes an antenna tuning plate, and the stack of the antenna tuning plate sequentially includes, from bottom to top: the frequency tuning board comprises a B2B3B1 feed board, a B2 frequency point tuning board, a B3 frequency point tuning board, an S frequency point adapter board, an S frequency point tuning board, a B1 frequency point tuning board, an L feed board and an L frequency point tuning board.

In one possible implementation, the antenna tuning plate is formed by laminating layers of solder paste, and after the layers are pressed together by a die, the layers of the tuning plate are physically connected by solidifying the solder paste by soldering.

In one possible implementation, the external main body of the active module is made of aluminum alloy, and a PCB board is embedded inside the active module. The PCB board integrates at least a B1 low noise amplifier, a B2 low noise amplifier, a B3 low noise amplifier, an S low noise amplifier, an L power amplifier, and a power supply processing unit.

In one possible implementation, the surface of the cavity is sprayed with a three-proofing paint.

In one possible implementation, the radome is made of high strength fibers and the box body is made of steel.

In one possible implementation, the base comprises a waterproof breather valve.

In a possible implementation manner, the junction of the radome and the box body is watertight, and the junction of the box body and the base is watertight.

Compared with the prior art, the embodiment of the application has the advantages that:

the application discloses passive antenna 'S stromatolite order among big dipper antenna through the distance of adjustment S frequency point tuning board and antenna house, under the condition that does not increase big dipper antenna height, can promote big dipper antenna at S frequency point received signal' S performance.

Meanwhile, the application also discloses a scheme that a B1 cavity filter and an L cavity filter are added outside the active module in the Beidou antenna, so that the receiving and transmitting isolation of a radio frequency circuit in the Beidou antenna is improved through the B1 cavity filter and the L cavity filter, and the stable work of a B1 frequency point is ensured when the antenna transmits a short message.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the specification.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic external view of a Beidou antenna provided in an embodiment of the present application;

fig. 2 is an exploded schematic view of a Beidou antenna according to an embodiment of the present application;

fig. 3 is a top view of a B1 cavity filter according to an embodiment of the present disclosure;

fig. 4 is a top view of an L-cavity filter according to an embodiment of the present disclosure;

fig. 5 is a schematic partial diagram of a B1 frequency-point receiving link according to an embodiment of the present application;

fig. 6 is a schematic diagram of a part of an L-bin transmission link according to an embodiment of the present application;

fig. 7 is an S-frequency point directional pattern collected by a passive antenna of the prior art (S-frequency point antenna body is on the top layer);

fig. 8 is an S-frequency point directional pattern collected by the passive antenna provided in this application (S-frequency point antenna body is located on the bottom third layer).

Detailed Description

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

As used in this specification and the appended claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to" determining "or" in response to detecting ". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".

Furthermore, in the description of the present application and the appended claims, the terms "first," "second," "third," and the like are used for distinguishing between descriptions and not necessarily for describing or implying relative importance.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.

In the present invention, unless otherwise explicitly specified or limited, unless otherwise indicated, all directional terms "upper, lower, left, right, inner, outer, top, bottom" and the like included in a term shall only represent the directional terms of the term in the conventional usage state, or to facilitate the description of the present invention and simplify the description, or to be understood by those skilled in the art as a colloquial term, unless otherwise explicitly specified or limited, and shall not be construed as limiting the technical solution.

The conventional microstrip antenna mode is mostly adopted in the existing Beidou antenna with high mechanical strength, the stacking sequence of the antenna is sequentially shortened according to the wavelength to perform stacking, namely a B2 frequency point antenna body, a B3 frequency point antenna body, a B1 frequency point antenna body, an L frequency point antenna body and an S frequency point antenna body are respectively arranged from the bottom layer to the top layer. Under the external structure with high mechanical strength, the conventional antenna ensures the high mechanical strength of the antenna, but sacrifices the performance of the antenna, so that the signal receiving and transmitting performance of the antenna is greatly influenced by external materials and weather, the gain at the S frequency point is particularly obvious, and a B1 receiving link fails when short messages are transmitted because the working frequency of a Beidou short message transmitting frequency point L is close to that of a receiving frequency point B1.

Based on the above problem, the embodiment of the application provides a big dipper antenna that high recepition nature, high isolation just have high mechanical strength. Fig. 1 is a schematic diagram of an appearance of a Beidou antenna provided by an embodiment of the present application.

Referring to fig. 1, the Beidou antenna comprises an antenna housing 1, a box body 4 and a base 10, wherein the antenna housing 1 is located at the uppermost end of the Beidou antenna, the box body 4 is located at the middle part of the Beidou antenna, and the base 10 is located at the bottom of the Beidou antenna. The radome 1, the box body 4 and the base 10 are tightly connected from top to bottom to form a closed cavity.

For example, the fastening connection may be riveting, snapping, fastening, and the like, and the application is not particularly limited.

In some embodiments, for the mechanical strength and the signal receiving and dispatching intensity of balanced big dipper antenna, antenna house 1 can adopt the high strength fiber material, and box body 4 can adopt alloy structure steel material.

Illustratively, the radome 1 employs aramid iii fiber. The aramid fiber III is manufactured in an adhesive form and is formed in a vacuum negative pressure tank. The method utilizes the high hardness, high temperature resistance, strong impact resistance and good wear resistance of the aramid fiber III, and also utilizes the good wave permeability of the aramid fiber III, so that the signal passing performance can be improved in advance while certain high mechanical strength is ensured.

In some embodiments, the surface of the enclosed cavity formed by the radome 1, the box 4 and the base 10 is coated with a three-proofing paint for dealing with severe external environments such as high temperature, high humidity and high corrosion.

In some embodiments, the joint between the radome 1 and the box 4 has water tightness, and the box 4 and the base 10 connector also have water tightness so as to adapt to various severe external environments such as high temperature, high humidity and the like.

For example, the water tightness can be achieved by adding a rubber sealing ring, coating a sealant, or using other means to achieve the waterproof purpose, which is not limited in this application.

In some embodiments, a waterproof and breathable valve is also designed on the base 10 to accommodate the harsh, hot, humid external environment.

Referring to fig. 2, an exploded schematic view of a Beidou antenna provided in an embodiment of the present application.

In some embodiments, the sealed cavity formed by the radome 1, the box body 4 and the base 10 mainly comprises a first assembly and a second assembly. The first combination body is located above the second combination body, namely the first combination body is closer to the radome 1, and the second combination body is closer to the base 10.

Illustratively, the combined body one at least comprises a passive antenna 2 and an active module 3, the passive antenna 2 and the active module 3 are fixedly connected, and the passive antenna 2 is positioned above the active module 3.

Illustratively, the combined body two at least comprises an L cavity filter 5, a B1 cavity filter 7, a baffle 8 and a tray 9, wherein the L cavity filter 5, the B1 cavity filter 7 and the baffle 8 are all positioned above the tray 9, and the L cavity filter 5 and the B1 cavity filter 7 are respectively positioned at two sides of the baffle 8. The L-cavity filter 5, the B1 cavity filter 7 and the baffle 8 are respectively fastened to the tray 9.

Optionally, the fastening connection mode may be a fastener connection mode, and may also be other connection modes, which is not further limited in this application.

The Beidou antenna further comprises a cable assembly 6 used for electrically connecting electrical components in the antenna, wherein the cable assembly comprises various insulating cables, shielding cables and electrical connectors.

The Beidou antenna further comprises a connector 11, and the connector is used for connecting the Beidou antenna with a receiver to realize power supply and signal transmission.

In some embodiments, the cable assembly 6 is used to electrically connect the L cavity filter 5 and the B1 cavity filter 7, and also to electrically connect the active module 3, the tray 9, and the connector 11. It should be noted that the present application only specifically describes the electrical connection of the components related to the invention, and the cable assembly 6 may be used for electrical connection other than the above components.

In some embodiments, the passive antenna 2 is a multi-frequency antenna designed by a microstrip antenna, and compared with the existing microstrip antenna, the present application discloses a lamination sequence different from the existing design, specifically: the antenna comprises a B2 frequency point antenna body, a B3 frequency point antenna body, an S frequency point antenna body, and a B1 and L shared antenna body from bottom to top. Correspondingly, the lamination of the antenna tuning plate in the passive antenna 2 is also adjusted, specifically: the method comprises the following steps from the bottom layer to the top layer in sequence: the frequency tuning board comprises a B2B3B1 feed board, a B2 frequency point tuning board, a B3 frequency point tuning board, an S frequency point adapter board, an S frequency point tuning board, a B1 frequency point tuning board, an L feed board and an L frequency point tuning board.

The embodiment of the application discloses be different from prior art 'S passive antenna 2 stromatolite order, can make S frequency point tuning board farther with antenna house 1' S distance under the prerequisite that does not increase the passive antenna height, reduced the directional diagram at S frequency point and received the influence of antenna house, strengthened the normal direction gain at S frequency point, realized the good receptivity of big dipper antenna to big dipper navigation system working band.

Alternatively, the lamination of the respective layers of the antenna tuning plate may be performed using solder paste.

For example, the tuning boards, the feed board and the adapter board are adhered by solder paste, and after being pressed by a die, the solder paste is solidified by reflow soldering, so that the lamination layers in the antenna tuning board are fixed.

In some embodiments, the external body of the active module 3 is made of aluminum alloy, and a PCB board is embedded inside the active module. The PCB is at least integrated with components such as a B1 low noise amplifier, a B2 low noise amplifier, a B3 low noise amplifier, an S low noise amplifier, an L power amplifier, a power supply processing unit and the like.

Optionally, active module 3 adopts the amplifier that highly integrated scheme realized multi-frequency point to in view of the consideration to weight and cost, active module 3's exterior structure adopts the aluminum alloy material in this application, and integrated components and parts are selected for can be according to actual need in the embedded PCB board, and this application does not do specifically and restricts.

Optionally, the active module 3, the tray 9 and the connector 11 are electrically connected by using a radio frequency connector. Wherein the tray 9 is electrically connected with the L cavity filter 5 and the B1 cavity filter 7 through the cable assembly 6.

In some embodiments, since the active module 3 of the present application adopts a highly integrated scheme, in order to solve the influence of spurious emissions in the out-of-band interference signal of the B1 frequency point link when the big dipper antenna is transmitting and receiving simultaneously. The application does not use a conventional dielectric filter, and designs two opposite cavity filters: b1 cavity filter 7 and L cavity filter 5, see fig. 3 and 4.

Meanwhile, referring to fig. 5 and 6, the embodiment of the present application also provides a circuit diagram of a radio frequency link passing through the B1 cavity filter 7 and the L cavity filter 5.

For example, fig. 5 is a partial schematic diagram of a B1 frequency-point receiving link according to an embodiment of the present application. In fig. 3, a receiving link of a B1 frequency point includes a passive antenna 2, a B1 cavity filter 7, a limiter, a low noise amplifier, a first sound table filter, a first monolithic amplifier, a second sound table filter, a temperature compensation attenuator, and a second monolithic amplifier, which are connected in sequence.

For example, fig. 6 is a partial schematic diagram of an L-bin transmission link according to an embodiment of the present application. In fig. 4, the L-frequency point transmitting link includes a monolithic amplifier i, a monolithic amplifier ii, a temperature compensator, a sound surface filter, a driving amplifier, a power tube, a dielectric filter, an L-cavity filter 5, an isolator, and a passive antenna 2, which are connected in sequence.

In the schematic diagram of the Beidou antenna B1 frequency point receiving link and the L frequency point link, the number and the types of the components related to the FIG. 5 and the FIG. 6 are selected according to actual conditions, and the application is not specifically limited.

In the actual situation, since the L frequency is transmitting a high power signal (the center frequency of the transmitting link of L is 1615 MHz), and receiving is receiving a small signal (the center frequency of the receiving link of B1 is 1575MHz), when the transmitting and receiving channels work simultaneously, the problem of poor transmitting and receiving isolation occurs (the transmitting and receiving frequency interval is 40 MHz). The medium filter in the prior art has been abandoned to this application, has disclosed two kinds of opposite sex cavity filters, through adopting two cavity filters, has realized 40 dB's receiving and dispatching isolation, has guaranteed that the amplifier of B1 frequency point receiving link can not appear amplifier saturated condition because of the influence at outband interfering signal L frequency point when the transmission, has guaranteed that L frequency point transmitting link is less than the white noise at the stray of receiving frequency point B1(1575MHz) simultaneously.

In conclusion, the application discloses passive antenna 'S stromatolite order among big dipper antenna through the distance of adjustment S frequency point tuning board and antenna house 1, under the condition that does not increase big dipper antenna height, has promoted big dipper antenna at S frequency point received signal' S performance by a wide margin.

Simultaneously, this application discloses big dipper antenna has increased solitary B1 cavity filter and L cavity filter outside active module, makes the radio frequency circuit in the big dipper antenna improve the isolation of receiving and dispatching through B1 cavity filter and L cavity filter, has ensured the stable work of B1 frequency point when carrying out the antenna transmission short message.

In order to verify the high receptability and the high isolation of the big dipper antenna that this application provided, provide specific embodiment as follows:

a microstrip antenna lamination in a conventional high-mechanical-strength Beidou antenna is respectively a B2 frequency point antenna body, a B3 frequency point antenna body, a B1 frequency point antenna body, an L frequency point antenna body and an S frequency point antenna body from the bottom layer to the top layer. Under the antenna housing of the passive antenna with high mechanical strength, the gain directional diagram of the S frequency point antenna is greatly influenced, and the normal gain of the S frequency point antenna is seriously deteriorated. The test results are shown in FIG. 7.

According to the embodiment of the application, the position of the S frequency point antenna body stacked in the microstrip antenna is adjusted, the distance between the S frequency point tuning plate and the antenna housing is increased, the problem of deterioration of an S frequency point antenna directional diagram is solved, and the good receiving performance of the Beidou antenna on the working frequency band of the Beidou navigation system is realized. The test results are shown in FIG. 8.

The specific implementation of the passive antenna is as follows: the B2 frequency point tuning plate is made of F4BM-2, has dielectric constant ER =3.5 and size of 600mm (L) 500mm (W) 2.5 mm (H); the B3 frequency point tuning plate is made of F4BM-2, has dielectric constant ER =4.5 and size of 600mm (L) 500mm (W) 2.5 mm (H); the S frequency point tuning plate is made of F4BM-2, has a dielectric constant ER =2.2 and has a size of 300mm (L) 250 mm (W) 3mm (H); the B1 frequency point tuning plate is made of TP-2, dielectric constant ER =6.5, size is 135mm (L) 135mm (W) 3mm (H); the L frequency point tuning plate is made of TP-2, the dielectric constant ER =12 and the size is 150mm (L) 150mm (W) 4mm (H); the feed board B2B3B1LS is made of F4BM-2, has dielectric constant ER =3.5 and size of 500mm (L) 500mm (W) 0.5mm (H); the S adapter plate is made of F4BM-2, has a dielectric constant ER =3.5 and a size of 500mm (L) 500mm (W) 0.5mm (H); the L feed plate is made of F4BM-2, has a dielectric constant ER =3.5 and a size of 500mm (L) 500mm (W) 0.5mm (H).

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims

1. The utility model provides a big dipper antenna which characterized in that: the antenna housing (1), the box body (4) and the base (10) are sequentially fastened and connected from top to bottom to form a closed cavity;

the component in the cavity comprises a first assembly and a second assembly, the first assembly and the second assembly are respectively and fixedly connected with the box body (4), and the first assembly is positioned above the second assembly;

the first combination body comprises a passive antenna (2) and an active module (3), the passive antenna (2) is positioned above the active module (3), and the passive antenna (2) is fixedly connected with the active module (3);

the assembly two includes L cavity filter (5), B1 cavity filter (7), baffle (8) and tray (9), wherein, L cavity filter (5) B1 cavity filter (7) with baffle (8) respectively with tray (9) fastening connection, L cavity filter (5) B1 cavity filter (7) with baffle (8) all are located the upper surface of tray (9), L cavity filter (5) with B1 cavity filter (7) are located respectively the both sides of baffle (8).

2. The Beidou antenna according to claim 1, characterized in that the Beidou antenna further comprises a cable assembly (6) and a connector (11), wherein the L cavity filter (5) and the B1 cavity filter (7) are respectively electrically connected with the tray (9) through the cable assembly (6); the active module (3), the tray (9) and the connector (11) are electrically connected by the cable assembly (6) which includes various insulated cables, shielded cables and electrical connectors.

3. The Beidou antenna according to claim 1, characterized in that the passive antenna (2) is a multi-frequency antenna designed in a microstrip form, and the lamination of the passive antenna (2) comprises from bottom layer to top layer: the antenna comprises a B2 frequency point antenna body, a B3 frequency point antenna body, an S frequency point antenna body and a B1 and L shared antenna body.

4. The Beidou antenna according to claim 3, characterized in that the passive antenna (2) further comprises an antenna tuning plate, and the lamination of the antenna tuning plate comprises from bottom layer to top layer: the frequency tuning board comprises a B2B3B1 feed board, a B2 frequency point tuning board, a B3 frequency point tuning board, an S frequency point adapter board, an S frequency point tuning board, a B1 frequency point tuning board, an L feed board and an L frequency point tuning board.

5. The Beidou antenna according to claim 4, wherein the antenna tuning plate is formed by laminating each lamination with solder paste, and after being pressed by a die, the solder paste is solidified by welding to realize physical connection of each lamination in the antenna tuning plate.

6. The Beidou antenna according to claim 1 or 2, characterized in that the active module (3) is made of aluminum alloy material and embedded with PCB board inside; the PCB board integrates at least a B1 low noise amplifier, a B2 low noise amplifier, a B3 low noise amplifier, an S low noise amplifier, an L power amplifier, and a power supply processing unit.

7. The Beidou antenna according to claim 1, wherein the cavity surface is painted with three-proofing paint.

8. The Beidou antenna according to claim 1, characterized in that the antenna housing (1) is made of high-strength fiber, and the box body (4) is made of steel.

9. The Beidou antenna according to claim 1, characterized in that the base (10) comprises a waterproof vent valve.

10. Beidou antenna according to claim 1, characterized in that the junction of the radome (1) and the box (4) is watertight and the junction of the box (4) and the base (10) is watertight.