CN1141593C - IC testing method and IC testing device using the same - Google Patents

IC testing method and IC testing device using the same Download PDF

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Publication number
CN1141593C
CN1141593C CNB971814333A CN97181433A CN1141593C CN 1141593 C CN1141593 C CN 1141593C CN B971814333 A CNB971814333 A CN B971814333A CN 97181433 A CN97181433 A CN 97181433A CN 1141593 C CN1141593 C CN 1141593C
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terminal
test
tested
switch
direct current
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CN1244925A (en
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桥本好弘
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Advantest Corp
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Advantest Corp
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Priority to PCT/JP1997/004228 priority Critical patent/WO1999027376A1/en
Priority to GB9912919A priority patent/GB2335280B/en
Priority to DE19782244T priority patent/DE19782244T1/en
Priority to CNB971814333A priority patent/CN1141593C/en
Priority to US09/319,898 priority patent/US6404220B1/en
Publication of CN1244925A publication Critical patent/CN1244925A/en
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Publication of CN1141593C publication Critical patent/CN1141593C/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30—Marginal testing, e.g. by varying supply voltage
    • G01R31/3004—Current or voltage test

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The present invention relates to an IC testing device. In the IC testing device for performing function test and DC test, the output end of a DC testing device is connected with a resistor with high resistance. Even if the DC testing device is connected to a function testing device, the function testing device can still be normally operated through the connection of the resistor. Consequently, the DC test is carried out in the process of the performance of the function test, and the function test and the DC test are performed together. The control of the spending time of the switching of a switch in the DC testing device is performed in the process of the function test, the switching time of the switch is not added to the time required for the test, and consequently, the testing time is reduced.

Description

The arrangement for testing integrated circuit of integrated circuit (IC) testing method and this method of testing of employing
Technical field
The present invention relates to IC (integrated circuit) method of testing and adopt the IC proving installation of this method, can carry out under the situation of functional test and DC test at the semiconductor devices such as storer that SIC (semiconductor integrated circuit) is constituted, carry out the leakage tests of functional test and DC test project at short notice.
Background technology
In the past, in the IC proving installation that semiconductor devices such as storer are tested, carry out functional test and DC test, to in two tests, all be judged to be normal IC and be judged to be certified products, the functional test function operate as normal whether that is used to judge semiconductor devices wherein, and DC test is used to judge whether each terminal of semiconductor devices has predetermined DC characteristic.
Fig. 3 illustrates the schematic configuration of IC proving installation.TES is that the symbol of IC proving installation integral body is given in expression among the figure.The inside style of IC proving installation TES is master controller MAIN, device for testing functions 100 and direct current test apparatus 200.
Master controller MAIN is made of computer system, comes control function proving installation 100 and direct current test apparatus 200 by bus B US.Device for testing functions 100 is by pattern generator 102, timing generator 104 and functional test unit 106A, 106B ... 106N constitutes.
Functional test unit 106A～106N is provided with corresponding to each terminal of tested IC 300, to switch S 11～S 1nCarry out switch control, functional test unit 106A～106N can be controlled to be the state that is connected and disconnects with each terminal of tested IC 300.
That is, functional test is following carrying out, that is, and and with switch S 11～S 1nThe state that is controlled to be out is connected to each terminal of tested IC 300 with functional test unit 106A～106N, applies test pattern signal to each terminal of tested IC 300, carries out functional test with this.
On the other hand, the terminal of tested IC 300 has been prepared 1 to several direct current test apparatus 200 (in the situation of having prepared a direct current test apparatus 200 shown in the example of Fig. 3), by with change-over switch S 21～S 2nBe controlled to be out one by one successively, and direct current test apparatus 200 is connected to each terminal of tested IC300, the DC characteristic of testing this special terminal successively successively.In addition, 400 these switch S of expression control 11～S 1nAnd S 21～S 2nController.
Fig. 4 illustrates the inner structure of a functional test unit 106A, the summary of functions test.Functional test unit 106A (other functional test unit also are identical structure) is made of waveform format device 11, driver 12, voltage comparator 13, logic comparator 14, fault analysis storer 15.
Waveform format device 11 receives the test pattern data that pattern generator 102 provides, and generates the test pattern signal with actual waveform.Timing generator 104 provides the rising timing of regulation test pattern signal and the timing signal regularly that descends to waveform format device 11.
The test pattern signal of waveform format device 11 output is shaped as the waveform of the amplitude with regulation logical value by driver 12, passes through switch S 11Offer the regulation terminal of tested IC 300, data storage is arrived tested IC 300.Here, be that when the input test pattern signal, each terminal of tested IC 300 is controlled as input pattern, switches to output mode in the moment of finishing write operation under the situation of I/O terminal (the double lead-out terminal of input) at this terminal.Switching to the timing of output mode, reading the content that is stored among the tested IC 300, be input to logic comparator 14 through voltage comparator 13.In addition, when voltage comparator 13 read the data of tested IC 300 outputs, the lead-out terminal of driver 12 was set to high impedance mode.
Whether the logic that voltage comparator 13 compares to determine the signal of reading from tested IC 300 keeps regular magnitude of voltage.That is, judge L (low) logic and H (height) logic whether for example below 0.8 volt with more than 2.4 volts, having under the normal logical value voltage condition, this logical value is input to logic comparator 14.
In logic comparator 14, input compares this expectation value and the logical value of importing from voltage comparator 13 from the expectation value of pattern generator 102, detects inconsistent generation.Taking place to think that there is fault in the memory cell that writes the address under the inconsistent situation, store this address of Fault analytical storer 14 into, read the trouble unit number from this Fault analytical storer 15 after test is finished and count, judge and whether might remedy.
Fig. 5 illustrates an example of the structure of direct current test apparatus 200.Illustrated structure illustrates the structure under direct current test apparatus 200 applies amperometric determination pattern operation at voltage the situation.Normal phase input end to operational amplifier 16 applies voltage V LOr V H, this voltage V LOr V HHas the logical value that be applied to the terminal of tested IC 300 from DA (digital-to-analogue) transducer 17.
Lead-out terminal and the sub-T of current output terminal at operational amplifier 16 IBetween be connected with current detecting resistance R1, at the sub-T of current output terminal IAnd be connected with switch S between the perception point SEN N2, at the sub-T of current output terminal IWith voltage detection terminal T VBetween be connected with protective resistance R3, with voltage detection terminal T VPass through switch S N1Be connected to perception point SEN.Perception point SEN is by change-over switch S 21Be connected to the terminal of tested IC 300.The reversed input terminal of operational amplifier 16 is connected to voltage detection terminal T V
The switch S that is connected in parallel with current sensing resistor R1 bThe expression switch current is measured the range shift switch of range.By with this switch S bBe controlled to be connection, connect resistance value little, promptly measure the resistor R 2 of big electric current (electric current in the output mode of tested IC 300), switch to big amperometric determination range.
According to the structure of this direct current test apparatus 200, by with switch S A1, S A2With change-over switch S 21Be controlled to be on-state, apply the voltage V that applies to normal phase input end of operational amplifier 16 from DA transducer 17 to the terminal of tested IC 300 LOr V H
That is, it is equal that operational amplifier 16 becomes the voltage of normal phase input end and reversed input terminal, thereby if apply for example V to normal phase input end of operational amplifier 16 L, the voltage that then makes reversed input terminal is (with voltage detection terminal T VVoltage identical) also become V L, come control output voltage with this.Therefore, the terminal to tested IC 300 applies voltage V LOr V H
Tested IC 300 in this DC test pattern, each terminals P iBe set to input pattern shown in Figure 6.By to terminals P iApply V L(applying the voltage of L logic) or V HThe state of (applying the voltage of H logic) is measured the electric current that flows through current sensing resistor R1 down, can measure and be connected to terminals P iActive component Q1 and each leakage current I of Q2 Rek1And I Rek218 expressions are used to take out the subtraction circuit of the voltage that produces on current sensing resistor R1, the voltage that this subtraction circuit 18 is obtained in 19 expressions carries out the AD transducer of AD conversion, output digital value.
Measuring above-mentioned leakage current I Rek1, I Rek2Situation under, change-over switch is switched on, and is determined at the voltage that the current sensing resistor R1 of the high about 100k Ω of relative resistance value go up to produce, and measures the leakage current I of each input terminal that flows through tested IC 300 Rek1And I Rek2Protective resistor R3 is made of the resistor of the resistance value of relative resistance value little (about tens Ω), in real work, even and switch S A1And S A2Be controlled as off-state simultaneously, also can protect operational amplifier 16, guarantee the feedback loop that closes, make operational amplifier 16 can not arrive state of saturation the reversed input terminal of operational amplifier 16.
By above explanation, be to be understood that the functional test in the IC proving installation and the summary of DC test.Here, above-mentioned functions test in the past and DC test are implemented with diverse timing.Promptly implementing to implement another test again after wherein some tests.Particularly in DC test, need be to change-over switch S 21, S 22S 2nCarry out switching controls and to switch S shown in Figure 3 11～S 1nCarry out switching controls.Its situation uses Fig. 7 to illustrate.
Under the situation of implementing functional test, with switch S shown in Figure 3 A1And S A2And change-over switch S 21～S 2nAll switch to off-state, direct current test apparatus 200 separates switch S from the terminal of tested IC 300 11～S 1nAll be controlled as on-state, implement functional test.Promptly, the output impedance of direct current test apparatus 200 is lower, be approximately several Ω, therefore in functional test, after direct current test apparatus 200 is electrically connected as the load of device for testing functions 100, the waveform deterioration of the test pattern signal that provides to tested IC from device for testing functions 100 is provided, can not carries out normal functional test.
Therefore, with change-over switch S 21～S 2nWhole and switch S A1, S A2Be controlled to be off-state, direct current test apparatus 200 is controlled to be any one terminal that is free of attachment to tested IC 300, implement functional test.
On the other hand, under the situation of implementing DC test, at first with switch S 11～S 1nAll be controlled to be on-state, functional test unit 106A～106N be connected on whole terminals of tested IC 300.Under this state, apply to tested IC 300 and to carry out the required initialization pattern of DC test.
That is, be under the situation of I/O terminal at the terminal that will carry out DC test, the mode initialization of importing this terminal from device for testing functions 100 is the required initialization pattern of input pattern (with reference to Fig. 7).Be set at the terminal that will carry out DC test under the state of input pattern and control, functional test unit 106A～106N is all separated from the terminal that will carry out DC test of tested IC 300.
Under this state, with change-over switch S 21Be controlled to be connection, implement DC test.DC test is following carrying out, that is, be applied in each logical value with H logic and L logic under the state of terminal of tested IC 300, measures the leakage current I that flows through terminal Rek1And I Rek2(with reference to Fig. 6), if this leakage current value below predetermined value, it is qualified then to be judged to be, if more than predetermined value, then is judged to be defective.
Because like this each terminal is implemented DC test, so for each terminal that will test is applied initialization pattern, need be with switch S 11～S 1nThe time T that be controlled to be connection, disconnects SW1, with to change-over switch S 21～S 2nCarry out the time T of the time T SW2 addition gained of switching controls Pi(with reference to Fig. 7 D).Apply the time T of initialization pattern SW1, with to change-over switch S 21～S 2nCarry out the time T of switching controls SW2Be equivalent to time (a few ms) that switch (relay) is switched, even measure the time T of electric current IM(Fig. 7 E) is shorter, adds the time T after this time P1Also become the long time.Therefore, if each terminal is carried out switch S with this 11～S 1nWith change-over switch S 21～S 2nSwitching controls, then required time of DC test is elongated.With this, under the situation of a large amount of IC of test, become big obstacle.
The objective of the invention is to propose a kind ofly can to shorten the test duration of IC, test the IC method of testing of a large amount of IC at short notice and use the IC proving installation of this method.
Summary of the invention
In the present invention, direct current test apparatus is connected to the terminal of tested IC through resistor, connection by this resistor, from device for testing functions, direct current test apparatus can not form big load, thereby can keep the state that direct current test apparatus is connected to the terminal of tested IC in functional test yet.
A kind of IC method of testing is proposed, according to this structure, in functional test, output end of driver of device for testing functions can be controlled to be high impedance mode, thereby can carry out DC test, and in the process of carrying out DC test, also need not the required switch control of separation function proving installation, in functional test, carry out the leakage tests in the DC test project.
Therefore, according to IC method of testing of the present invention, finish simultaneously with functional test, the leakage tests of DC test project has also been finished, and spended time is carried out leakage tests especially.Its result can shorten the required time of test significantly.
In the present invention, also propose to use the IC proving installation of above-mentioned IC method of testing.
IC proving installation of the present invention comprises:
A. device for testing functions comprises a plurality of drivers, is used to carry out the functional test to tested IC;
B. direct current test apparatus is used to carry out the DC leakage current test, and wherein said direct current test apparatus comprises (a) operational amplifier, has normal phase input end that has applied an assigned voltage; (b) current detecting terminal is connected with a lead-out terminal of described operational amplifier by a current sense resistor; (c) voltage detection terminal is connected with described current detecting terminal by a protective resistance, and is connected with the reversed input terminal of described operational amplifier and (d) perception point by a feedback circuit; (e) high-impedance resistors is connected between the voltage detection terminal and perception point of described direct current test apparatus; (f) first switch is used for applying the voltage that described current output terminal provides to described voltage detection terminal; (g) second switch is used for described high-impedance resistors is connected between described voltage detection terminal and the described perception point; (h) the 3rd switch, be connected between described current output terminal and the described perception point, wherein, during carrying out functional test, in the leakage current of the selected terminal on tested IC is flowed through in measurement, described first switch and described second switch are connected so that from described device for testing functions, and described direct current test apparatus is high impedance because of described high-impedance resistors, and
C. converting switch device is used for selectively the perception point of described direct current test apparatus is connected with one of described tested IC,
During described device for testing functions is carried out functional test, each driver is connected with each terminal of tested IC, described perception point is connected to one of terminal of described tested IC one by one selectively by described converting switch device, operating described first switch and second switch makes from described device for testing functions and it seems that described direct current test apparatus is high impedance status, and the driver of the described device for testing functions that links to each other with one of selected terminal of described tested IC, when described direct current test apparatus is applied to one of selected terminal on the described IC and begins the DC leakage current test by the voltage with described perception point, be controlled in high impedance status; Thus, during the functional test leakage current of the selected terminal on the described tested IC that flows through is being tested.
According to IC proving installation of the present invention, self-evident in carrying out the process of functional test, will device for testing functions in the process of carrying out DC test yet and direct current test apparatus disconnected from each other.Therefore switching the required time without insertion switch, is practicable DC test in the process of carrying out functional test.
Its result, even in the process of carrying out functional test, carry out DC test, also functional test and DC test mixing can be carried out, required time of this hybrid test can not prolong significantly than only carrying out the required time of functional test originally, can finish functional test and leakage tests at short notice.
The simple declaration of accompanying drawing
Fig. 1 is the block scheme of an embodiment of the expression IC proving installation that adopts IC method of testing of the present invention.
Fig. 2 is the sequential chart of explanation IC method of testing of the present invention.
Fig. 3 illustrates the block scheme of the summary of IC proving installation in the past.
Fig. 4 is the block scheme that the structure of the device for testing functions that uses in the IC proving installation shown in Figure 3 is described.
Fig. 5 is the connection layout that the structure of the direct current test apparatus that uses in the IC proving installation shown in Figure 3 is described.
Fig. 6 is the connection layout that the situation of the terminal of tested IC under the situation of carrying out the leakage tests in the DC test project is described.
Fig. 7 illustrates the sequential chart of the situation of DC test in the past.
The optimal morphology that carries out an invention
In order to illustrate in greater detail the present invention, be described with reference to the accompanying drawings below.
Fig. 1 is the embodiment that the IC method of testing of the proposition according to the present invention is tested the IC proving installation of tested IC 300.Among the figure, 100 presentation function proving installations, 200 expression direct current test apparatus, this content with Fig. 3 explanation is identical.In addition, under the situation of carrying out functional test, with switch S 11～S 1nAll be controlled to be on-state, repertoire test cell 106A～106N be connected to each terminal of tested IC 300.
Direct current test apparatus 200 is with change-over switch S 21～S 2nBe controlled to be on-state successively one by one, direct current test apparatus 200 optionally is connected to each terminal of tested IC 300, each terminal is carried out DC test one by one.In fact, its structure is that a plurality of direct current test apparatus 200 are set, and reduce the numbers of terminals of accepting test, thereby finish DC test at short notice, and hypothesis describes with 1 direct current test apparatus, 200 enforcement direct current test apparatus 200 here.
IC proving installation of the present invention is characterised in that, in direct current test apparatus 200, at voltage tester terminal T VAnd between the perception point SEN with switch S 2 resistor R 4 that is connected in series.
That is, in direct current test apparatus 200, with the sub-T of current output terminal IWith voltage detection terminal T VBetween the protective resistor R3 that connects the 1st switch S 1 that is connected in parallel, at voltage detection terminal T VAnd be connected in series between the perception point SEN the 2nd switch S 2 and resistor R 4.In addition, at the sub-T of current output terminal IAnd connection the 3rd switch S 3 between the perception point SEN.
Under the situation of carrying out functional test, the 1st switch S 1 and the 2nd switch S 2 are set at on-state, the 3rd switch S 3 is set at off-state.Under this state, at perception point SEN and the sub-T of current output terminal IAnd voltage detection terminal T VBetween the resistor R 4 that is connected in series.Therefore, see that from the functional test unit that is connected with direct current test apparatus 200 impedance of direct current test apparatus 200 can regard the resistance value of resistor R 4 as.Be chosen to be about 10k Ω by resistance value, can regard the impedance of the direct current test apparatus 200 seen from functional test unit 106A～106N as about 10k Ω resistor R 4.
The signal transmission line that connects between each functional test unit 106A～106N and the tested IC 300 generally is the characteristic impedance of 50 Ω by coupling.Therefore, even connect the load (direct current test apparatus 200) of 10k Ω at each output terminal of functional test unit 106A～106N, the impedance of circuit can not change significantly yet, and the waveform of the test pattern signal that provides to tested IC 300 from functional test unit 106A～106N can the multilated because of the connection of direct current test apparatus 200 yet.Promptly, even in functional test, direct current test apparatus 200 is connected under the some states among the tested IC 300, the waveform that is applied to the test pattern signal of the terminal that is connected with direct current test apparatus 200 can multilated yet, can normally carry out functional test.
Explanation by above should be appreciated that, is connected at direct current test apparatus 200 under the state of functional test unit and can carries out functional test.
In the present invention, also propose a kind of method, in the fulfillment process of functional test, be connected at functional test unit 106A～106N under the state of each terminal of tested IC 300, carry out DC test (leakage tests).
That is, a kind of method is proposed, need not be with switch S 11～S 1nBe controlled to be off-state, can measure the leakage current of the terminal that flows through tested IC 300.As this method, apply the timing of assigned voltage (applying the voltage of H logical OR L logic) at terminal from leakage current to direct current test apparatus 200 that will measure, the output state of driver 12 that is connected to the functional test unit of this terminal is controlled to be high impedance mode, be controlled as at driver 12 under the state of high impedance mode, direct current test apparatus 200 is measured the leakage current of the terminal that flows through tested IC 300.
For this reason, in the process of carrying out functional test, master controller MAIN applies the command signal that produces assigned voltage (H logical OR L logic) to direct current test apparatus 200.Specifically, apply the digital value that is used to produce assigned voltage to DA transducer 17.17 pairs of these digital values of DA transducer are carried out DA conversion, output voltage V LOr V H, apply this voltage V to normal phase input end of the operational amplifier 16 that constitutes direct current test apparatus 200 LOr V H
Operational amplifier 16 is operated, and makes voltage detection terminal T VVoltage equal to be applied to the voltage of normal phase input end.Its result is at voltage detection terminal T VThe last generation and the voltage V that applies from DA transducer 17 LOr V HThe voltage that equates, this voltage is applied to perception point SEN by the 2nd switch S 2 and resistor R 4, by change-over switch S 21～S 2nIn some terminals that is provided for tested IC 300.
In the fulfillment process of functional test, shown in Fig. 2 B and C, switch S 11～S1n and switch S 1, S2, S4 all are set at on-state.The choosing method of carrying out the timing of direct current leakage tests for example has following method.In the functional test program of the test procedure that reads in master controller MAIN, shown in Fig. 2 A, preestablish the timing (time of distributing to this timing is time that terminal is required of test) that DC test is used, in DC test regularly, produce control signal HIP, whole drivers 12 with each functional test unit 106A～106N, or the driver 12 that is connected to the terminal that will carry out DC test is controlled to be high impedance mode (with reference to Fig. 2 D), when driver 12 is controlled to be high impedance status, apply voltage to direct current test apparatus 200 and produce order, make direct current test apparatus 200 produce assigned voltages, measure leakage current applying under the state of this voltage.
Be the timing after tested IC 300 writes test pattern signal if will insert the timing setting of DC test in functional test, each terminal of then tested IC 300 is being write the fashionable input pattern that is set to, and therefore can former state carry out DC test.
To carrying out functional test again behind the terminal implementation leakage tests.In the process of carrying out functional test, carry out change-over switch S 21～S 2nSwitching (with reference to Fig. 2 E), direct current test apparatus 200 is connected to other terminals.Arbitrary timing position after this connection is finished is provided with the timing of DC test, carries out the leakage tests of next terminal.
Like this, by in the fulfillment process of functional test, finishing the switching of change-over switch S21～S2n, time restriction that can the leakage tests that insert in the fulfillment process of functional test is required is in the extremely short time, even parallel functional test and the DC test carried out, the whole required time can not prolong than only carrying out the required time of functional test significantly yet.
Here, the amperometric determination circuit with regard to direct current test apparatus 200 carries out simple declaration.In the present embodiment, to measure the resistor R 1 of high resistance (approximately 100k Ω) of Weak current (leakage current) usefulness and the resistor R 2 of measuring the small resistor value (about 100 Ω) of big electric current (output current of tested IC 300) usefulness and be connected in series, range shift switch S shown in Figure 5 is omitted in expression bSituation.Promptly, measure resistor R 1 be connected in parallel diode D1 and D2 with Weak current, when measuring big electric current, make these diodes D1 and D2 become on-state, make diode D1 and the big electric current of D2 bypass, under this state, detect the voltage that on resistor R 2, produces with subtraction circuit 18B, this voltage is applied to AD transducer 19 by switch S 5 carries out the AD conversion, import for example master controller MAIN.
On the other hand, when measuring Weak current, on resistor R 1, only produce the voltage of about several 10mV.Therefore, diode D1 or D2 are maintained at off-state.Thereby can measure the leakage current of the terminal that flows through tested IC 300 by being determined at the voltage that produces on the resistor R 1.That is whether, the voltage that produces on resistor R 1 is taken out by subtraction circuit 18A, and the voltage of this taking-up is applied to AD transducer 19 by switch S 4, carries out the AD conversion in the AD transducer, is input to master controller MAIN, compares with reference value, qualified to judge.
In the big amperometric determination pattern of the electric current when the tested IC 300 of mensuration is in output mode, switch S 11～S 1nBe controlled as disconnection, device for testing functions 100 separates from tested IC 300, become the state that has only direct current test apparatus 200 to be connected to tested IC 300, then in direct current test apparatus 200, the 1st switch S 1 is disconnected, the 2nd, the 3rd switch S 2, S3 are connected, switch S 4 is disconnected, switch S 5 is connected, under this state, carried out DC test.
Utilize the field on the industry
As mentioned above, according to IC method of testing of the present invention, in the process of carrying out functional test, carry out the switch S of low-response, complete operation spended time21～S 2nSwitching, in the way of functional test, will drive Moving device 12 is controlled to be high impedance mode, carries out DC test (leakage tests), owing to adopted this test Method adds that in the required time of functional test the required pure time of DC test (does not comprise switching over The required time) in the time of gained, can finish functional test and leakage tests. Its result can be big Amplitude shortens the whole testing time. Its result can must test at short notice in for example IC manufacturer Its effect of performance in the situation of a large amount of IC.

Claims (5)

1. method that is used for carrying out DC test at an IC proving installation, this IC proving installation comprises:
Device for testing functions has a plurality of functional tests unit, and each functional test unit comprises a driver, is used to carry out the functional test of a tested IC; And
Direct current test apparatus has the resistance that current output terminal, a perception point and have the high impedance of the output impedance that is higher than described driver, is used to carry out DC test;
It is characterized in that described method comprises:
Each functional test unit is connected with each terminal of IC,
Controlling described device for testing functions comes by utilizing described driver to apply the functional test that test mode signal is carried out described tested IC to each terminal of described tested IC;
During described functional test by described device for testing functions execution and described tested IC, by high-impedance resistors described current output terminal is connected with the described perception point of described direct current test apparatus, and selectively one of terminal of described perception point and described tested IC is connected
At described direct current test apparatus when described perception point provides an assigned voltage, the driver of one of functional test unit of controlling described device for testing functions is under high impedance status, wherein said perception point is connected with described device for testing functions by selected one in the terminal of IC
Control described direct current test apparatus measurement and flow through the leakage current of the terminal of described tested IC, thereby in the implementation of functional test, measure described leakage current.
2. IC proving installation comprises:
A. device for testing functions comprises a plurality of drivers, and each described driver applies a test pattern signal to each terminal of described tested IC, carries out the functional test to tested IC;
B. direct current test apparatus is used to carry out the DC leakage current test, and wherein said direct current test apparatus comprises
(a) operational amplifier has normal phase input end that has applied an assigned voltage,
(b) current output terminal is connected with a lead-out terminal of described operational amplifier by a current sense resistor,
(c) voltage detection terminal is connected by a protective resistance and described current output terminal, and pass through that a feedback circuit is connected with the reversed input terminal of described operational amplifier and
(d) perception point,
C. converting switch device is used for selectively one of the perception point of described direct current test apparatus and terminal of described tested IC being connected,
Described IC proving installation is characterised in that:
Wherein, described direct current test apparatus also comprises:
(e) high-impedance resistors is connected between the voltage detection terminal and perception point of described direct current test apparatus; With
(f) first switch is used for applying the voltage that described current output terminal provides to described voltage detection terminal
(g) second switch is used for described high-impedance resistors is connected between described voltage detection terminal and the described perception point,
(h) the 3rd switch is connected between described current output terminal and the described perception point,
During described device for testing functions is carried out functional test, each driver is connected with each terminal of tested IC, described perception point is connected to one of terminal of described tested IC one by one selectively by described converting switch device, operating described first switch and second switch makes from described device for testing functions and it seems that described direct current test apparatus is high impedance status, and the driver of the described device for testing functions that links to each other with one of selected terminal of described tested IC, when described direct current test apparatus is applied to one of selected terminal on the described IC and begins the DC leakage current test by the voltage with described perception point, be controlled in high impedance status; Thus, during the functional test leakage current of the selected terminal on the described tested IC that flows through is being tested.
3. according to the described IC proving installation of claim 2, it is characterized in that
Described direct current test apparatus also comprises:
The current measurement parts are used to measure the voltage that produces on described current sense resistor, to survey
Measure the value of the leakage current of the selected terminal on the tested IC that flows through.
4. according to the IC proving installation of claim 2, it is characterized in that, when carrying out DC test under the output mode at tested IC, disconnect and described second and described the 3rd switch connection by described first switch, disconnect the mode that is arranged on the cover of one between described device for testing functions and described tested IC change-over switch simultaneously, and the functional test unit of described device for testing functions and the terminal of IC are disconnected, so that described current output terminal is directly connected to the selected terminal of described perception point and tested IC.
5. according to the IC proving installation of claim 2, it is characterized in that when described direct current test apparatus began the DC leakage current test, described each output end of driver was controlled at high impedance status simultaneously.
CNB971814333A 1997-11-20 1997-11-20 IC testing method and IC testing device using the same Expired - Fee Related CN1141593C (en)

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GB9912919A GB2335280B (en) 1997-11-20 1997-11-20 Ic testing method and ic testing device using the same
DE19782244T DE19782244T1 (en) 1997-11-20 1997-11-20 IC test method and IC test device operating using this IC test method
CNB971814333A CN1141593C (en) 1997-11-20 1997-11-20 IC testing method and IC testing device using the same
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JP2001102609A (en) * 1999-09-28 2001-04-13 Kanegafuchi Chem Ind Co Ltd Device for measuring characteristic of photoelectric conversion device
AT412242B (en) * 2000-03-02 2004-11-25 Siemens Ag Oesterreich METHOD AND ARRANGEMENT FOR TESTING A TEST
JP4729212B2 (en) * 2001-09-27 2011-07-20 株式会社アドバンテスト Semiconductor test equipment
KR100989588B1 (en) 2005-07-07 2010-10-25 가부시키가이샤 어드밴티스트 Testing apparatus
JP4944793B2 (en) * 2005-12-15 2012-06-06 株式会社アドバンテスト Test equipment and pin electronics card
JP4726679B2 (en) * 2006-03-31 2011-07-20 ルネサスエレクトロニクス株式会社 Semiconductor test method and semiconductor device
KR101184312B1 (en) 2007-05-14 2012-09-21 가부시키가이샤 어드밴티스트 Testing apparatus
CN101995534B (en) * 2009-08-10 2013-08-28 宏正自动科技股份有限公司 Electric leakage detecting device and method
JP5629680B2 (en) * 2010-04-22 2014-11-26 株式会社アドバンテスト Pin card and test apparatus using the same
CN102540055B (en) * 2011-12-22 2015-07-29 深圳创维数字技术有限公司 A kind of method and device detecting logic level limit value
US9448274B2 (en) * 2014-04-16 2016-09-20 Teradyne, Inc. Circuitry to protect a test instrument
CN105044536B (en) * 2015-03-20 2018-11-13 深圳康姆科技有限公司 A kind of novel encapsulation defect inspection method and system

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GB9912919D0 (en) 1999-08-04
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CN1244925A (en) 2000-02-16
DE19782244T1 (en) 2000-01-05
GB2335280B (en) 2002-01-16

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