CN114158184A - Smart phone integrated circuit board based on graphite film coating and preparation process - Google Patents
Smart phone integrated circuit board based on graphite film coating and preparation process Download PDFInfo
- Publication number
- CN114158184A CN114158184A CN202111514627.5A CN202111514627A CN114158184A CN 114158184 A CN114158184 A CN 114158184A CN 202111514627 A CN202111514627 A CN 202111514627A CN 114158184 A CN114158184 A CN 114158184A
- Authority
- CN
- China
- Prior art keywords
- layer
- integrated circuit
- circuit board
- copper
- connecting column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention discloses a smart phone integrated circuit board based on a graphite film coating, which comprises a support board layer, wherein a copper-clad board layer is fixedly arranged on the support board layer, an element layer is fixedly arranged at the upper part of the copper-clad board layer, a power layer and a signal layer are sequentially arranged at the lower part of the copper-clad board layer, a substrate is fixedly arranged at the bottom of the signal layer, a graphite film layer is arranged at the bottom of the substrate, the power layer is electrically connected with the copper-clad board layer through a first connecting column, and the copper-clad board layer is electrically connected with the signal layer through a second connecting column; according to the invention, the two isolation layers are arranged in the integrated circuit board to realize isolation, the connection stability and the power-on can be improved through the connecting column and the clamping joint, and the heat dissipation treatment of the integrated circuit board can be effectively realized through the setting of the heat-conducting silicone grease layer and the graphite film layer.
Description
Technical Field
The invention relates to the technical field of collecting circuit boards, in particular to a smart phone integrated circuit board based on a graphite film coating and a preparation process thereof.
Background
With the increasing functions required by electronic products, the structure of the PCB is also more and more complex. Due to the space constraints of PCB circuit boards, circuit boards are also gradually "evolving" from single layer to double layer to multiple layers. An integrated circuit board is a carrier on which an integrated circuit is mounted. But often the integrated circuit board is also brought on. The integrated circuit board is mainly made of silica gel, so the integrated circuit board is generally green, a semiconductor manufacturing process is adopted for manufacturing a plurality of transistors, resistors, capacitors and other components on a smaller single crystal silicon chip, and the components are combined into a complete electronic circuit according to a multilayer wiring or tunnel wiring method. It is represented in the circuit by the letter "IC" (there are also the literal symbols "N", etc.).
When the existing integrated circuit board is used, the problems that a circuit is disordered, the electric connection among layers cannot be unstable, stable heat dissipation treatment cannot be realized when the existing integrated circuit board is used and the like exist generally, and therefore the graphite film coating-based smart phone integrated circuit board and the preparation process are urgently needed.
Disclosure of Invention
The invention aims to solve the problems that stable connection and electrification cannot be realized generally, and isolation of each layer cannot be realized, disordered circuits cannot be prevented, stable heat dissipation cannot be realized and the like in the using process of the existing graphite film coating-based smart phone integrated circuit board and a preparation process and an installation method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a smart mobile phone integrated circuit board based on graphite membrane coating, including supporting the sheet layer, the fixed copper sheet layer that covers that is equipped with on the support sheet layer, the fixed component layer that is equipped with in upper portion that covers the copper sheet layer, the lower part that covers the copper sheet layer is equipped with power source layer and signal layer in proper order, the fixed substrate that is equipped with in bottom on signal layer, the bottom of substrate is equipped with the graphite rete, the power source layer with cover and carry out electric connection through first spliced pole between the copper sheet layer, cover the copper sheet layer with carry out electric connection through the second spliced pole between the signal layer.
As a further description of the above technical solution:
the bottom of copper clad plate layer is fixed and is equipped with first isolation layer, the power plane is fixed to be set up the bottom of first isolation layer.
As a further description of the above technical solution:
the bottom of the power layer is fixedly provided with a second isolation layer, and the bottom of the second isolation layer is fixedly provided with the signal layer.
As a further description of the above technical solution:
the first isolation layer and the second isolation layer are made of bakelite plates or epoxy resin plates, and the first isolation layer and the second isolation layer are fixedly adhered to the copper-clad plate layer, the power layer and the signal layer through a semi-curing agent.
As a further description of the above technical solution:
the element layer is a silica gel plate, the substrate is a bakelite plate or an epoxy resin plate, the element layer is fixedly connected with the copper-clad plate layer through UV (ultraviolet) lamp baking heat treatment, and the substrate is fixedly adhered to the signal layer through a semi-curing agent.
As a further description of the above technical solution:
the gold-nickel alloy column is adopted by the first connecting column and the second connecting column, the two ends of the first connecting column and the second connecting column are respectively and fixedly connected with a clamping joint, and a silver plate is adopted by the clamping joint.
As a further description of the above technical solution:
the diameter of the clamping joint is 0.05-0.09cm longer than that of the first connecting column and that of the second connecting column, and aluminum oxide ceramic insulating coatings are coated on the outer surfaces of the first connecting column, the second connecting column and the like.
As a further description of the above technical solution:
the graphite film layer is fixedly adhered to the substrate through the heat-conducting silicone grease layer, and the thickness of each layer of plate material in the integrated circuit board is not more than 0.1-0.15 mm.
A preparation process of a smart phone integrated circuit board based on a graphite film coating comprises the following steps:
s1, drawing a wiring film, and realizing wiring processing on the power layer and the signal layer: drawing a wiring film by a laser plotter, fixedly adhering the wiring film to a power supply layer and a signal layer, adhering the wiring film to the power supply layer and the signal layer by a photosensitive dry film, and performing development treatment by exposure;
s2, etching and oxidizing to form a circuit: then, etching and oxidizing the power supply layer and the signal layer which are subjected to exposure and development treatment, so that the power supply layer and the signal layer can form a designed circuit;
s3, fixing, pressing and adhering the plates to form an integrated circuit board: place the signal layer on the substrate, then place second isolation layer, power supply layer, first isolation layer and support sheet layer on the signal layer in proper order, and scribble the semi-curing agent between each layer sheet layer, then carry out limit heating limit pressfitting processing to each sheet layer for each sheet layer can form wholly:
s4, performing copper plating treatment on the board layer: carrying out copper plating treatment on the board layer in the laminating process in the S, wherein firstly, electroless plating is carried out to form the minimum thickness capable of flowing current, secondly, electrolytic plating treatment is carried out to achieve the plating thickness required by design, copper plating is also attached to the copper foil on the outer layer, the thickness of the outer layer wiring is the thickness of the copper foil plus the plating thickness, then, treatment of an element layer is carried out on the outer part of the copper-clad board layer, and after the silica gel is coated, curing treatment is carried out through a UV baking lamp;
s5, arranging graphite film layers on the lower part or the upper and lower parts of the processed plate: and (3) coating heat-conducting silicone grease on the lower part or the upper and lower parts of the treated plate, then fixedly adhering the graphite film layers, and curing the adhered graphite film layers by using a UV (ultraviolet) baking lamp for-h.
As a further description of the above technical solution:
before the pressing process is carried out on the plate in the S3, the power layer is punched, the clamping joint is fixedly installed, the supporting plate layer is punched, the first connecting column penetrates through the supporting plate layer and is fixedly connected with the clamping joint, the signal layer is punched and is provided with the clamping joint, one side of the second connecting column penetrates through the supporting plate layer, the first isolating layer, the power layer, the second isolating layer and the clamping joint, and the clamping joint at the other end of the first connecting column and the other end of the second connecting column is fixedly connected when the copper-clad plate layer is formed by copper plating.
In conclusion, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. according to the invention, the copper clad plate layer, the power supply layer and the signal layer can be effectively isolated and separated by arranging the two isolation layers in the integrated circuit board, so that the problem of line disorder of the integrated circuit board can be avoided when the integrated circuit board is used for a long time.
2. According to the invention, the copper-clad plate layer, the power supply layer and the signal layer are electrically connected through the connecting column, and the clamping joint is arranged at the end part of the connecting column, so that the stability of the connecting column during connection can be improved, and poor contact caused by the connecting column during connection can be prevented.
3. According to the invention, the graphite film layer is adhered through the heat-conducting silicone grease layer, the integrated circuit board can be effectively subjected to heat dissipation treatment through the setting of the heat-conducting silicone grease layer and the graphite film layer, and the integrated circuit board can be prevented from being damaged or unstable in information transmission due to overhigh temperature when the integrated circuit board is used.
Drawings
Fig. 1 is a schematic structural diagram of a smart phone integrated circuit board based on a graphite film coating in the invention;
FIG. 2 is a flow chart illustrating the steps of the method of the present invention.
Illustration of the drawings:
1. supporting the slab layer; 2. coating a copper plate layer; 3. an element layer; 4. a first isolation layer; 5. a power layer; 6. a second isolation layer; 7. a signal layer; 8. a substrate; 9. a graphite film layer; 10. a first connecting column; 11. a second connecting column; 12. and (6) clamping the joint.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, a smart mobile phone integrated circuit board based on graphite film coating, including supporting sheet layer 1, it covers copper sheet layer 2 to fix being equipped with on supporting sheet layer 1, the fixed component layer 3 that is equipped with in upper portion that covers copper sheet layer 2, the lower part that covers copper sheet layer 2 is equipped with power strip 5 and signal layer 7 in proper order, the fixed substrate 8 that is equipped with in bottom of signal layer 7, the bottom of substrate 8 is equipped with graphite rete 9, power strip 5 with cover and carry out electric connection through first spliced pole 10 between the copper sheet layer 2, cover copper sheet layer 2 with carry out electric connection through second spliced pole 11 between the signal layer 7.
Further, the fixed first isolation layer 4 that is equipped with in bottom of cladding copper sheet layer 2, the fixed setting of power plane 5 is in the bottom of first isolation layer 4, second isolation layer 4 can effectually prevent the electrical contact, can realize insulating.
Further, the fixed second isolation layer 6 that is equipped with in bottom of power layer 5, the fixed bottom that is equipped with of second isolation layer 6 signal layer 7, second isolation layer 6 can effectually prevent the electrical contact, can realize insulating.
Further, first isolation layer 4 with what second isolation layer 6 adopted is bakelite board or epoxy board, first isolation layer 4 with second isolation layer 6 with cover copper sheet layer 2 the power layer 5 with fix the adhesion through the semi-curing agent between the signal layer 7, the semi-curing agent can ditch the effectual adhesion that carries on.
Further, what component layer 3 adopted is the silica gel board, what substrate 8 adopted is bakelite board or epoxy board, component layer 3 through the roast lamp heat treatment of UV with cover copper sheet layer 2 fixed connection, substrate 8 through the half curing agent with the fixed adhesion of signal layer 7, the roast lamp of UV can accelerate the adhesion solidification of half curing agent, improves work efficiency.
Further, first spliced pole 10 with the gold nickel alloy post that second spliced pole 11 adopted, first spliced pole 10 with the both ends of second spliced pole 11 are fixedly connected with block joint 12 respectively, what block joint 12 adopted is the silver sheet, and gold nickel alloy post is convenient for carry out electrically conductive, and the hardness that the nickel can increase gold, and the guidance quality of silver is strong, is convenient for carry out electrically conductive.
Furthermore, the diameter of the clamping joint 12 is 0.05-0.09cm longer than the diameter of the first connecting column 10 and the second connecting column 11, and the outer surfaces of the first connecting column 10, the second connecting column 11 and the like are coated with alumina ceramic insulating coatings, so that the clamping joint 12 can be prevented from falling off, and the first connecting column 10 and the second connecting column 11 can be prevented from conducting electricity.
Furthermore, the graphite film layer 9 is fixedly adhered to the substrate 8 through the heat-conducting silicone grease layer, and the thickness of each layer of board in the integrated circuit board is not more than 0.1-0.15mm, so that heat dissipation treatment is facilitated, and the integrated circuit board can be prevented from being too thick.
A preparation process of a smart phone integrated circuit board based on a graphite film coating comprises the following steps:
and S1, drawing a wiring film, and realizing wiring processing on the power layer 5 and the signal layer 7: drawing a wiring film by a laser plotter, fixedly adhering the wiring film to the power supply layer 5 and the signal layer 7, adhering the wiring film to the power supply layer 5 and the signal layer 7 by a photosensitive dry film, and performing development treatment by exposure;
s2, etching and oxidizing to form a circuit: then, etching and oxidizing the power supply layer 5 and the signal layer 7 which are subjected to exposure and development processing, so that the power supply layer 5 and the signal layer 7 can form a designed circuit;
s3, fixing, pressing and adhering the plates to form an integrated circuit board: place signal layer 7 on substrate 8, then place second isolation layer 6, power plane 5, first isolation layer 4 and support sheet layer 1 on signal layer in proper order, and scribble the semi-curing agent between each layer sheet layer, then carry out limit heating limit pressfitting processing to each sheet layer for each sheet layer can form wholly:
s4, performing copper plating treatment on the board layer: performing copper plating treatment on the board layer in the laminating process in S3, wherein the first step is electroless plating to form the minimum thickness capable of flowing current, the second step is electrolytic plating treatment in order to achieve the plating thickness required by design, the copper foil on the outer layer is also plated with copper, the thickness of the outer layer wiring is the copper foil thickness plus the plating thickness, the treatment of the element layer 3 is performed outside the copper-clad board layer 2, and after the silica gel is coated, the curing treatment is performed through a UV baking lamp;
s5, arranging a graphite film layer 9 on the lower part or both the upper part and the lower part of the processed plate: and (3) coating heat-conducting silicone grease on the lower part or the upper and lower parts of the treated plate, then fixedly adhering the graphite film layer 9, and curing the adhered graphite film layer 9 by using a UV (ultraviolet) baking lamp for 1-2 h.
Further, before the plate is subjected to the press-fitting processing in S3, the power layer 5 is punched, the snap fit joint 12 is fixedly mounted, the support plate layer 1 is punched, the first connecting column 10 penetrates through the support plate layer 1 and is fixedly connected with the snap fit joint 12, the signal layer 7 is punched and is mounted with the snap fit joint 12, one side of the second connecting column 11 penetrates through the support plate layer 1, the first isolation layer 4, the power layer 5 and the second isolation layer 6 and is fixedly connected with the snap fit joint 12, and then the snap fit joint 12 at the other end of the first connecting column 10 and the second connecting column 11 is fixedly connected when the copper-clad plate layer 2 is formed by copper plating, so that the electrical connection is facilitated, and the first connecting column 10 and the second connecting column 11 can be fixedly connected together, and the first connecting column 10 and the second connecting column 11 can be connected together, And the second connecting column 11 is fixedly connected with the clamping joint 12.
The working principle is as follows: in the invention, the first isolation layer 4 and the second isolation layer 6 are arranged in the integrated circuit board, so that the copper-clad board layer 2, the power supply layer 5 and the signal layer 7 can be effectively isolated and separated, and the problem of disordered lines of the integrated circuit board can be avoided when the integrated circuit board is used for a long time. Realize carrying out electric connection to copper clad sheet layer 2, power plane 5 and signal layer 7 through first spliced pole 10 and second spliced pole 11, can and be equipped with block joint 12 at the tip of first spliced pole 10 and second spliced pole 11, can improve the stability of first spliced pole 10 and second spliced pole 11 when connecting, prevent that first spliced pole 10 and second spliced pole 11 from when connecting, causing contact failure. Realize carrying out the adhesion to graphite rete 9 through heat conduction silicone grease layer, can effectually realize carrying out the heat dissipation through setting for of heat conduction silicone grease layer and graphite rete 9 and handle integrated circuit board, can prevent that integrated circuit board from taking place to damage or information transmission unstability when the high temperature of use.
The preparation process flow comprises the following steps:
firstly, drawing a wiring film to realize wiring processing on the power layer 5 and the signal layer 7: drawing a wiring film by a laser plotter, fixedly adhering the wiring film to the power supply layer 5 and the signal layer 7, adhering the wiring film to the power supply layer 5 and the signal layer 7 by a photosensitive dry film, and performing development treatment by exposure;
and secondly, etching and oxidizing to form a circuit: then, etching and oxidizing the power supply layer 5 and the signal layer 7 which are subjected to exposure and development processing, so that the power supply layer 5 and the signal layer 7 can form a designed circuit;
thirdly, fixing, pressing and adhering the plates to form the integrated circuit board: place signal layer 7 on substrate 8, then place second isolation layer 6, power plane 5, first isolation layer 4 and support sheet layer 1 on signal layer in proper order, and scribble the semi-curing agent between each layer sheet layer, then carry out limit heating limit pressfitting processing to each sheet layer for each sheet layer can form wholly:
and fourthly, carrying out copper plating treatment on the board layer: performing copper plating treatment on the board layer in the laminating process in S3, wherein the first step is electroless plating to form the minimum thickness capable of flowing current, the second step is electrolytic plating treatment in order to achieve the plating thickness required by design, the copper foil on the outer layer is also plated with copper, the thickness of the outer layer wiring is the copper foil thickness plus the plating thickness, the treatment of the element layer 3 is performed outside the copper-clad board layer 2, and after the silica gel is coated, the curing treatment is performed through a UV baking lamp;
fifthly, arranging graphite film layers 9 on the lower part or the upper part and the lower part of the processed plate: and (3) coating heat-conducting silicone grease on the lower part or the upper and lower parts of the treated plate, then fixedly adhering the graphite film layer 9, and curing the adhered graphite film layer 9 by using a UV (ultraviolet) baking lamp for 1-2 h.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (10)
1. The utility model provides a smart mobile phone integrated circuit board based on graphite membrane coating, including support sheet layer (1), its characterized in that: support fixed being equipped with on sheet layer (1) and cover copper sheet layer (2), the fixed component layer (3) that is equipped with in upper portion of covering copper sheet layer (2), the lower part of covering copper sheet layer (2) is equipped with power source (5) and signal layer (7) in proper order, the fixed substrate (8) that is equipped with in bottom of signal layer (7), the bottom of substrate (8) is equipped with graphite rete (9), power source (5) with cover and carry out electric connection through first spliced pole (10) between copper sheet layer (2), cover copper sheet layer (2) with carry out electric connection through second spliced pole (11) between signal layer (7).
2. The smart phone integrated circuit board based on graphite film coating of claim 1, characterized in that: the bottom of copper clad plate layer (2) is fixed and is equipped with first isolation layer (4), power layer (5) are fixed to be set up the bottom of first isolation layer (4).
3. The smart phone integrated circuit board based on graphite film coating of claim 2, characterized in that: the bottom of power layer (5) is fixed and is equipped with second isolation layer (6), the bottom of second isolation layer (6) is fixed and is equipped with signal layer (7).
4. The smart phone integrated circuit board based on graphite film coating of claim 3, characterized in that: first isolation layer (4) with what second isolation layer (6) adopted is bakelite board or epoxy board, first isolation layer (4) with second isolation layer (6) with cover copper sheet layer (2) power layer (5) with fix the adhesion through the semi-curing agent between signal layer (7).
5. The smart phone integrated circuit board based on graphite film coating of claim 1, characterized in that: the element layer (3) adopts a silica gel plate, the substrate (8) adopts a bakelite plate or an epoxy resin plate, the element layer (3) is fixedly connected with the copper-clad plate layer (2) through UV (ultraviolet) lamp baking heat treatment, and the substrate (8) is fixedly adhered with the signal layer (7) through a semi-curing agent.
6. The smart phone integrated circuit board based on graphite film coating of claim 1, characterized in that: the gold-nickel alloy column is characterized in that the first connecting column (10) and the second connecting column (11) adopt gold-nickel alloy columns, the two ends of the first connecting column (10) and the two ends of the second connecting column (11) are fixedly connected with clamping joints (12) respectively, and the clamping joints (12) adopt silver plates.
7. The smart phone integrated circuit board based on graphite film coating of claim 6, characterized in that: the diameter of the clamping joint (12) is 0.05-0.09cm longer than that of the first connecting column (10) and that of the second connecting column (11), and aluminum oxide ceramic insulating coatings are coated on the outer surfaces of the first connecting column (10), the second connecting column (11) and the like.
8. The smart phone integrated circuit board based on graphite film coating of claim 1, characterized in that: the graphite film layer (9) is fixedly adhered to the substrate (8) through the heat-conducting silicone grease layer, and the thickness of each layer of plate material in the integrated circuit board is not more than 0.1-0.15 mm.
9. A preparation process of an integrated circuit board of a smart phone based on a graphite film coating is characterized by comprising the following steps: the method comprises the following steps:
and S1, drawing a wiring film, and realizing wiring processing on the power layer (5) and the signal layer (7): drawing a wiring film through a laser plotter, fixedly adhering the wiring film to a power supply layer (5) and a signal layer (7), adhering the wiring film to the power supply layer (5) and the signal layer (7) through a photosensitive dry film, and performing development processing through exposure;
s2, etching and oxidizing to form a circuit: then, etching and oxidizing the power supply layer (5) and the signal layer (7) which are subjected to exposure and development processing, so that the power supply layer (5) and the signal layer (7) can form a designed circuit;
s3, fixing, pressing and adhering the plates to form an integrated circuit board: place signal layer (7) on substrate (8), then place second isolation layer (6), power supply layer (5), first isolation layer (4) and support sheet layer (1) on signal layer in proper order, and scribble the semi-curing agent between each layer sheet layer, then carry out limit heating limit pressfitting to each sheet layer and handle for each sheet layer can form wholly:
s4, performing copper plating treatment on the board layer: carrying out copper plating treatment on the board layer in the laminating process in S3, wherein the first step is electroless plating to form the minimum thickness capable of flowing current, the second step is electrolytic plating treatment to achieve the plating thickness required by design, the copper foil on the outer layer is also plated with copper, the thickness of the outer layer wiring is the copper foil thickness plus the plating thickness, the second step is to carry out treatment on the element layer (3) outside the copper-clad board layer (2), and after the silica gel is coated, carrying out curing treatment through a UV baking lamp;
s5, arranging a graphite film layer (9) on the lower part or both the upper part and the lower part of the processed plate: and (3) coating heat-conducting silicone grease on the lower part or the upper and lower parts of the treated plate, then fixedly adhering the graphite film layer (9), and curing the adhered graphite film layer (9) by a UV (ultraviolet) baking lamp for 1-2 h.
10. The preparation process of the smart phone integrated circuit board based on the graphite film coating as claimed in claim 9, wherein the graphite film coating comprises the following steps: in the step S3, before the plate is pressed, the power layer (5) is punched, then, the clamping joint (12) is fixedly installed, then, the supporting plate layer (1) is perforated, and then the first connecting column (10) penetrates through the supporting plate layer (1) to be fixedly connected with the clamping joint (12), then, a clamping joint (12) is installed on the signal layer (7) in a punching mode, one side of a second connecting column (11) penetrates through the supporting board layer (1), the first isolating layer (4), the power supply layer (5) and the second isolating layer (6) to be fixedly connected with the clamping joint (12), and then fixedly connecting the clamping joint (12) on the other ends of the first connecting column (10) and the second connecting column (11) when the copper-clad plate layer (2) is formed by copper plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111514627.5A CN114158184A (en) | 2021-12-13 | 2021-12-13 | Smart phone integrated circuit board based on graphite film coating and preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111514627.5A CN114158184A (en) | 2021-12-13 | 2021-12-13 | Smart phone integrated circuit board based on graphite film coating and preparation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114158184A true CN114158184A (en) | 2022-03-08 |
Family
ID=80450967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111514627.5A Pending CN114158184A (en) | 2021-12-13 | 2021-12-13 | Smart phone integrated circuit board based on graphite film coating and preparation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114158184A (en) |
-
2021
- 2021-12-13 CN CN202111514627.5A patent/CN114158184A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2007207861A (en) | In SOLDER COATED COPPER FOIL RIBBON WIRE AND ITS CONNECTION METHOD | |
| CN110678004B (en) | Manufacturing method of PCB for charging pile | |
| US9819263B2 (en) | Power converter and method for manufacturing the same | |
| CN113825306B (en) | Circuit board and preparation method thereof | |
| US20080084678A1 (en) | Printed circuit board and a method for imbedding a battery in a printed circuit board | |
| TW442929B (en) | Semiconductor device and manufacture thereof | |
| CN114158184A (en) | Smart phone integrated circuit board based on graphite film coating and preparation process | |
| CN216721653U (en) | Smart phone integrated circuit board based on graphite film coating | |
| JP2009177071A (en) | Polyimide film circuit board and method of manufacturing the same | |
| CN217011281U (en) | Nickel-copper combined heat dissipation module board | |
| JPS60263494A (en) | Method of producing recording electrode plate | |
| JP4142933B2 (en) | Wiring board manufacturing method | |
| JP4139185B2 (en) | Wiring board manufacturing method | |
| JP3006482U (en) | Copper clad laminate and double-sided printed wiring board using the same | |
| JPH0653658A (en) | Multilayer printed wiring board | |
| JP2004165573A (en) | Method of manufacturing wiring board | |
| JPS616895A (en) | Multilayer printed circuit board with inner layer resistor | |
| JP2004165325A (en) | Method of manufacturing wiring board | |
| JP2003124494A (en) | Connection base plate | |
| JP2004140245A (en) | Method of manufacturing wiring board | |
| JPS61253887A (en) | Manufacture of hybrid integrated circuit | |
| JP2004140190A (en) | Method of manufacturing wiring board | |
| JP2004140109A (en) | Method of manufacturing wiring board | |
| JP2004165327A (en) | Method of manufacturing wiring board | |
| JP2004165577A (en) | Method of manufacturing wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |