JP3006482U - Copper clad laminate and double-sided printed wiring board using the same - Google Patents
Copper clad laminate and double-sided printed wiring board using the sameInfo
- Publication number
- JP3006482U JP3006482U JP1994009378U JP937894U JP3006482U JP 3006482 U JP3006482 U JP 3006482U JP 1994009378 U JP1994009378 U JP 1994009378U JP 937894 U JP937894 U JP 937894U JP 3006482 U JP3006482 U JP 3006482U
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- Japan
- Prior art keywords
- insulating resin
- resin layer
- metal wire
- wiring board
- clad laminate
- Prior art date
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】
【目的】電気的な信頼性に優れた両面プリント配線板を
安価に提供する。
【構成】銅張積層板の絶縁層の形成時に、金属線を絶縁
層の所定の部位に埋設する。金属線を所定の部位に埋設
した絶縁層の表裏に、銅めっきによる導電体層を形成し
て銅張積層板とする。金属線を絶縁層の所定の部位に埋
設した銅張積層板を用いて両面プリント配線板を作製す
る。作製した両面プリント配線板の導電体回路間の電気
的な接続は、予め絶縁層に埋設した金属線にて行なう。
(57) [Abstract] [Purpose] To provide a double-sided printed wiring board with excellent electrical reliability at low cost. [Structure] When forming an insulating layer of a copper clad laminate, a metal wire is embedded in a predetermined portion of the insulating layer. A conductor layer is formed by copper plating on the front and back surfaces of the insulating layer in which the metal wire is embedded in a predetermined portion to form a copper clad laminate. A double-sided printed wiring board is manufactured using a copper clad laminate in which a metal wire is embedded in a predetermined portion of an insulating layer. Electrical connection between the conductor circuits of the produced double-sided printed wiring board is performed by a metal wire embedded in an insulating layer in advance.
Description
【０００１】[0001]
本考案は、銅張積層板およびそれを用いた両面プリント配線板に関する。 The present invention relates to a copper clad laminate and a double-sided printed wiring board using the same.
【０００２】[0002]
従来の銅張積層板を用いた両面プリント配線板の構造を、図５に示して説明す る。 The structure of a double-sided printed wiring board using a conventional copper clad laminate will be described with reference to FIG.
【０００３】 銅張積層板を用いた両面プリント配線板１は、銅張積層板の絶縁層２の表裏に 形成した銅箔を、化学的手段などにてエッチングして導電体回路３を形成する。 銅箔に代えて、導電体回路３を導電性ペーストまたは金属線にて形成することも ある。従来の両面プリント配線板１は、銅張積層板に導通用透孔４と、図示しな い部品挿入用透孔などを形成する。導通用透孔４や部品挿入用透孔などの透孔は 、銅張積層板にドリル加工やプレス加工などの機械的手段、またはレーザー加工 などによって形成される。なお、導通用透孔４の周囲には、導電体回路３によっ て形成した導通用ランドが存在する。In the double-sided printed wiring board 1 using a copper clad laminate, the copper foils formed on the front and back of the insulating layer 2 of the copper clad laminate are etched by chemical means or the like to form the conductor circuit 3. . Instead of the copper foil, the conductor circuit 3 may be formed of a conductive paste or a metal wire. In the conventional double-sided printed wiring board 1, a through hole 4 for conduction and a through hole for inserting a component (not shown) are formed in a copper clad laminate. The through holes 4 for conduction and the through holes for inserting components are formed in the copper clad laminate by mechanical means such as drilling or pressing, or by laser processing. Around the through hole 4 for conduction, there is a land for conduction formed by the conductor circuit 3.
【０００４】 両面プリント配線板１では、導通用透孔４内に導電性の物質を形成し、絶縁層 ２の表裏に形成した導電体回路３間の電気的な接続を行なう。従来の両面プリン ト配線板では、導通用透孔４内および導通用ランドの表面に、無電解銅めっき層 ５および電解銅めっき層６を順次に形成する。絶縁層２や導電体回路３が露出し た所定の部位にはソルダーレジスト層７を形成する。また、必要に応じて図示し ないシンボルマークなどを、両面プリント配線板１に形成する。In the double-sided printed wiring board 1, a conductive substance is formed in the conductive through holes 4 to electrically connect the conductor circuits 3 formed on the front and back surfaces of the insulating layer 2. In the conventional double-sided printed wiring board, the electroless copper plating layer 5 and the electrolytic copper plating layer 6 are sequentially formed in the through hole 4 for conduction and on the surface of the land for conduction. A solder resist layer 7 is formed on a predetermined portion where the insulating layer 2 and the conductor circuit 3 are exposed. Moreover, a symbol mark (not shown) or the like is formed on the double-sided printed wiring board 1 as needed.
【０００５】[0005]
上述した従来の両面プリント配線板１は、絶縁層２の表裏に形成した導電体回 路３間を電気的に接続するための導通用透孔４が必要であった。従来の両面プリ ント配線板１は、導通用透孔４を形成しなければならないために、透孔の数が非 常に多くなっていた。このために、プレス加工によって同時に多数の透孔を形成 すると、絶縁層２または導電体回路３に、クラックまたはバリなどが発生してし まうという問題があった。 The above-described conventional double-sided printed wiring board 1 requires the through holes 4 for conduction for electrically connecting the conductor circuits 3 formed on the front and back surfaces of the insulating layer 2. In the conventional double-sided printed wiring board 1, the number of through holes is very large because the through holes 4 for conduction must be formed. Therefore, when a large number of through holes are formed at the same time by press working, there is a problem that cracks or burrs may occur in the insulating layer 2 or the conductor circuit 3.
【０００６】 従来の両面プリント配線板１は、プレス加工によって透孔を銅張積層板に形成 することが困難であったために、ドリル加工またはレーザー加工にて銅張積層板 に順次に透孔を形成していた。しかし、ドリル加工またはレーザー加工による透 孔の形成方法は、クラックまたはバリなどが銅張積層板に発生しにくい反面、透 孔を形成するには非常に時間が掛かる。そのために生産効率が悪化し、両面プリ ント配線板１の製造単価の上昇の大きな要因となっていた。しかも、ドリル加工 によって銅張積層板に透孔を形成しても、銅張積層板の絶縁層２または導電体回 路３に発生するバリまたはクラックを完全には除去できていなかった。In the conventional double-sided printed wiring board 1, since it was difficult to form the through holes in the copper clad laminate by pressing, the through holes were sequentially formed in the copper clad laminate by drilling or laser machining. Had formed. However, while the method of forming holes by drilling or laser processing is less likely to cause cracks or burrs in the copper-clad laminate, it takes a very long time to form holes. As a result, the production efficiency deteriorated, which was a major factor in the increase in the manufacturing unit price of the double-sided printed wiring board 1. Moreover, even if the through holes were formed in the copper-clad laminate by drilling, burrs or cracks generated in the insulating layer 2 or the conductor circuit 3 of the copper-clad laminate could not be completely removed.
【０００７】 次の問題として、従来の両面プリント配線板１は、絶縁層２の表裏に形成した 導電体回路間３を電気的に接続するための工程が必要であった。すなわち、導通 用透孔４内に導電性の物質を形成する工程、例えばめっき工程を行なう必要があ った。さらには、導通用透孔４の内壁に形成する導電体層、例えば無電解銅めっ き層５および電解銅めっき層６を形成するには、より大きな導通用透孔４が必要 であった。As a next problem, the conventional double-sided printed wiring board 1 requires a process for electrically connecting the conductor circuits 3 formed on the front and back surfaces of the insulating layer 2. That is, it is necessary to perform a step of forming a conductive substance in the through hole 4 for conduction, for example, a plating step. Further, in order to form a conductor layer formed on the inner wall of the through hole 4 for conduction, for example, the electroless copper plating layer 5 and the electrolytic copper plating layer 6, a larger through hole 4 for conduction was required. .
【０００８】 また、導通用透孔４の導通用ランドへの電子部品の表面実装は、両面プリント 配線板１の電気的な信頼性を損なうために困難であった。したがって、従来は導 電体回路３の配線の際に電子部品の表面実装用の部品実装用ランドを導通用ラン ドとは別に形成していた。部品実装用ランドが導通用ランドとは別に必要である ために、導電体回路３の配線が長く複雑になっていた。そのために、両面プリン ト配線板１の面積が大きくなってしまうという問題があった。Surface mounting of electronic components on the conductive lands of the conductive through holes 4 is difficult because the electrical reliability of the double-sided printed wiring board 1 is impaired. Therefore, conventionally, when wiring the conductor circuit 3, the component mounting land for surface mounting of the electronic component is formed separately from the conduction land. Since the component mounting land is required separately from the conduction land, the wiring of the conductor circuit 3 is long and complicated. Therefore, there is a problem that the area of the double-sided printed wiring board 1 becomes large.
【０００９】[0009]
本考案は、上述した問題点に鑑みてなされたものである。本考案は、銅張積層 板の作製時に、金属線を絶縁層の所定の部位に埋設したものである。金属線の絶 縁層への埋設は、絶縁層の絶縁性樹脂が硬化する前または硬化中に行なうのが好 ましい。そして、絶縁層に埋設した金属線にて、絶縁層の表裏に形成する導電体 間の電気的な接続を行なう。さらには、金属線を絶縁層の所定の部位に埋設した 銅張積層板を用いて両面プリント配線板を作製した。絶縁層に埋設した金属線に て絶縁層の表裏に形成した導電体回路間の電気的な接続を行ない、絶縁層の表裏 に形成した導電体回路の電気的な接続のための導通用透孔を不要とした。 The present invention has been made in view of the above problems. According to the present invention, a metal wire is embedded in a predetermined portion of an insulating layer when a copper clad laminate is manufactured. The embedding of the metal wire in the insulating layer is preferably performed before or during the curing of the insulating resin of the insulating layer. Then, the metal wires embedded in the insulating layer electrically connect the conductors formed on the front and back surfaces of the insulating layer. Furthermore, a double-sided printed wiring board was produced using a copper clad laminate in which a metal wire was embedded in a predetermined portion of an insulating layer. Conductive holes for electrical connection between the conductor circuits formed on the front and back of the insulating layer, with the metal wires embedded in the insulating layer for electrical connection between the conductor circuits formed on the front and back of the insulating layer. Was unnecessary.
【００１０】[0010]
〈実施例１〉 本考案に係る銅張積層板の第１の実施例の構造を、図１に記載して説明する。 本考案に係る銅張積層板８の絶縁層は、熱硬化型の絶縁性樹脂を用いるのが好ま しい。本考案に係る銅張積層板８は、熱硬化型の絶縁性樹脂を加熱し、硬化させ て絶縁性樹脂層２ａを形成する。熱硬化型の絶縁性樹脂としてはフェノール樹脂 、エポキシ樹脂、メラミン樹脂、ＢＴ（ビスマレイド・トリアジン）樹脂、ポリ イミド樹脂、シアネートエステル樹脂、シリコン樹脂、ポリエステル樹脂、弗素 樹脂、ポリブタジェン樹脂またはポリエーテルイミド樹脂などが挙げられる。 <Example 1> The structure of Example 1 of the copper clad laminate according to the present invention will be described with reference to FIG. The insulating layer of the copper clad laminate 8 according to the present invention is preferably made of thermosetting insulating resin. In the copper clad laminate 8 according to the present invention, a thermosetting insulating resin is heated and cured to form the insulating resin layer 2a. Examples of thermosetting insulating resin are phenol resin, epoxy resin, melamine resin, BT (bismaleide triazine) resin, polyimide resin, cyanate ester resin, silicone resin, polyester resin, fluorine resin, polybutadiene resin or polyetherimide resin. And so on.
【００１１】 絶縁性樹脂層２ａには、予め複数の金属線９を一定の間隔で埋設して配列させ る。金属線９は、絶縁性樹脂層２ａの厚さ方向に埋設するのが好ましい。金属線 ９の絶縁性樹脂層２ａへの埋設は、絶縁性樹脂層２ａの形成用の金型に絶縁性樹 脂を注入する前に金型に設置する。または、絶縁性樹脂層２ａの形成用の金型に 注入した絶縁性樹脂を加熱して硬化させる前、または絶縁性樹脂の硬化中に絶縁 性樹脂層２ａに埋設する。絶縁性樹脂を加熱して硬化し、絶縁性樹脂層２ａとす ると同時に、埋設した金属線９を固定する。埋設する金属線９の長さは、形成す る絶縁性樹脂層２ａの厚さと同等以上とし、必要に応じて金属線９の長さを適宜 に調整する。埋設する金属線９の直径は、金属線９の材質または導電体回路に流 れる電気量などを考慮して判断する。In the insulating resin layer 2a, a plurality of metal wires 9 are embedded and arranged in advance at regular intervals. The metal wire 9 is preferably embedded in the thickness direction of the insulating resin layer 2a. The embedding of the metal wire 9 in the insulating resin layer 2a is set in the mold before injecting the insulating resin into the mold for forming the insulating resin layer 2a. Alternatively, it is embedded in the insulating resin layer 2a before the insulating resin injected into the mold for forming the insulating resin layer 2a is heated and cured, or during the curing of the insulating resin. The insulating resin is heated and cured to form the insulating resin layer 2a, and at the same time, the embedded metal wire 9 is fixed. The length of the metal wire 9 to be buried is equal to or more than the thickness of the insulating resin layer 2a to be formed, and the length of the metal wire 9 is appropriately adjusted as necessary. The diameter of the metal wire 9 to be buried is determined in consideration of the material of the metal wire 9 or the amount of electricity flowing in the conductor circuit.
【００１２】 考案に係る金属線９としては銅線、アルミニウム線、銀線、金線、ニッケル線 、鉄線またはこれらの金属を含んだ合金の線もしくはこれらの金属を被覆した線 などが挙げられる。特には銅線、銅を含んだ合金の線または銅を被覆した線が好 ましい。Examples of the metal wire 9 according to the invention include a copper wire, an aluminum wire, a silver wire, a gold wire, a nickel wire, an iron wire, an alloy wire containing these metals, or a wire coated with these metals. In particular, a copper wire, an alloy wire containing copper, or a wire coated with copper is preferable.
【００１３】 絶縁性樹脂層２ａの表面に導電体３ａとして銅箔を形成して銅張積層板８、特 に好ましくは両面銅張積層板８を作製する。絶縁性樹脂層２ａに一定の間隔で配 列し、埋設した複数の金属線９と、絶縁性樹脂層２ａの表面に形成した導電体３ ａは、電気的に接続される。本考案に係る銅張積層板８の導電体３ａは、電解銅 箔または圧延銅箔を用いてもよいが、銅めっき法によって形成した銅めっき層を 用いるのが好ましい。銅めっき法によって絶縁性樹脂層２ａの表面に銅めっき層 を形成した場合、絶縁性樹脂層２ａに埋設した金属線９と銅めっき層は銅めっき 工程時に強固に固着する。さらには、埋設した金属線９と銅めっき層との電気的 な接続の信頼性も高い。銅めっき層の厚さは、従来の銅張積層板の銅箔の厚さと 同等程度の厚さであればよい。A copper foil is formed as a conductor 3a on the surface of the insulating resin layer 2a to produce a copper-clad laminate 8, particularly preferably a double-sided copper-clad laminate 8. The plurality of metal wires 9 arranged and buried in the insulating resin layer 2a at regular intervals and the conductor 3a formed on the surface of the insulating resin layer 2a are electrically connected. The conductor 3a of the copper clad laminate 8 according to the present invention may use electrolytic copper foil or rolled copper foil, but it is preferable to use a copper plating layer formed by a copper plating method. When the copper plating layer is formed on the surface of the insulating resin layer 2a by the copper plating method, the metal wire 9 and the copper plating layer embedded in the insulating resin layer 2a are firmly fixed during the copper plating step. Furthermore, the reliability of the electrical connection between the buried metal wire 9 and the copper plating layer is high. The thickness of the copper plating layer may be the same as the thickness of the copper foil of the conventional copper clad laminate.
【００１４】 〈実施例２〉 次に、本考案に係る銅張積層板の第２の実施例の構造を、図２に示して説明す る。Second Embodiment Next, the structure of a second embodiment of the copper clad laminate according to the present invention will be described with reference to FIG.
【００１５】 本考案に係る銅張積層板８Ａは、絶縁層に実施例１と同様の熱硬化型の絶縁性 樹脂を用いるのが好ましい。本考案に係る銅張積層板８Ａは、実施例１と同様の 熱硬化型の絶縁性樹脂を加熱し、硬化させて絶縁性樹脂層２ａを形成する。In the copper clad laminate 8A according to the present invention, it is preferable to use the same thermosetting insulating resin as that of the first embodiment for the insulating layer. In the copper clad laminate 8A according to the present invention, the thermosetting insulating resin similar to that of the first embodiment is heated and cured to form the insulating resin layer 2a.
【００１６】 本考案に係る銅張積層板８Ａは、絶縁性樹脂層２ａを形成する前に両面プリン ト配線板の導電体回路の回路設計を行ない、この設計にしたがって絶縁性樹脂層 ２ａに金属線９を実施例１と同様に埋設する。絶縁性樹脂層２ａに予め埋設する 部位は、導電体回路の設計上、絶縁性樹脂層２ａの表裏に形成する導電体３ａ間 の電気的な接続を行なう部位とする。金属線９の絶縁性樹脂層２ａへの埋設方法 および埋設する方向は、実施例１と同様である。なお、埋設する金属線９の直径 は、その金属線９に流れる電気量および金属線９の材質などに応じて判断する。In the copper clad laminate 8A according to the present invention, the circuit design of the conductor circuit of the double-sided printed wiring board is performed before forming the insulating resin layer 2a, and the insulating resin layer 2a is made of metal according to this design. The wire 9 is buried as in the first embodiment. The part to be embedded in the insulating resin layer 2a in advance is a part for electrical connection between the conductors 3a formed on the front and back surfaces of the insulating resin layer 2a in the design of the conductor circuit. The embedding method and the embedding direction of the metal wire 9 in the insulating resin layer 2a are the same as in the first embodiment. The diameter of the metal wire 9 to be buried is determined according to the amount of electricity flowing through the metal wire 9 and the material of the metal wire 9.
【００１７】 本考案に係る実施例２の金属線９としては、実施例１と同様の金属線を用いる のが好ましい。As the metal wire 9 of the second embodiment according to the present invention, it is preferable to use the same metal wire as that of the first embodiment.
【００１８】 絶縁性樹脂層２ａの表面に、導電体３ａとして実施例１と同様の銅箔を形成し 、銅張積層板８Ａ、特に好ましくは両面銅張積層板８Ａとする。なお、絶縁性樹 脂層２ａに埋設した金属線９と、絶縁性樹脂層２ａの表面に形成した導電体３ａ は、電気的に接続する。On the surface of the insulating resin layer 2a, a copper foil similar to that used in Example 1 is formed as the conductor 3a to form a copper-clad laminate 8A, particularly preferably a double-sided copper-clad laminate 8A. The metal wire 9 embedded in the insulating resin layer 2a and the conductor 3a formed on the surface of the insulating resin layer 2a are electrically connected.
【００１９】 〈実施例３〉 次に、実施例１の銅張積層板８を用いて形成した両面プリント配線板について 、図３に示して説明する。Example 3 Next, a double-sided printed wiring board formed using the copper clad laminate 8 of Example 1 will be described with reference to FIG.
【００２０】 本考案に係る両面プリント配線板１Ａは、絶縁性樹脂層２ａに予め複数の金属 線９を一定の間隔で埋設し、配列した実施例１の銅張積層板８を用いる。実施例 １の銅張積層板８を用いて両面プリント配線板１Ａを作製するので、絶縁性樹脂 層２ａ内に予め一定の間隔で埋設し、配列した複数の金属線９の埋設位置を考慮 して、導電体回路３の回路設計をする。この回路設計にしたがって導電体回路３ を形成する。導電体回路３は、銅張積層板の銅箔を用いて形成するのが好ましい 。しかし、絶縁性樹脂層２ａの少なくとも一方の表面または一部の表面に、導電 性ペーストまたは金属線にて導電体回路３を形成してもよい。導電性ペーストと しては金ぺースト、銀ペースト、銅ペーストまたはカーボンペーストなどが挙げ られる。また、金属線としては銅線、アルミニウム線、銀線、金線、ニッケル線 、鉄線またはこれらの金属を含んだ合金の線もしくはこれらの金属を被覆した線 などが挙げられる。The double-sided printed wiring board 1A according to the present invention uses the copper clad laminate 8 of Example 1 in which a plurality of metal wires 9 are embedded in advance in the insulating resin layer 2a at regular intervals. Since the double-sided printed wiring board 1A is manufactured by using the copper clad laminate 8 of Example 1, it is embedded in the insulating resin layer 2a at a predetermined interval in advance and the embedded positions of the plurality of arranged metal wires 9 are taken into consideration. Then, the circuit of the conductor circuit 3 is designed. The conductor circuit 3 is formed according to this circuit design. The conductor circuit 3 is preferably formed using a copper foil of a copper clad laminate. However, the conductor circuit 3 may be formed on at least one surface or a part of the surface of the insulating resin layer 2a with a conductive paste or a metal wire. Examples of the conductive paste include gold paste, silver paste, copper paste, carbon paste and the like. Examples of the metal wire include a copper wire, an aluminum wire, a silver wire, a gold wire, a nickel wire, an iron wire, an alloy wire containing these metals, or a wire coated with these metals.
【００２１】 本考案に係る両面プリント配線板１Ａにおいて、絶縁性樹脂層２ａの表裏に形 成した導電体回路３間の電気的な接続は、絶縁性樹脂層２ａに予め埋設した金属 線９によって行なう。金属線９と導電体回路３は、実施例１の銅張積層板８を作 製する際に電気的に接続している。絶縁性樹脂層２ａに埋設した金属線９の長さ は、必要に応じて適宜な工程で切断または研磨して調整してもよい。その後、必 要に応じて両面プリント配線板１Ａの表面にソルダーレジスト層７、図示しない シンボルマークを形成する。その後、両面プリント配線板１Ａの外形加工を行な う。なお、導通用透孔４以外の他の用途に用いる透孔を、プレス加工またはドリ ル加工などの機械的手段、もしくはレーザー加工などにて適宜に必要な箇所に形 成し、両面プリント配線板１Ａを作製する。In the double-sided printed wiring board 1A according to the present invention, the electrical connection between the conductor circuits 3 formed on the front and back surfaces of the insulating resin layer 2a is made by the metal wire 9 embedded in advance in the insulating resin layer 2a. To do. The metal wire 9 and the conductor circuit 3 are electrically connected to each other when the copper clad laminate 8 of Example 1 is manufactured. The length of the metal wire 9 embedded in the insulating resin layer 2a may be adjusted by cutting or polishing in an appropriate step as needed. Thereafter, a solder resist layer 7 and a symbol mark (not shown) are formed on the surface of the double-sided printed wiring board 1A, if necessary. After that, the outer shape of the double-sided printed wiring board 1A is processed. It should be noted that through holes used for other purposes than the through holes 4 for conduction are formed at appropriate places by mechanical means such as press working or drilling, or laser processing, and the double-sided printed wiring board is formed. Make 1A.
【００２２】 〈実施例４〉 次に、実施例２の銅張積層板を用いて形成した両面プリント配線板について、 図４に示して説明する。Example 4 Next, a double-sided printed wiring board formed using the copper clad laminate of Example 2 will be described with reference to FIG.
【００２３】 本考案に係る両面プリント配線板１Ｂは、導電体回路３の回路設計にしたがっ て絶縁性樹脂層２ａに金属線９を予め埋設した、実施例２の銅張積層板８Ａを用 いる。導電体回路３の回路設計にしたがって、導電体回路３を形成する。導電体 回路３は、銅張積層板の銅箔をエッチングすることによって形成するのが好まし い。しかし、実施例１の銅張積層板８を用いた両面プリント配線板１Ａと同様に 、絶縁性樹脂層２ａの少なくとも一方の表面または一部の表面に、導電性ペース トまたは金属線にて導電体回路３を形成してもよい。導電性ペーストまたは金属 線は、実施例１による銅張積層板８を用いた両面プリント配線板１Ａと同様の部 材が挙げられる。具体的には、導電性ペーストとしては金ぺースト、銀ペースト 、銅ペーストまたはカーボンペーストなどが挙げられる。また、金属線としては 銅線、アルミニウム線、銀線、金線、ニッケル線、鉄線またはこれらの金属を含 んだ合金の線もしくはこれらの金属を被覆した線などが挙げられる。The double-sided printed wiring board 1B according to the present invention uses the copper clad laminate 8A of Example 2 in which the metal wire 9 is embedded in advance in the insulating resin layer 2a according to the circuit design of the conductor circuit 3. . The conductor circuit 3 is formed according to the circuit design of the conductor circuit 3. The conductor circuit 3 is preferably formed by etching the copper foil of the copper clad laminate. However, similar to the double-sided printed wiring board 1A using the copper clad laminate 8 of Example 1, at least one surface or part of the surface of the insulating resin layer 2a is electrically conductive with a conductive paste or a metal wire. The body circuit 3 may be formed. The conductive paste or the metal wire may be the same material as the double-sided printed wiring board 1A using the copper clad laminate 8 according to the first embodiment. Specifically, examples of the conductive paste include gold paste, silver paste, copper paste, carbon paste and the like. Examples of the metal wire include a copper wire, an aluminum wire, a silver wire, a gold wire, a nickel wire, an iron wire, an alloy wire containing these metals, and a wire coated with these metals.
【００２４】 実施例２の銅張積層板８Ａを用いた両面プリント配線板１Ｂにおいて、絶縁性 樹脂層２ａの表裏に形成した導電体回路３間の電気的な接続は、銅張積層板の絶 縁性樹脂層２ａに予め埋設した金属線９にて行なう。金属線９と導電体回路３は 、実施例２の銅張積層板８Ａを作製する際に電気的に接続している。絶縁性樹脂 層２ａに埋設した金属線９の長さは、必要に応じて適宜な工程で切断または研磨 して調整してもよい。その後、必要に応じて両面プリント配線板１Ｂの表面にソ ルダーレジスト層７、図示しないシンボルマークを形成する。その後、両面プリ ント配線板１Ａの外形加工を行なう。なお、導通用透孔４以外の他の用途に用い る透孔は、プレス加工またはドリル加工などの機械的手段、もしくはレーザー加 工などにて適宜に必要な箇所に形成し、両面プリント配線板１Ｂを作製する。In the double-sided printed wiring board 1B using the copper clad laminate 8A of Example 2, the electrical connection between the conductor circuits 3 formed on the front and back of the insulating resin layer 2a is performed by the insulation of the copper clad laminate. The metal wire 9 is embedded in the edge resin layer 2a in advance. The metal wire 9 and the conductor circuit 3 are electrically connected when the copper clad laminate 8A of Example 2 is manufactured. The length of the metal wire 9 embedded in the insulating resin layer 2a may be adjusted by cutting or polishing in an appropriate step as needed. Thereafter, a solder resist layer 7 and a symbol mark (not shown) are formed on the surface of the double-sided printed wiring board 1B, if necessary. After that, the outer shape of the double-sided printed wiring board 1A is processed. The through holes used for purposes other than the through holes 4 for conduction are formed at appropriate places by mechanical means such as press working or drilling, or laser processing, and the double-sided printed wiring board is formed. Make 1B.
【００２５】[0025]
本考案における第１の効果として、導電体回路間の電気的な接続を絶縁性樹脂 層の作製時に埋設した金属線によって行なうために、従来のように導通用透孔を ドリル加工によって形成する必要がない。導通用透孔を機械的手段にて形成しな いために、導電体回路にクラックまたはバリが発生することはなく、電気的な信 頼性に優れた両面プリント配線板が得ることができる。導通用透孔以外の透孔を プレス加工によって同時に多数形成しても、形成する透孔数が少ないために、絶 縁性樹脂層および導電体回路にクラックおよびバリなどが発生することを防ぐこ とができる。また、ドリル加工またはレーザー加工にて順次に導通用透孔以外の 透孔の形成を行なったとしても、形成する透孔数が少ないために、従来よりも短 時間で透孔を形成する工程を終了することができる。 As a first effect of the present invention, since the electrical connection between the conductor circuits is made by the metal wire embedded at the time of forming the insulating resin layer, it is necessary to form the through hole for conduction as in the conventional method by drilling. There is no. Since the conductive through holes are not formed by mechanical means, no cracks or burrs are generated in the conductor circuit, and a double-sided printed wiring board having excellent electrical reliability can be obtained. Even if a large number of through-holes other than the through-holes for conduction are simultaneously formed by press working, the number of through-holes to be formed is small, so it is possible to prevent cracks and burrs from occurring in the insulating resin layer and the conductor circuit. You can Even if the through holes other than the conductive through holes are sequentially formed by drilling or laser processing, since the number of the through holes to be formed is small, the step of forming the through holes in a shorter time than the conventional method is required. Can be finished.
【００２６】 第２の効果として、導通用透孔に導電性物質を形成する工程、例えばめっき工 程が不要であり、両面プリント配線板の製造時間を短縮することができる。さら には、工程数が削減できることによって、両面プリント配線板の歩留りの向上を 図ることができる。As a second effect, a step of forming a conductive substance in the conductive through hole, for example, a plating step is unnecessary, and the manufacturing time of the double-sided printed wiring board can be shortened. Furthermore, the reduction in the number of steps can improve the yield of double-sided printed wiring boards.
【００２７】 第３の効果として、絶縁性樹脂層に埋設した金属線の上に形成した導電体回路 による導通用ランドに、電子部品を表面実装することができる。導通用ランドに 電子部品を表面実装することができない、銅めっきスルーホール法による従来の 両面プリント配線板と比較して、本考案に係る両面プリント配線板は小型化する ことが容易である。また、従来の両面プリント配線板の導電体回路と比較して、 導電体回路の配線の長さが短いので、導電体回路の設計が容易であり、且つ電気 的な信頼性も高い。As a third effect, an electronic component can be surface-mounted on a conduction land formed by a conductor circuit formed on a metal wire embedded in an insulating resin layer. The double-sided printed wiring board according to the present invention can be easily miniaturized as compared with the conventional double-sided printed wiring board using the copper-plated through-hole method in which electronic parts cannot be surface-mounted on the conduction land. Further, since the length of the wiring of the conductor circuit is shorter than that of the conventional conductor circuit of the double-sided printed wiring board, the design of the conductor circuit is easy and the electrical reliability is high.
【００２８】 第４の効果として、絶縁層の表裏に形成した導電体回路間の電気的な接続を埋 設した金属線にて電気的に接続するために、従来の銅めっきスルーホール法によ る両面プリント配線板と比較して電気的な信頼性が高い。したがって、一般的に 言われているアスペクト比（板厚／スルーホール径）の高い両面プリント配線板 でも高い電気的な信頼性を得ることができる。 以上ことから、本考案に係る両面プリント配線板およびその銅張積層板は、従 来の両面プリント配線板およびその銅張積層板よりも安価に製造できるとともに 、電気的な信頼性に優れている。As a fourth effect, the conventional copper plating through-hole method is used to electrically connect the conductor circuits formed on the front and back surfaces of the insulating layer with the buried metal wire. Higher electrical reliability than double-sided printed wiring boards. Therefore, it is possible to obtain high electrical reliability even with a double-sided printed wiring board having a high aspect ratio (thickness / through hole diameter) which is generally said. From the above, the double-sided printed wiring board and its copper-clad laminate according to the present invention can be manufactured at a lower cost than the conventional double-sided printed wiring board and its copper-clad laminate, and are excellent in electrical reliability. .
【図１】本考案に係る銅張積層板の断面図。FIG. 1 is a cross-sectional view of a copper clad laminate according to the present invention.
【図２】本考案に係る銅張積層板の断面図。FIG. 2 is a sectional view of a copper clad laminate according to the present invention.
【図３】本考案に係る両面プリント配線板の断面図。FIG. 3 is a sectional view of a double-sided printed wiring board according to the present invention.
【図４】本考案に係る両面プリント配線板の断面図。FIG. 4 is a sectional view of a double-sided printed wiring board according to the present invention.
【図５】従来の両面プリント配線板の断面図。FIG. 5 is a sectional view of a conventional double-sided printed wiring board.
１ 両面プリント配線板 １Ａ 両面プリント配線板 １Ｂ 両面プリント配線板 ２ 絶縁層 ２ａ 絶縁性樹脂層 ３ 導電体回路 ３ａ 導電体 ４ 導通用透孔 ５ 無電解銅めっき層 ６ 電解銅めっき層 ７ ソルダーレジスト層 ８ 銅張積層板 ８Ａ 銅張積層板 ９ 金属線 1 Double-sided Printed Wiring Board 1A Double-sided Printed Wiring Board 1B Double-sided Printed Wiring Board 2 Insulating Layer 2a Insulating Resin Layer 3 Conductor Circuit 3a Conductor 4 Conductive Through Hole 5 Electroless Copper Plating Layer 6 Electrolytic Copper Plating Layer 7 Solder Resist Layer 8 Copper-clad laminate 8A Copper-clad laminate 9 Metal wire
Claims (4)
層と、絶縁性樹脂層に導通用透孔を形成せずに一定の間
隔で埋設し、配列した複数の金属線と、絶縁性樹脂層の
表面に形成した銅めっきからなる導電体とからなり、絶
縁性樹脂層の表面に形成した導電体と、絶縁性樹脂層に
予め埋設した金属線とを電気的に接続したことを特徴と
する銅張積層板。1. An insulating resin layer made of a thermosetting insulating resin, and a plurality of metal wires embedded and arranged at a constant interval without forming through holes for conduction in the insulating resin layer, and insulation. A conductor formed of copper plating formed on the surface of the conductive resin layer, and the conductor formed on the surface of the insulating resin layer and the metal wire previously embedded in the insulating resin layer are electrically connected. Characteristic copper clad laminate.
層と、絶縁性樹脂層に導通用透孔を形成せずに、絶縁性
樹脂層の表裏に形成する導電体回路間の電気的な接続を
行なう部位に埋設した電流量に応じた直径を有する金属
線と、絶縁性樹脂層の表面に形成した銅めっきからなる
導電体とからなり、絶縁性樹脂層の表面に形成した導電
体と、絶縁性樹脂層に予め埋設した金属線とを電気的に
接続したことを特徴とする銅張積層板。2. An insulating resin layer made of a thermosetting insulating resin, and an electric circuit between conductor circuits formed on the front and back sides of the insulating resin layer without forming through holes for conduction in the insulating resin layer. Conductive wire formed on the surface of the insulating resin layer, which is composed of a metal wire having a diameter corresponding to the amount of current embedded in the portion to be electrically connected and a conductor made of copper plating formed on the surface of the insulating resin layer. A copper clad laminate characterized in that a body and a metal wire embedded in advance in an insulating resin layer are electrically connected.
層と、絶縁性樹脂層に導通用透孔を形成せずに一定の間
隔で埋設し、配列した複数の金属線と、絶縁性樹脂層の
表裏に形成した導電体回路と、絶縁性樹脂層の表裏に形
成した導電体回路間を絶縁性樹脂層に予め埋設した金属
線によって電気的に接続したことを特徴とする両面プリ
ント配線板。3. An insulating resin layer made of a thermosetting insulating resin, and a plurality of metal wires which are buried and arranged at regular intervals without forming through holes for conduction in the insulating resin layer, and insulation. -Sided printing, characterized in that the conductor circuits formed on the front and back of the conductive resin layer and the conductor circuits formed on the front and back of the insulating resin layer are electrically connected by a metal wire embedded in the insulating resin layer in advance. Wiring board.
層と、絶縁性樹脂層の厚さ方向に導通用透孔を形成せず
に、絶縁性樹脂層の表裏に形成する導電体回路間の電気
的な接続を行なう部位に埋設した電流量に応じた直径を
有する金属線と、絶縁性樹脂層の表裏に形成した導電体
回路と、絶縁性樹脂層の表裏に形成した導電体回路間を
絶縁性樹脂層に予め埋設した金属線によって電気的に接
続したことを特徴とする両面プリント配線板。4. An insulating resin layer made of a thermosetting insulating resin, and a conductor formed on the front and back of the insulating resin layer without forming through holes for conduction in the thickness direction of the insulating resin layer. A metal wire having a diameter corresponding to the amount of current embedded in a portion for electrical connection between circuits, a conductor circuit formed on the front and back of the insulating resin layer, and a conductor formed on the front and back of the insulating resin layer A double-sided printed wiring board, characterized in that the circuits are electrically connected by a metal wire embedded in an insulating resin layer in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1994009378U JP3006482U (en) | 1994-07-08 | 1994-07-08 | Copper clad laminate and double-sided printed wiring board using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1994009378U JP3006482U (en) | 1994-07-08 | 1994-07-08 | Copper clad laminate and double-sided printed wiring board using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3006482U true JP3006482U (en) | 1995-01-24 |
Family
ID=43142348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1994009378U Expired - Lifetime JP3006482U (en) | 1994-07-08 | 1994-07-08 | Copper clad laminate and double-sided printed wiring board using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3006482U (en) |
-
1994
- 1994-07-08 JP JP1994009378U patent/JP3006482U/en not_active Expired - Lifetime
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