JPS61253887A - Manufacture of hybrid integrated circuit - Google Patents
Manufacture of hybrid integrated circuitInfo
- Publication number
- JPS61253887A JPS61253887A JP9565085A JP9565085A JPS61253887A JP S61253887 A JPS61253887 A JP S61253887A JP 9565085 A JP9565085 A JP 9565085A JP 9565085 A JP9565085 A JP 9565085A JP S61253887 A JPS61253887 A JP S61253887A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- integrated circuit
- resin
- hybrid integrated
- resin substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は端部に絶縁性の樹脂基板を有する金属ペース混
成集積回路基板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a metal-based hybrid integrated circuit board having an insulating resin substrate at its end.
消費電力の大きい回路を混成集積化する場合の基層とし
て第８図に示す構造のいわゆる金属基板が使われている
。同図で１はアルミニウム板等の金属板、２は樹脂、３
は銅などの導体である。A so-called metal substrate having the structure shown in FIG. 8 is used as a base layer for hybrid integration of circuits with large power consumption. In the figure, 1 is a metal plate such as an aluminum plate, 2 is a resin, and 3 is a metal plate such as an aluminum plate.
is a conductor such as copper.
Ｎ８図に示す金属基板では、導体に近接して金属板があ
るためセラミック基板の場合のように放熱又は伝熱用の
金属板を接着する必要がないという利点がある。一方金
属基板は導体が薄い樹脂で金属板に接着されているため
、外形近くに導体な配置すると金属板と導体間に放電が
起こり基板として性能を失ってしまう。The metal substrate shown in Figure N8 has the advantage that since the metal plate is located close to the conductor, there is no need to bond a metal plate for heat radiation or heat transfer as in the case of a ceramic substrate. On the other hand, in a metal substrate, the conductor is bonded to the metal plate with a thin resin, so if the conductor is placed near the outer shape, electric discharge will occur between the metal plate and the conductor, causing the board to lose its performance.
６ 〔発明が解決しようとする問題点〕従って外形と導
体間には侶頼性を確保するに足りる距離が必要となるこ
のことは、セラミックスが大きくなるという欠点があっ
た。また第９図に金属基板の従来からの端子接続構造を
示す。４は端子、５は樹脂である。端子４は直接導体３
にハンダ７でハンダ付けされており、端子４にかかる力
はすべて導体３と絶縁層２間の剥離力となり、容易には
がれてしまうため樹脂５により補強をしなければならな
いという欠点があり、クリップ形端子の使用が強く望ま
れていた。6 [Problems to be Solved by the Invention] Therefore, there must be a sufficient distance between the outer shape and the conductor to ensure reliability, which has the disadvantage that the ceramic becomes bulky. Further, FIG. 9 shows a conventional terminal connection structure of a metal substrate. 4 is a terminal, and 5 is a resin. Terminal 4 is directly connected to conductor 3
All the force applied to the terminal 4 becomes a peeling force between the conductor 3 and the insulating layer 2, and it easily peels off, so it has the disadvantage that it must be reinforced with resin 5. The use of shaped terminals was strongly desired.
本発明はかかる欠点を解決したものであり、金属板の少
なくとも１側面にガラス繊維強化耐熱樹脂板を接続する
ことにより、導体と金属板間の放電を防止することがで
き、しかも回路基板全体を大きさを必要以上に増すこと
もない。さらに端子をクリップ形とすることによる端子
剥落を防止することができる混成集積回路基板の製法を
提供するものである。The present invention solves these drawbacks, and by connecting a glass fiber reinforced heat-resistant resin plate to at least one side of the metal plate, it is possible to prevent electrical discharge between the conductor and the metal plate, and moreover, the entire circuit board can be prevented. There is no need to increase the size more than necessary. Furthermore, the present invention provides a method for manufacturing a hybrid integrated circuit board that can prevent the terminals from falling off due to the terminals being in the form of clips.
すなわち発明は、ガラス繊維強化耐熱樹脂基板を所定の
形状に穴明は加工し穴部と同一形状に加工した金属板を
嵌合する工程〔１〕と、該金属板を嵌合した樹脂基板の
１主面上に絶縁性の接着層を介して金属箔を接合する工
程〔２〕と、該樹脂基板の金属箔面上に印刷もしくは感
光性レジストの写真法により耐エツチングレジストを設
け、エツチングすることにより所望の回路を形成する工
程〔３〕と、前記樹脂基板を外形加工する工程〔′４〕
から成ることを特徴とする。That is, the invention includes a step [1] of drilling a hole in a glass fiber-reinforced heat-resistant resin substrate into a predetermined shape and fitting a metal plate processed into the same shape as the hole, and a step of forming a resin substrate into which the metal plate is fitted. 1. Step [2] of bonding metal foil on the main surface via an insulating adhesive layer, and etching-resistant resist is provided on the metal foil surface of the resin substrate by printing or photosensitive resist photography, and etching is performed. a step of forming a desired circuit [3], and a step of processing the outer shape of the resin substrate ['4].
It is characterized by consisting of.
以下図面により本発明の詳細な説明する。第１図〜第４
図は、本発明の回路基板を製造するための工程を示す断
面であり、第１図より順々に説明を行う。The present invention will be explained in detail below with reference to the drawings. Figures 1 to 4
The figures are cross-sectional views showing the steps for manufacturing the circuit board of the present invention, which will be explained in order starting from FIG.
耐熱樹脂として例えばエポキシ系樹脂、ポリイミド等を
用いたガラス繊維強化耐熱樹脂基板６は、所定の形状に
穴明は加工され、該穴部と同一形状に加工された金属板
１をプレス加工で嵌合し、樹脂基板６と金属板１とを一
体化する（第１図）。A glass fiber-reinforced heat-resistant resin substrate 6 using, for example, epoxy resin, polyimide, or the like as a heat-resistant resin has holes drilled into a predetermined shape, and a metal plate 1 cut into the same shape as the hole is inserted by press working. Then, the resin substrate 6 and the metal plate 1 are integrated (FIG. 1).
この樹脂基板６と嵌合する金属板１は例えばアル、 ミ
ニラム板、アルマイト板、鉄板、硅素鋼板、ステンレス
板、銅板等積々な金属板及び合金板、複合金属板が使用
出来る。As the metal plate 1 to be fitted with the resin substrate 6, a variety of metal plates, alloy plates, and composite metal plates can be used, such as aluminum plates, miniram plates, alumite plates, iron plates, silicon steel plates, stainless steel plates, copper plates, etc.
次に金属板１を嵌合した樹脂基板６を脱脂し、望ましく
は調布研磨等の表面調整を行い、該樹脂基板６の１主面
に熱硬化性樹脂の絶縁性接着層２を設け、金属箔８を積
層するかもしくは金属箔８に絶縁性接着層２を設け、金
属板１を嵌合した樹脂基板６に積層する。または前記樹
脂及び箔いづれにも絶縁性接着層２を設けて積層しても
よい。７該絶縁性接着層２はピンホール発生を少くする
ため複数層設けるのが望ましく、絶縁性の侶頼性と製造
工程の合理化、伝熱性から２〜５層が望ましい（第２図
）。Next, the resin substrate 6 fitted with the metal plate 1 is degreased, preferably subjected to surface conditioning such as Chofu polishing, an insulating adhesive layer 2 of thermosetting resin is provided on one main surface of the resin substrate 6, and the The foil 8 is laminated, or the metal foil 8 is provided with an insulating adhesive layer 2, and the metal plate 1 is laminated onto the resin substrate 6 fitted therewith. Alternatively, an insulating adhesive layer 2 may be provided on both the resin and the foil and laminated thereon. 7. The insulating adhesive layer 2 is preferably provided with a plurality of layers in order to reduce the occurrence of pinholes, and preferably has 2 to 5 layers from the viewpoint of reliability of insulation, rationalization of the manufacturing process, and heat conductivity (FIG. 2).
絶縁性の熱硬化性樹脂の絶縁性接着層２は、良熱伝導性
の無機粉体例えば、酸化ベリリウムやアルミナ、シリカ
、チツ化ホウ素、酸化マグネシウム等を単独もしくは複
合して含有せしめたエポキシ樹脂、イミド樹脂等の熱硬
化性樹脂を使用するか、絶縁性接着層２の補強を目的と
してガラス繊維布に含浸させ用いる場合もある。積層は
加圧、加熱プレスもしくは熱ロール等で行うが、この時
、第２図の金属板１と樹脂基板６との微少のすきまに接
着剤が流入し基板全体が一体化するのである。The insulating adhesive layer 2 made of an insulating thermosetting resin is made of an epoxy resin containing inorganic powder with good thermal conductivity, such as beryllium oxide, alumina, silica, boron titanide, magnesium oxide, etc., singly or in combination. In some cases, a thermosetting resin such as an imide resin is used, or a glass fiber cloth is impregnated for the purpose of reinforcing the insulating adhesive layer 2. Lamination is carried out using pressure, a heated press, a heated roll, etc. At this time, the adhesive flows into the minute gap between the metal plate 1 and the resin substrate 6 shown in FIG. 2, and the entire substrate is integrated.
積層され硬化した本発明の基板の金属箔３上に印刷法も
しくは写真法にて耐エツチングレジストを設け、エツチ
ングし耐エツチングレジストを除去し、所望の導電回路
を形成する。第３図は本発明の一路形成した基板断面図
を示す。該回路を形成した本発明の基板（第６図）は、
金属板１部周辺に樹脂基板６が配置するよう外形加工す
る（第４図）。第５図は第４図の平面図であり、破線に
囲まれた金属板１は、樹脂基板６により周囲を囲まれて
いる。樹脂基板６に配置された導体３は金属板１より隔
たりがあり、放電は全くない。また導体３の配置によっ
ては、第６図（蜀の平面図のごとく金属板１の側面の１
個所に樹脂基板６が接合されたもの、あるいは第６図（
Ｂ）の平面図であっても何んら差し支えない。これらの
接合は、接着剤により接着することができる。第７図は
本発明の応用例であり、端子４はクリップ形で樹脂基板
６に取付けられて安定固定した状態で導体３を挾み、・
・ンダシで一着することにより、外力を受けても端子４
は剥落することがない。An etching-resistant resist is provided on the laminated and hardened metal foil 3 of the substrate of the present invention by a printing method or a photographic method, and the etching-resistant resist is removed by etching to form a desired conductive circuit. FIG. 3 shows a cross-sectional view of a one-way formed substrate of the present invention. The substrate of the present invention (FIG. 6) on which the circuit is formed is as follows:
The outer shape is processed so that the resin substrate 6 is placed around a portion of the metal plate (FIG. 4). FIG. 5 is a plan view of FIG. 4, and the metal plate 1 surrounded by a broken line is surrounded by a resin substrate 6. The conductor 3 arranged on the resin substrate 6 is spaced apart from the metal plate 1, and there is no discharge at all. Also, depending on the arrangement of the conductor 3, one side of the metal plate 1 may be
The resin substrate 6 is bonded to the parts shown in Fig. 6 (
There is no problem even if it is a plan view of B). These connections can be bonded with adhesive. FIG. 7 shows an application example of the present invention, in which the terminal 4 is attached to the resin board 6 in a clip shape, and the conductor 3 is sandwiched between the terminals 3 and 3 in a stable fixed state.
・By attaching the wire to the terminal 4, even if external force is applied, the terminal 4
will not peel off.
以上述べたごとく、本発明の基板は熱伝導性が良い金属
基板のもつ秀れた性能とガラス繊維強化基板のもつ繁用
性を合わせもつ性能を有する。その１例として同じパタ
ーンに対する基板の大きさを小さく出来る利点をもつし
、また端子接合図である第７図の端子の強度はクリップ
端子により保たれ、従来のように補強の必要はなく、セ
ラミックス基板用のクリップ端子やクリップ端子装置装
置がそのまま利用できる効果がある。As described above, the substrate of the present invention has the excellent performance of a metal substrate with good thermal conductivity and the versatility of a glass fiber reinforced substrate. For example, it has the advantage of reducing the size of the board for the same pattern, and the strength of the terminal shown in Figure 7, which is a terminal connection diagram, is maintained by the clip terminal, so there is no need for reinforcement as in the conventional case, and ceramics are used. There is an advantage that the clip terminal for the board and the clip terminal device device can be used as is.
第１図、第２図、第３図、第４図及び第６図（Ａ）（Ｅ
）は本発明の１実施例を示す断面図、第５図は平面図、
第７図は本発明応用例図、第８図、第９図は従来技術例
の説明図である。
符号
１・・・金属板、２・・・絶縁性接着層、３・・・導体
、４・・・端子、５・・・端子補強樹脂、６・・・樹脂
基板、７・・・ハンダ、８・・・金属箔。Figures 1, 2, 3, 4 and 6 (A) (E
) is a sectional view showing one embodiment of the present invention, FIG. 5 is a plan view,
FIG. 7 is an illustration of an application example of the present invention, and FIGS. 8 and 9 are illustrations of prior art examples. Code 1: Metal plate, 2: Insulating adhesive layer, 3: Conductor, 4: Terminal, 5: Terminal reinforcing resin, 6: Resin board, 7: Solder, 8...Metal foil.
Claims (4)
け加工し、穴部と同一形状に加工した金属板を嵌合する
工程〔１〕と、該金属板を嵌合した樹脂基板の１主面上
に絶縁性の接着層を介して金属箔を接合する工程〔２〕
と、該樹脂基板の金属箔面上に印刷もしくは感光性レジ
ストの写真法により耐エッチングレジストを設け、エッ
チングすることにより所望の回路を形成する工程〔３］
と、前記樹脂基板を外形加工する工程〔４〕から成る混
成集積回路基板の製造方法。(1) Step [1] of drilling a glass fiber-reinforced heat-resistant resin substrate into a predetermined shape and fitting a metal plate processed into the same shape as the hole, and step 1 of the resin substrate fitted with the metal plate. Step of joining metal foil on the main surface via an insulating adhesive layer [2]
and a step of forming a desired circuit by providing an etching-resistant resist by printing or photosensitive resist photography on the metal foil surface of the resin substrate and etching it [3]
A method for manufacturing a hybrid integrated circuit board, comprising the steps of: (4) processing the outer shape of the resin board;
がプレス加工であることを特徴とする特許請求の範囲第
１項記載の混成集積回路基板の製造方法。(2) The method for manufacturing a hybrid integrated circuit board according to claim 1, wherein the metal plate is fitted into the hole portion of the glass fiber reinforced heat-resistant resin substrate by press working.
シ系樹脂組成物であることを特徴とする特許請求範囲第
１項記載の混成集積回路基板の製造方法。(3) The method for manufacturing a hybrid integrated circuit board according to claim 1, wherein the insulating adhesive layer is an epoxy resin composition containing an inorganic powder with good thermal conductivity.
であることを特徴とする、特許請求範囲第１項及び第３
項記載の混成集積回路基板の製造方法。(4) Claims 1 and 3, characterized in that the insulating adhesive layer is a glass fiber cloth impregnated with a thermosetting resin.
A method for manufacturing a hybrid integrated circuit board as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9565085A JPS61253887A (en) | 1985-05-07 | 1985-05-07 | Manufacture of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9565085A JPS61253887A (en) | 1985-05-07 | 1985-05-07 | Manufacture of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61253887A true JPS61253887A (en) | 1986-11-11 |
Family
ID=14143373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9565085A Pending JPS61253887A (en) | 1985-05-07 | 1985-05-07 | Manufacture of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61253887A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008374A1 (en) * | 1988-02-26 | 1989-09-08 | Fujitsu Limited | Substrate for mounting optical parts and electric circuitry parts and method of producing the same |
| JPH0795619B1 (en) * | 1988-02-26 | 1995-10-11 | Fujitsu Ltd |
-
1985
- 1985-05-07 JP JP9565085A patent/JPS61253887A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008374A1 (en) * | 1988-02-26 | 1989-09-08 | Fujitsu Limited | Substrate for mounting optical parts and electric circuitry parts and method of producing the same |
| JPH0795619B1 (en) * | 1988-02-26 | 1995-10-11 | Fujitsu Ltd |
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