CN114134468A - Machining process for preventing point discharge during vacuum sputtering - Google Patents

Machining process for preventing point discharge during vacuum sputtering Download PDF

Info

Publication number
CN114134468A
CN114134468A CN202111464803.9A CN202111464803A CN114134468A CN 114134468 A CN114134468 A CN 114134468A CN 202111464803 A CN202111464803 A CN 202111464803A CN 114134468 A CN114134468 A CN 114134468A
Authority
CN
China
Prior art keywords
vacuum sputtering
blade
sputtering equipment
vacuum
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111464803.9A
Other languages
Chinese (zh)
Inventor
颜玮
王斌
李晓星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haipo Chuzhou Material Technology Co ltd
Original Assignee
Haipo Chuzhou Material Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haipo Chuzhou Material Technology Co ltd filed Critical Haipo Chuzhou Material Technology Co ltd
Priority to CN202111464803.9A priority Critical patent/CN114134468A/en
Publication of CN114134468A publication Critical patent/CN114134468A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/028Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Abstract

The invention relates to the field of blade vacuum sputtering, in particular to a processing technology for preventing point discharge during vacuum sputtering, which comprises an insulating plate, blade surface treatment, vacuum sputtering equipment detection and blade vacuum sputtering processing, wherein the insulating plate comprises an adhesive plate, the top of the adhesive plate is provided with a rubber layer, the top of the rubber layer is provided with a polytetrafluoroethylene film, the top of the polytetrafluoroethylene film is provided with an acrylic adhesive, the top of the acrylic adhesive is provided with an anti-static treatment layer, the top of the anti-static treatment layer is provided with a polyethylene film, the top of the polyethylene film is provided with a PET (polyethylene terephthalate) isolating film, and the blade vacuum sputtering comprises the following steps: s1, placing; s2, starting a vacuum pump; and S3, starting the vacuum sputtering equipment. The invention has the advantages of preventing the point discharge when the blade is sputtered in vacuum, not only improving the quality of the blade in vacuum sputtering, improving the safety of the blade during vacuum sputtering processing, but also avoiding the point discharge when the burr phenomenon occurs on the blade in vacuum sputtering.

Description

Machining process for preventing point discharge during vacuum sputtering
Technical Field
The invention relates to the field of vacuum sputtering of blades, in particular to a machining process for preventing point discharge during vacuum sputtering.
Background
Vacuum sputtering mainly uses glow discharge to make argon ions impact on the target material surface. Mainly uses glow discharge to make argon ions impact the surface of the target material, and the atoms of the target material are ejected and accumulated on the surface of the substrate to form a film. The properties and uniformity of the sputtered film are better than those of the evaporated film, but the coating speed is much slower than that of the evaporated film. The novel sputtering equipment almost uses a powerful magnet to enable electrons to move spirally so as to accelerate argon ionization around a target material, so that the collision probability between the target and argon ions is increased, and the sputtering speed is improved. Generally, direct current sputtering is adopted for metal coating, RF alternating current sputtering is adopted for non-conductive ceramic materials, the basic principle is that argon ions are impacted on the surface of a target by glow discharge in vacuum, positive ions in the plasma are accelerated to impact the surface of a negative electrode serving as a sputtered material, and the impact enables substances of the target to fly out to be deposited on a substrate to form a thin film.
Chinese patent No. CN105132872B provides an improved vacuum sputtering surface treatment method, which comprises the following steps: (1) pre-treating the surface of a workpiece to be treated; (2) spraying UV medium paint and ultraviolet curing or medium powder (medium paint) thermal curing; (3) and performing vacuum sputtering chromium plating to obtain a chromium-plated workpiece. The invention provides an improved vacuum sputtering surface treatment method with low reject ratio, low cost and good environmental protection, which does not need to spray varnish for protection.
The existing vacuum sputtering machining process is easy to generate the point discharge phenomenon during the vacuum sputtering of the blade, so that the quality of the blade during the vacuum sputtering is reduced, the safety during the vacuum sputtering machining is influenced, the point discharge phenomenon is easy to generate during the vacuum sputtering when the burr phenomenon occurs on the blade, and the defect is overcome, so that the machining process for preventing the point discharge during the vacuum sputtering is urgently needed to be developed.
Disclosure of Invention
The invention aims to provide a processing technology for preventing the generation of point discharge during vacuum sputtering, which aims to solve the problems that the quality of a blade during vacuum sputtering is reduced and the safety during vacuum sputtering is influenced because the point discharge phenomenon is easy to occur during the vacuum sputtering of the blade, which is proposed in the background technology.
The technical scheme of the invention is as follows: the utility model provides a processing technology who prevents point discharge production during vacuum sputtering, includes that insulation board, blade surface treatment, vacuum sputtering equipment detect and blade vacuum sputtering processing, the insulation board is including pasting the board, the top of pasting the board is provided with the rubber layer, the top on rubber layer is provided with the polytetrafluoroethylene membrane, the top of polytetrafluoroethylene membrane is provided with the acrylic acid adhesive, the top of acrylic acid adhesive is provided with prevents the static processing layer, the top of preventing the static processing layer is provided with the polyethylene film, the top of polyethylene film is provided with the PET barrier film.
Further, the blade vacuum sputtering comprises the following steps:
s1, placing: opening a vacuum sputtering equipment door, placing the blade with the surface treated in the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, and then closing the vacuum sputtering equipment door;
s2, starting a vacuum pump: starting a vacuum pump, pumping out air in the vacuum sputtering equipment, and reducing the pressure intensity in the vacuum sputtering equipment;
s3, starting the vacuum sputtering equipment: when the pressure reaches the designated pressure, starting vacuum sputtering equipment, and carrying out vacuum sputtering processing on the blade by the vacuum sputtering equipment;
s4, pressure relief: after the blade is subjected to vacuum sputtering processing, opening a valve on the vacuum sputtering equipment, and introducing air into the vacuum sputtering equipment;
s5, taking out: when the air pressure in the vacuum sputtering equipment is consistent with the outside, the door of the vacuum sputtering equipment is opened, the included angle for clamping the blade is loosened, and the blade is taken out.
Further, the blade surface treatment comprises the following steps:
A1. polishing: placing the blade on a grinding machine, and starting the grinding machine to grind two surfaces of the blade;
A2. cleaning: polishing the blade, placing the blade into a cleaning machine for cleaning, and then taking out the blade;
A3. drying: placing the cleaned blade into a drying box, starting the drying box, and drying the moisture on the surface of the blade by the drying box;
A4. and (3) cooling: and taking the dried blade out of the drying box, and then taking the blade out for cooling.
Further, the detection of the vacuum sputtering equipment comprises the following steps:
B1. cleaning: opening a door of the vacuum sputtering equipment, and cleaning the interior of the vacuum sputtering equipment through a dust collector;
B2. and (3) detection: then closing the door of the vacuum sputtering equipment, starting a vacuum pump of the vacuum sputtering equipment, and detecting the sealing effect of the vacuum sputtering equipment;
B3. pasting: and opening the door of the vacuum sputtering equipment after the vacuum sputtering equipment is detected to be qualified, and flatly adhering the insulating plate on the inner wall of the vacuum sputtering equipment.
Further, in the step S2, the vacuum pump reduces the internal pressure of the vacuum sputtering device to-6 to-8 Pa, and keeps the vacuum sputtering of the blade to be finished.
Further, in the step A1, a double-end-face polishing device is adopted as a polishing machine, the double-end-face polishing device simultaneously polishes two faces of the blade, in the step A2, water temperature of 40-45 ℃ is adopted in a cleaning machine, and cleaning time is 2-3 min.
Further, in the A3, the temperature set in the drying box is 100-120 ℃, and the drying time is 3-4 min.
Further, in the A4, the temperature of the blade cooling space is 25-30 ℃, and the temperature of the blade body is reduced to a specified position.
Further, in B2, the vacuum pump reduces the pressure in the vacuum sputtering equipment to-10 to-11 Pa, and the pressure is kept for 5-6 min.
Further, in the B3, the insulating plate is formed of one or more films selected from a polyethylene film, a polyvinylidene fluoride film, a polyimide film and a polytetrafluoroethylene film, and the thickness of the insulating plate is set to 2 to 2.5 mm.
The invention provides a processing technology for preventing point discharge from generating in vacuum sputtering through improvement, compared with the prior art, the processing technology has the following improvements and advantages:
(1) the insulating plate is adhered to the inner wall of the vacuum sputtering equipment, and the insulating plate can prevent the inner wall of the vacuum sputtering equipment from generating point discharge when the blade is subjected to vacuum sputtering, so that the point discharge can be prevented when the blade is subjected to vacuum sputtering, the quality of the blade in vacuum sputtering is improved, and the safety of the blade during vacuum sputtering is improved.
(2) The blade surface treatment process is adopted, the blade is polished and cleaned before vacuum sputtering machining, the surface cleanliness of the blade is improved, the quality and the qualification rate of the blade during the subsequent vacuum sputtering machining can be improved, the phenomenon that the blade is speckled on the surface after the vacuum sputtering machining is avoided, and meanwhile, the phenomenon that the blade is burred on the blade and the point discharge occurs during the vacuum sputtering machining can be avoided.
(3) The vacuum sputtering equipment is detected, the inside of the vacuum sputtering equipment is cleaned through the detection process of the vacuum sputtering equipment, the cleanliness of the vacuum sputtering equipment can be guaranteed, the quality of the blade during vacuum sputtering is improved, the occurrence of faults during the vacuum sputtering of the blade can be reduced through the detection of the vacuum sputtering equipment, and the yield of the blade during the vacuum sputtering is improved.
Drawings
The invention is further explained below with reference to the figures and examples:
FIG. 1 is a view of the structure of an insulating plate of the present invention;
FIG. 2 is a flow chart of the vacuum sputtering process for a blade of the present invention;
FIG. 3 is a flow chart of the blade surface treatment of the present invention;
FIG. 4 is a flow chart of the vacuum sputtering apparatus of the present invention.
Description of reference numerals:
1 insulating board, 2 sticking board, 3 rubber layer, 4 polytetrafluoroethylene film, 5 acrylic acid adhesive, 6 antistatic treatment layer, 7 polyethylene film, 8 PET barrier film.
Detailed Description
The present invention will be described in detail with reference to fig. 1 to 3, and the technical solutions in the embodiments of the present invention will be clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a processing technology for preventing point discharge during vacuum sputtering by improving, as shown in figures 1-3, comprising an insulating plate 1, blade surface treatment, vacuum sputtering equipment detection and blade vacuum sputtering processing, wherein the insulating plate 1 comprises an adhesive plate 2, the insulating plate 1 is adhered on the inner wall of the vacuum sputtering equipment, the insulating plate 1 can prevent the point discharge phenomenon on the inner wall of the vacuum sputtering equipment when the blade is subjected to vacuum sputtering, therefore, the point discharge can be prevented during the blade vacuum sputtering, the quality of the blade in vacuum sputtering is improved, the safety of the blade during the vacuum sputtering processing is improved, the top of the adhesive plate 2 is provided with a rubber layer 3, the top of the rubber layer 3 is provided with a polytetrafluoroethylene film 4, the top of the polytetrafluoroethylene film 4 is provided with an acrylic adhesive 5, the top of the acrylic adhesive 5 is provided with an anti-static treatment layer 6, the top of the antistatic treatment layer 6 is provided with a polyethylene film 7, and the top of the polyethylene film 7 is provided with a PET barrier film 8.
Further, the blade vacuum sputtering comprises the following steps:
s1, placing: opening a vacuum sputtering equipment door, placing the blade with the surface treated in the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, and then closing the vacuum sputtering equipment door;
s2, starting a vacuum pump: starting a vacuum pump, pumping out air in the vacuum sputtering equipment, reducing the pressure in the vacuum sputtering equipment, reducing the internal pressure of the vacuum sputtering equipment to-8 Pa by the vacuum pump, and keeping the vacuum sputtering of the blade to be finished all the time;
s3, starting the vacuum sputtering equipment: when the pressure reaches the designated pressure, starting vacuum sputtering equipment, and carrying out vacuum sputtering processing on the blade by the vacuum sputtering equipment;
s4, pressure relief: after the blade is subjected to vacuum sputtering processing, opening a valve on the vacuum sputtering equipment, and introducing air into the vacuum sputtering equipment;
s5, taking out: when the air pressure in the vacuum sputtering equipment is consistent with the outside, the door of the vacuum sputtering equipment is opened, the included angle for clamping the blade is loosened, and the blade is taken out.
Further, the blade surface treatment comprises the following steps:
A1. polishing: placing the blade on a grinding machine, starting the grinding machine to grind two surfaces of the blade, wherein the grinding machine adopts double-end-surface grinding equipment, and the double-end-surface grinding equipment simultaneously grinds two surfaces of the blade;
A2. cleaning: polishing the blade, placing the blade into a cleaning machine for cleaning, wherein the water temperature is 45 ℃ and the cleaning time is 3min, and then taking out the blade;
A3. drying: placing the cleaned blade into a drying box, starting the drying box, wherein the temperature in the drying box is 120 ℃, the drying time is 4min, and the drying box dries the moisture on the surface of the blade;
A4. and (3) cooling: and taking the dried blade out of the drying box, taking the blade out for cooling, wherein the temperature of the blade cooling space is 30 ℃, and reducing the temperature of the blade body to a specified position.
Further, the detection of the vacuum sputtering equipment comprises the following steps:
B1. cleaning: opening a door of the vacuum sputtering equipment, and cleaning the interior of the vacuum sputtering equipment through a dust collector;
B2. and (3) detection: then closing the door of the vacuum sputtering equipment, starting a vacuum pump of the vacuum sputtering equipment, reducing the pressure in the vacuum sputtering equipment to-11 Pa by the vacuum pump, keeping the pressure for 6min, and detecting the sealing effect of the vacuum sputtering equipment;
B3. pasting: and after the vacuum sputtering equipment is detected to be qualified, opening a door of the vacuum sputtering equipment, and flatly adhering the insulating plate 1 to the inner wall of the vacuum sputtering equipment.
Further, in S2, the vacuum pump reduces the internal pressure of the vacuum sputtering apparatus to-8 Pa and keeps the blade vacuum sputtering to end.
Further, in A1, the polisher adopts double-end-face polishing equipment, the double-end-face polishing equipment simultaneously polishes two faces of the blade, in A2, the cleaning machine adopts water temperature of 45 ℃, and the cleaning time is 3 min.
Further, in A3, the temperature set in the drying oven was 120 ℃ and the drying time was 4 min.
Further, in a4, the temperature of the insert cooling space was 30 ℃, and the insert body temperature was lowered to the specified position.
Further, in B2, the vacuum pump reduced the pressure in the vacuum sputtering apparatus to-11 Pa, and the pressure was maintained for 6 min.
Further, in B3, the insulating plate 1 used one or more films of a polyethylene film, a polyvinylidene fluoride film, a polyimide film and a polytetrafluoroethylene film, and the insulating plate 1 was set to a thickness of 2.5 mm.
The working principle is as follows: placing a blade on a grinding machine, starting the grinding machine to grind two surfaces of the blade, wherein the grinding machine adopts double-end-surface grinding equipment, the double-end-surface grinding equipment simultaneously grinds two surfaces of the blade, the blade after grinding is placed in a cleaning machine to be cleaned, the cleaning machine adopts water temperature of 40-45 ℃ and the cleaning time is 2-3min, then taking out the blade, placing the cleaned blade in a drying box, starting the drying box, the temperature in the drying box is 100-120 ℃, the drying time is 3-4min, the drying box dries the moisture on the surface of the blade, the dried blade is taken out of the drying box, then taking out the blade to be cooled, the temperature of a blade cooling space is 25-30 ℃, the temperature of a blade body is reduced to a designated position, opening a vacuum sputtering equipment door, and cleaning the interior of the vacuum sputtering equipment through a dust collector, then closing the door of the vacuum sputtering equipment, starting a vacuum pump of the vacuum sputtering equipment, reducing the pressure in the vacuum sputtering equipment to-10 to-11 Pa by the vacuum pump, keeping the pressure for 5-6min, detecting the sealing effect of the vacuum sputtering equipment, opening the door of the vacuum sputtering equipment after the vacuum sputtering equipment is detected to be qualified, flatly adhering the insulating plate 1 on the inner wall of the vacuum sputtering equipment, opening the door of the vacuum sputtering equipment, placing the blade with the processed surface in the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, then closing the door of the vacuum sputtering equipment, starting the vacuum pump, pumping out the air in the vacuum sputtering equipment, reducing the pressure in the vacuum sputtering equipment to-6 to-8 Pa by the vacuum pump, and keeping the vacuum sputtering of the blade to be finished all the time, starting the vacuum sputtering equipment when the specified pressure is reached, carrying out vacuum sputtering processing on the blade by the vacuum sputtering equipment, opening a valve on the vacuum sputtering equipment after the vacuum sputtering processing of the blade is finished, introducing air into the vacuum sputtering equipment, opening the door of the vacuum sputtering equipment when the air pressure in the vacuum sputtering equipment is consistent with the outside, loosening an included angle for clamping the blade, and taking out the blade.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A processing technology for preventing point discharge during vacuum sputtering is characterized in that: including insulation board (1), blade surface treatment, vacuum sputtering equipment detection and blade vacuum sputtering processing, insulation board (1) is including pasting board (2), the top of pasting board (2) is provided with rubber layer (3), the top on rubber layer (3) is provided with polytetrafluoroethylene membrane (4), the top of polytetrafluoroethylene membrane (4) is provided with acrylic acid adhesive (5), the top of acrylic acid adhesive (5) is provided with prevents static processing layer (6), the top of preventing static processing layer (6) is provided with polyethylene film (7), the top of polyethylene film (7) is provided with PET barrier film (8).
2. The process of claim 1, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: the blade vacuum sputtering comprises the following steps:
s1, placing: opening a door of the vacuum sputtering equipment, adhering an insulating plate (1) to check whether the insulating plate completely covers the inner wall of the vacuum sputtering equipment, placing the blade with the processed surface into the vacuum sputtering equipment, clamping and fixing the blade through an included angle in the vacuum sputtering equipment, and then closing the door of the vacuum sputtering equipment;
s2, starting a vacuum pump: starting a vacuum pump, pumping out air in the vacuum sputtering equipment, and reducing the pressure intensity in the vacuum sputtering equipment;
s3, starting the vacuum sputtering equipment: when the pressure reaches the designated pressure, starting vacuum sputtering equipment, and carrying out vacuum sputtering processing on the blade by the vacuum sputtering equipment;
s4, pressure relief: after the blade is subjected to vacuum sputtering processing, opening a valve on the vacuum sputtering equipment, and introducing air into the vacuum sputtering equipment;
s5, taking out: when the air pressure in the vacuum sputtering equipment is consistent with the outside, the door of the vacuum sputtering equipment is opened, the included angle for clamping the blade is loosened, and the blade is taken out.
3. The process of claim 1, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: the blade surface treatment comprises the following steps:
A1. polishing: placing the blade on a grinding machine, and starting the grinding machine to grind two surfaces of the blade;
A2. cleaning: polishing the blade, placing the blade into a cleaning machine for cleaning, and then taking out the blade;
A3. drying: placing the cleaned blade into a drying box, starting the drying box, and drying the moisture on the surface of the blade by the drying box;
A4. and (3) cooling: and taking the dried blade out of the drying box, and then taking the blade out for cooling.
4. The process of claim 1, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: the detection of the vacuum sputtering equipment comprises the following steps:
B1. cleaning: opening a door of the vacuum sputtering equipment, and cleaning the interior of the vacuum sputtering equipment through a dust collector;
B2. and (3) detection: then closing the door of the vacuum sputtering equipment, starting a vacuum pump of the vacuum sputtering equipment, and detecting the sealing effect of the vacuum sputtering equipment;
B3. pasting: after the vacuum sputtering equipment is detected to be qualified, the door of the vacuum sputtering equipment is opened, and the insulating plate (1) is flatly adhered to the inner wall of the vacuum sputtering equipment.
5. The process of claim 3, wherein the step of preventing the occurrence of the point discharge during the sputtering step comprises: in the step S2, the vacuum pump reduces the internal pressure of the vacuum sputtering device to-6 to-8 Pa, and the vacuum sputtering of the blade is kept to be finished.
6. The process of claim 3, wherein the step of preventing the occurrence of the point discharge during the sputtering step comprises: in the step A1, a double-end-face polishing device is adopted as the polishing machine, the double-end-face polishing device simultaneously polishes two faces of the blade, in the step A2, the water temperature is 40-45 ℃, and the cleaning time is 2-3 min.
7. The process of claim 3, wherein the step of preventing the occurrence of the point discharge during the sputtering step comprises: in the A3, the temperature set in the drying box is 100-120 ℃, and the drying time is 3-4 min.
8. The process of claim 3, wherein the step of preventing the occurrence of the point discharge during the sputtering step comprises: in the step A4, the temperature of the blade cooling space is 25-30 ℃, and the temperature of the blade body is reduced to a specified position.
9. The process of claim 4, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: in the B2, the vacuum pump reduces the pressure in the vacuum sputtering equipment to-10 to-11 Pa, and the pressure is kept for 5-6 min.
10. The process of claim 4, wherein the step of preventing the occurrence of the point discharge during the vacuum sputtering comprises: in the B3, the insulating plate (1) adopts one or more layers of polyethylene film, polyvinylidene fluoride film, polyimide film and polytetrafluoroethylene film, and the thickness of the insulating plate (1) is set to be 2-2.5 mm.
CN202111464803.9A 2021-12-03 2021-12-03 Machining process for preventing point discharge during vacuum sputtering Pending CN114134468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111464803.9A CN114134468A (en) 2021-12-03 2021-12-03 Machining process for preventing point discharge during vacuum sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111464803.9A CN114134468A (en) 2021-12-03 2021-12-03 Machining process for preventing point discharge during vacuum sputtering

Publications (1)

Publication Number Publication Date
CN114134468A true CN114134468A (en) 2022-03-04

Family

ID=80387397

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111464803.9A Pending CN114134468A (en) 2021-12-03 2021-12-03 Machining process for preventing point discharge during vacuum sputtering

Country Status (1)

Country Link
CN (1) CN114134468A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179455A (en) * 2004-11-25 2006-07-06 Honda Motor Co Ltd Fuel cell stack
KR20060113579A (en) * 2006-09-14 2006-11-02 한국진공주식회사 Automatic coating system of automotive lamps reflector coating and protective layer
CN201009496Y (en) * 2006-05-27 2008-01-23 大连理工大学 Complex adaptation pad
US20100078313A1 (en) * 2008-09-30 2010-04-01 Canon Anelva Corporation Sputtering apparatus and method of thin film formation
US20100129635A1 (en) * 2007-05-14 2010-05-27 Dow Global Technologies Inc. Faced insulation and method of making same
CN105132872A (en) * 2015-08-24 2015-12-09 上海斯典化工有限公司 Improved vacuum sputtering surface processing method
CN211744870U (en) * 2019-12-26 2020-10-23 东莞市凯尔得利塑胶有限公司 Anticreep PCBA insulation board
CN112575298A (en) * 2020-12-04 2021-03-30 海珀(滁州)材料科技有限公司 Machining process for preventing point discharge during vacuum sputtering
CN214111847U (en) * 2020-10-12 2021-09-03 上海鑫福润达绝缘材料有限公司 Insulating plate with good impact resistance effect

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006179455A (en) * 2004-11-25 2006-07-06 Honda Motor Co Ltd Fuel cell stack
CN201009496Y (en) * 2006-05-27 2008-01-23 大连理工大学 Complex adaptation pad
KR20060113579A (en) * 2006-09-14 2006-11-02 한국진공주식회사 Automatic coating system of automotive lamps reflector coating and protective layer
US20100129635A1 (en) * 2007-05-14 2010-05-27 Dow Global Technologies Inc. Faced insulation and method of making same
US20100078313A1 (en) * 2008-09-30 2010-04-01 Canon Anelva Corporation Sputtering apparatus and method of thin film formation
CN105132872A (en) * 2015-08-24 2015-12-09 上海斯典化工有限公司 Improved vacuum sputtering surface processing method
CN211744870U (en) * 2019-12-26 2020-10-23 东莞市凯尔得利塑胶有限公司 Anticreep PCBA insulation board
CN214111847U (en) * 2020-10-12 2021-09-03 上海鑫福润达绝缘材料有限公司 Insulating plate with good impact resistance effect
CN112575298A (en) * 2020-12-04 2021-03-30 海珀(滁州)材料科技有限公司 Machining process for preventing point discharge during vacuum sputtering

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
曹国富等: "高频直缝焊管理论与实践", 冶金工业出版社, pages: 90 - 93 *

Similar Documents

Publication Publication Date Title
CN105453241A (en) Anodization architecture for electro-plate adhesion
JP3030287B1 (en) Method for cleaning film forming apparatus, method for cleaning sputtering target, and cleaning apparatus used for these
CN103481199A (en) Target material processing method
CN101492808A (en) Surface treatment process for square TiW target material for sputtering
CN210065893U (en) Self-cleaning etching anode device
CN106269648A (en) A kind of ceramic layer minimizing technology of thermal barrier coating
US20230365769A1 (en) Resin surface hydrophilization method, plasma processing device, laminate body, and laminate body manufacturing methodresin surface hydrophilization method, plasma processing device, laminate body, an laminate body manufacturing method
CN106683998A (en) Flexible substrate pretreatment process
JP4440541B2 (en) Method for regenerating plasma processing apparatus, plasma processing apparatus, and method for regenerating member inside plasma processing container
CN112575298A (en) Machining process for preventing point discharge during vacuum sputtering
CN111850482A (en) Vacuum plating PVD coating process
CN114717513A (en) Electric arc spraying method of stainless steel component suitable for physical vapor deposition process
CN114134468A (en) Machining process for preventing point discharge during vacuum sputtering
CN107245692A (en) A kind of cemented carbide substrate surfaces preprocess method of PVD coatings
CN111411328B (en) Surface coating method for metal plate
US20200347490A1 (en) Metal surface protective layer and preparation method thereof
WO2015025823A1 (en) Sputtering film formation device and sputtering film formation method
EP3453533A1 (en) Vacuum dry plate cleaning and laminating machine
CN102330057B (en) Method for preparing metal ruthenium film for hard semiconductor component
CN109825806B (en) PET (polyethylene terephthalate) non-conductive film and preparation method thereof
CN215887210U (en) Magnetron sputtering coating machine convenient to operation
KR101192321B1 (en) Dlc coating method and device thereof
CN114188210A (en) Surface treatment method for deposition surface in etching cavity of metal etching machine
CN202705450U (en) Electrostatic elimination device for coating
US5951372A (en) Method of roughing a metallic surface of a semiconductor deposition tool

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination