CN113939149A - Heat dissipation membrane and heat dissipation adhesive film for portable terminal - Google Patents
Heat dissipation membrane and heat dissipation adhesive film for portable terminal Download PDFInfo
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- CN113939149A CN113939149A CN202111074771.1A CN202111074771A CN113939149A CN 113939149 A CN113939149 A CN 113939149A CN 202111074771 A CN202111074771 A CN 202111074771A CN 113939149 A CN113939149 A CN 113939149A
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- copper
- graphene
- heat dissipation
- film
- graphene composite
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
Abstract
A heat dissipation membrane and a heat dissipation adhesive film for a portable terminal relate to the technical field of heat dissipation of electronic equipment, wherein the heat dissipation membrane is a copper graphene composite membrane, the copper graphene composite membrane is a mesh copper net with a graphene solution coated on the surface, and the heat dissipation adhesive film comprises a graphene resin layer, a copper graphene composite membrane and a heat conduction adhesive layer which are sequentially compounded.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation membrane and a heat dissipation adhesive film for a portable terminal.
Background
The development of technology is more and more advanced, and the trend of electronic devices is more and more light and thin, and the trend of internal electronic components is more and more sophisticated, so that the difficulty of heat dissipation of the internal components is increased, and the electrical characteristics among the components must be considered to avoid short circuit, especially the problem of heat generation is related to the life of the product and the amount of energy required for the performance of the product. In view of the above, a better heat dissipation mechanism is needed to solve the high heat problem of the electronic products with small size and light weight.
In general, a portable terminal such as a smartphone includes a cooling member for cooling a semiconductor chip. As is well known, a Baper Chamber (VC), which is a cooling member of a portable terminal, is a heat pipe that is filled with a refrigerant gas to dissipate heat of a semiconductor chip. However, the disadvantage of the Baper Chamber is that it is very expensive and the refrigerant gas is not permanent. In order to solve this problem, a heat dissipation technology using multilayer artificial graphite has been applied to the latest portable terminals.
Since the laminated artificial graphite is subject to dust (powder) falling from the side, both sides of the laminated artificial graphite must be adhered with double-sided tape. Further, the thermal insulation efficiency is improved as the thickness of the artificial graphite layer is increased, but the volume is increased, and the side surface needs to be wrapped with a double-sided tape (to form a pocket), which complicates the processing.
In order to solve the technical problem of the artificial graphite laminate, a technique of coating a resin on pure graphene, which is attached to the surface of an object by using a curable resin as a binder, has been recently applied. However, although pure graphene has very good heat conductivity, all resin materials are low heat conductivity materials, but when resin is mixed with pure graphene, the overall heat conductivity is rapidly reduced, which is not comparable to a pure graphene heat dissipation coating or a traditional metal material heat dissipation mode. For the heat dissipation of the semiconductor chip of the portable terminal, the current technology mostly adopts the use mode of pure graphene doped resin, so that there is a need for improvement.
However, since the coating uses the cured resin as the adhesive to attach the graphene to the surface of the object or the fin, and all resin materials are low thermal conductivity materials, the thermal conductivity of the graphene heat dissipation coating is affected by the resin and cannot be compared with metal.
Disclosure of Invention
In view of the disadvantages of the prior art, an object of the present invention is to provide a heat dissipation film for a portable terminal, which comprises the following specific steps:
the utility model provides a portable terminal is with heat dissipation diaphragm, heat dissipation diaphragm sets up to copper graphite alkene complex film, copper graphite alkene complex film sets up to cover the netted copper mesh that is equipped with graphite alkene solution for the surface.
Further, the graphene solution is dried on the mesh copper net in a spraying mode.
Further, the preparation method of the copper graphene composite film comprises the following steps:
s210: preparing copper to form a mesh copper net;
s220: and filling the holes of the reticular copper net with a graphene solution, and coating the reticular copper net with the graphene solution until the reticular copper net is dried.
Further, in step S210, the diameter of the copper wire in the mesh copper net is 10um-100um, and the transverse spacing and the longitudinal spacing of the mesh copper net are both 10um-300 um.
Further, copper line diameter further sets up to 30um-40um, horizontal interval, longitudinal separation distance further set up to 100 um.
Further, after the preparation of the copper graphene composite membrane is finished, pressurization treatment is carried out on the copper graphene composite membrane in a high-temperature press.
Another objective of the present invention is to provide a heat dissipation film for a portable terminal, which has the following specific scheme:
a heat dissipation adhesive film comprises the copper graphene composite film, a graphene resin layer and a heat conduction adhesive layer, wherein the graphene resin layer, the copper graphene composite film and the heat conduction adhesive layer are formed by compounding in sequence, the graphene resin layer is located on the upper surface of the copper graphene composite film, and the heat conduction adhesive layer is located on the lower surface of the copper graphene composite film.
Further, the graphene resin layer is formed by mixing graphene and synthetic resin, and the synthetic resin is polyester resin or polyurethane resin.
Furthermore, a release film layer is attached to one side, far away from the copper graphene composite film, of the thermal conductivity bonding layer.
Further, the preparation method of the heat dissipation adhesive film comprises the following steps:
s230: forming a graphene resin layer on the upper surface of the copper graphene composite film;
s240: a thermally conductive adhesive layer is formed on the upper surface of the copper graphene composite film.
Compared with the prior art, the invention has the following beneficial effects:
according to the heat dissipation membrane, under the condition that graphene does not need to be coated with resin, the heat dissipation membrane is directly made of the net-shaped copper mesh with good heat conductivity and pure graphene, the net-shaped copper mesh with high heat conductivity is arranged, on the premise that the curing performance and the adhesion performance of the heat dissipation membrane are guaranteed, the net-shaped copper mesh and the graphene are in synergistic effect, the heat conductivity of the heat dissipation membrane is greatly improved, in addition, due to the problem of dust, the traditional artificial graphite lamination is produced in a pocket mode through adhesive tapes on the top, the bottom and the side faces, the heat dissipation membrane can be used without being processed, the manufacturing mode is relatively easy, and the material cost is lower than that of the artificial graphite lamination.
Drawings
Fig. 1 is a diagram illustrating a layer composition of a heat dissipation film according to an embodiment of the present invention.
Fig. 2 is a process flow diagram of a method for manufacturing a heat dissipation film according to the present invention.
Fig. 3 is a conceptual diagram of main steps in the method for manufacturing a heat dissipation adhesive film according to the present invention.
Reference numerals: 100. a heat-dissipating adhesive film; 110. a copper graphene composite film; 111. a mesh copper mesh; 111a, holes; 112. a graphene solution; 120. a graphene resin layer; 130. a thermally conductive adhesive layer; f1, a release film layer; pr, high temperature press.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the present invention is not limited to these examples.
Referring to fig. 1 to 3, a heat dissipation film of the present invention is a heat dissipation film for a semiconductor chip of a portable terminal.
The heat dissipation membrane is set as a copper graphene composite film 110, and the copper graphene composite film 110 is set as a mesh copper mesh 111 with a graphene solution 112 coated on the surface.
In an embodiment of the present invention, the copper graphene composite film 110 is characterized in that a graphene solution 112 is sprayed on the mesh-shaped copper mesh 111 by spraying and dried. A method for manufacturing the copper graphene composite film 110 according to an embodiment of the present invention having the above-described configuration will be described below.
The preparation method of the copper graphene composite film 110 is as follows:
s210: preparing copper to form a mesh copper net 111;
s220: the holes 111a of the mesh-shaped copper mesh 111 are filled with the graphene solution 112, and the graphene solution 112 is coated on the mesh-shaped copper mesh 111 until being dried.
First, a mesh-like copper mesh 111 in a mesh form is formed using copper [ fig. 3 (a) ]. The mesh-like structure can be formed, for example, by weaving. In step S210, the diameter of the copper wires in the mesh-shaped copper mesh 111 is 10um to 100um, and the practical application is about 30um to 40um, which is advantageous in terms of thermal conductivity and manufacturing process, and the lateral spacing and the longitudinal spacing of the mesh-shaped copper mesh 111 are both 10um to 300um, and when graphene is precipitated between the meshes, the thermal conductivity and the manufacturing method are considered, and the diameter is generally about 100 um.
Thereafter, while filling the pores 111a of the mesh-shaped copper mesh 111 with the graphene solution 112, the surface of the mesh-shaped copper mesh 111 is coated with the graphene solution 112 to form the copper graphene composite film 110 ((b) of fig. 3).
Denoted by reference numeral 112 in fig. 3(b) is a graphene solution 112 filled in the pores 111a of the mesh copper net 111 and coated on the mesh copper net 111.
Since an air layer cannot be provided for good heat conduction, it is necessary to increase the density of the graphene solution 112 on the mesh-like copper mesh 111 in order to eliminate the air layer. In step S220, it is preferable that the number of times of repeating the spraying and drying may be set to be multiple times, so as to improve uniformity of the sprayed graphene solution 112, thereby ensuring uniformity of heat dissipation of the copper graphene composite film 110.
Preferably, after steps S210 and S220 are completed, the preparation of the copper graphene composite film 110 is completed, and the copper graphene composite film 110 is subjected to pressurization treatment in a high-temperature press Pr, which is made of high-temperature pressing sheet (Pr) in this embodiment.
For the heat dissipation film, the invention further provides a heat dissipation adhesive film, which includes the copper graphene composite film 110, a graphene resin layer 120, and a thermal conductive adhesive layer 130, where the graphene resin layer 120, the copper graphene composite film 110, and the thermal conductive adhesive layer 130 are sequentially formed by compounding, the graphene resin layer 120 is located on the upper surface of the copper graphene composite film 110, and the thermal conductive adhesive layer 130 is located on the lower surface of the copper graphene composite film 110. The following is a description of a method for manufacturing a heat dissipation film in an embodiment of the present invention having the above-described configuration.
The method of preparing the heat dissipation adhesive film 100 is as follows:
s230: forming a graphene resin layer 120 on the upper surface of the copper graphene composite film 110;
s240: a thermally conductive adhesive layer 130 is formed on the upper surface of the copper graphene composite film 110.
The graphene resin layer 120 is formed by mixing graphene and synthetic resin, and the synthetic resin is polyester resin or polyurethane resin. The graphene resin layer 120 is formed on the upper surface of the graphene resin layer 120 after the copper graphene composite film 110 is subjected to a pressure treatment by the high-temperature press Pr.
So set up for the copper graphite alkene complex film 110 that makes through step S230 has the advantage that prevents that graphite alkene powder (dust) from dropping from copper graphite alkene complex film 110, and thereby has the advantage that improves the radiating efficiency through the heat-conduction on the graphite alkene horizontal direction. After that, the copper graphene composite film 110 prepared through the step S240 may have an advantage of being firmly attached through the thermally conductive adhesive layer 130.
As described above, the copper graphene composite film 110 enables heat of a heat source to move vertically, and the graphene resin layer 120 enables horizontal heat conduction (horizontal heat conduction) of heat, so that a heat diffusion effect is large and a heat conductivity is good. In addition, since the pure graphene is coated on the mesh-shaped copper mesh 111 with high thermal conductivity (the thermal conductivity of copper is high, 350-.
Preferably, a release film layer F1 is attached to a side of the thermal conductive adhesive layer 130 away from the copper graphene composite film 110, and the release film layer F1 can provide temporary adhesive failure to the thermal conductive adhesive layer 130, and when the thermal conductive adhesive layer is required to be used, the release film layer F1 is torn.
Specifically, the thermally conductive adhesive layer 130 is bonded to the surface of the copper graphene composite film 110, and then the release film layer F1 is bonded to the copper graphene composite film 110.
Alternatively, the thermally conductive adhesive layer 130 may be formed by coating on the copper graphene composite film 110, and the thermally conductive adhesive layer 130 may be formed by coating an adhesive and drying the graphene solution 112.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (10)
1. The utility model provides a portable terminal is with heat dissipation diaphragm which characterized in that, heat dissipation diaphragm sets up to copper graphite alkene complex film (110), copper graphite alkene complex film (110) set up to the surface and cover netted copper net (111) that are equipped with graphite alkene solution (112).
2. The heat dissipation film for a portable terminal according to claim 1, wherein the graphene solution (112) is dried on the mesh copper net (111) by spraying.
3. The heat dissipation film for a portable terminal according to claim 2, wherein the copper graphene composite film (110) is prepared by the following method:
s210: preparing copper to form a mesh copper net (111);
s220: the holes (111a) of the mesh copper net (111) are filled with graphene solution (112), and the graphene solution (112) is coated on the mesh copper net (111) until the mesh copper net is dried.
4. The heat dissipation film for portable terminal according to claim 3, wherein in step S210, the diameter of the copper wires in the mesh copper net (111) is 10um-100um, and the transverse spacing and the longitudinal spacing of the mesh copper net (111) are both 10um-300 um.
5. The heat dissipation film for portable terminal as claimed in claim 4, wherein the diameter of the copper wire is further set to 30um-40um, and the transverse and longitudinal pitches are further set to 100 um.
6. The heat dissipation film for a portable terminal according to claim 3, wherein the copper graphene composite film (110) is subjected to a pressure treatment in a high temperature press (Pr) after being prepared.
7. A heat dissipation adhesive film, comprising the copper graphene composite film (110) according to any one of claims 1 to 6, and further comprising a graphene resin layer (120), a thermally conductive adhesive layer (130), wherein the graphene resin layer (120), the copper graphene composite film (110), and the thermally conductive adhesive layer (130) are sequentially formed by compounding, the graphene resin layer (120) is on the upper surface of the copper graphene composite film (110), and the thermally conductive adhesive layer (130) is on the lower surface of the copper graphene composite film (110).
8. The heat dissipating adhesive film according to claim 7, wherein the graphene resin layer (120) is formed by mixing graphene and a synthetic resin, and the synthetic resin is any one of a polyester resin and a polyurethane resin.
9. The heat dissipating adhesive film of claim 8 wherein a release film layer (F1) is attached to the side of the thermally conductive adhesive layer (130) remote from the copper graphene composite film (110).
10. The heat dissipating adhesive film according to claim 7, wherein the heat dissipating adhesive film (100) is prepared by the following method:
s230: forming a graphene resin layer (120) on the upper surface of the copper graphene composite film (110);
s240: a thermally conductive adhesive layer (130) is formed on the upper surface of the copper graphene composite film (110).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111074771.1A CN113939149A (en) | 2021-09-14 | 2021-09-14 | Heat dissipation membrane and heat dissipation adhesive film for portable terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111074771.1A CN113939149A (en) | 2021-09-14 | 2021-09-14 | Heat dissipation membrane and heat dissipation adhesive film for portable terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113939149A true CN113939149A (en) | 2022-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111074771.1A Pending CN113939149A (en) | 2021-09-14 | 2021-09-14 | Heat dissipation membrane and heat dissipation adhesive film for portable terminal |
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| Country | Link |
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| CN (1) | CN113939149A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115477902A (en) * | 2022-02-21 | 2022-12-16 | 广东东立新材料科技股份有限公司 | Heat dissipation adhesive tape with high heat dissipation performance and preparation method thereof |
-
2021
- 2021-09-14 CN CN202111074771.1A patent/CN113939149A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115477902A (en) * | 2022-02-21 | 2022-12-16 | 广东东立新材料科技股份有限公司 | Heat dissipation adhesive tape with high heat dissipation performance and preparation method thereof |
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