CN209572212U - A kind of insulated Aluminium based plates of three dimentional heat conduction - Google Patents
A kind of insulated Aluminium based plates of three dimentional heat conduction Download PDFInfo
- Publication number
- CN209572212U CN209572212U CN201822183153.0U CN201822183153U CN209572212U CN 209572212 U CN209572212 U CN 209572212U CN 201822183153 U CN201822183153 U CN 201822183153U CN 209572212 U CN209572212 U CN 209572212U
- Authority
- CN
- China
- Prior art keywords
- layer
- resin layer
- heat
- graphene
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a kind of insulated Aluminium based plates of three dimentional heat conduction comprising aluminium sheet, insulating layer and copper foil, the insulating layer along far from the first resin layer, graphene layer and the second resin layer that the aluminium sheet direction is sequentially arranged by forming.The insulated Aluminium based plates are by using specific insulation layer structure, the characteristics of changing insulating properties isotropism, greatly improved insulating layer XY to thermal conductivity, thus by heat from pyrotoxin to XYZ all directions spread, it passes to again to aluminium sheet, heat dissipation area is increased, radiating efficiency is improved, compared with traditional heat-dissipating structure, by introducing graphene layer, radiant heat transfer effect is enhanced, is shed by way of converting heat is heat radiation by graphene layer, to improve radiating efficiency.In addition, resin layer is arranged in graphene layer top and bottom, while ensure that heating conduction, also make substrate that there is the high pressure-resistant reliability that insulate.
Description
Technical field
The utility model belongs to printed circuit board production technical field, is related to a kind of high thermal conductive substrate, relates in particular to
A kind of insulated Aluminium based plates of three dimentional heat conduction.
Background technique
As the application field that LED is encapsulated constantly is expanded, the requirement to the luminous intensity and reliability of LED component is also continuous
It improves, especially in general lighting, headlight for vehicles and high-power illumination field, the encapsulation of LED chip is proposed tightened up
It is required that wherein insulating properties and cooling requirements to LED packaging are the most significant.For improve LED packaging heat dissipation performance,
The metal-based copper-clad plate with insulating layer is generallyd use as support plate, cooperates external heat sink to radiate, metal-based copper-clad plate
Need to have higher thermal conductivity, pressure-resistant performance and long-term reliability, Conventional insulation layer thermal conductivity is up to the left side 3W/mK at present
The right side, support plate overall thermal conductivity are 15~30W/mK.
The material composition of existing insulating layer is mainly the thermosetting polymer resin composite material of heat filling filling, is flat
Weigh the performance indexess such as thermal conductivity and insulating properties, the properties such as thermal conductivity of resin and heat filling, all already close to pole
The level of limit, the macromolecule resin containing liquid crystal structure such as developed in recent years, although intrinsic thermal conductivity is higher than common resin
Several times, but since the formation condition of liquid crystalline phase is more harsh, the unsuitable technique routinely produced, it is difficult to large-scale application.It is thermally conductive
Surface side filler, it is desirable that thermal conductivity is higher, while the filler of good insulating, and the filling kind for meeting the two performances at present is less,
Such as the filler of boron nitride, aluminium nitride etc, although having the two properties simultaneously, due to some other performance such as dispersibility,
There is very big difficulty in mobility and resin compatible difference etc., processing technology, and with high costs.
Therefore use traditional insulating layer mentality of designing at present, have a very big promotion to allow insulating layer thermal conductivity, difficulty compared with
Greatly.Chinese patent CN103722805B discloses a kind of high-heat-conductionaluminum aluminum base copper clad board, and the ball-aluminium oxide of different-grain diameter is answered
Match, while by the way of three-layer coating, insulating layer is divided into intermediate ultra-high conducting thermosphere and common heat-conducting layer, thermal conductivity reach up and down
While to 3W/mK, it can guarantee the bond strength between insulating layer and copper foil and aluminium sheet.Although the insulating layer that the program uses
Thermal conductivity has reached current higher technical level in vertical direction, but in practical applications, pyrotoxin is Relatively centralized
In some part of Metal Substrate support plate, heat is difficult to propagate in level dielectric layer direction, and hot stack easy to form causes part
Temperature is excessively high, influences chip performance stabilization and reliability.
Utility model content
For this purpose, the utility model exactly will solve above-mentioned technical problem, so that it is hot in horizontal direction to propose that one kind can solve
The insulated Aluminium based plates of conducting problem while the high three dimentional heat conduction of vertical direction heat conduction efficiency.
In order to solve the above technical problems, the technical solution of the utility model are as follows:
The utility model provides a kind of insulated Aluminium based plates of three dimentional heat conduction comprising aluminium sheet, insulating layer and copper foil, it is described exhausted
Edge layer along far from the first resin layer, graphene layer and the second resin layer that the aluminium sheet direction is sequentially arranged by forming.
Preferably, the graphene layer is at least one layer.
Preferably, first resin layer with a thickness of 30~50 μm, the second resin layer with a thickness of 20~30 μm.
Preferably, every layer of graphene layer with a thickness of 20~25 μm.
Preferably, the graphene film layer thermal conductivity in the horizontal direction is 800~1200W/mK.
Preferably, the aluminium sheet with a thickness of 0.8~5.0mm, copper foil with a thickness of 18~105 μm.
Preferably, the resin layer is epoxy resin layer.
The above-mentioned technical proposal of the utility model has the advantage that compared with prior art
(1) insulated Aluminium based plates of three dimentional heat conduction described in the utility model comprising aluminium sheet, insulating layer and copper foil, it is described
Insulating layer along far from the first resin layer, graphene layer and the second resin layer that the aluminium sheet direction is sequentially arranged by forming.It is described
Insulated Aluminium based plates are by using specific insulation layer structure, the characteristics of changing insulating properties isotropism, insulation greatly improved
Layer XY to thermal conductivity then pass to aluminium sheet so that heat be spread from pyrotoxin to XYZ all directions, increase heat dissipation
Area improves radiating efficiency, compared with traditional heat-dissipating structure, by introducing graphene layer, enhances radiant heat transfer effect, leads to
It crosses graphene layer the form that converting heat is heat radiation sheds, to improve radiating efficiency.In addition, in graphene layer top surface
Resin layer is set with bottom surface, while ensure that heating conduction, also makes substrate that there is the high pressure-resistant reliability that insulate.
(2) insulated Aluminium based plates of three dimentional heat conduction described in the utility model, the graphene layer are at least one layer, and described
One resin layer, the second resin layer thickness also can adjust, pass through and adjust the number of plies of graphene layer, the first resin layer, the second resin
The thickness of layer, realizes thermally conductive to entire insulating layer and insulation performance adjusting, meets different requirements.
Detailed description of the invention
In order to be more likely to be clearly understood the content of the utility model, below according to the specific implementation of the utility model
Example and in conjunction with attached drawing, the utility model is described in further detail, wherein
Fig. 1 is the structural schematic diagram of the insulated Aluminium based plates of three dimentional heat conduction described in the utility model embodiment.
Appended drawing reference indicates in figure are as follows: 1- aluminium sheet；2- insulating layer；The first resin layer of 21-；22- graphene layer；23- second
Resin layer；3- copper foil.
Specific embodiment
Embodiment 1
The present embodiment provides a kind of insulated Aluminium based plates of three dimentional heat conduction, as shown in Figure 1, the insulation aluminium base of the three dimentional heat conduction
Plate includes aluminium sheet 1, insulating layer 2 and the copper foil 3 of stacked above one another setting from the bottom to top, wherein the aluminium sheet 1 with a thickness of 0.8mm,
Copper foil 3 with a thickness of 18 μm.
Further, the insulating layer 2 is by along the first resin layer for being sequentially arranged of direction (from the bottom to top) far from aluminium sheet 1
21, graphene layer 22 and the second resin layer 23 composition, wherein the first resin layer 21, the second resin layer 23 are epoxy resin layer,
Heat filling can be filled in the epoxy resin layer.The graphene layer 22 is porous graphene thin-film material, with a thickness of 20 μ
M is connect by way of bonding with first resin layer 21, the second resin layer 23, reduces the wind of the layering of insulating layer 2
Danger, first resin layer 21 with a thickness of 30 μm, the second resin layer 23 with a thickness of 20 μm.22 film of graphene layer is also
It can be surface-treated by silane coupling agent.
The graphene layer 22 in the horizontal direction (direction XY) thermal conductivity be 800~1200W/mK, the graphene
Layer 22 is at least one layer, can be set as multilayer, graphene layer described in the present embodiment according to thermally conductive and insulation performance needs
22 be 1 layer.The graphene layer 2 and the copper foil 3 by 23 bonding connection of the second resin layer, the graphene layer 22 with it is described
Aluminium sheet 1 passes through 21 bonding connection of the first resin layer.
The insulated Aluminium based plates of three dimentional heat conduction described in the present embodiment utilize graphene in the ultra-high conducting heating rate of in-plane, will
Heat radiates by local diffusion to whole plate, then via aluminium sheet, significantly improves the radiating efficiency of aluminum substrate, while ensure that aluminium base
The insulation pressure resistance reliability of plate entirety.
Embodiment 2
The present embodiment provides a kind of insulated Aluminium based plates of three dimentional heat conduction, as shown in Figure 1, the insulation aluminium base of the three dimentional heat conduction
Plate includes aluminium sheet 1, insulating layer 2 and the copper foil 3 of stacked above one another setting from the bottom to top, wherein the aluminium sheet 1 with a thickness of 5.0mm,
Copper foil 3 with a thickness of 105 μm.
Further, the insulating layer 2 is by along the first resin layer for being sequentially arranged of direction (from the bottom to top) far from aluminium sheet 1
21, graphene layer 22 and the second resin layer 23 composition, wherein the first resin layer 21, the second resin layer 23 are epoxy resin layer,
Heat filling can be filled in the epoxy resin layer.The graphene layer 22 is porous graphene thin-film material, with a thickness of 25 μ
M is connect by way of bonding with first resin layer 21, the second resin layer 23, reduces the wind of the layering of insulating layer 2
Danger, first resin layer 21 with a thickness of 50 μm, the second resin layer 23 with a thickness of 30 μm.22 film of graphene layer is also
It can be surface-treated by silane coupling agent.
The graphene layer 22 in the horizontal direction (direction XY) thermal conductivity be 800~1200W/mK, the graphene
Layer 22 is at least one layer, can be set as multilayer, graphene layer described in the present embodiment according to thermally conductive and insulation performance needs
22 be 5 layers.Close to the graphene layer 22 of copper foil 3 and the copper foil 3 by 23 bonding connection of the second resin layer, close to aluminium sheet
1 graphene layer 22 and the aluminium sheet 1 pass through 21 bonding connection of the first resin layer.Connected between graphene layer 22 by conventional
The mode of connecing connects, and is such as bonded.
Embodiment 3
The present embodiment provides a kind of insulated Aluminium based plates of three dimentional heat conduction, as shown in Figure 1, the insulation aluminium base of the three dimentional heat conduction
Plate includes aluminium sheet 1, insulating layer 2 and the copper foil 3 of stacked above one another setting from the bottom to top, wherein the aluminium sheet 1 with a thickness of 2.0mm,
Copper foil 3 with a thickness of 50 μm.
Further, the insulating layer 2 is by along the first resin layer for being sequentially arranged of direction (from the bottom to top) far from aluminium sheet 1
21, graphene layer 22 and the second resin layer 23 composition, wherein the first resin layer 21, the second resin layer 23 are epoxy resin layer,
Heat filling can be filled in the epoxy resin layer.The graphene layer 22 is porous graphene thin-film material, with a thickness of 22 μ
M is connect by way of bonding with first resin layer 21, the second resin layer 23, reduces the wind of the layering of insulating layer 2
Danger, first resin layer 21 with a thickness of 40 μm, the second resin layer 23 with a thickness of 25 μm.22 film of graphene layer is also
It can be surface-treated by silane coupling agent.
The graphene layer 22 in the horizontal direction (direction XY) thermal conductivity be 800~1200W/mK, the graphene
Layer 22 is at least one layer, can be set as multilayer, graphene layer described in the present embodiment according to thermally conductive and insulation performance needs
22 be 2 layers.Close to the graphene layer 22 of copper foil 3 and the copper foil 3 by 23 bonding connection of the second resin layer, close to aluminium sheet
1 graphene layer 22 and the aluminium sheet 1 pass through 21 bonding connection of the first resin layer.Connected between graphene layer 22 by conventional
The mode of connecing connects, and is such as bonded.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes among the protection scope created still in the utility model.
Claims (7)
1. a kind of insulated Aluminium based plates of three dimentional heat conduction, which is characterized in that including aluminium sheet, insulating layer and copper foil, the insulating layer by
Along the first resin layer, graphene layer and the second resin layer composition being sequentially arranged far from the aluminium sheet direction.
2. the insulated Aluminium based plates of three dimentional heat conduction according to claim 1, which is characterized in that the graphene layer is at least one
Layer.
3. the insulated Aluminium based plates of three dimentional heat conduction according to claim 2, which is characterized in that the thickness of first resin layer
Be 30-50 μm, the second resin layer with a thickness of 20-30 μm.
4. the insulated Aluminium based plates of three dimentional heat conduction according to claim 3, which is characterized in that every layer of graphene layer with a thickness of
20-25μm。
5. the insulated Aluminium based plates of three dimentional heat conduction according to claim 4, which is characterized in that the graphene film layer is in water
Square to thermal conductivity be 800~1200W/mK.
6. the insulated Aluminium based plates of three dimentional heat conduction according to claim 5, which is characterized in that the aluminium sheet with a thickness of 0.8
~5.0mm, copper foil with a thickness of 18~105 μm.
7. the insulated Aluminium based plates of three dimentional heat conduction according to claim 6, which is characterized in that the resin layer is epoxy resin
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822183153.0U CN209572212U (en) | 2018-12-25 | 2018-12-25 | A kind of insulated Aluminium based plates of three dimentional heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822183153.0U CN209572212U (en) | 2018-12-25 | 2018-12-25 | A kind of insulated Aluminium based plates of three dimentional heat conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209572212U true CN209572212U (en) | 2019-11-01 |
Family
ID=68330808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822183153.0U Active CN209572212U (en) | 2018-12-25 | 2018-12-25 | A kind of insulated Aluminium based plates of three dimentional heat conduction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209572212U (en) |
-
2018
- 2018-12-25 CN CN201822183153.0U patent/CN209572212U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205082059U (en) | heat dissipation circuit board | |
| CN102448251B (en) | Multilayer single-face aluminum-based circuit board and manufacturing method thereof | |
| CN105304593B (en) | High efficiency and heat radiation substrate for photoelectric device | |
| CN201853747U (en) | Heat-conducting and heat-dissipating structure of LED | |
| WO2010006475A1 (en) | A ceramic packaging substrate for the high power led | |
| CN209572212U (en) | A kind of insulated Aluminium based plates of three dimentional heat conduction | |
| CN107396618A (en) | A kind of fin of good insulating | |
| Bao et al. | Thermal management technology of IGBT modules based on two-dimensional materials | |
| CN101764193A (en) | High-heat conductivity and large-power LED lead frame and manufacture method thereof | |
| CN203521463U (en) | High-thermal conductivity LED-COB packaging substrate | |
| CN206524327U (en) | A kind of power model | |
| CN207811649U (en) | A kind of novel heat-conducting piece | |
| CN209659706U (en) | A kind of wiring board with heat conduction structure | |
| CN207014900U (en) | A kind of aluminium nitride substrate | |
| CN206432290U (en) | A kind of LED plant light compensations light source | |
| CN202293492U (en) | Aluminum-based copper-clad plate | |
| CN216610358U (en) | High-thermal-conductivity aluminum-based copper-clad plate | |
| CN201479470U (en) | Laminated panel of radiator-based copper foil printed circuit board | |
| CN205124123U (en) | Copper -clad plate of high heat conduction copper of high proof voltage base | |
| CN206894993U (en) | A kind of LED copper-clad plate | |
| CN203282775U (en) | Heat-conducting copper plate with aluminum clad layer | |
| CN102412365B (en) | The radiating module structure of LED | |
| CN213426557U (en) | Circuit board | |
| CN207783259U (en) | A kind of high-density multi-layered wiring board | |
| CN209447842U (en) | A kind of high-power LED encapsulation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |