CN113891913A - Resin composition for sealing and electronic component device - Google Patents
Resin composition for sealing and electronic component device Download PDFInfo
- Publication number
- CN113891913A CN113891913A CN202080039291.9A CN202080039291A CN113891913A CN 113891913 A CN113891913 A CN 113891913A CN 202080039291 A CN202080039291 A CN 202080039291A CN 113891913 A CN113891913 A CN 113891913A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- sealing
- curing agent
- sealing resin
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 78
- 239000011342 resin composition Substances 0.000 title claims abstract description 74
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 47
- 239000003822 epoxy resin Substances 0.000 claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 35
- 239000011256 inorganic filler Substances 0.000 claims abstract description 25
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 25
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 14
- 230000009477 glass transition Effects 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 15
- -1 bisphenol a Chemical compound 0.000 description 14
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 11
- 238000000465 moulding Methods 0.000 description 10
- 150000002989 phenols Chemical class 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 239000004305 biphenyl Substances 0.000 description 8
- 235000010290 biphenyl Nutrition 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000003566 sealing material Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 125000003710 aryl alkyl group Chemical group 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- UIXPTCZPFCVOQF-UHFFFAOYSA-N ubiquinone-0 Chemical compound COC1=C(OC)C(=O)C(C)=CC1=O UIXPTCZPFCVOQF-UHFFFAOYSA-N 0.000 description 4
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
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- 239000000203 mixture Substances 0.000 description 3
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- 238000001721 transfer moulding Methods 0.000 description 3
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical group C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 3
- 229940005561 1,4-benzoquinone Drugs 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- AIACLXROWHONEE-UHFFFAOYSA-N 2,3-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=C(C)C(=O)C=CC1=O AIACLXROWHONEE-UHFFFAOYSA-N 0.000 description 2
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 2
- VTWDKFNVVLAELH-UHFFFAOYSA-N 2-methylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=CC1=O VTWDKFNVVLAELH-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- RLQZIECDMISZHS-UHFFFAOYSA-N 2-phenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=CC(=O)C(C=2C=CC=CC=2)=C1 RLQZIECDMISZHS-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910002113 barium titanate Inorganic materials 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- CRGRWBQSZSQVIE-UHFFFAOYSA-N diazomethylbenzene Chemical compound [N-]=[N+]=CC1=CC=CC=C1 CRGRWBQSZSQVIE-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000011417 postcuring Methods 0.000 description 2
- 239000002516 radical scavenger Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- BLBVJHVRECUXKP-UHFFFAOYSA-N 2,3-dimethoxy-1,4-dimethylbenzene Chemical group COC1=C(C)C=CC(C)=C1OC BLBVJHVRECUXKP-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical class CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000002156 mixing Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
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- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
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- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
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- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The resin composition for sealing comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, wherein the curing agent (B) comprises a curing agent having a specific structure, and the softening point of the curing agent having a specific structure is 80-120 ℃.
Description
Technical Field
The present invention relates to a resin composition for sealing and an electronic component device.
Background
In recent years, with the demand for higher functionality of electronic devices, semiconductor packages have been further miniaturized and thinned. For example, the thickness of the sealing material is 0.25 to 0.4mm in a thin semiconductor package of 1mm or less. When the thickness of the sealing material is reduced in this manner, warpage occurs. When a semiconductor package is small and thin, even if it is slightly warped, defects occur in a dicing process for singulating the package, or a wire break occurs due to stress generated inside the package. Therefore, in order to reduce the warpage of the sealing material, a measure of increasing the thermal expansion coefficient is taken (for example, refer to patent documents 1 and 2).
In a package having a large chip area such as a semiconductor package for memory use, resin characteristics having high thermal expansion and high elastic modulus at high temperatures are required as a sealing material.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2017-128657.
Patent document 2: international publication No. 2015/152037.
Disclosure of Invention
Problems to be solved by the invention
One of the measures for increasing the thermal expansion coefficient is to reduce the amount of filler. However, although the thermal expansion coefficient can be increased by decreasing the amount of the filler, the elastic modulus at high temperature is lowered, and therefore, the two have a competitive relationship (trade off), and it is difficult to achieve both.
On the other hand, with the miniaturization of semiconductor packages, it is necessary to increase the thermal conductivity of the sealing material in order to escape the generated heat to the outside. In order to increase the thermal conductivity of the sealing material, a highly filled filler is effective. However, since the thermal expansion coefficient is increased, the properties are opposite to those of the highly filled filler, and thus it is difficult to achieve both of them.
In addition, the epoxy resin composition for sealing described in patent document 1 uses a phenol novolac resin having a specific structure as a curing agent, and the phenol novolac resin has a low softening point, and thus has poor storage stability and insufficient moldability.
In addition, in a small and thin semiconductor package, sufficient fluidity is required for filling the sealing material into the narrow portion.
The present invention provides a resin composition for sealing, which has excellent fluidity, storage stability and moldability, and can obtain a cured product with high thermal expansion, high elastic modulus at high temperature and reduced warpage. Also disclosed is an electronic component device using such a sealing resin composition.
Means for solving the problems
The present inventors have found that the above problems are solved by a sealing resin composition containing a curing agent having a specific structure and a softening point in a specific range.
Namely, the invention of the present application is as follows.
[1] A resin composition for sealing, which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, wherein the curing agent (B) contains a curing agent represented by the following general formula (1), and the softening point of the curing agent represented by the following general formula (1) is 80-120 ℃.
In the formula (1), R1～R5Each independently is a hydrogen atom, an allyl group or a single bond to an onium group, and R1～R5At least one of which is allyl, a plurality of R1～R5The same or different from each other, and n is an integer of 0 to 5.
[2] An electronic component device comprising an element sealed with a cured product of the sealing resin composition according to [1 ].
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a resin composition for sealing which is excellent in flowability, storage stability and moldability and can give a cured product having high thermal expansion, high elastic modulus at high temperature and reduced warpage can be provided. Further, an electronic component device using the sealing resin composition can be provided.
Drawings
Fig. 1 is a sectional view showing an electronic component device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail below with reference to one embodiment.
< resin composition for sealing >
The resin composition for sealing of the present embodiment is a resin composition for sealing containing (a) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler, wherein the curing agent (B) contains a curing agent represented by the following general formula (1), and the softening point of the curing agent represented by the following general formula (1) is 80 to 120 ℃.
In the formula (1), R1～R5Each independently is a hydrogen atom, an allyl group or a single bond to an onium group, and R1～R5At least one of which is allyl, a plurality of R1～R5The same or different from each other, and n is an integer of 0 to 5.
[ (A) epoxy resin ]
The epoxy resin (a) used in the present embodiment is not particularly limited in terms of molecular weight, molecular structure, and the like, as long as it has two or more epoxy groups in one molecule.
Examples of the epoxy resin (a) include a biphenyl type epoxy resin, a cresol novolac type epoxy resin, a phenol novolac type epoxy resin, a bisphenol a type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a dicyclopentadiene type epoxy resin, a triphenol methane type epoxy resin, a heterocyclic type epoxy resin such as a triazine skeleton-containing epoxy resin, a stilbene type bifunctional epoxy resin, a naphthalene type epoxy resin, a condensed ring aromatic hydrocarbon-modified epoxy resin, an alicyclic type epoxy resin, a polyfunctional type epoxy resin, and the like. Wherein, biphenyl type epoxy resin, naphthalene type epoxy resin and multifunctional epoxy resin can be used.
These epoxy resins may be used alone or in combination of two or more.
(A) The softening point of the epoxy resin may be 40 to 130 ℃, 50 to 110 ℃, or 80 to 110 ℃ from the viewpoints of workability of the sealing resin composition and melt viscosity at the time of molding.
The softening point in the present specification means "ring and ball softening point" and is a value measured according to ASTM D36.
Examples of the commercially available product of the epoxy resin (A) include, for example, YX-4000 (epoxy equivalent 185, softening point 105 ℃ C.) manufactured by Mitsubishi chemical corporation, NC-3000 (epoxy equivalent 273, softening point 58 ℃ C.) manufactured by Nippon Chemicals corporation, NC-3000H (epoxy equivalent 288, softening point 91 ℃ C.) manufactured by Nippon chemical corporation, N-655EXP-S (epoxy equivalent 200, softening point 55 ℃ C.) (trade names) manufactured by DIC corporation, and the like.
The content of the (a) epoxy resin may be 2 to 10% by mass, and may be 4 to 10% by mass, based on the total amount of the sealing resin composition. When the content of the epoxy resin (a) is 2% by mass or more, a cured product can be molded, and when it is 10% by mass or less, a sufficient elastic modulus can be obtained.
[ (B) curing agent ]
The curing agent (B) used in the present embodiment includes a curing agent represented by the following general formula (1).
In the formula, R1～R5Each independently is a hydrogen atom, an allyl group or a single bond to an onium group, and R1～R5At least one of which is allyl, a plurality of R1～R5The same or different from each other, and n is an integer of 0 to 5.
The curing agent represented by the general formula (1) has three or more hydroxyl groups and allyl groups in one molecule, and contains a triphenylmethane skeleton. Therefore, it is presumed that the curing agent (B) increases the crosslinking density even if the crosslinking density is increased by including the curing agent represented by the above general formula (1)The thermal expansion coefficient can be increased by adding the inorganic filler (D) described later. It is also presumed that the cured product of the sealing resin composition of the present embodiment does not decrease in elastic modulus at high temperature, and that the cured product can be easily made to have a flexural elastic modulus E at 260 ℃260And flexural modulus of elasticity E at 25 DEG C25Ratio of (E)25/E260) Is 7.5 or less. From this, it is presumed that the sealing resin composition of the present embodiment can obtain a cured product with reduced warpage.
R is as defined above1～R5The number of carbon atoms of the allyl group(s) may be 1 to 8, and may be 2 to 5. Specific examples of allyl groups include-CH2-CH＝CH2、-CH2-C(CH3)＝CH2And the like.
In addition, a plurality of R1～R5May be the same as or different from each other.
R is as defined above1～R5At least one of which is an allyl group, which may be R from the viewpoint of reactivity1～R5One of them.
In the above general formula (1), R is1～R5Is an allyl group, meaning that there is at least one allyl group per phenyl ring.
n is an integer of 0 to 5, 0 to 3, and 1 to 2.
The curing agent represented by the general formula (1) has a softening point of 80 to 120 ℃, preferably 80 to 110 ℃, and preferably 85 to 100 ℃. When the softening point of the curing agent represented by the above general formula (1) is less than 80 ℃, there is a risk of lowering the storage stability of the sealing resin composition, and when it exceeds 120 ℃, there is a risk of lowering the manufacturability.
(B) The content of the curing agent represented by the above general formula (1) contained in the curing agent may be 40% by mass or more, 50% by mass or more, 60% by mass or more, 70% by mass or more, 80% by mass or more, and 100% by mass, from the viewpoints of the storage stability of the sealing resin composition and the reduction of warpage of a cured product.
The curing agent (B) is not particularly limited, and examples thereof include phenol compounds having two phenolic hydroxyl groups in one molecule, such as resorcinol, catechol, bisphenol a, bisphenol F, and substituted or unsubstituted biphenol; phenol resins such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol a, bisphenol F, phenylphenol, and aminophenol, and/or naphthols such as α -naphthol, β -naphthol, and dihydroxynaphthalene, and aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde, which are condensed or co-condensed with an acidic catalyst; aralkyl phenol resins such as phenol aralkyl resins, naphthol aralkyl resins, and biphenyl aralkyl resins synthesized from the above phenols and/or naphthols and dimethoxyp-xylene, bis (methoxymethyl) biphenyl, and the like; modified resins such as p-xylylene-modified phenol resin, m-xylylene-modified phenol resin, melamine-modified phenol resin, terpene-modified phenol resin, and the like; dicyclopentadiene phenol resins and dicyclopentadiene naphthol resins synthesized by copolymerizing phenols and/or naphthols with dicyclopentadiene; polycyclic aromatic ring-modified phenol resins; biphenyl type phenol resin; triphenylmethane type phenol resins, and the like. Further, the phenol resin may be one obtained by copolymerizing two or more of the above phenol resins. Among them, aralkyl type phenol resins, biphenyl aralkyl type phenols, novolak type phenol resins, triphenylmethane type phenol resins, aralkyl type phenol resins, biphenyl aralkyl type phenols may be mentioned.
(B) The softening point of the curing agent may be 50 to 120 ℃ and 60 to 110 ℃ from the viewpoint of manufacturability.
The content of the curing agent (B) may be 2 to 10% by mass, and may be 3 to 8% by mass, based on the total amount of the sealing resin composition. When the content of the curing agent (B) is 2% by mass or more, the amount of the inorganic filler (D) does not become too large, and kneading of the sealing resin composition becomes easy. In addition, warpage of a cured product of the sealing resin composition can be reduced. On the other hand, when the content of the (B) curing agent is 10% by mass or less, the amount of the (D) inorganic filler does not become too small, the elastic modulus of the cured product of the sealing resin composition is improved, warpage can be reduced, and a practical cured product can be obtained.
[ (C) curing Accelerator ]
The curing accelerator (C) used in the present embodiment can be used without particular limitation as long as it is generally used as a curing accelerator for epoxy resins.
Examples of the curing accelerator (C) include cyclic amidine compounds such as 1, 8-diazabicyclo [5.4.0] undecene-7, 1, 5-diazabicyclo [4.3.0] nonene-5, 6-dibutylamino-1, 8-diazabicyclo [5.4.0] undecene-7; compounds having intramolecular polarization obtained by adding a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, or phenyl-1, 4-benzoquinone, or a compound having a pi bond such as diazophenylmethane or phenol resin to these cyclic amidine compounds; tertiary amine compounds such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, and derivatives thereof; examples of 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole, 2-phenyl-4, 5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, 4-diamino-6- [2 ' -methylimidazolyl- (1 ') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 ' -undecylimidazolyl- (1 ') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 ' -ethyl-4 ' -methylimidazolyl- (1 ') ] -ethyl-s-triazine and the like Imidazole compounds having imidazole ring such as diamino-s-silicon-containing triazine compounds and derivatives thereof; organic phosphine compounds such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, diphenylphosphine, and phenylphosphine; a phosphorus compound having intramolecular polarization obtained by adding a quinone compound such as maleic anhydride, 1, 4-benzoquinone, 2, 5-toluquinone, 1, 4-naphthoquinone, 2, 3-dimethylbenzoquinone, 2, 6-dimethylbenzoquinone, 2, 3-dimethoxy-5-methyl-1, 4-benzoquinone, or phenyl-1, 4-benzoquinone, or a compound having a pi bond such as diazophenylmethane or phenol resin to these organic phosphine compounds; tetra-substituted phosphonium/tetra-substituted borates such as tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium ethyltriphenylborate, tetrabutylphosphonium tetrabutylborate and the like; tetraphenylboron salts such as 2-ethyl-4-methylimidazole/tetraphenylboron salt and N-methylmorpholine/tetraphenylboron salt, and derivatives thereof. (C) One curing accelerator may be used, or two or more curing accelerators may be used in combination.
The curing accelerator (C) may be an imidazole curing accelerator, and particularly the imidazole compound is blended to provide the sealing resin composition with excellent fluidity.
The content of the curing accelerator (C) may be 0.1 to 3% by mass, and may be 0.1 to 1% by mass, based on the total amount of the sealing resin composition. When the content of the (C) curing accelerator is 0.1% by mass or more, the effect of accelerating curability can be obtained, and when the content is 3% by mass or less, the filling property can be improved.
[ (D) inorganic Filler ]
The inorganic filler (D) used in the present embodiment can be used without particular limitation as long as it is an inorganic filler generally used for a sealing resin composition. Specific examples of the inorganic filler (D) include fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, potassium titanate, barium titanate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllium oxide, zirconia, forsterite, steatite, spinel, mullite, and titanium dioxide, and beads, single crystal fibers, and glass fibers obtained by spheroidizing these particles can be used. (D) One or more kinds of the inorganic fillers may be used in combination.
(D) The inorganic filler may be fused silica or crystalline silica, from the viewpoint of improving mechanical strength. (D) The inorganic filler may be alumina from the viewpoint of improving the thermal conductivity, and barium titanate from the viewpoint of improving the dielectric constant.
(D) The inorganic filler may have an average particle diameter of 5 to 12 μm, or 5 to 10 μm. When the average particle diameter of the inorganic filler (D) is 5 μm or more, the filling property of the sealing resin composition can be improved, and when it is 12 μm or less, the flowability and moldability of the sealing resin composition can be improved.
In the present embodiment, the average particle diameter refers to a particle diameter (D50) when 50% is accumulated from the smaller diameter side in the volume-based particle size distribution obtained by using the laser diffraction scattering particle size distribution measuring apparatus.
The inorganic filler (D) may have a maximum particle diameter of 15 to 75 μm, or 15 to 55 μm. When the maximum particle diameter of the inorganic filler (D) is 75 μm or less, the filling property can be improved.
In the present embodiment, the maximum particle size refers to a particle size (D99) when 99% of the particles are accumulated from the smaller diameter side in the volume-based particle size distribution.
(D) The shape of the inorganic filler may be spherical from the viewpoint of improving fluidity.
The content of the inorganic filler (D) may be 75 to 95% by mass, 80 to 90% by mass, or 83 to 90% by mass based on the total amount of the sealing resin composition. When the content of the inorganic filler (D) is 75% by mass or more, the elastic modulus of a cured product of the sealing resin composition can be kept high, and when the content is 95% by mass or less, the moldability can be improved.
The sealing resin composition of the present embodiment can contain, in addition to the above components, additives such as a flame retardant, carbon black, an organic dye, a coloring agent such as titanium oxide or red iron oxide (Bengala), a release agent, a coupling agent, and an ion scavenger, which are generally blended in such a composition, as needed.
When the sealing resin composition of the present embodiment contains the above-mentioned additive, the amount of the additive may be 0.1 to 1% by mass, or 0.2 to 0.5% by mass, respectively, based on the total amount of the sealing resin composition.
In the sealing resin composition of the present embodiment, the content of the components (a) to (D) may be 80% by mass or more, may be 90% by mass or more, and may be 95% by mass or more.
In the production of the sealing resin composition of the present embodiment, the epoxy resin (a), the curing agent (B), the curing accelerator (C), the inorganic filler (D), and other various components which may be blended as needed are thoroughly mixed (dry-mixed) using a mixer or the like, and then melt-kneaded using a kneading apparatus such as a hot roll or a kneader, cooled, and pulverized into an appropriate size.
The flexural modulus E at 260 ℃ of a cured product of the sealing resin composition of the present embodiment260And flexural modulus of elasticity E at 25 DEG C25Ratio of (E)25/E260) May be 7.5 or less, and may be 7.0 or less. Equivalence ratio (E)25/E260) When the amount is 7.5 or less, the warpage of the cured product can be reduced, and an electronic component device with high reliability can be obtained.
The flexural modulus E at 260 ℃ of a cured product of the sealing resin composition of the present embodiment260Can be 1.4 to 3.5GPa, and can be 1.8 to 3.3 GPa. When the above-mentioned E is260Within the above range, the ratio (E) is easily satisfied25/E260) Is 7.5 or less. The content of E can be adjusted by appropriately adjusting the ratio and the type of the resin component in the sealing resin composition260The value of (c).
In addition, the cured product of the sealing resin composition of the present embodiment has a flexural modulus of elasticity E at 25 ℃25May be 12 to 30GPa, and may be 14 to 25 GPa. When the above-mentioned E is25Within the above range, the ratio (E) is easily satisfied25/E260) Is 7.5 or less. The content of the inorganic filler (D) can be adjusted to adjust E25The value of (c).
Modulus of elasticity in bending E25And E260Can be measured according to JIS K6911: the measurement 2006 can be specifically measured according to the method described in the examples.
The coefficient of thermal expansion (α 1) of a cured product of the sealing resin composition of the present embodiment may be 7 to 18 ppm/DEG C, and may be 9 to 16 ppm/DEG C. The coefficient of thermal expansion (alpha 2) of a cured product of the sealing resin composition may be 33 to 70 ppm/DEG C, and may be 35 to 60 ppm/DEG C.
The Thermal expansion coefficient can be measured by Thermal Mechanical Analysis (TMA), specifically, by the method described in examples.
The glass transition temperature of the cured product of the sealing resin composition of the present embodiment may be 150 ℃ or higher, and may be 155 ℃ or higher, from the viewpoint of improving moldability. Further, when the glass transition temperature of the cured product is 150 ℃ or higher, the above ratio (E) is easily satisfied25/E260) Is 7.5 or less. In addition, the continuous moldability is improved.
The glass transition temperature (Tg) can be measured by Thermal Mechanical Analysis (TMA), specifically, by the method described in examples.
< electronic component device >
The electronic component device of the present embodiment includes an element sealed with a cured product of the sealing resin composition. The electronic component device is an electronic component device in which necessary portions are sealed with respect to a whole set of a support member such as a lead frame, a single crystal silicon semiconductor element or a compound semiconductor element such as SiC or GaN, a member such as an electric wire or a bump for electrically connecting these, and other constituent members, by using a cured product of the sealing resin composition.
Fig. 1 shows an example of an electronic component device according to the present embodiment. The adhesive layer 3 may be interposed between the lead frame 1 such as a copper frame and the semiconductor element 2. The electrodes 4 on the semiconductor element 2 and the lead portions 5 of the lead frame 1 are connected by bonding wires 6, and these are further sealed with a cured product 7 of the sealing resin composition of the present embodiment.
As a method for sealing with the above-mentioned sealing resin composition, transfer molding is most common, but injection molding, compression molding, or the like may be used.
The molding temperature can be 150-220 ℃ and can be 170-210 ℃. The molding time may be 45 to 300 seconds, and may be 60 to 200 seconds. In the case of post-curing, the heating temperature is not particularly limited, and may be, for example, 150 to 220 ℃ and 170 to 210 ℃. The heating time is not particularly limited, and may be, for example, 0.5 to 10 hours, or 1 to 8 hours.
Examples
The present invention will be described in detail with reference to examples, but the present invention is not limited to these examples at all.
(examples 1 to 7 and comparative examples 1 to 5)
The components of the types and amounts shown in table 1 were mixed at normal temperature (23 ℃) using a mixer, kneaded under heating at 90 to 115 ℃ using hot rolls, cooled, and pulverized to prepare a sealing resin composition.
In table 1, the blank column indicates no matching.
The details of each component described in table 1 used for the preparation of the sealing resin composition are as follows.
[ (A) epoxy resin ]
YX-4000: biphenyl type epoxy resin (trade name, manufactured by Mitsubishi chemical corporation, epoxy equivalent 185, softening point 105 ℃ C.).
NC-3000: biphenyl novolac epoxy resin (trade name, manufactured by Nippon Kagaku K.K., having an epoxy equivalent of 273 and a softening point of 58 ℃ C.).
N-655 EXP-S: an o-cresol novolac epoxy resin (trade name, available from DIC corporation, epoxy equivalent 200, softening point 55 ℃ C.).
[ (B) curing agent ]
(curing agent represented by the general formula (1))
SH-041-01: allyl-containing triphenylmethane-type phenol resin (trade name, manufactured by Minghe Kaisha corporation, hydroxyl equivalent 139, softening point 90 ℃ C.).
(curing agent other than the curing agent represented by the general formula (1))
MEH-7500: triphenylmethane-type phenol (trade name, manufactured by KANGHECHE CHEMICAL DENKO K.K., OH equivalent 98, softening point 110 ℃ C.).
MEH-5000: phenol novolac resin (trade name, manufactured by Minghe chemical Co., Ltd., hydroxyl equivalent 168, softening point 73 ℃ C.).
MEHC-7800 SS: an aralkyl type phenol resin (trade name, manufactured by KANGHECHE CHEMICAL KOKAI K.K., hydroxyl equivalent 172, softening point 65 ℃ C.).
[ (C) curing Accelerator ]
2P-4 MHZ: imidazole compound (trade name, manufactured by four chemical industries, Ltd.).
[ (D) inorganic Filler ]
FB-910 GSQ: spherical fused silica (trade name, manufactured by Admatech technologies, Ltd., average particle diameter 5 μm, maximum particle diameter 20 μm).
[ other Components ]
Releasing agent: carnauba wax (trade name: manufactured by Toyo ADL (trade name) (TOYOCHEM)).
Colorant: MA-100RMJ (trade name, manufactured by Mitsubishi chemical corporation).
Flame retardant: FP-100 (trade name: Vietsu, manufactured by Pharmacopeia).
An ion scavenger: DHT-4C (trade name: manufactured by Kyowa chemical industry Co., Ltd.).
The properties of the sealing resin compositions prepared in examples 1 to 7 and comparative examples 1 to 5 were measured and evaluated under the measurement conditions shown below. The evaluation results are shown in table 1.
[ evaluation items ]
(1) Glass transition temperature, coefficient of thermal expansion (. alpha.1,. alpha.2)
The obtained sealing resin composition was molded by a transfer molding machine under conditions of a mold temperature of 175 ℃, a molding pressure of 7MPa and a curing time of 120 seconds, and further subjected to post-curing at a temperature of 175 ℃ for 8 hours to prepare a test piece (3 mm. times.4 mm. times.17 mm). The obtained test piece was measured using a thermal analyzer (product name: TMA/SS150, manufactured by Seiko Seisaku-Sho Ltd.) at a temperature increase rate of 10 ℃/min under a load of 98 mN.
The thermal expansion coefficients of the obtained TMA curves at 40 to 90 ℃ and 200 to 230 ℃ are represented as α 1 and α 2, respectively, and the intersection temperature of the tangents to the TMA curves at 90 ℃ and 190 ℃ is read and represented as the glass transition temperature (Tg).
(2) Flexural modulus of elasticity (E)25、E260) Ratio of (E)25/E260)
A test piece (4 mm. times.10 mm. times.80 mm) was prepared under the same conditions as in (1) above. Using the obtained test pieces, the flexural modulus of elasticity (E) at 25 ℃ was measured25) And flexural modulus of elasticity (E) at 260 deg.C260). The measurement was carried out by applying a load using a precision universal tester (AUTOGRRAPH AG-IS, available from Shimadzu corporation, with a fulcrum/punch radius of 0.3mm and a test speed of 1 mm/min), in accordance with JIS-K6911: 2006.
Furthermore, from the above-mentioned E25And E260Calculating the ratio (E)25/E260)。
(3) Gel time
The obtained sealing resin composition is spread on a hot plate maintained at 175 ℃ into a circular shape having a diameter of 3 to 5cm, and the time for thickening and eventually for losing the viscosity of the sealing resin composition is measured when kneading and mixing the composition at a constant speed.
(4) Spiral flow
The obtained resin composition for sealing was subjected to transfer molding at a molding temperature of 175 ℃ and a molding pressure of 7MPa to measure the spiral flow.
(5) Specific gravity of
The volume and mass of the obtained sealing resin composition were measured, and the specific gravity of the sealing resin composition was calculated from the results.
(6) Flow viscosity
According to JIS K7210: 1999, the viscosity of the obtained resin composition for sealing was measured by using an Koshika flow tester (product name: CFT-500C, manufactured by Shimadzu corporation).
(7) Shrinkage rate
A test piece was produced under the same conditions as in (1) above. Using the obtained test piece, the test piece was measured according to JIS K6911: the shrinkage (%) is determined by the following formula (i) 2006.
Shrinkage (%) ((D-D)/D) × 100 (i).
In the formula, D: length of mold cavity (mm), d: length (mm) of test piece.
(8) Warping (room temperature (25 ℃), 260 ℃)
Using the prepared sealing resin composition, a package for evaluation (15 mm. times.15 mm, sealing thickness: 250 μm, overall thickness: 380 μm) on which a chip of 10 mm. times.10 mm and 150 μm thickness was mounted was prepared. After curing at 175 ℃ for 8 hours, the cured product was placed in a heating apparatus, and the temperature in the apparatus was increased from 25 ℃ to 260 ℃ (10 ℃/25 seconds), and then decreased to 25 ℃ (10 ℃/25 seconds). The warpage state of the evaluation package at 260 ℃ after the temperature rise and the maximum height (μm) of the warpage from the ground surface were measured. The warpage state of the evaluation package after the temperature reduction at 25 ℃ and the maximum height (μm) of the warpage from the ground surface were measured. The maximum height when smile (smile) warpage occurred was taken as a negative value, and the maximum height when cry (cry) warpage occurred was taken as a positive value, and the evaluation was performed according to the following criteria.
A: the absolute value of the resulting warpage is less than 2 mm.
C: the absolute value of the generated warpage is 2mm or more.
(9) Storage stability
The sealing resin composition was stored at room temperature (25 ℃) and a relative humidity of 40% for 24 hours, and then taken out, and the mass of the cake was measured, and the mass ratio of the cake to the mass of the entire sealing resin composition was shown. Note that, 20% or less was regarded as pass.
(10) Continuous formability
PBGA (Plastic Ball Grid Array (30 mm. times.30 mm. times.1 mm, t/2) was continuously molded 300 times using a parting load measuring molding machine (product name: GM-500, manufactured by Kyowa Kasei Co., Ltd.). The mold temperature was 190 ℃ and the molding time was 240 seconds. The evaluation was performed according to the following criteria.
A: the molding was carried out 150 times continuously without any mold contamination.
B: although mold contamination was found, 150 consecutive moldings were possible.
C: it cannot be continuously molded up to 150 times due to adhesion to a mold or the like.
It is understood that the sealing resin compositions of examples 1 to 7 using the curing agent (B) containing the curing agent represented by the general formula (1) are excellent in fluidity, storage stability and continuous moldability, and satisfy the ratio (E)25/E260) A cured product which has a high thermal expansion, a high elastic modulus at high temperatures and a reduced warpage of 7.5 or less. On the other hand, it is understood that the sealing resin compositions of comparative examples 1 to 5, in which the curing agent represented by the general formula (1) was not contained as the curing agent, did not satisfy the ratio (E)25/E260) 7.5 or less, and the cured product has a large warpage. The sealing resin composition of comparative example 1, which used a phenol novolac resin (MEH-5000) as a curing agent, had a viscosity as low as 11Pa · s, but had a spiral flow as short as 138cm, which may cause unfilled portions in the molded article.
Description of reference numerals
1: a lead frame; 2: a semiconductor element; 3: an adhesive layer; 4: an electrode; 5: a lead part; 6: a bonding wire; 7: a cured product of the sealing resin composition.
Claims (6)
1. A sealing resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler,
the curing agent (B) comprises a curing agent represented by the following general formula (1), the softening point of the curing agent represented by the following general formula (1) is 80-120 ℃,
in the formula (1), R1～R5Each independently is a hydrogen atom, an allyl group or a single bond to an onium group; and, R1～R5At least one of which is allyl; plural R1～R5Are the same or different from each other; n is an integer of 0 to 5。
2. The resin composition for sealing as claimed in claim 1, wherein,
the content of the curing agent represented by the general formula (1) contained in the curing agent (B) is 40% by mass or more.
3. The resin composition for sealing as claimed in claim 1 or 2, wherein,
a flexural modulus E at 260 ℃ of a cured product of the sealing resin composition260And flexural modulus of elasticity E at 25 DEG C25Ratio E of25/E260Is 7.5 or less.
4. The resin composition for sealing as claimed in any one of claims 1 to 3,
the glass transition temperature of a cured product of the sealing resin composition is 150 ℃ or higher.
5. The resin composition for sealing as claimed in any one of claims 1 to 4,
the content of the inorganic filler (D) is 75 to 95 mass% based on the total amount of the sealing resin composition.
6. An electronic component device, wherein,
the sealing resin composition for sealing an element, which comprises a cured product of the sealing resin composition according to any one of claims 1 to 5.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-101664 | 2019-05-30 | ||
| JP2019101664 | 2019-05-30 | ||
| PCT/JP2020/020613 WO2020241594A1 (en) | 2019-05-30 | 2020-05-25 | Encapsulating resin composition and electronic component device |
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| CN113891913A true CN113891913A (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202080039291.9A Pending CN113891913A (en) | 2019-05-30 | 2020-05-25 | Resin composition for sealing and electronic component device |
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| Country | Link |
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| JP (1) | JPWO2020241594A1 (en) |
| CN (1) | CN113891913A (en) |
| TW (1) | TW202104339A (en) |
| WO (1) | WO2020241594A1 (en) |
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| JP7336419B2 (en) | 2020-06-08 | 2023-08-31 | 信越化学工業株式会社 | Thermosetting epoxy resin composition, thermosetting epoxy resin sheet, and cured product thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04348121A (en) * | 1990-08-27 | 1992-12-03 | Fujitsu Ltd | Epoxy resin composition |
| JPH05132539A (en) * | 1991-11-11 | 1993-05-28 | Fujitsu Ltd | Epoxy resin composition |
| JPH05170876A (en) * | 1991-12-19 | 1993-07-09 | Fujitsu Ltd | Epoxy resin composition |
| JPH05320317A (en) * | 1992-05-21 | 1993-12-03 | Fujitsu Ltd | Epoxy resin composition |
| JPH06136093A (en) * | 1992-09-08 | 1994-05-17 | Fujitsu Ltd | Epoxy resin composition |
| JPH06263841A (en) * | 1993-03-12 | 1994-09-20 | Fujitsu Ltd | Epoxy resin composition |
| CN101522792A (en) * | 2006-10-02 | 2009-09-02 | 日立化成工业株式会社 | Epoxy resin molding material for sealing and electronic component device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03207746A (en) * | 1990-01-10 | 1991-09-11 | Fujitsu Ltd | Epoxy resin composition |
| JPH04216820A (en) * | 1990-12-19 | 1992-08-06 | Fujitsu Ltd | Epoxy resin composition |
| JPH05326754A (en) * | 1992-05-22 | 1993-12-10 | Fujitsu Ltd | Epoxy resin composition for semiconductor sealing |
-
2020
- 2020-05-25 CN CN202080039291.9A patent/CN113891913A/en active Pending
- 2020-05-25 WO PCT/JP2020/020613 patent/WO2020241594A1/en active Application Filing
- 2020-05-25 JP JP2021522761A patent/JPWO2020241594A1/ja active Pending
- 2020-05-27 TW TW109117629A patent/TW202104339A/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04348121A (en) * | 1990-08-27 | 1992-12-03 | Fujitsu Ltd | Epoxy resin composition |
| JPH05132539A (en) * | 1991-11-11 | 1993-05-28 | Fujitsu Ltd | Epoxy resin composition |
| JPH05170876A (en) * | 1991-12-19 | 1993-07-09 | Fujitsu Ltd | Epoxy resin composition |
| JPH05320317A (en) * | 1992-05-21 | 1993-12-03 | Fujitsu Ltd | Epoxy resin composition |
| JPH06136093A (en) * | 1992-09-08 | 1994-05-17 | Fujitsu Ltd | Epoxy resin composition |
| JPH06263841A (en) * | 1993-03-12 | 1994-09-20 | Fujitsu Ltd | Epoxy resin composition |
| CN101522792A (en) * | 2006-10-02 | 2009-09-02 | 日立化成工业株式会社 | Epoxy resin molding material for sealing and electronic component device |
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| Publication number | Publication date |
|---|---|
| TW202104339A (en) | 2021-02-01 |
| WO2020241594A1 (en) | 2020-12-03 |
| JPWO2020241594A1 (en) | 2020-12-03 |
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