CN113644019A - 一种半导体贴片机的复合上料装置 - Google Patents
一种半导体贴片机的复合上料装置 Download PDFInfo
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- CN113644019A CN113644019A CN202110907503.7A CN202110907503A CN113644019A CN 113644019 A CN113644019 A CN 113644019A CN 202110907503 A CN202110907503 A CN 202110907503A CN 113644019 A CN113644019 A CN 113644019A
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- 239000002131 composite material Substances 0.000 title claims abstract description 41
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 4
- 230000005540 biological transmission Effects 0.000 claims description 13
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical group Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 3
- 241000252254 Catostomidae Species 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000007306 turnover Effects 0.000 description 18
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110907503.7A CN113644019B (zh) | 2021-08-09 | 2021-08-09 | 一种半导体贴片机的复合上料装置 |
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CN202110907503.7A CN113644019B (zh) | 2021-08-09 | 2021-08-09 | 一种半导体贴片机的复合上料装置 |
Publications (2)
Publication Number | Publication Date |
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CN113644019A true CN113644019A (zh) | 2021-11-12 |
CN113644019B CN113644019B (zh) | 2024-03-19 |
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CN202110907503.7A Active CN113644019B (zh) | 2021-08-09 | 2021-08-09 | 一种半导体贴片机的复合上料装置 |
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Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0235047A2 (en) * | 1986-02-28 | 1987-09-02 | Tenryu Technics Co., Ltd. | Chip mounter |
TW383444B (en) * | 1997-06-18 | 2000-03-01 | Sez Semiconduct Equip Zubehoer | Gripper for wafer-shaped articles |
KR20020076021A (ko) * | 2001-03-27 | 2002-10-09 | (주)케이.씨.텍 | 반도체 웨이퍼 이송용 로봇의 웨이퍼 파지 장치 |
US20030072645A1 (en) * | 2001-08-09 | 2003-04-17 | Terry Murray | Edge gripping pre-aligner |
CN201931069U (zh) * | 2010-12-07 | 2011-08-17 | 浙江今飞凯达轮毂有限公司 | 一种自动取料机械手 |
CN103794537A (zh) * | 2014-02-28 | 2014-05-14 | 深圳市华龙精密模具有限公司 | 一种半导体自动排片设备的抓料机械手 |
US9049810B2 (en) * | 2010-06-14 | 2015-06-02 | Samsung Techwin Co., Ltd. | Device mounter head and device mounting method using the same |
CN207566463U (zh) * | 2017-12-13 | 2018-07-03 | 恩纳基智能科技无锡有限公司 | 一种叠层上下料装置 |
CN108336009A (zh) * | 2018-04-23 | 2018-07-27 | 中山铨镁能源科技有限公司 | 一种太阳能光伏板加工过程汇总的移栽装置 |
CN108682645A (zh) * | 2018-07-09 | 2018-10-19 | 上海世禹精密机械有限公司 | 半导体基板载具拆解下料机及其下料方法 |
CN109676912A (zh) * | 2019-01-25 | 2019-04-26 | 深圳市韵腾激光科技有限公司 | 一种摄像头模组双头切割贴片装置 |
KR102037189B1 (ko) * | 2018-07-04 | 2019-10-28 | 제너셈(주) | 반도체 패키지 로딩언로딩 장치 |
CN110797289A (zh) * | 2019-11-18 | 2020-02-14 | 大连佳峰自动化股份有限公司 | 一种半导体铜基板上料机构 |
CN210824352U (zh) * | 2019-07-30 | 2020-06-23 | 河北鑫乐医疗器械科技股份有限公司 | 一种自动上料装置 |
CN111640701A (zh) * | 2020-07-01 | 2020-09-08 | 安徽富信半导体科技有限公司 | 一种半导体元件封装用多轴自动抓料设备 |
CN212086828U (zh) * | 2020-05-20 | 2020-12-04 | 苏州格律泰新能源有限公司 | 一种smt贴片机的元件供料装置 |
CN112479059A (zh) * | 2020-10-30 | 2021-03-12 | 安徽恩大阀门机械有限公司 | 一种阀门加工用上料设备 |
WO2021056191A1 (zh) * | 2019-09-24 | 2021-04-01 | 大族激光科技产业集团股份有限公司 | 一种激光加工*** |
CN112786508A (zh) * | 2021-02-23 | 2021-05-11 | 天津环博科技有限责任公司 | 一种硅片移栽设备 |
-
2021
- 2021-08-09 CN CN202110907503.7A patent/CN113644019B/zh active Active
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0235047A2 (en) * | 1986-02-28 | 1987-09-02 | Tenryu Technics Co., Ltd. | Chip mounter |
TW383444B (en) * | 1997-06-18 | 2000-03-01 | Sez Semiconduct Equip Zubehoer | Gripper for wafer-shaped articles |
KR20020076021A (ko) * | 2001-03-27 | 2002-10-09 | (주)케이.씨.텍 | 반도체 웨이퍼 이송용 로봇의 웨이퍼 파지 장치 |
US20030072645A1 (en) * | 2001-08-09 | 2003-04-17 | Terry Murray | Edge gripping pre-aligner |
US9049810B2 (en) * | 2010-06-14 | 2015-06-02 | Samsung Techwin Co., Ltd. | Device mounter head and device mounting method using the same |
CN201931069U (zh) * | 2010-12-07 | 2011-08-17 | 浙江今飞凯达轮毂有限公司 | 一种自动取料机械手 |
CN103794537A (zh) * | 2014-02-28 | 2014-05-14 | 深圳市华龙精密模具有限公司 | 一种半导体自动排片设备的抓料机械手 |
CN207566463U (zh) * | 2017-12-13 | 2018-07-03 | 恩纳基智能科技无锡有限公司 | 一种叠层上下料装置 |
CN108336009A (zh) * | 2018-04-23 | 2018-07-27 | 中山铨镁能源科技有限公司 | 一种太阳能光伏板加工过程汇总的移栽装置 |
KR102037189B1 (ko) * | 2018-07-04 | 2019-10-28 | 제너셈(주) | 반도체 패키지 로딩언로딩 장치 |
CN108682645A (zh) * | 2018-07-09 | 2018-10-19 | 上海世禹精密机械有限公司 | 半导体基板载具拆解下料机及其下料方法 |
CN109676912A (zh) * | 2019-01-25 | 2019-04-26 | 深圳市韵腾激光科技有限公司 | 一种摄像头模组双头切割贴片装置 |
CN210824352U (zh) * | 2019-07-30 | 2020-06-23 | 河北鑫乐医疗器械科技股份有限公司 | 一种自动上料装置 |
WO2021056191A1 (zh) * | 2019-09-24 | 2021-04-01 | 大族激光科技产业集团股份有限公司 | 一种激光加工*** |
CN110797289A (zh) * | 2019-11-18 | 2020-02-14 | 大连佳峰自动化股份有限公司 | 一种半导体铜基板上料机构 |
CN212086828U (zh) * | 2020-05-20 | 2020-12-04 | 苏州格律泰新能源有限公司 | 一种smt贴片机的元件供料装置 |
CN111640701A (zh) * | 2020-07-01 | 2020-09-08 | 安徽富信半导体科技有限公司 | 一种半导体元件封装用多轴自动抓料设备 |
CN112479059A (zh) * | 2020-10-30 | 2021-03-12 | 安徽恩大阀门机械有限公司 | 一种阀门加工用上料设备 |
CN112786508A (zh) * | 2021-02-23 | 2021-05-11 | 天津环博科技有限责任公司 | 一种硅片移栽设备 |
Non-Patent Citations (2)
Title |
---|
曾进辉;陈冬兴;: "条状板材抓取机械手的研究与设计", 工业控制计算机, no. 09 * |
赵欲立;张艳红;: "剃齿机自动送料装置探讨", 中小企业管理与科技(下旬刊), no. 04 * |
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CN113644019B (zh) | 2024-03-19 |
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CP03 | Change of name, title or address | ||
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Address after: 214100 1-8-101, 1-8-201, Zone C, jinshanbei science and Technology Industrial Park, Wuxi City, Jiangsu Province Patentee after: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd. Country or region after: China Patentee after: Wuxi Research Institute of Applied Technologies Tsinghua University Address before: 214100 1-8-101, 1-8-201, Zone C, jinshanbei science and Technology Industrial Park, Wuxi City, Jiangsu Province Patentee before: ENERGY INTELLIGENT TECHNOLOGY WUXI CO.,LTD. Country or region before: China Patentee before: Wuxi Research Institute of Applied Technologies Tsinghua University |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 214000 Jiangsu Wuxi Jinshanbei Science and Technology Industrial Park C1-8 Patentee after: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd. Country or region after: China Patentee after: Wuxi Research Institute of Applied Technologies Tsinghua University Address before: 214100 1-8-101, 1-8-201, Zone C, jinshanbei science and Technology Industrial Park, Wuxi City, Jiangsu Province Patentee before: Ennaji Intelligent Equipment (Wuxi) Co.,Ltd. Country or region before: China Patentee before: Wuxi Research Institute of Applied Technologies Tsinghua University |