CN1135616C - 芯片罩盖 - Google Patents

芯片罩盖 Download PDF

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CN1135616C
CN1135616C CNB961934808A CN96193480A CN1135616C CN 1135616 C CN1135616 C CN 1135616C CN B961934808 A CNB961934808 A CN B961934808A CN 96193480 A CN96193480 A CN 96193480A CN 1135616 C CN1135616 C CN 1135616C
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CN1182499A (zh
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D�����°�
D·霍德奥
J·基尔施鲍尔
C·尼德列
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P·斯坦普卡
H-H·施特克汉
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Infineon Technologies AG
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Abstract

本发明涉及一种全部或部分地覆盖芯片的电气组件、电子组件、光电子组件和/或电气机械组件的芯片罩盖，在芯片罩盖里，有一种启动剂启动它时，能够全部地或部分地破坏芯片的各电气、电子、光电子和/或电气机械组件，它可以在试图从芯片移去罩盖时加以启动。由是，人们有可能可靠地避免对芯片不正当的分析和/或操作。

Description

芯片罩盖
本发明涉及一种全部或部分地覆盖芯片的电气组件、电子组件、光电子组件和/或电气机械组件的芯片罩盖。
这种芯片罩盖防止芯片的覆盖区域由于机械强力或环境条件而损坏。
在芯片卡、智能卡(smart card)等上安装芯片的芯片罩盖，至今是可以去除的，例如用化学方法(如用发烟硝酸处理)，这样通过相对简单的方式就可以准确分析芯片的线路和/或操作芯片线路。
进行这种芯片线路的分析和/或操作的可能性是不希望有的，因为有可能被滥用。
举例来说，付款电视领域即将使用的芯片或称为智能卡。如果一个用户成功地分析了可以允许接收某一个特定电视节目的芯片电路，即分析芯片内各部件的功能和位置和/或相互连接的线路，并获得通过适当跳线或类似方法而改变它们的性能，它因此便可以***收费服务。
这些操作的可能性不局限于付款电视领域，也可用于所有种类的进入控制合法权利的芯片，并可开辟无数可能的滥用机会，这不仅导致经济损失，而且可能导致相当严重的安全方面的后果。
本发明的任务是进一步发展芯片罩盖，它可以可靠地防止不正当的芯片分析和/或操作。
为此，根据本发明，提供了一种全部或部分地覆盖芯片的电气组件、电子组件和/或电气机械组件的芯片罩盖，其特征在于提供有一种启动剂，它在被一种溶剂启动时释放一种具有还原作用的物质，该物质能够分解芯片罩盖，或者该物质保存在芯片罩盖内尝试从芯片移去芯片罩盖。
所述启动剂在处于启动状态时，各芯片电气组件、电子组件、光电子组件和/或电气机械组件将被全部或部分地消除，它可以在试图从芯片移去其罩盖时被启动。
在此，可能的是：在移去芯片罩盖的同时，导致破坏芯片与安全相关的区域。
这样就可以可靠地防止对芯片的不正当分析和操作。
本发明的有益改进参见各附属权利要求。
本发明在下面以实施例借助于附图予以说明。
附图表示两个相互叠置的芯片，其安全相关区域由一个芯片罩盖按本发明的一个实施例予以覆盖。虽然提供的是一个截面图，然而为了表现清楚，略去了阴影。
在图中，参考数字1表示作为控制器的第一个未装盒的芯片。举例来说，具有ROM，PROM，EEPROM和RAM的西门子组件SLE 44C20可以用来作为控制器。
第一芯片1通过一个粘合剂2固定在一个***载体3上。
***载体3可以是例如一种用来构成一个芯片卡或智能卡的塑料卡，它也可以是一种柔韧的线路板或一种所谓的引线框架。
铝制各导线4，按照附图，分布在第一芯片1的上表面。
各导线4是由形式为氮化硅(Si3N4)结构薄层5的第一个芯片罩盖层所覆盖。这个薄层5是用来保护芯片免因外来影响而损坏，特别是湿气和潮雾。
Si3N4薄层5的上面是第二个芯片罩盖层，它的形式是聚酰亚胺薄层6，聚酰亚胺层6保护其下的各芯片结构免受机械损伤。
在所述芯片罩盖层5和6内具有凹坑，各铝制接触点7(铝焊接区)分布在那里。
在第一芯片1的上面是一块第二未装盒芯片8，其形式是一种ASIC组件(用户专用组件)。
第二芯片8是通过粘合剂9粘合到上述的聚酰亚胺薄层6上。
第二芯片8同样有铝制接触点7，按照附图，接触点在其上侧。
第一芯片的各接触点和第二芯片的各接触点相互间由焊接线10连接。
整个上述组合装置由一个形式为一球形顶盖(Globe top)的第三芯片罩盖11所环绕，此顶盖旨在保护上述组合装置不受外界影响和机械损伤。在上述范围内，球形顶盖的第三芯片罩盖11是环氧树脂。
以上所述，图内所示组合装置是一个芯片卡或智能卡或类似图的一部分。
第一至第三芯片罩盖5，6和11和粘合剂2一般是由可用化学方法去除的材料构成的。举例来说，发烟硝酸就适于此用，虽然它破坏芯片罩盖，但它并不破坏铝制的各导线4和各接触点7。
为了防止以这种方式可能在芯片与安全保护有关区域里发生不正当的分析和/或操作，在这些区域里，在芯片罩盖之内提供有一些启动剂。
在此要保护以防止不正当分析和操作的安全相关的区域在芯片卡、智能卡和其类似品中，是位于下方的控制器芯片1，其时各芯片相互叠置。这个区域也应该是本实施例内与安全相关的区域。
在本实施例中，启动剂是一种材料，它在遇到一种形式为溶剂、腐蚀剂等的化学溶解芯片罩盖的材料时被启动，举例来说，遇到发烟硝酸。在启动时，释放出一种具有还原作用的物质，它消毁那些铝制芯片结构，诸如各导线4，由而使得不可能对与安全保护有关的芯片区域进行不正当分析和/或操作。
在非启动状态，启动剂不浸蚀芯片。
在本实施例中，在启动剂启动之后，芯片结构被破坏，其中结构的溶解是由于化学还原。
在本实施例中，启动剂由RCl2形成。在遇到HNO3时，自由基由下列反应式产生：
。由于它们的还原性质，这些自由基破坏芯片罩盖下诸铝制结构。
使用在遇到HNO3时释放起氧化作用的物质的启动剂时，在此不能导致预期的结果，因为进行氧化的物质的作用期只有这么长，即直到在这些铝制结构的表面形成一层氧化层。这个氧化层给铝结构本身产生一种自我保护作用，因而不会破坏各铝结构。
图中参考数字12所表示的启动剂可以在安全敏感区域上以窗口式缝隙或凹坑形式提供，它们为此目的分布在Si3N4薄层5和/或聚酰亚胺薄层6里，在芯片卡、智能卡和类似品安装完成后，启动剂由芯片罩盖封装在这些缝隙或凹坑里面。
除此以外的另一种办法是：启动剂安设在聚酰亚胺载体里。
没有必要使处于非启动态的启动剂跟需要时要破坏的铝结构相接触。
启动剂的布置安排可以根据种种不同的要求而定，或根据各个芯片而定。
启动剂的门类最好与用以溶解该芯片罩盖的化学物质相适应，这样以便在任何溶剂遇到启动剂时启动剂可以可靠地按需要启动。
只要可以防止对各芯片的分析和/或操作，启动的方式可以多种选择。例如，代替上述以化学还原破坏铝结构，也可以由产生热量等方式破坏芯片。
我们也可以使用许多种不同的启动剂，按照规定的需要与不同的溶剂相反应，以便种种不同的溶剂至少每次可以启动一种启动剂。
在芯片罩盖里，我们还可以使用另一种物质按同样方式根据需要来启动启动剂。所以，启动剂物质可以不依赖于所用溶剂而加以选择，并在移去芯片罩盖时启动剂也和所需要的启动物质一样被释放出。
上面最后提到的可能性的优益处在于：即使通过一种非化学方式尝试接近安全相关芯片结构，该结构也可以被破坏。
当我们进行尝试去移去芯片罩盖时，设置在芯片罩盖中的上述启动剂使得有可能让芯片的各安全有关区域自动破坏。
考虑到要破坏结构的尺寸非常小，所提供的启动剂数量在相应的位置同样也非常小。
另一种提高防止不正当分析和/或操作芯片的安全性措施在于，安排安全相关性较小的芯片，也就是在实施例中，ASIC-芯片8，准确地置放在其它芯片安全相关的区域上方，也就是在本实施例中，准确地置放在控制器芯片1最最与安全相关的区域上方。因而，由于没有光学接近手段，芯片可以不移去罩盖而被分析和/或操作，也会成为不可能。
上述实施例涉及一种所谓软片上放芯片-芯片上放芯片结构(chip-on-chip-on-flex-Aufbau)，并使用一种芯片-和-连线组合工艺(chip-and-wire-Verbindungstechnologie)。明显不过的是：本发明不限于这样一种结构，而且也可以应用到各单个芯片，应用到以任何需要方式连结在一起任意排列的任何数目的芯片上。
此外，对根据以上说明的所使用的各种材料也没有什么限制。这些材料可以用任何其它希望的材料代替，只要这些材料能达到所希望的功能。
通过按照上述本发明的芯片罩盖设计，芯片的不正当分析和/或操作可以轻易地可靠地避免，它在很大程度上与装置的设计无关。

Claims (13)

1.全部或部分地覆盖芯片的电气组件、电子组件和/或电气机械组件的芯片罩盖，其特征在于提供有一种启动剂，它在被一种溶剂启动时释放一种具有还原作用的物质，该物质能够分解芯片罩盖，或者该物质保存在芯片罩盖内，当从芯片移去芯片罩盖时，启动剂被启动。
2.根据权利要求1的芯片罩盖，其特征在于，在一个芯片卡或一个智能卡上的未装盒的芯片可以被罩盖覆盖起来。
3.根据权利要求1或2的芯片罩盖，其特征在于，该芯片是一个控制组件或一个ASIC组件。
4.根据权利要求1或2的芯片罩盖，其特征在于，该启动剂是设置在设于芯片罩盖内的空隙里。
5.根据权利要求1或2的芯片罩盖，其特征在于，该启动剂是集成组合在罩盖材料载体内。
6.根据权利要求1的芯片罩盖，其特征在于，该芯片电气的、电子的、光电子的和/或电气机械的组件被该具有还原作用的物质破坏。
7.根据权利要求1或2的芯片罩盖，其特征在于，该芯片电气的、电子的、光电子的和/或电气机械的组件是铝结构。
8.根据权利要求1或2的芯片罩盖，其特征在于，该启动剂是RCl2。
9.根据权利要求8的芯片罩盖，其特征在于，当RCl2被启动时，一种自由基被形成。
10.根据权利要求9的芯片罩盖，其特征在于，该自由基是具有还原作用的物质。
11.根据权利要求1或2的芯片罩盖，其特征在于，该启动剂是被一种溶解芯片罩盖的溶剂所启动。
12.根据权利要求1或2的芯片罩盖，其特征在于，该启动剂是被一种存储在芯片罩盖之内的启动材料所启动。
13.根据权利要求1或2的芯片罩盖，其特征在于，一个第二芯片被安装在该芯片安全相关区域的上方。
CNB961934808A 1995-04-25 1996-04-09 芯片罩盖 Expired - Lifetime CN1135616C (zh)

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