CN113406463A

CN113406463A - Semiconductor finished product modularization testing arrangement

Info

Publication number: CN113406463A
Application number: CN202010181128.8A
Authority: CN
Inventors: 叶育廷; 陈岳宏
Original assignee: Miramems Sensing Technology Co ltd
Current assignee: Miramems Sensing Technology Co ltd
Priority date: 2020-03-16
Filing date: 2020-03-16
Publication date: 2021-09-17
Also published as: TWM616268U

Abstract

A modularized testing device for semiconductor products comprises a carrier plate with an electric connecting circuit, wherein a microcontroller, a connecting port and a combining piece are fixedly arranged on the carrier plate and are electrically connected with each other through the electric connecting circuit. And the microcontroller tests a semiconductor finished product to be tested combined with the combining piece based on the test calculation to obtain a test result.

Description

Semiconductor finished product modularization testing arrangement

[ technical field ] A method for producing a semiconductor device

The invention relates to the field of testing of semiconductor finished products, in particular to a modular testing device for function testing integration of semiconductor finished products.

[ background of the invention ]

Semiconductor finished products generally need to be shipped after being subjected to Test and confirmation function expression before leaving a factory, and Automatic Test Equipment (ATE) sold in the market meets the requirements of a large number of complex Test processes. However, for products such as micro-electro-mechanical products, which focus on mechanical function testing, the use of expensive and bulky automated testing equipment is obviously not economical. In addition, the flexible flat cable connection between the automatic test equipment and the device under test is prone to cause attenuation of transmission signals or bending damage of the flexible flat cable, which results in instability and reduced reliability. The above problems remain to be solved.

[ summary of the invention ]

The invention provides a modularized testing device, which provides a modularized hardware circuit for testing the mechanism function of a semiconductor finished product, such as a micro electro mechanical finished product, and the like, can test a device to be tested through the input test calculation of a computer, maintains the testing function of large-scale automatic testing equipment, and provides a design with low cost and simplified structure.

The invention provides a modularized testing device which is provided with a connector for fixing and butting a device to be tested, improves the flat cable connection mode of general automatic testing equipment and provides a testing scheme with high stability and high reliability.

According to the above, a semiconductor product modularized testing device comprises a carrier board including an electrical connection circuit; a microcontroller is fixedly arranged on the carrier plate; a connection port fixed on the carrier plate and electrically connected to the microcontroller via the electrical connection line, wherein an external test algorithm is input from the connection port and transmitted to the microcontroller via the electrical connection line; and a combining part is fixedly arranged on the carrier plate and is electrically connected to the microcontroller through the electric connection circuit, wherein the microcontroller tests a semiconductor product to be tested combined with the combining part based on the test calculation and obtains a test result.

[ description of the drawings ]

FIG. 1 is a block diagram of a semiconductor modular test system configured with a semiconductor modular test apparatus according to a first embodiment of the present invention.

Fig. 2 is a schematic perspective view of a semiconductor modular test apparatus according to a first embodiment of the present invention.

FIG. 3 is a block diagram of a semiconductor modular test system configured with a semiconductor modular test apparatus according to a second embodiment of the present invention.

[ notation ] to show

Modular testing device 1, 9

Hub 3

External device 5

Device under test 7

Carrier plate 11

Microcontroller 12

Electrical connection line 13

Coupling member 14

Test algorithm 15

Connection port 16

Test result 17

[ detailed description ] embodiments

The term micro-electromechanical system (MEMS final product) refers to a product that uses a micro-electromechanical system (MEMS) element as a main function, and the application range of the MEMS product includes, for example but not limited to, a micro-actuator, a biochip, a micro-accelerometer, a gravity sensor, a micro-gyroscope, a micro-magnetometer, or a chemical micro-sensor. The product can be a chip package product with a normal semiconductor package, or a product with a chip fixed on a hard circuit board or a flexible board. The micro electro mechanical system product has a conductive pad (pad), a conductive pin (pin), a solder ball or a conductive connection (lead) for conductive connection.

The test algorithm (testing algorithm) referred to in the following includes test condition (test condition) and algorithm (algorithm), such as, but not limited to, different reference clock signals, start condition signal, end condition signal, read/write command or transfer command, etc. Next, the testing algorithm of the present invention is stored in an external device, such as a general-purpose computer, and the computer is used for illustration, but the device electrically connected to the modular testing device of the present invention is not limited to the computer, and other external devices, such as a memory card, can be used as the external device of the present invention.

A Device Under Test (DUT) referred to hereinafter in the present invention is known as an object to be tested that is connected by a transmission line such as a flat cable using Automatic Test Equipment (ATE). Although the following embodiments are illustrated with micro-electromechanical products, semiconductor products with conductive connections can be used as the dut of the present invention, such as CMOS ICs.

Fig. 1 is a block diagram of a semiconductor modular test system configured with a semiconductor modular test apparatus according to a first embodiment of the present invention, and fig. 2 is a perspective diagram of the semiconductor modular test apparatus according to the first embodiment. Referring to fig. 1 and 2, the modular testing device 1 includes a MicroController 12 (MCU), a connecting element 14 and a connection port 16, wherein the MicroController 12 is electrically connected to the connecting element 14 and the connection port 16 through an electrical connection line 13, and the electrical connection line 13 is electrically connected to other passive components (not shown). In the present invention, the modular testing device 1 has an appearance with a specific shape and a size corresponding to a postcard, for example, a length of 14.8 cm × 10.5 cm, but is not limited to a regular or irregular shape. In practice, the modular testing apparatus 1 has a carrier 11, such as an insulating substrate, and the electrical connection circuit 13 is formed on the carrier 11 in a suitable manner to form a printed circuit board, wherein the microcontroller 12, the bonding element 14 and the connection port 16 are all fixed on the carrier 11, it can be understood that the arrangement positions of the microcontroller 12, the bonding element 14 and the connection port 16 are not limited to the same surface of the carrier 11, but may be different surfaces of the carrier 11. In addition, since the carrier 11 can be a printed circuit board, the carrier 11 can also optionally include other conductive connections for connecting other devices, the carrier 11 can be a single layer or a multi-layer board, and the electrical connection circuit 13 can include vias and wires (not shown) in the carrier 11. Therefore, compared to the conventional automatic testing equipment, the modular testing apparatus 1 of the present invention not only has a small size and is portable, but also can be installed or fixed on other mechanisms as required by taking advantage of the small size. Therefore, compared with the automatic testing equipment with huge volume, the user can apply the modular testing device 1 of the present invention without planning a large machine space.

With continued reference to fig. 1 and 2, the modular test apparatus 1 is electrically connected and coupled to a device under test 7 by a bonding member 14, and is connected to a hub 3(hub) through a connection port 16, and the hub 3 is further connected to an external device 5. In one embodiment, the connection port 16, such as, but not limited to, a Universal Serial Bus (USB) connector or interface conforming to a specification, may be connected to the hub 3 by a wire or a male-female connector. The hub 3 generally comprises a plurality of connectors (connectors), and may have the same or different specifications. It is understood that the hub 3 has a plurality of connectors connected to a plurality of wires or wires, which are not described herein. Next, the bonding element 14, such as a socket or socket (socket) or a connector (connector), can provide electrical connection and fixing functions, that is, when the device under test 7 is connected to the bonding element 14, the device under test 7 not only can transmit electrical signals through the bonding element 14, but also can be temporarily fixed on the carrier board 11 of the modular testing apparatus 1 by the bonding element 14. Therefore, compared with the conventional automatic test equipment which uses a flexible flat cable to connect the tested device, the combination part 14 of the modular test device 1 of the present invention directly connects with the tested device 7, thereby eliminating the disadvantage of signal attenuation caused by transmission of transmission lines, solving the problem of flexural damage of the flexible flat cable, and providing a test scheme with high stability and high reliability.

Referring to fig. 1 and 2, a user can input or store a test algorithm 15 through an external device 5, such as a computer or a memory card, and the test algorithm 15 is transmitted to the modular test apparatus 1 through the hub 3 via the connection port 16, wherein the test algorithm 15 is further transmitted through the electrical connection line 13 of the modular test apparatus 1 and written into the microcontroller 12. The microcontroller 12 tests the device under test 7 coupled to the bonding element 14 based on the test algorithm 15 and obtains a test result 17. In other words, the user can write the test algorithm 15 outputted from the external device 5 into the modular test apparatus 1 and test the device under test 7 by the operation of the external device 5, and the test result 17 can be synchronously returned to the modular test apparatus 1 or/and the external device 5. It is understood that the tested device 7, such as a mems device or other semiconductor device, responds to the electrical signal of the test algorithm 15 and transmits the electrical signal back to the microcontroller 12 through the connector 14 and the electrical connection line 13 to obtain the test result 17, and the test result 17 can also be transmitted back to the external device 5 through the electrical connection line 13, the connection port 16 and the hub 3, and displayed or/and stored in the external device 5 according to the requirement. The test result 17 is, in the case of the mems product as the device under test 7, for example, the performance of the mechanism function such as rotation, atmospheric pressure or force, and the like, but the present invention is not limited thereto. Therefore, compared with the conventional automatic test equipment which takes time to input the test algorithm into the automatic test equipment, for the function to be tested which is not a high-end function, the user only needs to input the test algorithm 15 into any appropriate external device 5, and the external device 5 is communicated with the modular test device 1 of the present invention, so that the test algorithm 15 can be written into and executed quickly, thereby saving the time for executing the test of the device under test 7 such as semiconductor products.

Referring to fig. 1 and 2, the conventional USB interface has a power signal pin, so that the power required for the operation of the modular test apparatus 1 can be obtained from the external device 5 through the hub 3 in addition to receiving the test algorithm 15 from the external device 5. It is understood that the modular test apparatus 1 may also be configured with a power storage (not shown) for storing power. Furthermore, the general hub 3 is only connected to a single connection port of the external device 5, such as a USB interface conforming to USB specification, so that when the external device 5 and the modular testing device 1 are connected through the hub 3 in this embodiment, the modular testing device 1 only occupies a single interface of the external device 5, and the micro-controller 12 can perform the testing operation of the mems product. Therefore, the modular test device 1 of the present invention occupies very little interface resources of the external device 5, and can achieve the features that the common automatic test equipment machines sold in the market can not realize.

FIG. 3 is a second embodiment of the modular test apparatus of the present invention. Compared to the first embodiment, the modular test apparatus 9 of the second embodiment has a plurality of connection ports 16, a plurality of microcontrollers 12 and a plurality of bonding members 14, which corresponds to the integration of the hub 3 of the first embodiment into the modular test apparatus 9. It is understood that the plurality of connection ports 16 included in the modular test apparatus 9 may be USB connectors, USB interfaces, or other connection interface designs of the same or different specifications. According to the above, the modular test device of the invention is a hardware circuit with low cost and simplified structure, has the advantage of exquisite volume, and can be combined with different test jigs to achieve the result of modular test. Compared with an automatic test equipment machine station which is expensive and occupies a large space, the modularized test device provided by the invention not only has executable test functions, but also can provide a test scheme with high stability and high reliability.

The above-described embodiments are merely illustrative of the technical spirit and features of the present invention, and the object of the present invention is to enable those skilled in the art to understand the content of the present invention and to implement the same, and the scope of the present invention should not be limited by the above-described embodiments, i.e., all equivalent changes and modifications made in the spirit of the present invention should be covered by the scope of the present invention.

Claims

1. A semiconductor product modularized testing device is characterized by comprising:

a carrier including an electrical connection line;

a microcontroller is fixedly arranged on the carrier plate;

a connection port fixed on the carrier plate and electrically connected to the microcontroller via the electrical connection line, wherein an external test algorithm is input from the connection port and transmitted to the microcontroller via the electrical connection line; and

and a connecting part is fixedly arranged on the carrier plate and is electrically connected to the microcontroller through the electric connecting circuit, wherein the microcontroller tests a semiconductor product to be tested combined with the connecting part based on the test calculation to obtain a test result.

2. The device for testing modularity of semiconductor products as claimed in claim 1, wherein said test result is transmitted to said connection port through said junction element via said electrical connection line and said microcontroller, and then transmitted to the outside of said device for testing modularity.

3. The device of claim 1, wherein the connection port comprises a USB interface or a USB connector.

4. The device for modular testing of finished semiconductors of claim 1, wherein the bonding member comprises a slot or a connector.

5. The device for testing modularity of claim 1 wherein said carrier and said electrical connections comprise a printed circuit board.

6. The apparatus of claim 1, wherein the semiconductor product under test is a micro-electromechanical product.

7. The apparatus of claim 6, wherein the test results comprise performance of a plurality of mechanical functions.

8. The apparatus of claim 1, wherein the testing algorithm is transmitted from a computer to the connection port via a hub.

9. The device of claim 8, wherein the computer provides power to the device through the hub.