CN104035019A - Semiconductor circuit testing device and switching module thereof - Google Patents
Semiconductor circuit testing device and switching module thereof Download PDFInfo
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- CN104035019A CN104035019A CN201310072496.9A CN201310072496A CN104035019A CN 104035019 A CN104035019 A CN 104035019A CN 201310072496 A CN201310072496 A CN 201310072496A CN 104035019 A CN104035019 A CN 104035019A
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Abstract
The embodiment of the invention provides a semiconductor circuit testing device and a switching module thereof. The switching module is used for electrically connecting a backplane board of the semiconductor circuit testing device and a test veneer. The backplane board is provided with a plurality of connecting interfaces at least used for transmitting control signals. The switching module includes a first electrical pin, a second electrical pin and a control module. The first electrical pin and the second electrical pin are respectively coupled to the backplane board and the test veneer, and the first electrical pin and the second electrical pin have different hardware specifications. The control module is controlled by a semiconductor control signal to drive a test program on the test veneer and convert the test program from a first instruction format which can be identified by the test veneer into a second instruction format which can be identified by the semiconductor circuit testing device. Therefore, the switching module provided by the embodiment of the invention can drive test veneers of different specifications.
Description
Technical field
The present invention is about a kind of semiconductor circuit proving installation and interconnecting module thereof, particularly about a kind of semiconductor circuit proving installation and interconnecting module thereof of testing single-board of the different size of transferring.
Background technology
Along with scientific and technological progress, the function of semiconductor circuit is maked rapid progress too, and the function of carrying is more and more diversified.Traditionally, semiconductor circuit, before dispatching from the factory, tends to through a series of test procedure, all normal to determine the various functions in semiconductor circuit.Described a series of test procedure can be carried out through the proving installation by one or more conventionally, and described proving installation can be used to a batch ground measurement semiconductor circuit to be measured.In general, proving installation can an external computer or other be suitable for user and input the equipment of instruction, set project, the parameter of test or the details of other test procedures of test by user.Proving installation is controlled by described computer and carries out corresponding test procedure, and whether the function of return in semiconductor circuit be normal.
Traditionally, in proving installation, can have some testing single-boards, each testing single-board can be carried out the test procedure presetting, and proving installation is by starting corresponding testing single-board with measuring semiconductor circuit.But the testing single-board that Ge Jia manufacturer manufactures mostly can not be general, reason is hardware specification and the order format difference that drives firmware.When user's wish is used proving installation that different vendor manufactures and when testing single-board, often needs external switching cabinet.But external switching machine case is bulky, and not necessarily compatible with proving installation, also not convenient in use.In addition,, if user does not purchase switching cabinet, just need proving installation and the testing single-board of complete purchase with manufacturer, lack the elasticity of freely selecting.Therefore, industry needs a kind of semiconductor circuit proving installation and interconnecting module thereof, the described interconnecting module semiconductor-on-insulator circuit test device of can directly the testing single-board of different size directly being transferred, thus exempt the inconvenience that uses the cabinet of transferring.
Summary of the invention
In view of this, the invention reside in and propose a kind of semiconductor circuit proving installation, there is pluggable interconnecting module, and the testing single-board of the described interconnecting module control different size of process, the convenience of user in the time of test semiconductor circuit to be measured promoted.
The embodiment of the present invention provides a kind of semiconductor circuit proving installation, optionally connecting test veneer of described semiconductor circuit proving installation, and testing single-board stores test procedure.Described semiconductor circuit proving installation comprises base plate (backplane board) and interconnecting module.Described base plate has most connecting interfaces, at least in order to transmit a control signal.Described interconnecting module comprises the first electrical pin, the second electrical pin and control module.The first electrical pin is in order to optionally to couple base plate, and the second electrical pin is in order to optionally to couple testing single-board, and the first electrical pin has different hardware specifications from the second electrical pin.Control module couples base plate and testing single-board, be controlled by described control signal to drive the test procedure on testing single-board, and by test procedure by the first order format that can tested veneer identification, converting to can be by the second order format of semiconductor circuit proving installation identification.
In the present invention's one example embodiment, interconnecting module has more substrate, and substrate definition has upper surface, lower surface, and with upper surface and the adjacent outer peripheral edges side of lower surface, the first electrical pin is arranged on described outer peripheral edges side.In addition, the upper surface of substrate is formed with sunk structure, and sunk structure is in order to accommodating testing single-board, and the sidewall of sunk structure is defined as the inner peripheral side of substrate, and the second electrical pin is arranged on described inner peripheral side.
In addition, the invention reside in and propose a kind of interconnecting module, described interconnecting module is pluggable to be installed in semiconductor circuit proving installation, make semiconductor circuit proving installation can pass through the testing single-board of described interconnecting module control different size, promote the convenience of user in the time of test semiconductor circuit to be measured.
The embodiment of the present invention provides a kind of interconnecting module, and described interconnecting module is for being optionally electrically connected semiconductor circuit proving installation and testing single-board.Semiconductor circuit proving installation has base plate, and testing single-board stores test procedure.Described interconnecting module comprises the first electrical pin, the second electrical pin and control module.The first electrical pin is in order to optionally to couple base plate, and the second electrical pin is in order to optionally to couple testing single-board, and the first electrical pin has different hardware specifications from the second electrical pin.Control module couples base plate and testing single-board, be controlled by a control signal to drive the test procedure on testing single-board, and by test procedure by the first order format that can tested veneer identification, converting to can be by the second order format of semiconductor circuit proving installation identification.
In sum, the semiconductor circuit proving installation that the embodiment of the present invention provides and interconnecting module thereof must not use external switching cabinet, save the space that switching cabinet is set.In addition, described interconnecting module can be changed different order format, makes semiconductor circuit proving installation can directly control the testing single-board that different vendor manufactures.In addition, the testing single-board that different vendor manufactures can be connected to interconnecting module, and is set directly in semiconductor circuit proving installation, promotes user's operation ease.Because user does not need semiconductor circuit proving installation and the testing single-board of complete purchase with manufacturer, the semiconductor circuit proving installation that the embodiment of the present invention provides and interconnecting module thereof have more improved user freely selects the elasticity of testing single-board.
For enabling further to understand feature of the present invention and technology contents, refer to following about detailed description of the present invention and accompanying drawing, but these explanations and appended graphic the present invention that are only used for illustrating but not are done any restriction to interest field of the present invention.
Brief description of the drawings
Fig. 1 illustrates the schematic perspective view according to the interconnecting module of the present invention's one example embodiment.
Fig. 2 illustrates the schematic perspective view according to the semiconductor circuit proving installation of the present invention's one example embodiment.
Fig. 3 illustrates the functional block diagram according to the semiconductor circuit proving installation of the present invention's one example embodiment.
[symbol description]
1: interconnecting module
10: substrate
10a: upper surface
10b: lower surface
10c: outer peripheral edges side
102: sunk structure
102a: inner peripheral side
12: the first electrical pins
14: the second electrical pins
16: control module
18: the three electrical pins
20: on-off element
162: transformer
3: semiconductor circuit proving installation
30: base plate
32: cell body
4: testing single-board
5: support plate
6: semiconductor circuit to be measured
Embodiment
Refer to Fig. 1, Fig. 1 illustrates the schematic perspective view according to the interconnecting module of the present invention's one example embodiment.As shown in Figure 1, interconnecting module 1 has substrate 10, the first electrical pin 12, the second electrical pin 14, control module 16, the 3rd electrical pin 18 and on-off element 20.Substrate 10 has upper surface 10a, lower surface 10b and outer peripheral edges side 10c, and outer peripheral edges side 10c is adjacent with upper surface 10a and lower surface 10b respectively.In an example, substrate 10 is a rectangular thin plate, and upper surface 10a is parallel to lower surface 10b, and outer peripheral edges side 10c is perpendicular to upper surface 10a and lower surface 10b.As shown in Figure 1, the outer peripheral edges side 10c of interconnecting module 1 refers to the side in substrate 10 outsides, and the present embodiment does not limit the first electrical pin 12 and be arranged on long side or the short side in substrate 10 outsides, can freely select in person of ordinary skill in the field.
In addition, the substrate 10 that Fig. 1 illustrates carries the first electrical pin 12, the second electrical pin 14, control module 16, the 3rd electrical pin 18 and on-off element 20, but the present invention component kind or quantity that restricting substrate 10 does not carry.For instance, substrate 10 more can be in order to carry plural on-off element 20 or other suitable elements.Although note that Fig. 1 does not illustrate the electrical connection between each element, control module 16 at least can be electrically connected respectively the first electrical pin 12, the second electrical pin 14, the 3rd electrical pin 18 and on-off element 20.
Please continue referring to Fig. 1, the upper surface 10a of substrate 10 is formed with sunk structure 102, and sunk structure 102 is not in order to accommodating testing single-board (being illustrated in Fig. 1).In practice, described testing single-board at least stores a test procedure, and in the time that testing single-board is driven and starts, described test procedure can be used for testing semiconductor circuit to be measured (not being illustrated in Fig. 1).At this, sunk structure 102 is depressed in upper surface 10a to I haven't seen you for ages, and described testing single-board can be placed in sunk structure 102.The present embodiment does not limit testing single-board and must be placed on completely in sunk structure 102, in other words, and the also testing single-board of accommodating part only of sunk structure 102.
In an example, sunk structure 102 can be defined as a hollow space of substrate 10, and sunk structure 102 is through to lower surface 10b from the upper surface 10a of substrate 10.As shown in Figure 1, the sidewall of sunk structure 102 may be defined as the inner peripheral side 102a of substrate 10, and inner peripheral side 102a and aforesaid outer peripheral edges side 10c are not continuous side.At this, it is upper that the second electrical pin 14 is arranged on inner peripheral side 102a, and the first electrical pin 12 has different hardware specifications from the second electrical pin 14.For instance, the first electrical pin 12 is the base plates (backplane board) (not being illustrated in Fig. 1) for being optionally electrically connected semiconductor circuit proving installation.Described base plate has most connecting interfaces, at least can transmit a control signal, and the first electrical pin 12 can be electrically connected on base plate most individual connecting interfaces one of them.The second electrical pin 14 should be the testing single-board that optionally couples different vendor's manufacturing.Therefore, the first electrical pin 12 has same hardware specification with described connecting interface, and can the corresponding default hardware specification of manufacturer (for example special, non-common specification) of manufacturing semiconductor circuit proving installation.The second electrical pin 14 can corresponding institute the hardware specification of testing single-board of wish switching, the hardware specifications such as such as PXI, PCI, PXI-e or PCI-e.Certainly, the present embodiment does not limit the first electrical pin 12 and the corresponding hardware specification of the second electrical pin 14 at this, as long as the hardware specification of the first electrical pin 12 and the second electrical pin 14 is different, belongs to the disclosed category of the embodiment of the present invention.
Base plate and the testing single-board of control module 16 coupling semiconductor circuit test devices.In addition, control module 16 is controlled by semiconductor circuit proving installation to drive the test procedure on testing single-board, and by test procedure by the first order format that can tested veneer identification, converting to can be by the second order format of semiconductor circuit proving installation identification.In practice, control module 16 can be preset with a function library, the predeterminable common applied order format of testing single-board on the market of described function library.Thereby in the time that the testing single-board of different vendor is connected upper interconnecting module 1, the type that control module 16 can Fast Identification testing single-board, and call out out the function that is applicable to controlling described testing single-board.By this, control module 16 just can be integrated into the order format of various different testing single-boards one can be by the order format of semiconductor circuit proving installation identification, and user can be given an order to semiconductor circuit proving installation, and directly drive or control testing single-board.From the angle of practical operation, interconnecting module 1 can be integrated third-party testing single-board, and third-party testing single-board is converted to a part for semiconductor circuit proving installation, make test process more fast, more easily operation.
Although note that it can be a wafer that the present embodiment has illustrated control module 16, and be arranged on the substrate 10 of interconnecting module 1.But in fact control module 16 also can be disconnected from each other with substrate 10.For instance, control module 16 can be also an equipment that is arranged on semiconductor circuit proving installation outside, and couples base plate and testing single-board by cable.Accordingly, as long as there is an electronic component can change conversion instruction form between semiconductor circuit proving installation and testing single-board, all should belong to the category of the disclosed control module 16 of the present embodiment.
Please continue referring to Fig. 1, on the outer peripheral edges side 10c of substrate 10, more can there is the 3rd electrical pin 18, the 3rd electrical pin 18 is in order to couple support plate (load board) (not being illustrated in Fig. 1), and on support plate, can be provided with at least one semiconductor circuit to be measured (not being illustrated in Fig. 1).For instance, the 3rd electrical pin 18 can have most the probes that protrude, and described multiple probe can directly be resisted against the metallic conduction sheet on support plate, makes interconnecting module 1 to be electrically connected semiconductor circuit to be measured through support plate.At this, the present embodiment does not limit the coupling mode of the 3rd electrical pin 18 and support plate, and person of ordinary skill in the field can freely design.
On the other hand, interconnecting module 1 more can have at least one on-off element 20, and on-off element 20 is in order to select whether export signal in interconnecting module 1 to semiconductor circuit to be measured.In an example, on-off element 20 can be relay or other suitable elements.In practice, due to the testing single-board that a support plate can connect many interconnecting modules 1 or must not transfer simultaneously, be electrically connected these interconnecting modules 1 simultaneously and may cause interference to the test result of semiconductor circuit to be measured with testing single-board.Accordingly, if the corresponding test procedure of interconnecting module 1 is not performed, user can be by gauge tap element 20 to cut off the electric connection of interconnecting module 1 and semiconductor circuit to be measured, to avoid the test result of semiconductor circuit to be measured to be subject to the circuit of redundancy or different test procedure interference.
In order to make this person of ordinary skill in the field be easier to understand the mutual relationship between the each element of semiconductor circuit proving installation of the present invention, please also refer to Fig. 1 and Fig. 2.Fig. 2 illustrates the schematic perspective view according to the semiconductor circuit proving installation of the present invention's one example embodiment.As shown in the figure, semiconductor circuit proving installation 3 is optionally electrically connected testing single-board 4 through interconnecting module 1, and semiconductor circuit proving installation 3 has base plate 30 and at least one pluggable interconnecting module 1.The interconnecting module 1 that Fig. 2 illustrates is identical with Fig. 1 haply, and the present embodiment does not repeat them here.As shown in Figure 2, on base plate 30, should there are at least one and the first electrical pin 12 corresponding connecting interfaces (not illustrating), the first electrical pin 12 of interconnecting module 1 can be plugged on one of them connecting interface one to one.In addition, testing single-board 4 also should have one the second corresponding slot of electrical pin 14 or plug, makes testing single-board 4 can couple interconnecting module 1.
In practice, semiconductor circuit proving installation 3 can be electrically connected an outside computer, and user can, by the described computer of operation to export described control signal, control semiconductor circuit proving installation 3 by this.That is to say, described computer can be preset with a set of system program, and described system program is can be by the second order format of semiconductor circuit proving installation 3 identifications, can be used to call out the testing single-board 4 being embedded on interconnecting module 1.Then, by default function library in the control module 16 of interconnecting module 1, dynamically change described the second order format become can tested veneer 4 identifications the first order format, testing single-board 4 can be controlled by user expediently.
Please continue referring to Fig. 2, semiconductor circuit proving installation 3 has the cell body 32 of an accommodating interconnecting module 1, and the 3rd electrical pin 18 of interconnecting module 1 is exposed to the opening part of cell body 32, makes the 3rd electrical pin 18 be suitable for being electrically connected support plate.Haply, substrate 10 thickness of the thickness of testing single-board 4 and interconnecting module 1 are suitable, and while making testing single-board 4 be contained in sunk structure 102, testing single-board 4 can not protrude from upper surface 10a and the lower surface 10b of substrate 10.
In order to make this person of ordinary skill in the field be easier to understand the relation of semiconductor circuit proving installation, support plate and semiconductor circuit to be measured, please also refer to Fig. 2 and Fig. 3.Fig. 3 illustrates the functional block diagram according to the semiconductor circuit proving installation of the present invention's one example embodiment.As shown in the figure, semiconductor circuit proving installation 3 has base plate 30 and is plugged on the interconnecting module 1 on base plate 30.Because the 3rd electrical pin 18 of interconnecting module 1 is exposed to cell body 32, make support plate 5 can couple easily each interconnecting module 1 (or other testing single-boards that must not transfer), and on support plate 5, can couple the semiconductor circuit to be measured 6 that exceedes.In practice, support plate 5 can distribute the interconnecting module 1 of appointment to the semiconductor circuit to be measured 6 of specifying, and makes different semiconductor circuits to be measured 6 can carry out test procedure simultaneously.Specifically, different semiconductor circuits to be measured 6 can be carried out an identical test procedure (corresponding same interconnecting module 1 or the testing single-board that must not transfer) simultaneously, or can carry out different test procedure (corresponding different the interconnecting modules 1 or testing single-board that must not transfer) simultaneously.Accordingly, the semiconductor circuit proving installation 3 of the present embodiment can the plural semiconductor circuit 6 to be measured of many field testings, to accelerate testing process.
In sum, the semiconductor circuit proving installation that the embodiment of the present invention provides and interconnecting module thereof must not use external switching cabinet, save the space that switching cabinet is set.In addition, described interconnecting module can be changed different order format, makes semiconductor circuit proving installation can directly control the testing single-board that different vendor manufactures.In addition, the testing single-board that different vendor manufactures can be connected to interconnecting module, and is set directly in semiconductor circuit proving installation, promotes user's operation ease.Because user does not need semiconductor circuit proving installation and the testing single-board of complete purchase with manufacturer, the semiconductor circuit proving installation that the embodiment of the present invention provides and interconnecting module thereof have more improved user freely selects the elasticity of testing single-board.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and not with above-mentioned disclosed preferred embodiment, category of the present invention is limited.On the contrary, its objective is that hope can contain in the category of the scope of the claims of being arranged in of various changes and tool equality institute of the present invention wish application.
Claims (10)
1. a semiconductor circuit proving installation, is optionally electrically connected a testing single-board, and this testing single-board stores a test procedure, it is characterized in that, this semiconductor circuit proving installation comprises:
One base plate, has most connecting interfaces, at least in order to transmit a control signal; And
At least one interconnecting module, comprising:
One first electrical pin, in order to optionally couple those connecting interfaces one of them;
One second electrical pin, in order to optionally to couple this testing single-board, this first electrical pin has different hardware specifications from this second electrical pin; And
One control module, couple this base plate and this testing single-board, be controlled by this control signal to drive this test procedure on this testing single-board, and by this test procedure by by one first order format of this testing single-board identification, convert to by one second order format of this semiconductor circuit proving installation identification.
2. semiconductor circuit proving installation as claimed in claim 1, it is characterized in that, this interconnecting module has more a substrate, this substrate definition has a upper surface, a lower surface, and an outer peripheral edges side adjacent with this upper surface and this lower surface, this first electrical pin is arranged on this outer peripheral edges side.
3. semiconductor circuit proving installation as claimed in claim 2, it is characterized in that, this upper surface of this substrate is formed with a sunk structure, this sunk structure is in order to accommodating this testing single-board, and the sidewall of this sunk structure is defined as an inner peripheral side of this substrate, this second electrical pin is arranged on this inner peripheral side.
4. semiconductor circuit proving installation as claimed in claim 3, is characterized in that, this sunk structure is through to this lower surface from this upper surface of this substrate.
5. semiconductor circuit proving installation as claimed in claim 3, is characterized in that, this interconnecting module more comprises one the 3rd electrical pin, and the 3rd electrical pin, in order to couple a support plate, is provided with at least one semiconductor circuit to be measured on this support plate.
6. an interconnecting module, for optionally connecting semiconductor circuit test device and a testing single-board, this semiconductor circuit proving installation has a base plate, and this testing single-board stores a test procedure, it is characterized in that, and this interconnecting module comprises:
One first electrical pin, in order to optionally to couple this base plate;
One second electrical pin, in order to optionally to couple this testing single-board, this first electrical pin has different hardware specifications from this second electrical pin; And
One control module, couple this base plate and this testing single-board, be controlled by a control signal to drive this test procedure on this testing single-board, and by this test procedure by by one first order format of this testing single-board identification, convert to by one second order format of this semiconductor circuit proving installation identification.
7. interconnecting module as claimed in claim 6, it is characterized in that, have more a substrate, this substrate definition has a upper surface, a lower surface, and an outer peripheral edges side adjacent with this upper surface and this lower surface, this first electrical pin is arranged on this outer peripheral edges side.
8. interconnecting module as claimed in claim 7, it is characterized in that, this upper surface of this substrate is formed with a sunk structure, this sunk structure is in order to accommodating this testing single-board, and the sidewall of this sunk structure is defined as an inner peripheral side of this substrate, this second electrical pin is arranged on this inner peripheral side.
9. interconnecting module as claimed in claim 8, is characterized in that, this sunk structure is through to this lower surface from this upper surface of this substrate.
10. interconnecting module as claimed in claim 8, is characterized in that, more comprises one the 3rd electrical pin, and the 3rd electrical pin, in order to couple a support plate, is provided with at least one semiconductor circuit to be measured on this support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310072496.9A CN104035019B (en) | 2013-03-07 | 2013-03-07 | Semiconductor circuit test device and interconnecting module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310072496.9A CN104035019B (en) | 2013-03-07 | 2013-03-07 | Semiconductor circuit test device and interconnecting module thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104035019A true CN104035019A (en) | 2014-09-10 |
| CN104035019B CN104035019B (en) | 2016-12-28 |
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| CN201310072496.9A Active CN104035019B (en) | 2013-03-07 | 2013-03-07 | Semiconductor circuit test device and interconnecting module thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113406463A (en) * | 2020-03-16 | 2021-09-17 | 苏州明皜传感科技有限公司 | Semiconductor finished product modularization testing arrangement |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532612A (en) * | 1994-07-19 | 1996-07-02 | Liang; Louis H. | Methods and apparatus for test and burn-in of integrated circuit devices |
| US6314034B1 (en) * | 2000-04-14 | 2001-11-06 | Advantest Corp. | Application specific event based semiconductor memory test system |
| CN2438174Y (en) * | 2000-08-08 | 2001-07-04 | 华硕电脑股份有限公司 | Test tool switching device |
| JP2002162450A (en) * | 2000-11-22 | 2002-06-07 | Mitsubishi Electric Corp | Testing device of semiconductor integrated circuit, and test method of the semiconductor integrated circuit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113406463A (en) * | 2020-03-16 | 2021-09-17 | 苏州明皜传感科技有限公司 | Semiconductor finished product modularization testing arrangement |
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| CN104035019B (en) | 2016-12-28 |
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