CN1635388A - Ball grid array substrate detecting device and constructive method thereof - Google Patents
Ball grid array substrate detecting device and constructive method thereof Download PDFInfo
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- CN1635388A CN1635388A CN 200310123414 CN200310123414A CN1635388A CN 1635388 A CN1635388 A CN 1635388A CN 200310123414 CN200310123414 CN 200310123414 CN 200310123414 A CN200310123414 A CN 200310123414A CN 1635388 A CN1635388 A CN 1635388A
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Abstract
This invention relates to a ball grating array base plate test device and its structure method, which comprises the following steps: setting at least one signal plug in one circuit board test bench supportive board; using at least one signal line electrically connected to the signal plug so to select the relative signal plug connecting to the microprocessor in the bench by putting one circuit test location module or one BGA test location module; dong the test program to the circuit board in the circuit board module or the BGA board in BGA module; displaying the result on the result output device connected to one microprocessor.
Description
Technical field
The present invention relates to a kind of ball grid array base plate (BGA) pick-up unit and constructive method thereof, it mainly is module to be put in BGA test be placed on the circuit board testing board by a signal line, and obtained testing goal by to be allowed a ball grid array base plate to be measured whereby.
Background technology
Generally speaking, possess the ball grid array base plate (BGA) that many pin counts are arranged and mainly be and be used to the fixing chip (chip) that has been cut, and as the connecting tube of chip and external circuit, so extensively be used in electronic product or the semiconductor subassembly.And along with the size downsizing and the diverse designer trends of function of chip, ball grid array base plate also must increase its corresponding pin count thereupon, possesses the pin circuit of trickleer densification, and therefore, the detection of substrate finished product has its importance.
Ball grid array base plate pick-up unit commonly used, as shown in Figure 1, BGA proving installation 10 mainly includes a BGA tester table 11, on BGA tester table 11, be provided with one and can put the loading plate 13 of module 15 in order to carry BGA test, and be provided with a module board 155 in the BGA test storing module 15, and can be electrically connected on a microprocessor 17 by one first transmission line 175, when causing a BGA substrate 18 to be measured to be placed in the module board 155, can be via the effect of module board 155 and microprocessor 17 short-circuit test that breaks (Open/Short test), module testing (Componenttest), BGA Ji draws diode test (BGA Clamping Diode test), empty weldering test, NAND NAND Tree test, various trace routines such as distance XOR Tree test.And the result who is detected can be shown in the display 19, is beneficial to the user and observes.Certainly, this display 19 can be electrically connected with microprocessor 17 by one second transmission line 179.
Though above-mentioned BGA proving installation 10 can carry out various testings to BGA substrate 18 to be measured, but also need special BGA tester table 11, microprocessor 17 and a display 19 in order to detect BGA substrate 18 to be measured, not only increase purchase cost, also occupy limited usage space.
In addition, in various electronic motor industries, regular meeting prepares that the circuit board testing device that possesses various electric circuit inspection functions is arranged, for example online circuit board test device (ICT), global function circuit board automatic detection device (ATE) or electric circuit inspection equipment, as shown in Figure 2.Circuit board testing device 20 mainly includes a circuit board testing board 21, on circuit board testing board 21, be provided with one and can put the loading plate 23 of module 25 in order to carry a circuit board testing, and be provided with a module board 255 in the circuit board testing storing module 25, and can be electrically connected on a microprocessor 27 by one first transmission line 275, cause a circuit board under test 28 to be placed in circuit board testing when putting in the module 25, can accept the effect of module board 255 and microprocessor 27 and the short-circuit test that breaks (Open/Short test), module testing (Componenttest), the resistance value test, various trace routines such as power test.And the result who is detected can be shown in the display 29, is beneficial to the user and inspects.Certainly, this display 29 can be electrically connected with microprocessor 27 by one second transmission line 279.
Comparator circuit board test device 20 and BGA proving installation 10 are as can be known, it all has a microprocessor 27 and display 29, and all has separately a board 11,21, but must buy different proving installations because of the difference of product to be measured, not only the waste on apprentice's increasing purchase buy basis has also occupied limited usage space.
Therefore, how to design a kind of ball grid array base plate proving installation of novelty, can combine cleverly, not only can enlarge the usable range of circuit board testing board with circuit board testing device, also can save the purchase cost of testing apparatus, this is invention emphasis of the present invention.
Summary of the invention
Fundamental purpose of the present invention, be to provide a kind of ball grid array base plate proving installation, module is put in its BGA test can share a circuit board testing board with a circuit board testing module, and the equipment in the shared circuit board testing board, is minimized the purchase cost of testing apparatus whereby.
Secondary objective of the present invention is to provide a kind of ball grid array base plate proving installation, and module is put in its BGA test can share a circuit board testing board with a circuit board testing module, is saved the occupied usage space of testing apparatus whereby.
Another purpose of the present invention is to provide a kind of ball grid array base plate proving installation, and module is put in its BGA test can share a circuit board testing board with a circuit board testing module, can be enlarged the usable range of circuit board testing board whereby.
Another purpose of the present invention is to provide a kind of ball grid array base plate proving installation, and the design that module can be passed through a rotating disc is put in its BGA test, and improves operation convenience and test accuracy.
Another purpose of the present invention, be to provide a kind of constructive method of ball grid array base plate pick-up unit, it utilizes a signal line can cause BGA test storing module to be used for a circuit road board test board, not only can be saved the cost expenditure and the institute that buy proving installation whereby and be taken up space, can be enlarged the usable range of circuit board testing board again.
For reaching above-mentioned purpose, therefore, in a preferred embodiment of the present invention, it is mainly constructed and includes: a circuit board testing board, in be provided with at least one loading plate, can put module in order to put a circuit board testing, and loading plate is provided with at least one signal slot, and the signal slot can be electrically connected on a microprocessor by one first transmission line; Module is put in one BGA test, can be placed on the loading plate of circuit board testing board, and be electrically connected on the signal slot by at least one signal line, cause a ball grid array base plate to be measured that is present in the BGA test storing module can be carried out a trace routine via the effect of microprocessor; And an output unit as a result, be electrically connected on microprocessor by one second transmission line, and shown the result of trace routine.
Description of drawings
Fig. 1 is the schematic perspective view of BGA proving installation commonly used;
Fig. 2 is the schematic perspective view of circuit board testing device commonly used;
Fig. 3 is the structure decomposition map of a preferred embodiment of the present invention;
Fig. 4 is a combination synoptic diagram of the present invention;
Fig. 5 puts the three-dimensional exploded view of module one embodiment for BGA test of the present invention;
Fig. 6 is the combination synoptic diagram of embodiment as shown in Figure 5; And
Fig. 7 is the schematic perspective view of further embodiment of this invention.
Description of reference numerals:
10 BGA proving installations, 11 BGA tester tables
Module is put in 13 loading plates, 15 BGA test
155 module boards, 17 microprocessors
175 first transmission lines, 179 second transmission lines
18 BGA substrate 19 displays to be measured
20 circuit board testing devices, 21 circuit board testing boards
23 loading plates, 25 circuit board testings are put module
255 module boards, 27 microprocessors
275 first transmission lines, 279 second transmission lines
28 circuit board under test, 29 displays
30 BGA proving installations, 31 circuit board testing boards
33 loading plates, 333 signal slots
Module is put in 335 signal line, 35 BGA test
351 rotating discs, 352 cover plates
353 base plates, 354 BGA put the district
355 ejector retainner plates, 356 centre holes
357 test adaptor devices, 358 thimbles
359 module boards, 37 microprocessors
375 first transmission lines, 379 second transmission lines
38 BGA substrate 39 displays to be measured
45 circuit board testings are put module 48 circuit board under test
51 second tester tables 55 are output unit as a result
Embodiment
Further understand and understanding for architectural feature of the present invention and the effect that realized are had, with preferred embodiment figure and cooperate detailed explanation, be described as follows:
At first, see also Fig. 3, be the structure decomposing schematic representation of ball grid array base plate proving installation one preferred embodiment of the present invention; As shown in the figure, BGA proving installation 30 of the present invention mainly is to utilize various circuit board testing devices, for example online circuit board test device (ICT), global function circuit board automatic detection device (ATE) or other electric circuit inspection equipment, it includes a circuit board testing board 31, on circuit board testing board 31, be provided with one equally and can put the loading plate 33 of module 45 in order to carry a circuit board testing, loading plate 33 is provided with at least one signal slot 333, and signal slot 333 can be electrically connected on microprocessor 37 by first transmission line 375.
When user's desire detects a BGA substrate 38 to be measured, can be about to circuit board testing earlier and put module 45 and move away from loading plate 33 surfaces, and BGA test storing module 35 can steadily be placed in loading plate 33 positions that are available, the BGA test is put module 35 and then can be plugged in the corresponding signal slot 333 by at least one signal line 335, so, BGA test put module 35 can by signal line 335, signal slot 333 and first transmission line 375 be able to be arranged at circuit board testing board 31 in microprocessor 37 be electrically connected, as shown in Figure 4.
Then, the user only needs that a BGA substrate 38 to be measured is placed in the BGA test and puts in the BGA storing district 355 of module 35, can draw various trace routines such as diode test (BGA Clamping Diode test), sky weldering test, NAND NAND Tree test, XOR XOR Tree test by 37 effects breaking of the microprocessor in the circuit board testing board 31 short-circuit test (Open/Short test), module testing (Component test), BGA Ji.In addition, the result who is detected can be shown in the display 39, is beneficial to the user and inspects.Certainly, this display 39 also can be electrically connected with microprocessor 37 by one second transmission line 379.
The BGA test is put module 35 and is placed on the loading plate 33 of circuit board testing board 31, and can directly utilize first transmission line 375, microprocessor 37, second transmission line 379 and display 39 in the circuit board testing board 31, therefore, not only can enlarge the usable range of circuit board testing board 31 whereby, also can therefore save the purchase cost expenditure of BGA tester table 11 and reduce the occupied usage space of proving installation.
Moreover, see also Fig. 5, be the three-dimensional exploded view of BGA test storing module one embodiment of the present invention, as shown in the figure, the BGA test is put module 35 and is combined by a cover plate 352, base plate 353, ejector retainner plate 355 and test adaptor device 357.Wherein, cutter is provided with a BGA that can put BGA substrate 38 to be measured and puts district 354 in the base plate 353, be provided with several centre holes 356 and also can cooperate the ball pad position of BGA substrate 38 to be measured and number in the ejector retainner plate 355 and cut a hole, can be placed with a thimble 358 in the centre hole 356, the module board 359 that can allow pin and on the BGA substrate 38 to be measured be located on the test adaptor device 357 via the effect of thimble 358 is electrically connected, and can carry out various electric circuit inspection work to BGA substrate 38 to be measured whereby.
In addition, see also Fig. 6, in the time of in BGA substrate 38 to be measured is placed in BGA storing district 354, cover plate 352 can be covered on the base plate, and be installed with a rotating disc 351 on cover plate 352 surfaces, the user is the light degree of fiting of control cover plate 352 and base plate 353 by the rotation of rotating disc 351, so, not only be not easy to use the person and handle BGA test storing module 35, can reach the pin on thimble 358, the BGA substrate to be measured (38) and the electrical connection of module board 359 again really, to improve the precision of circuit measuring.
Certainly, the BGA substrate 38 to be measured of each pattern all has the BGA test that detects with its collocation to put module 35, test adaptor device 357, module board 359, but module 35 or module board 359 are put in test if the BGA substrate 38 to be measured of approximate specification also can be shared a BGA, whereby to save the cost expenditure.
At last, see also Fig. 7, be the schematic perspective view of further embodiment of this invention; As shown in the figure, repeat that mobile BGA test puts that module 35 or circuit board testing are put module 45 and the assembly damage that may cause for fear of the user, therefore in this embodiment, mainly the side at original circuit board testing board 31 is provided with one second tester table 51, original circuit board testing board 31 can be put circuit board testing and put module 45, in order to detect circuit board under test 48; Then put the BGA test on second tester table 51 and put module 35, in order to detect BGA substrate 38 to be measured.
In sum, the present invention relates to a kind of ball grid array base plate pick-up unit, it mainly is module to be put in BGA test be placed on the circuit board testing board by a signal line, and obtained testing goal by to be allowed a ball grid array base plate to be measured whereby.
The above only is a preferred embodiment of the present invention, be not to be used for limiting scope of the invention process, all equivalences of being made according to the described shape of the present patent application, structure, feature and spirit change and revise, and all should be included in the claim of the present patent application.
Claims (18)
1. ball grid array base plate pick-up unit, it is mainly constructed and includes:
One circuit board testing board is provided with at least one loading plate, can put module in order to put a circuit board testing, and loading plate is provided with at least one signal slot, and the signal slot can be electrically connected on a microprocessor by one first transmission line;
Module is put in one BGA test, can be placed on the loading plate of this circuit board testing board, and be electrically connected on this signal slot by at least one signal line, cause a ball grid array base plate to be measured that is present in the BGA test storing module can be carried out a trace routine via the effect of this microprocessor; And
One output unit as a result is electrically connected on this microprocessor by one second transmission line, and is shown the result of this trace routine.
2. ball grid array base plate pick-up unit as claimed in claim 1 is characterized in that, this circuit board testing is put module can be electrically connected on this signal slot by a signal line.
3. ball grid array base plate pick-up unit as claimed in claim 1 is characterized in that, also includes at least one second tester table, can in order to select to put this circuit board testing put module, BGA test put module and knockdown one of them.
4. ball grid array base plate pick-up unit as claimed in claim 3 is characterized in that, this circuit board testing is put module, the BGA test is put module and all can be electrically connected on this signal slot by a signal line.
5. ball grid array base plate pick-up unit as claimed in claim 1 is characterized in that, this as a result output unit may be selected to be one of them of a display, printer, facsimile recorder, memory storage, network follower, electric transmission device and combination thereof.
6. ball grid array base plate pick-up unit as claimed in claim 1 is characterized in that, this circuit board testing board may be selected to be one of them of an online circuit board test apparatus, global function circuit board automatic checkout equipment, electric circuit inspection equipment and combination thereof.
7. ball grid array base plate pick-up unit as claimed in claim 1 is characterized in that, this BGA test is put module and included at least:
One cover plate:
One base plate is connected with the side in this cover plate, can become one to cover aspect with this cover plate, puts the district and be provided with a BGA in the base plate, can be in order to put this ball grid array base plate to be measured; And
One ejector retainner plate, inner cutter is provided with several centre holes, can put a thimble in the centre hole, and an end limit of thimble can touch a pin of this ball grid array base plate to be measured; And
One module board can be in order to touching the other end limit of this thimble, and this module board can be electrically connected at this signal slot by this signal line.
8. ball grid array base plate pick-up unit as claimed in claim 7 is characterized in that this cover plate is provided with a rotating disc, the degree that covers of this cover plate of may command and base plate by the rotation of rotating disc.
9. ball grid array base plate pick-up unit as claimed in claim 7 is characterized in that, this BGA test is put module and also can be included a test adaptor device, and this module board can be fixedly arranged on the test adaptor device.
10. ball grid array base plate pick-up unit as claimed in claim 9 is characterized in that, several different ejector retainner plates can be shared a module board and test adaptor device.
11. a ball grid array base plate pick-up unit, it mainly includes:
One cover plate;
One base plate is connected with the side in this cover plate, can become one to cover aspect with this cover plate, puts the district and be provided with a BGA in the base plate, can be in order to put this ball grid array base plate to be measured; And
One ejector retainner plate, inner cutter is provided with several centre holes, can put a thimble in the centre hole, and an end limit of thimble can touch a pin of this this ball grid array base plate to be measured; And
One test adaptor device is provided with a module board, can be in order to touching the other end limit of this thimble, and this test adaptor device can be electrically connected on this signal slot by this signal line.
12. ball grid array base plate pick-up unit as claimed in claim 11 is characterized in that this cover plate is provided with a rotating disc, the degree that covers of this cover plate of may command and base plate by the rotation of rotating disc.
13. a ball grid array base plate pick-up unit, it is mainly constructed and includes:
One BGA tester table, in be provided with at least one loading plate, can put module in order to put BGA test, and loading plate is provided with at least one signal slot, and the signal slot can be electrically connected on a microprocessor by one first transmission line, causes a BGA substrate to be measured that is present in the BGA test storing module can be carried out one first trace routine via the effect of this microprocessor;
One circuit board testing is put module, can be placed on the loading plate of this BGA tester table, and be electrically connected on this signal slot by at least one signal line, cause a circuit board under test that is present in the circuit board testing storing module can be carried out one second trace routine via the effect of this microprocessor; And
One output unit as a result is electrically connected on this microprocessor by one second transmission line, and is able to one of them result that option table reveals this first trace routine, second trace routine and combination thereof.
14. the constructive method of a ball grid array base plate pick-up unit, it mainly is module to be put in BGA test be placed on the circuit board testing board, BGA storing module can be electrically connected on the signal slot in this circuit board testing board again by a signal line, cause the BGA test to put module and can be controlled by the interior microprocessor of this circuit board testing board, and carried out the testing of a ball grid array base plate to be measured whereby.
15. constructive method as claimed in claim 14, it is characterized in that, this circuit board is put on the board also can put module in order to put a circuit board testing, and this circuit board testing is put signal slot and microprocessor that module also can be electrically connected on this circuit board testing board by at least one signal line.
16. constructive method as claimed in claim 14, it is characterized in that, this microprocessor can be electrically connected on an output unit as a result by one second transmission line, and by this as a result output unit be able to the testing result of this ball grid array base plate to be measured is exported.
17. constructive method as claimed in claim 16 is characterized in that, this as a result output unit may be selected to be a display, printer, facsimile recorder, memory storage, network follower, electric transmission device and knockdown one of them.
18. constructive method as claimed in claim 14 is characterized in that, this circuit board testing board system may be selected to be one of them of an online circuit board test apparatus, global function circuit board automatic checkout equipment, electric circuit inspection equipment and combination thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101234145A CN100373165C (en) | 2003-12-26 | 2003-12-26 | Ball grid array substrate detecting device and constructive method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101234145A CN100373165C (en) | 2003-12-26 | 2003-12-26 | Ball grid array substrate detecting device and constructive method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1635388A true CN1635388A (en) | 2005-07-06 |
| CN100373165C CN100373165C (en) | 2008-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101234145A Expired - Fee Related CN100373165C (en) | 2003-12-26 | 2003-12-26 | Ball grid array substrate detecting device and constructive method thereof |
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| CN (1) | CN100373165C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102621431A (en) * | 2012-04-11 | 2012-08-01 | 游森溢 | Mixed type testing device |
| CN104267218A (en) * | 2014-10-11 | 2015-01-07 | 中国航天科工集团第三研究院第八三五七研究所 | BGA package test socket with pin testing function |
| CN104597390A (en) * | 2014-12-31 | 2015-05-06 | 苏州征之魂专利技术服务有限公司 | Multi-model multi-interpolation lattice structure test automatic identification system |
| CN104599056A (en) * | 2015-01-05 | 2015-05-06 | 苏州征之魂专利技术服务有限公司 | Lattice structure first piece seal testing machine and database proofreading test method |
| CN110133416A (en) * | 2019-06-10 | 2019-08-16 | 重庆理工大学 | A kind of BGA plate electro-migration testing device |
| CN110133373A (en) * | 2019-06-10 | 2019-08-16 | 重庆理工大学 | A kind of solder joint resistance testing device of BGA plate |
| CN110784270A (en) * | 2019-10-11 | 2020-02-11 | 中国电子科技集团公司第二十九研究所 | BGA port radio frequency transmission performance detection device and detection method |
| CN113406463A (en) * | 2020-03-16 | 2021-09-17 | 苏州明皜传感科技有限公司 | Semiconductor finished product modularization testing arrangement |
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| JP3183591B2 (en) * | 1993-07-02 | 2001-07-09 | 三菱電機株式会社 | Semiconductor device test system, semiconductor device test method, semiconductor device insertion / extraction station, and test chamber |
| SG90713A1 (en) * | 1995-07-28 | 2002-08-20 | Advantest Corp | Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus |
| CN2457613Y (en) * | 2000-11-27 | 2001-10-31 | 英业达股份有限公司 | Automatic test clamp |
| US6541991B1 (en) * | 2001-05-04 | 2003-04-01 | Xilinx Inc. | Interface apparatus and method for testing different sized ball grid array integrated circuits |
| CN2482096Y (en) * | 2001-06-20 | 2002-03-13 | 华硕电脑股份有限公司 | Automatic circuit board function testing device |
| TW545582U (en) * | 2002-05-07 | 2003-08-01 | Via Tech Inc | Testing assembly for BGA IC devices |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102621431A (en) * | 2012-04-11 | 2012-08-01 | 游森溢 | Mixed type testing device |
| CN104267218A (en) * | 2014-10-11 | 2015-01-07 | 中国航天科工集团第三研究院第八三五七研究所 | BGA package test socket with pin testing function |
| CN104597390A (en) * | 2014-12-31 | 2015-05-06 | 苏州征之魂专利技术服务有限公司 | Multi-model multi-interpolation lattice structure test automatic identification system |
| CN104599056A (en) * | 2015-01-05 | 2015-05-06 | 苏州征之魂专利技术服务有限公司 | Lattice structure first piece seal testing machine and database proofreading test method |
| CN110133416A (en) * | 2019-06-10 | 2019-08-16 | 重庆理工大学 | A kind of BGA plate electro-migration testing device |
| CN110133373A (en) * | 2019-06-10 | 2019-08-16 | 重庆理工大学 | A kind of solder joint resistance testing device of BGA plate |
| CN110133373B (en) * | 2019-06-10 | 2021-07-30 | 重庆理工大学 | Solder joint resistance testing arrangement of BGA board |
| CN110133416B (en) * | 2019-06-10 | 2021-07-30 | 重庆理工大学 | BGA board electromigration testing arrangement |
| CN110784270A (en) * | 2019-10-11 | 2020-02-11 | 中国电子科技集团公司第二十九研究所 | BGA port radio frequency transmission performance detection device and detection method |
| CN110784270B (en) * | 2019-10-11 | 2021-10-22 | 中国电子科技集团公司第二十九研究所 | BGA port radio frequency transmission performance detection device and detection method |
| CN113406463A (en) * | 2020-03-16 | 2021-09-17 | 苏州明皜传感科技有限公司 | Semiconductor finished product modularization testing arrangement |
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|---|---|
| CN100373165C (en) | 2008-03-05 |
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