CN112935257B - Preparation process of copper-tungsten-based diamond radiating fin - Google Patents
Preparation process of copper-tungsten-based diamond radiating fin Download PDFInfo
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- CN112935257B CN112935257B CN202110102551.9A CN202110102551A CN112935257B CN 112935257 B CN112935257 B CN 112935257B CN 202110102551 A CN202110102551 A CN 202110102551A CN 112935257 B CN112935257 B CN 112935257B
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- copper
- tungsten
- radiating fin
- diamond
- powder
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 26
- 239000010432 diamond Substances 0.000 title claims abstract description 26
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000010949 copper Substances 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 230000008595 infiltration Effects 0.000 claims abstract description 11
- 238000001764 infiltration Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 11
- 238000005245 sintering Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000000498 ball milling Methods 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims abstract description 5
- 238000005406 washing Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 206010070834 Sensitisation Diseases 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 230000008313 sensitization Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 238000010923 batch production Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/247—Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/043—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by ball milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Abstract
The invention discloses a preparation process of a copper-tungsten-based diamond radiating fin, which relates to the technical field of radiating fin preparation and comprises the following steps of: s1, carrying out 200-300 nm surface copper plating treatment on 50-60 mesh diamond powder; s2, performing ball milling mixing treatment on 30-40% by weight of 5-8 micron tungsten powder and 60-70% by weight of-200 mesh electrolytic copper powder; s3, pressing the copper-plated diamond according to the volume percentage of 62.5% and the tungsten copper according to the volume percentage of 37.5%; s4, performing copper infiltration sintering of-200 meshes; s5, removing superfluous copper on the surface, and finishing the processing and production of the radiating fin. The copper-based diamond composite material prepared by the method has good heat dissipation performance, the heat conductivity is 450-550W/mk, the raw material preparation is simple, the manufacturing process path is simple, and the batch production is extremely easy to realize.
Description
Technical Field
The invention relates to the technical field of radiating fin preparation, in particular to a copper-tungsten-based diamond radiating fin preparation process.
Background
The radiating fin is a device for radiating the heat-generating electronic element in the power supply, and is mostly made of aluminum alloy, brass or bronze into a plate shape, a sheet shape, a multi-sheet shape and the like, for example, a CPU central processing unit in a computer needs to use a quite large radiating fin, and a power tube, a row tube and a power amplifier tube in a television need to use the radiating fin. In use, a layer of heat-conducting silicone grease is coated on the contact surface of the electronic element and the heat sink, so that heat emitted by the element is more effectively conducted to the heat sink and then emitted to the surrounding air through the heat sink.
However, the existing radiating fin has poor radiating effect, the preparation process is complex, the raw materials are difficult to manufacture, and batch production is not easy to realize, so the invention provides the preparation process of the copper-tungsten-based diamond radiating fin.
Disclosure of Invention
The invention aims to provide a preparation process of a copper-tungsten-based diamond radiating fin, and the copper-based diamond composite material prepared by the process has good radiating performance, the thermal conductivity is 450-550W/mk, the raw material preparation is simple, the manufacturing process path is simple, and the batch production is extremely easy to realize.
In order to achieve the above purpose, the present invention provides the following technical solutions: the preparation process of the copper-tungsten-based diamond radiating fin comprises the following steps of:
s1, carrying out 200-300 nm surface copper plating treatment on 50-60 mesh diamond powder;
s2, performing ball milling mixing treatment on 30-40% by weight of 5-8 micron tungsten powder and 60-70% by weight of-200 mesh electrolytic copper powder;
s3, pressing the copper-plated diamond according to the volume percentage of 62.5% and the tungsten copper according to the volume percentage of 37.5%;
s4, performing copper infiltration sintering of-200 meshes;
s5, removing superfluous copper on the surface, and finishing the processing and production of the radiating fin.
Preferably, the nano surface copper plating treatment method in the step S1 comprises the steps of workpiece pretreatment, oil and rust removal, activation and sensitization; washing with water; copper plating is carried out for 15 to 60 minutes; washing with water; passivating; and (5) drying.
Preferably, the density of the pressing in the step S3 is 85-90%.
Preferably, the copper infiltration sintering of-200 meshes is carried out in the step S4, and the copper infiltration amount is more than 20-30%.
Preferably, the step S5 of removing the excessive copper is performed by mechanical polishing, and then the required fin size is manufactured by a numerical control machine.
Preferably, the heat conductivity of the heat sink in S5 is 450-550W/mk.
Compared with the prior art, the invention has the beneficial effects that:
1. the copper-based diamond composite material prepared by the method has good heat dissipation performance, the heat conductivity is 450-550W/mk, the raw material preparation is simple, the manufacturing process path is simple, and the batch production is extremely easy to realize.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
An embodiment of the present invention provides: the preparation process of the copper-tungsten-based diamond radiating fin comprises the following steps of:
s1, carrying out 200-300 nm surface copper plating treatment on 50-60 mesh diamond powder;
s2, performing ball milling mixing treatment on 30-40% by weight of 5-8 micron tungsten powder and 60-70% by weight of-200 mesh electrolytic copper powder;
s3, pressing the copper-plated diamond according to the volume percentage of 62.5% and the tungsten copper according to the volume percentage of 37.5%;
s4, performing copper infiltration sintering of-200 meshes;
s5, removing superfluous copper on the surface, and finishing the processing and production of the radiating fin.
In this embodiment, the method for copper plating the nano surface in S1 includes the steps of workpiece pretreatment, degreasing, rust removal, activation and sensitization; washing with water; copper plating is carried out for 15 to 60 minutes; washing with water; passivating; and (5) drying.
In this example, the density of the press in S3 reaches 85-90%.
In this embodiment, the copper infiltration sintering of-200 mesh copper is performed in the step S4, and the copper infiltration amount is more than 20-30%.
In this embodiment, the step S5 of removing the excess copper is performed by mechanical polishing, and then the required fin size is manufactured by a numerical control machine.
In this embodiment, the heat conductivity of the heat sink in S5 is 450-550W/mk.
The industrial steps are as follows:
s1, carrying out 200-300 nm surface copper plating treatment on 50-60 mesh diamond powder;
s2, performing ball milling mixing treatment on 30-40% by weight of 5-8 micron tungsten powder and 60-70% by weight of-200 mesh electrolytic copper powder;
s3, pressing the copper-plated diamond according to the volume percentage of 62.5% and the tungsten copper according to the volume percentage of 37.5%;
s4, performing copper infiltration sintering of-200 meshes;
s5, removing superfluous copper on the surface, and finishing the processing and production of the radiating fin.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (4)
1. The preparation process of the copper-tungsten-based diamond radiating fin comprises copper, tungsten and diamond and is characterized in that: the method comprises the following steps:
s1, carrying out 200-300 nm surface copper plating treatment on 50-60 mesh diamond powder;
s2, performing ball milling mixing treatment on 30-40% by weight of 5-8 micron tungsten powder and 60-70% by weight of-200 mesh electrolytic copper powder;
s3, pressing the copper-plated diamond according to the volume percentage of 62.5% and the tungsten copper according to the volume percentage of 37.5%;
s4, performing copper infiltration sintering of-200 meshes;
s5, removing superfluous copper on the surface, and finishing the processing production of the radiating fin;
the nano surface copper plating treatment method in the step S1 comprises the steps of workpiece pretreatment, oil and rust removal, activation and sensitization; washing with water; copper plating is carried out for 15 to 60 minutes; washing with water; passivating; drying;
the pressed density in the S3 reaches 85-90%.
2. The process for preparing a copper-tungsten-based diamond heat sink according to claim 1, wherein: and (3) performing copper infiltration sintering of-200 meshes in the step S4, wherein the copper infiltration amount is more than 20-30%.
3. The process for preparing a copper-tungsten-based diamond heat sink according to claim 1, wherein: and S5, removing redundant copper, machining through mechanical polishing, and then machining and producing the required cooling fin size through a numerical control machine tool.
4. The process for preparing a copper-tungsten-based diamond heat sink according to claim 1, wherein: the heat conductivity of the radiating fin in the S5 is 450-550W/mk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110102551.9A CN112935257B (en) | 2021-01-26 | 2021-01-26 | Preparation process of copper-tungsten-based diamond radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110102551.9A CN112935257B (en) | 2021-01-26 | 2021-01-26 | Preparation process of copper-tungsten-based diamond radiating fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112935257A CN112935257A (en) | 2021-06-11 |
| CN112935257B true CN112935257B (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110102551.9A Active CN112935257B (en) | 2021-01-26 | 2021-01-26 | Preparation process of copper-tungsten-based diamond radiating fin |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115319099A (en) * | 2022-07-20 | 2022-11-11 | 中山市海明润超硬材料有限公司 | Diamond composite material and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004175626A (en) * | 2002-11-28 | 2004-06-24 | Sumitomo Electric Ind Ltd | High thermal conductivity diamond sintered compact, heat sink for mounting semiconductor using the same, and its manufacturing method |
| CN101279366A (en) * | 2008-05-28 | 2008-10-08 | 天津大学 | Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition |
| CN101845567A (en) * | 2010-05-14 | 2010-09-29 | 北京科技大学 | Method for strengthening diamond powder degreasing blank subjected to injection molding by infiltrating Cu |
| CN101885060A (en) * | 2010-06-22 | 2010-11-17 | 上海中希合金有限公司 | High-performance copper-diamond electrical contact material and preparation process thereof |
| CN103981382A (en) * | 2014-05-22 | 2014-08-13 | 武汉理工大学 | Preparation method of high heat-conducting diamond/copper-based composite material |
| CN109175354A (en) * | 2018-10-29 | 2019-01-11 | 合肥工业大学 | A kind of preparation method of diamond/W-Cu composite material |
-
2021
- 2021-01-26 CN CN202110102551.9A patent/CN112935257B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004175626A (en) * | 2002-11-28 | 2004-06-24 | Sumitomo Electric Ind Ltd | High thermal conductivity diamond sintered compact, heat sink for mounting semiconductor using the same, and its manufacturing method |
| CN101279366A (en) * | 2008-05-28 | 2008-10-08 | 天津大学 | Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition |
| CN101845567A (en) * | 2010-05-14 | 2010-09-29 | 北京科技大学 | Method for strengthening diamond powder degreasing blank subjected to injection molding by infiltrating Cu |
| CN101885060A (en) * | 2010-06-22 | 2010-11-17 | 上海中希合金有限公司 | High-performance copper-diamond electrical contact material and preparation process thereof |
| CN103981382A (en) * | 2014-05-22 | 2014-08-13 | 武汉理工大学 | Preparation method of high heat-conducting diamond/copper-based composite material |
| CN109175354A (en) * | 2018-10-29 | 2019-01-11 | 合肥工业大学 | A kind of preparation method of diamond/W-Cu composite material |
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| CN112935257A (en) | 2021-06-11 |
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