CN112935257A - Preparation process of copper-tungsten based diamond radiating fin - Google Patents
Preparation process of copper-tungsten based diamond radiating fin Download PDFInfo
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- CN112935257A CN112935257A CN202110102551.9A CN202110102551A CN112935257A CN 112935257 A CN112935257 A CN 112935257A CN 202110102551 A CN202110102551 A CN 202110102551A CN 112935257 A CN112935257 A CN 112935257A
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- CN
- China
- Prior art keywords
- copper
- tungsten
- heat sink
- diamond
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 30
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 30
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 230000008595 infiltration Effects 0.000 claims abstract description 11
- 238000001764 infiltration Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000005245 sintering Methods 0.000 claims abstract description 8
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000498 ball milling Methods 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims abstract description 5
- 238000003754 machining Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 206010070834 Sensitisation Diseases 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 3
- 230000008313 sensitization Effects 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000002994 raw material Substances 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/24—After-treatment of workpieces or articles
- B22F2003/247—Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/043—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by ball milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Abstract
The invention discloses a preparation process of a copper-tungsten based diamond radiating fin, which relates to the technical field of radiating fin preparation and comprises the following steps: s1, performing 200-300 nanometer surface copper plating treatment on the 50-60 mesh diamond powder; s2, performing ball milling and mixing treatment on 30-40 wt% of 5-8 micron tungsten powder and 60-70 wt% of-200-mesh electrolytic copper powder; s3, pressing the copper-plated diamond by 62.5 percent by volume and the tungsten copper by 37.5 percent by volume; s4, carrying out copper infiltration sintering of-200 meshes; and S5, removing the excessive copper on the surface, and finishing the processing production of the heat sink. The copper-based diamond composite material prepared by the invention has good heat dissipation performance, the heat conductivity is 450-550W/mk, the raw material preparation is simple, the manufacturing process path is simple, and the mass production is very easy to realize.
Description
Technical Field
The invention relates to the technical field of heat radiating fin preparation, in particular to a preparation process of a copper-tungsten based diamond heat radiating fin.
Background
The radiating fin is a device for radiating heat of electronic elements which are easy to generate heat in electrical appliances, and is made of aluminum alloy, brass or bronze into a plate shape, a sheet shape, a plurality of sheet shapes and the like, for example, a CPU (central processing unit) in a computer needs to use a relatively large radiating fin, and power tubes, row tubes and power amplifier tubes in a power amplifier in a television set need to use the radiating fin. Generally, a layer of heat-conducting silicone grease is coated on the contact surface of an electronic component and a heat sink when the heat sink is in use, so that heat emitted by the component is more effectively conducted to the heat sink and then dissipated to the ambient air through the heat sink.
However, the existing radiating fin has poor radiating effect, the preparation process is relatively complex, the raw materials are difficult to manufacture, and batch production is not easy to realize, so the invention provides the preparation process of the copper-tungsten-based diamond radiating fin.
Disclosure of Invention
The invention aims to provide a preparation process of a copper-tungsten-based diamond radiating fin, the copper-based diamond composite material prepared by the process has good heat radiating performance, the heat conductivity is 450-550W/mk, the raw material preparation is simple, the manufacturing process path is simple, and the mass production is very easy to realize.
In order to achieve the purpose, the invention provides the following technical scheme: a preparation process of a copper-tungsten based diamond radiating fin comprises copper, tungsten and diamond, and comprises the following steps:
s1, performing 200-300 nanometer surface copper plating treatment on the 50-60 mesh diamond powder;
s2, performing ball milling and mixing treatment on 30-40 wt% of 5-8 micron tungsten powder and 60-70 wt% of-200-mesh electrolytic copper powder;
s3, pressing the copper-plated diamond by 62.5 percent by volume and the tungsten copper by 37.5 percent by volume;
s4, carrying out copper infiltration sintering of-200 meshes;
and S5, removing the excessive copper on the surface, and finishing the processing production of the heat sink.
Preferably, the nano surface copper plating treatment method in S1 comprises the steps of workpiece pretreatment, oil and rust removal, activation and sensitization; washing with water; copper plating is carried out for 15-60 minutes; washing with water; passivating; and (5) drying.
Preferably, the density of the pressing in S3 reaches 85-90%.
Preferably, in the S4, copper infiltration sintering with 200 meshes is carried out, and the copper infiltration amount is more than 20-30%.
Preferably, the removal of the excess copper in S5 is performed by machining and grinding, and then machining and producing the required fin size by a numerical control machine.
Preferably, the thermal conductivity of the heat sink in S5 is 450-550W/mk.
Compared with the prior art, the invention has the beneficial effects that:
1. the copper-based diamond composite material prepared by the invention has good heat dissipation performance, the heat conductivity is 450-550W/mk, the raw material preparation is simple, the manufacturing process path is simple, and the mass production is very easy to realize.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment provided by the invention comprises the following steps: a preparation process of a copper-tungsten based diamond radiating fin comprises copper, tungsten and diamond, and comprises the following steps:
s1, performing 200-300 nanometer surface copper plating treatment on the 50-60 mesh diamond powder;
s2, performing ball milling and mixing treatment on 30-40 wt% of 5-8 micron tungsten powder and 60-70 wt% of-200-mesh electrolytic copper powder;
s3, pressing the copper-plated diamond by 62.5 percent by volume and the tungsten copper by 37.5 percent by volume;
s4, carrying out copper infiltration sintering of-200 meshes;
and S5, removing the excessive copper on the surface, and finishing the processing production of the heat sink.
In this embodiment, the nano surface copper plating treatment method in S1 includes workpiece pretreatment, oil and rust removal, activation, and sensitization; washing with water; copper plating is carried out for 15-60 minutes; washing with water; passivating; and (5) drying.
In this embodiment, the density of the pressing in S3 reaches 85-90%.
In this embodiment, in the step S4, sintering with-200 mesh copper infiltration is performed, and the copper infiltration amount is greater than 20-30%.
In this embodiment, the removal of the excess copper in S5 is performed by machining and then machining the desired fin size by a numerical control machine.
In this embodiment, the thermal conductivity of the heat sink in S5 is 450-.
The method comprises the following industrial steps:
s1, performing 200-300 nanometer surface copper plating treatment on the 50-60 mesh diamond powder;
s2, performing ball milling and mixing treatment on 30-40 wt% of 5-8 micron tungsten powder and 60-70 wt% of-200-mesh electrolytic copper powder;
s3, pressing the copper-plated diamond by 62.5 percent by volume and the tungsten copper by 37.5 percent by volume;
s4, carrying out copper infiltration sintering of-200 meshes;
and S5, removing the excessive copper on the surface, and finishing the processing production of the heat sink.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A preparation process of a copper-tungsten based diamond radiating fin comprises copper, tungsten and diamond, and is characterized in that: the method comprises the following steps:
s1, performing 200-300 nanometer surface copper plating treatment on the 50-60 mesh diamond powder;
s2, performing ball milling and mixing treatment on 30-40 wt% of 5-8 micron tungsten powder and 60-70 wt% of-200-mesh electrolytic copper powder;
s3, pressing the copper-plated diamond by 62.5 percent by volume and the tungsten copper by 37.5 percent by volume;
s4, carrying out copper infiltration sintering of-200 meshes;
and S5, removing the excessive copper on the surface, and finishing the processing production of the heat sink.
2. The process for preparing a copper-tungsten-based diamond heat sink according to claim 1, wherein: the nano surface copper plating treatment method in the S1 comprises the steps of workpiece pretreatment, oil and rust removal, activation and sensitization; washing with water; copper plating is carried out for 15-60 minutes; washing with water; passivating; and (5) drying.
3. The process for preparing a copper-tungsten-based diamond heat sink according to claim 1, wherein: the density of the pressing in the S3 reaches 85-90%.
4. The process for preparing a copper-tungsten-based diamond heat sink according to claim 1, wherein: and carrying out copper infiltration sintering of-200 meshes in the S4, wherein the copper infiltration amount is more than 20-30%.
5. The process for preparing a copper-tungsten-based diamond heat sink according to claim 1, wherein: the removal of the excess copper in S5 is performed by machining and then machining the desired fin size by a numerical control machine.
6. The process for preparing a copper-tungsten-based diamond heat sink according to claim 1, wherein: the thermal conductivity of the heat sink in S5 is 450-550W/mk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110102551.9A CN112935257B (en) | 2021-01-26 | 2021-01-26 | Preparation process of copper-tungsten-based diamond radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110102551.9A CN112935257B (en) | 2021-01-26 | 2021-01-26 | Preparation process of copper-tungsten-based diamond radiating fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112935257A true CN112935257A (en) | 2021-06-11 |
| CN112935257B CN112935257B (en) | 2023-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110102551.9A Active CN112935257B (en) | 2021-01-26 | 2021-01-26 | Preparation process of copper-tungsten-based diamond radiating fin |
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| Country | Link |
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| CN (1) | CN112935257B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115319099A (en) * | 2022-07-20 | 2022-11-11 | 中山市海明润超硬材料有限公司 | Diamond composite material and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004175626A (en) * | 2002-11-28 | 2004-06-24 | Sumitomo Electric Ind Ltd | High thermal conductivity diamond sintered compact, heat sink for mounting semiconductor using the same, and its manufacturing method |
| CN101279366A (en) * | 2008-05-28 | 2008-10-08 | 天津大学 | Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition |
| CN101845567A (en) * | 2010-05-14 | 2010-09-29 | 北京科技大学 | Method for strengthening diamond powder degreasing blank subjected to injection molding by infiltrating Cu |
| CN101885060A (en) * | 2010-06-22 | 2010-11-17 | 上海中希合金有限公司 | High-performance copper-diamond electrical contact material and preparation process thereof |
| CN103981382A (en) * | 2014-05-22 | 2014-08-13 | 武汉理工大学 | Preparation method of high heat-conducting diamond/copper-based composite material |
| CN109175354A (en) * | 2018-10-29 | 2019-01-11 | 合肥工业大学 | A kind of preparation method of diamond/W-Cu composite material |
-
2021
- 2021-01-26 CN CN202110102551.9A patent/CN112935257B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004175626A (en) * | 2002-11-28 | 2004-06-24 | Sumitomo Electric Ind Ltd | High thermal conductivity diamond sintered compact, heat sink for mounting semiconductor using the same, and its manufacturing method |
| CN101279366A (en) * | 2008-05-28 | 2008-10-08 | 天津大学 | Method for producing diamond reinforced Cu-matrix compound material by surface metallization and chemical deposition |
| CN101845567A (en) * | 2010-05-14 | 2010-09-29 | 北京科技大学 | Method for strengthening diamond powder degreasing blank subjected to injection molding by infiltrating Cu |
| CN101885060A (en) * | 2010-06-22 | 2010-11-17 | 上海中希合金有限公司 | High-performance copper-diamond electrical contact material and preparation process thereof |
| CN103981382A (en) * | 2014-05-22 | 2014-08-13 | 武汉理工大学 | Preparation method of high heat-conducting diamond/copper-based composite material |
| CN109175354A (en) * | 2018-10-29 | 2019-01-11 | 合肥工业大学 | A kind of preparation method of diamond/W-Cu composite material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115319099A (en) * | 2022-07-20 | 2022-11-11 | 中山市海明润超硬材料有限公司 | Diamond composite material and preparation method thereof |
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| Publication number | Publication date |
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| CN112935257B (en) | 2023-11-24 |
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