CN112867361A - Display screen assembly and electronic device - Google Patents

Display screen assembly and electronic device Download PDF

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Publication number
CN112867361A
CN112867361A CN202110089020.0A CN202110089020A CN112867361A CN 112867361 A CN112867361 A CN 112867361A CN 202110089020 A CN202110089020 A CN 202110089020A CN 112867361 A CN112867361 A CN 112867361A
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China
Prior art keywords
display screen
heat dissipation
heat
film layer
driving chip
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Granted
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CN202110089020.0A
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Chinese (zh)
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CN112867361B (en
Inventor
李志林
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

The application discloses display screen subassembly and electron device. The display screen assembly comprises a display screen, a first driving chip and a heat dissipation film layer. First driver chip stacks up the setting with the display screen and is connected with the display screen electricity, and the heat dissipation rete stacks up the setting between display screen and first driver chip, and the heat dissipation rete covers first driver chip, and the heat dissipation rete includes graphite alkene and carbon nanotube, and graphite alkene and carbon nanotube construct the heat conduction passageway of heat dissipation rete jointly, and the heat conductivity of heat dissipation rete on with the display screen parallel direction is greater than with the heat conductivity on the display screen vertical direction. So, the heat dissipation rete utilizes graphite alkene and the carbon nanotube complex that has high thermal conductivity to form, and the heat conductivity of heat dissipation rete in following the display screen parallel direction is great for the heat dissipation rete can be with the produced heat of first drive chip along deriving with the parallel direction efficient of display screen, with the produced heat of avoiding first drive chip too big and too concentrate and lead to burning out the display screen.

Description

Display screen assembly and electronic device
Technical Field
The application relates to the technical field of display, in particular to a display screen assembly and an electronic device.
Background
In the related art, a driving chip is usually attached to the display screen for driving the display screen to display. However, the driving chip generates heat during operation, and the driving chip is easily overheated when generating abnormal heat, thereby reducing the service life of the display screen and even burning the screen.
Disclosure of Invention
The embodiment of the application provides a display screen assembly and an electronic device.
The display screen subassembly of this application embodiment includes:
a display screen;
the first driving chip is arranged in a stacking mode with the display screen and is electrically connected with the display screen;
the heat dissipation film layer is stacked between the display screen and the first driving chip and covers the first driving chip, the heat dissipation film layer comprises graphene and carbon nano tubes, the graphene and the carbon nano tubes are jointly constructed into a heat conduction channel of the heat dissipation film layer, and the heat conductivity of the heat dissipation film layer in the parallel direction of the display screen is larger than the heat conductivity of the heat dissipation film layer in the vertical direction of the display screen.
The electronic device of the embodiment of the application comprises:
a housing; and
the display screen assembly of the above embodiment, the display screen assembly is mounted on the housing.
In the display screen subassembly and the electron device of this application embodiment, be provided with the heat dissipation rete between display screen and first driver chip, the heat dissipation rete includes graphite alkene and carbon nanotube, and graphite alkene and carbon nanotube construct the heat conduction passageway of heat dissipation rete jointly, and the heat conductivity of heat dissipation rete on with the display screen parallel direction is greater than with the display screen vertical direction on the heat conductivity. Like this, the heat dissipation rete utilizes graphite alkene and the carbon nanotube complex that has high thermal conductivity to construct into the higher heat conduction passageway of heat-conducting ability to make thermal conductivity on with the display screen parallel direction great, thereby make the heat dissipation rete can lead out the produced heat of first drive chip along the direction efficient with the display screen parallel, so as to avoid the produced heat of first drive chip too big and too concentrate and lead to the display screen life-span to descend or even burn out the display screen.
Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a display screen assembly according to an embodiment of the present application;
FIG. 2 is another schematic structural view of a display screen assembly according to an embodiment of the present application;
FIG. 3 is a further schematic structural view of a display screen assembly according to an embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of the display screen assembly of FIG. 1 taken along line IV-IV;
fig. 5 is a schematic view of a heat conducting network of graphene and carbon nanotubes in a heat dissipation film layer according to an embodiment of the present disclosure;
FIG. 6 is another schematic cross-sectional view of a display screen assembly according to an embodiment of the present application;
FIG. 7 is a further schematic cross-sectional view of a display screen assembly according to an embodiment of the present application;
FIG. 8 is a schematic cross-sectional view of the display screen assembly of FIG. 1 taken along line VIII-VIII;
fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 10 is an enlarged schematic view at X in the electronic device of fig. 9.
Description of the main element symbols:
an electronic device 1000;
the display screen assembly 100, the display screen 10, the display layer 11, the touch layer 12, the first driving chip 20, the heat dissipation film layer 30, the graphene 31, the carbon nanotubes 32, the heat conduction channel 33, the heat dissipation sublayer 34, the first portion 35, the second portion 36, the heat insulation layer 40, the heat conduction layer 50, the second driving chip 60, the flexible circuit board 70, and the heat dissipation member 80;
the heat dissipation structure comprises a shell 200, a heat dissipation structure 201, a protrusion 202 and a groove 203.
Detailed Description
Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.
In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Further, the present application may repeat reference numerals and/or reference letters in the various examples, which have been repeated for purposes of brevity and clarity and do not in themselves dictate a relationship between the various embodiments and/or arrangements discussed.
Referring to fig. 1 to 4, a display panel assembly 100 according to an embodiment of the present disclosure includes a display panel 10, a first driving chip 20, and a heat dissipation film 30. First driver chip 20 and the range upon range of setting of display screen 10 and be connected with display screen 10 electricity, heat dissipation rete 30 is range upon range of the setting between display screen 10 and first driver chip 20, heat dissipation rete 30 covers first driver chip 20, heat dissipation rete 30 includes graphite alkene 31 and carbon nanotube 32, graphite alkene 31 and carbon nanotube 32 construct the heat conduction passageway 33 of heat dissipation rete 30 jointly, heat dissipation rete 30 is greater than the heat conductivity on the vertical direction with display screen 10 with the heat conductivity on the display screen 10 parallel direction.
It is understood that high temperatures can have detrimental effects on the stability, reliability and lifetime of electronic components. According to estimation, the reliability of the electronic component is reduced by 10% every time the temperature of the electronic component is increased by 2 ℃; when the temperature of the device rises to 50 ℃, the service life of the device is only 16 percent of that of the device at room temperature (25 ℃). Excessive temperatures can compromise semiconductor junctions, damage circuit connection interfaces, increase conductor resistance, and cause thermal stress damage. Statistics show that electronic device failures due to thermal failures account for 55% of the total failures. Therefore, ensuring that the heat generated by the heat-generating electronic components can be discharged in time has become an important consideration for the design and assembly of electronic product systems.
In the related art, a driving chip is usually attached to the display screen for driving the display screen to display. However, the driving chip generates heat during operation, and if the driving chip generates heat abnormally due to circuit abnormality or the like, the driving chip is easily overheated to cause the service life of the display screen to be reduced or even the screen to be burnt.
In the display panel assembly 100 of the embodiment of the application, the heat dissipation film layer 30 is disposed between the display panel 10 and the first driving chip 20, the heat dissipation film layer 30 includes the graphene 31 and the carbon nanotubes 32, the graphene 31 and the carbon nanotubes 32 jointly constitute the heat conduction channel 33 of the heat dissipation film layer 30, and the thermal conductivity of the heat dissipation film layer 30 in the direction parallel to the display panel 10 is greater than the thermal conductivity in the direction perpendicular to the display panel 10. In this way, the heat dissipation film layer 30 is compositely constructed into the heat conduction channel 33 with higher heat conduction capability by using the graphene 31 and the carbon nanotubes 32 with high heat conduction performance, and the heat conduction of the heat dissipation film layer 30 in the direction parallel to the display screen 10 is higher, so that the heat generated by the first driving chip 20 can be efficiently conducted out by the heat dissipation film layer 30 in the direction parallel to the display screen 10, and the phenomenon that the display screen 10 is shortened in service life and even burnt out due to too much and too much concentrated heat generated by the first driving chip 20 is avoided.
Specifically, in the embodiment of the present application, the first driving chip 20 may be a display screen 10 driving chip for driving the pixels of the display screen 10 to display, in one embodiment, the first driving chip 20 is directly bonded to the bonding area of the display screen 10, and in another embodiment, the first driving chip 20 may also be connected to the bonding area of the display screen 10 through the flexible circuit board 70, which is not limited herein.
In addition, in the embodiment of the present application, the heat dissipation film layer 30 may be a composite film layer formed by compounding the graphene 31 and the carbon nanotubes 32. It can be understood that the graphene 31 and the carbon nanotube 32 both have high thermal conductivity and good thermal conductivity, and the graphene 31 and the carbon nanotube 32 both have thermal conductivity directionality (fig. 5 shows a thermal conductive network formed by compounding the graphene 31 and the carbon nanotube 32), in an embodiment of the present application, the graphene 31 and the carbon nanotube 32 are compounded to form the heat dissipation film layer 30, the thermal conductivity directions of the graphene 31 and the carbon nanotube 32 are both arranged in a direction parallel to the display screen 10, and the non-thermal conductivity directions of the graphene 31 and the carbon nanotube 32 are arranged perpendicular to the display screen 10. Since the graphene 31 and the carbon nanotube 32 have a heat conduction direction, a heat insulation effect can be achieved in a non-heat conduction direction, and the composite material layer (i.e., the heat dissipation film layer 30) of the graphene 31 and the carbon nanotube 32 is arranged between the display screen 10 and the first driving chip 20, so that the graphene 31 and the carbon nanotube 32 and the heat conduction channel 33 which is jointly configured have excellent heat conductivity in a direction parallel to the display screen 10, and heat emitted by the first driving chip 20 can be rapidly led out in a direction parallel to the display screen 10 through the heat dissipation film layer 30 to avoid the display screen 10 from being burnt due to over-concentration of heat, and meanwhile, a heat insulation effect can be achieved in a direction perpendicular to the display screen 10. Preferably, in the embodiment of the present application, the thermal conduction channel 33 formed by the graphene 31 and the carbon nanotube 32 is parallel to the display screen 10, that is, the graphene 31 and the carbon nanotube 32 may be on the same plane parallel to the display screen 10 so that the thermal conduction channel 33 formed by the graphene 31 and the carbon nanotube 32 is also parallel to the display screen 10.
In particular, the graphene 31 has a unique two-dimensional planar structure, and the carbon nanotubes 32 have a tubular structure, and in one possible embodiment, two graphene 31 molecules can form a stable chemical bond at both ends of each carbon nanotube 32 to realize the composition of the graphene 31 and the carbon nanotube 32.
Referring to fig. 2, in some embodiments, each carbon nanotube 32 has graphene 31 connected to both ends thereof. Thus, the graphene 31 and the carbon nanotubes 32 are connected in an interlaced manner to form the heat conducting channel 33 with excellent heat conducting performance.
Referring to fig. 3, in some embodiments, the heat dissipation film 30 includes a plurality of heat dissipation sub-layers 34 stacked one on another, each heat dissipation sub-layer 34 includes graphene 31 and carbon nanotubes 32, and each heat dissipation sub-layer 34 is formed with a heat conduction channel 33.
Thus, the heat dissipation film layer 30 can be formed by overlapping the plurality of heat dissipation sublayers 34, so that the heat dissipation film layer 30 has a certain thickness, the plurality of heat dissipation sublayers 34 are all formed with one heat conduction channel 33, and the plurality of heat conduction channels 33 can more efficiently conduct out the heat generated by the first driving chip 20.
Specifically, the number of heat dissipation sublayers 34 is not limited herein. In the manufacturing process, a single-layer graphene and a carbon nanotube may be firstly used to form a single-layer composite film (i.e., the heat dissipation sublayer 31), and then a plurality of single-layer composite films are stacked to form a multi-layer composite film (i.e., the heat dissipation film 30).
Referring to fig. 6, in some embodiments, the display panel assembly 100 further includes a thermal insulation layer 40, and the thermal insulation layer 40 is attached to the display panel 10 and located between the heat dissipation film layer 30 and the display panel 10.
In this way, the thermal insulation layer 40 can effectively block heat transfer between the heat dissipation film layer 30 and the display panel 10, thereby further reducing the influence of the heat of the first driving chip 20 on the display panel 10.
Specifically, it can be understood that, as can be seen from the above description, the heat dissipation film layer 30 is a composite film layer formed by compounding the graphene 31 and the carbon nanotubes 32, and although the thermal conductivity of the heat dissipation film layer 30 in the direction parallel to the display screen 10 is much greater than the thermal conductivity in the direction perpendicular to the display screen 10, a part of heat may still be transferred to the display screen 10 from the direction perpendicular to the display screen 10, and therefore, the heat insulation layer 40 disposed between the heat dissipation film layer 30 and the display screen 10 can effectively block the part of heat from being transferred to the display screen 10 to avoid affecting the display screen 10.
In the embodiment of the present application, the material of the thermal insulation layer 40 may be an inorganic compound or an organic high molecular polymer having a relatively high heat resistance, such as high temperature resistant PI, PET, foam, a metal layer, and the like, which are not specifically shown herein. In addition, in the embodiment of the present application, the thermal insulation layer 40 may also include a plurality of thermal insulation sublayers arranged in a stacked manner, and the materials of the plurality of thermal insulation sublayers may be different or the materials of at least two thermal insulation sublayers are different, so that the propagation of heat can be blocked more effectively by using the characteristics of different materials that have different thermal insulation effects.
Referring to fig. 1 and 4, in some embodiments, the heat dissipation film 30 extends to the edge of the display screen 10.
Thus, the heat dissipation film 30 can extend to the edge of the display screen 10 along the parallel direction of the display screen 10 so as to guide the heat generated by the first driving chip 20 out of the display screen 10 to be dissipated to the outside.
Specifically, referring to fig. 10, it can be understood that in an electronic device 1000 such as a mobile phone having the display screen 10, the display screen assembly 100 is usually mounted on the housing 200, and it is finally the channel housing 200 for heat dissipation. Therefore, the heat dissipation film layer 30 extending to the edge of the display screen 10 along the parallel direction of the display screen 10 can guide the heat to the housing 200 as quickly as possible to be dissipated to the outside through the housing 200 of the electronic device 1000 to maintain the low temperature state of the first driving chip 20.
Referring to fig. 1, in some embodiments, the heat dissipation film 30 includes a first portion 35 corresponding to the first driving chip 20 and a second portion 36 outside the first driving chip 20. The second portion 36 extends from one end of the first portion 35 towards the edge of the display screen 10, and the cross-sectional area of the second portion 36 in a direction perpendicular to the extension direction of the second portion 36 is larger than the cross-sectional area of the first portion 35 in the direction perpendicular to the extension direction of the second portion 36. It will be appreciated that in fig. 1, the direction perpendicular to the extension of the second portion 36 is the direction perpendicular to the display screen 10, i.e. perpendicular to the plane of the paper.
In this way, setting the cross-sectional area of the second portion 36 in the direction perpendicular to the extending direction of the second portion 36 to be larger than the cross-sectional area of the first portion 35 in the direction perpendicular to the extending direction of the second portion 36 can increase the heat transfer area as much as possible to improve the heat dissipation efficiency.
Specifically, referring to fig. 1, in the illustrated embodiment, the first portion 35 of the heat dissipation film 30 corresponds to the first driving chip 20, the number of the second portions 36 is two, the two second portions 36 are respectively connected to two ends of the first portion 35, the two second portions 36 respectively extend from two ends of the first portion 35 to edges of the display panel 10, the planar structure of the second portion 36 may be rectangular, trapezoidal, or other shapes, and the cross-sectional area of the second portion 36 is larger than that of the first portion 35. Furthermore, it is understood that in such an embodiment, the first portion 35 corresponds to the first driving chip 20, which can be understood as the first portion 35 just completely covering the first driving chip 20 or slightly exceeding the first driving chip 20.
Further, in certain embodiments, the second portion 36 has a cross-sectional area that gradually increases in a direction perpendicular to the extension of the second portion 36.
Thus, the second portion 36 gradually expands from one end of the first portion 35 to the edge of the display screen 10, so as to improve the heat dissipation efficiency of the heat dissipation film 30.
Referring to fig. 7, in some embodiments, the display panel assembly 100 further includes a heat conductive layer 50, and the heat conductive layer 50 is stacked between the heat dissipation film layer 30 and the first driving chip 20.
In this way, the heat conduction layer 50 contacts the first driving chip 20 to fill the air gap between the heat dissipation film layer 30 and the first driving chip 20, and the heat generated by the first driving chip 20 can be quickly guided to the heat dissipation film layer 30 through the heat conduction layer 50.
Specifically, the heat conductive layer 50 may be made of heat conductive silicone. It is understood that air is a poor conductor of heat and does not conduct heat well, resulting in heat build-up. Therefore, in such an embodiment, disposing the heat conductive layer 50 between the heat dissipation film layer 30 and the first driver chip 20 may enable heat to be quickly conducted out through the heat conductive layer 50 and the heat dissipation film layer 30 to avoid heat accumulation.
Of course, it is understood that in some embodiments, the heat conducting layer 50 may not be provided, but the first driving chip 20 is directly attached to the heat dissipation film layer 30, and the heat dissipation film layer 30 directly contacts the first driving chip 20 and fills the gap between the first driving chip 20 and the display screen 10, so that the heat dissipation film layer 30 may be directly connected to the hot spot (the first driving chip 20), and the gap at the connection is substantially eliminated, thereby reducing the heat source concentration.
Referring to fig. 8, in some embodiments, the display panel 10 includes a display layer 11 and a touch layer 12 stacked on the display layer 11, the first driving chip 20 is electrically connected to the display layer 11, the display panel assembly 100 further includes a second driving chip 60, the second driving chip 60 is electrically connected to the touch layer 12, and the second driving chip 60 and the heat dissipation film 30 are disposed in a staggered manner.
In this way, the display layer 11 can be driven by the first driving chip 20 to display, the touch layer 12 can be driven by the second driving chip 60 to perform touch feedback, and meanwhile, the second driving chip 60 for driving the touch side 12 generates less heat during operation, and can be arranged in a staggered manner with the heat dissipation film 30 to reduce the arrangement area of the heat dissipation film 30, thereby saving the manufacturing cost.
Specifically, referring to fig. 1, in such an embodiment, the display screen assembly 100 may include a flexible circuit board 70, one end of the flexible circuit board 70 may be electrically connected to the first driving chip 20, the other end of the flexible circuit board is used for electrically connecting to a main board of an electronic device 1000 (such as a mobile phone) having the display screen assembly 100, and the second driving chip 60 may be disposed on the flexible circuit board 70.
Further, referring to fig. 1 and 8, in such an embodiment, the display panel assembly 100 may further include a heat dissipation member 80, the heat dissipation member 80 is attached to the second driving chip 60, the heat dissipation member 80 may be a composite film of graphene 31 and carbon nanotubes 32 as the heat dissipation film layer 30, and the heat dissipation member 80 covers the second driving chip 60 and extends to the edge of the display panel 10. In this way, the heat sink 80 is provided to quickly dissipate the heat generated by the second driving chip 60 to improve the heat dissipation efficiency of the second driving chip 60.
Referring to fig. 9, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 200 and the display panel assembly 100 according to any of the embodiments, where the display panel assembly 100 is mounted on the housing 200.
In the electronic device 1000 according to the embodiment of the application, the heat dissipation film layer 30 is disposed between the display screen 10 and the first driving chip 20, the heat dissipation film layer 30 includes the graphene 31 and the carbon nanotubes 32, the graphene 31 and the carbon nanotubes 32 jointly constitute the heat conduction channel 33 of the heat dissipation film layer 30, and the thermal conductivity of the heat dissipation film layer 30 in the direction parallel to the display screen 10 is greater than the thermal conductivity in the direction perpendicular to the display screen 10. In this way, the heat dissipation film layer 30 is compositely constructed into the heat conduction channel 33 with higher heat conduction capability by using the graphene 31 and the carbon nanotubes 32 with high heat conduction performance, and the heat conduction of the heat dissipation film layer 30 in the direction parallel to the display screen 10 is higher, so that the heat generated by the first driving chip 20 can be efficiently conducted out by the heat dissipation film layer 30 in the direction parallel to the display screen 10, and the phenomenon that the display screen 10 is shortened in service life and even burnt out due to too much and too much concentrated heat generated by the first driving chip 20 is avoided.
Specifically, the electronic device 1000 according to the embodiment of the present application includes, but is not limited to, an electronic device having the display screen 10, such as a mobile phone, a tablet computer, and a wearable device.
Referring to fig. 9, in some embodiments, a heat dissipation structure 201 is formed on an inner wall of the housing 200, and the heat dissipation film 30 extends to an edge of the display screen 10 and is in heat conduction connection with the heat dissipation structure 201.
Thus, the heat dissipation film layer 30 is connected with the heat dissipation structure 201 on the housing 200 in a heat conduction manner, so that the heat generated by the first driving chip 20 can be quickly guided to the housing 200 through the heat dissipation film layer 30, and then dissipated to the outside through the heat dissipation structure 201 to maintain the first driving chip 20 in a low temperature state, thereby avoiding the display screen 10 from being burnt out due to excessive heat and excessive concentration.
Further, referring to fig. 10, in such an embodiment, the heat dissipation structure 201 includes a plurality of protrusions 202 disposed at intervals, a groove 203 is formed between two adjacent protrusions 202, and the heat dissipation film layer 30 covers the plurality of protrusions 202 and at least partially fills the groove 203.
As such, the heat dissipation film layer 30 covering the protrusions 202 of the heat dissipation structure 201 and at least partially filling the grooves 203 may make the contact area of the heat dissipation film layer 30 and the housing 200 larger to improve the heat dissipation efficiency.
Specifically, referring to fig. 1 and 10, in such an embodiment, the second portion 36 of the heat dissipation film 30 is in an umbrella structure and contacts with the heat dissipation structure 201, and the heat dissipation structure 201 may be a sawtooth structure formed on the inside of the housing 200, when the display panel assembly 100 is mounted on the housing 200, the heat dissipation film 30 can cover the protrusions 202 of the heat dissipation structure 201 and fill the grooves 203 of the heat dissipation structure 201, so that the contact area between the heat dissipation film 30 and the housing 200 is increased, and the heat dissipation efficiency is also improved accordingly.
In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims (11)

1. A display screen assembly, comprising:
a display screen;
the first driving chip is arranged in a stacking mode with the display screen and is electrically connected with the display screen;
the heat dissipation film layer is stacked between the display screen and the first driving chip and covers the first driving chip, the heat dissipation film layer comprises graphene and carbon nano tubes, the graphene and the carbon nano tubes are jointly constructed into a heat conduction channel of the heat dissipation film layer, and the heat conductivity of the heat dissipation film layer in the parallel direction of the display screen is larger than the heat conductivity of the heat dissipation film layer in the vertical direction of the display screen.
2. The display screen assembly of claim 1, wherein the heat dissipation film layer includes a plurality of heat dissipation sub-layers stacked together, each of the heat dissipation sub-layers including the graphene and the carbon nanotubes, and each of the heat dissipation sub-layers having one of the heat conduction channels formed therein.
3. The display screen assembly of claim 1, further comprising a thermal insulating layer attached to the display screen and located between the heat sink film layer and the display screen.
4. The display screen assembly of claim 1, wherein the heat sink film layer extends to an edge location of the display screen.
5. The display screen assembly of claim 1, wherein the heat dissipation film layer includes a first portion corresponding to the first driver chip and a second portion located outside the first driver chip;
the second portion extends from one end of the first portion to an edge of the display screen, and a cross-sectional area of the second portion in a direction perpendicular to an extending direction of the second portion is larger than a cross-sectional area of the first portion in the direction perpendicular to the extending direction of the second portion.
6. The display screen assembly of claim 5, wherein the second portion has a gradually increasing cross-sectional area in a direction perpendicular to an extension of the second portion.
7. The display screen assembly of claim 1, further comprising a thermally conductive layer disposed between the heat sink film layer and the first driver chip in a stacked arrangement.
8. The display screen assembly of claim 1, wherein the display screen includes a display layer and a touch layer stacked on the display layer, the first driving chip is electrically connected to the display layer, the display screen assembly further includes a second driving chip, the second driving chip is electrically connected to the touch layer, and the second driving chip and the heat dissipation film are arranged in a staggered manner.
9. An electronic device, comprising:
a housing; and
the display screen assembly of any of claims 1-8, the display screen assembly mounted on the housing.
10. The electronic device of claim 9, wherein a heat dissipation structure is formed on an inner wall of the housing, and the heat dissipation film extends to an edge of the display screen and is in heat conduction connection with the heat dissipation structure.
11. The electronic device of claim 10, wherein the heat dissipation structure comprises a plurality of protrusions arranged at intervals, a groove is formed between two adjacent protrusions, and the heat dissipation film layer covers the plurality of protrusions and at least partially fills the groove.
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