US20150000885A1

US20150000885A1 - Enclosure of high heat dispersion capacity and electronic device using same

Info

Publication number: US20150000885A1
Application number: US14/133,475
Authority: US
Inventors: Jen-Tsorng Chang
Original assignee: Hon Hai Precision Industry Co Ltd
Current assignee: Hon Hai Precision Industry Co Ltd
Priority date: 2013-06-28
Filing date: 2013-12-18
Publication date: 2015-01-01
Also published as: TW201500187A

Abstract

An enclosure includes a casing, a heat dispersion layer, and a cover glass. The casing includes an outer surface. The heat dispersion layer is covered on the outer surface. The cover glass is covered on a side of the heat dispersion layer facing away from the casing, and a part of the heat dispersion layer is exposed to air from the cover glass. The heat dispersion layer has a larger heat dispersion area than the casing.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to enclosures, and particularly to an enclosure having relatively high heat-dispersion capacity and an electronic device using the enclosure.
2. Description of Related Art
Electronic devices may include a casing and a cover glass. The cover glass covers the casing to protect an outer surface of the electronic device from being scratched. However, heat-dispersion efficiency of the cover glass is often lower than satisfactory, which results in heat generated by electronic elements received in the casing not being dissipated efficiently.
Therefore, it is desirable to provide an enclosure for an electronic device to overcome the limitations described.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of an embodiment of an electronic device.

FIG. 2 is a cross-sectional view of an enclosure of the electronic device of FIG. 1.

DETAILED DESCRIPTION

Embodiments of the disclosure will be described with reference to the drawings.
FIGS. 1-2 show an exemplary embodiment of an electronic device 100. The electronic device 100 includes an enclosure 10 and at lease one electronic element 20, such as a display screen or a circuit board, received in the enclosure 10. In the embodiment, the electronic device 100 is a mobile phone.
The enclosure 10 includes a casing 11, a heat dispersion layer 12, a cover glass 13, and two optical glue layers 14.
The casing 11 is substantially cuboid and can be made of metal or plastic. In other embodiments, the casing 11 can be any other suitable shape and be made of other suitable materials. The casing 11 includes an outer surface 111.
The heat dispersion layer 12 is made of a grapheme or carbon nanotubes film. A thermal conductivity of the heat dispersion layer 12 is greater than a thermal conductivity of the casing 11. The heat dispersion layer 12 made of graphene or carbon nanotubes has a large heat dispersion area than the casing 11.
In the embodiment, the heat dispersion layer 12 is transparent and absorbs less than about 2.3% of light rays. A thermal conductivity of the heat dispersion layer 12 is about 5300 watts per milliKelvin (W/mK). The heat dispersion layer 12 is flexible. A thickness of the heat dispersion layer 12 is about 100 micrometers (gm) to about 1000 μm.
The cover glass 13 can be made of sapphire, tempered glass, or other suitable material. The cover glass 13 includes an upper surface 131 and a lower surface 132. A surface hardness of the upper surface 131 is about 8 H to about 9 H. The lower surface 132 defines a plurality of nanometer-sized recesses (not shown) formed by etching. In the embodiment, a thermal conductivity of the cover glass 13 is about 1.1 W/mK. A thickness of the cover glass 13 is about 10 μm to about 150 μm.
Each optical glue layer 14 is formed by a hard glue made of epoxy resin. An adhesive strength of the optical glue layer 14 is about A9, and more than about 90% of light rays can penetrate the optical glue layer 14.
In assembly, a layer of epoxy resin is sprayed on the outer surface 111 of the casing 11 and cured, thereby forming the first optical glue layer 14. The heat dispersion layer 12 is attached to the casing 11 by the first optical glue layer 14.
Another layer of epoxy resin is sprayed on the heat dispersion layer 12 and cured, thereby forming the second optical glue layer 14. The lower surface 132 of the cover glass 13 is adhered to the second optical glue layer 14, thereby attaching the cover glass 13 to the heat dispersion layer 12. In the embodiment, sides of the heat dispersion layer 12 are directly exposed to air. As the heat dispersion layer 12 is flexible, the cover glass 13 can be wholly attached to the casing 11. As the lower surface 132 is etched to define nanometer-sized recesses, an adhesive strength of the enclosure 13 is improved.
In use, heat generated by the electronic element 20 is transferred to the casing 11. As the heat dispersion layer 12 has a larger heat dispersion area than the casing 11, the heat is quickly transferred from the casing 11 to the heat dispersion layer 12, and the heat is subsequently dissipated to ambient air from the heat dispersion layer 12. As the thermal conductivity of the heat dispersion layer 12 is greater than that of the casing 11, the heat will not be transferred to the cover glass 13.
When an external force is applied on the upper surface 131 of the cover glass 13, the cover glass 13 will not be easily scratched. In addition, the optical glue layers 14 absorb a portion of force applied on the cover glass 13, so the cover glass 13 will not be easily damaged.
Particular embodiments are shown and described by way of illustration only. The principles and the features of the present disclosure may be employed in various and numerous embodiments thereof without departing from the scope of the disclosure as claimed. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.

Claims

What is claimed is:

1. An enclosure, comprising:

a casing comprising an outer surface;

a heat dispersion layer covered on the outer surface; and

a cover glass covered on a side of the heat dispersion layer facing away the casing, a part of the heat dispersion layer exposing from the cover glass, the heat dispersion layer having a larger heat dispersion area than the casing.

2. The enclosure of claim 1, wherein a thermal conductivity of the heat dispersion layer is greater than the casing.

3. The enclosure of claim 1, wherein the heat dispersion layer is made of graphene or carbon nanotubes.

4. The enclosure of claim 1, further comprising two optical glue layers, wherein one optical glue layer is adhered between the heat dispersion layer and the casing, another optical glue layer is adhered between the cover glass and the heat dispersion layer.

5. The enclosure of claim 1, wherein sides of the heat dispersion layer are directly exposed to air.

6. An electronic device, comprising;

an enclosure, comprising:

a casing comprising an outer surface;

a heat dispersion layer covered on the outer surface; and

a cover glass covered on a side of the heat dispersion layer facing away the casing, a part of the heat dispersion layer exposing from the cover glass, the heat dispersion layer having a larger heat dispersion area than the casing; and

at lease one electronic device received in the enclosure.

7. The electronic device of claim 6, wherein a thermal conductivity of the heat dispersion layer is greater than the casing.

8. The electronic device of claim 6, wherein the heat dispersion layer is made of graphene or carbon nanotube.

9. The electronic device of claim 6, further comprising two optical glue layers, wherein one optical glue layer is adhered between the heat dispersion layer and the casing, another optical glue layer is adhered between the cover glass and the heat dispersion layer.

10. The electronic device of claim 6, wherein sides of the heat dispersion layer are directly exposed to air.