CN112492890A - 显示基板及其制备方法、显示装置 - Google Patents
显示基板及其制备方法、显示装置 Download PDFInfo
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- CN112492890A CN112492890A CN201980001037.7A CN201980001037A CN112492890A CN 112492890 A CN112492890 A CN 112492890A CN 201980001037 A CN201980001037 A CN 201980001037A CN 112492890 A CN112492890 A CN 112492890A
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 229910052750 molybdenum Inorganic materials 0.000 claims description 14
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
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- 239000010949 copper Substances 0.000 claims description 9
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
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- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 3
- 235000011008 sodium phosphates Nutrition 0.000 claims description 3
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 3
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 3
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- LFETXMWECUPHJA-UHFFFAOYSA-N methanamine;hydrate Chemical compound O.NC LFETXMWECUPHJA-UHFFFAOYSA-N 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
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- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
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Images
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示基板及其制备方法、显示装置。该显示基板(200)的制备方法包括:形成显示区(21)和非显示区(22),非显示区(22)包括开孔区(222);在显示区(21)和开孔区(222)之间形成第一阻隔墙(23),第一阻隔墙(23)围绕开孔区(222)且包括第一金属层结构,第一金属层结构的围绕开孔区(222)的至少一个侧面形成有凹口(231);在第一阻隔墙(23)形成后,在显示区(21)内以及第一阻隔墙(23)上形成导电层图案(218);形成导电层图案(218)包括:在显示区(21)和第一阻隔墙(23)上形成导电材料层(2180),导电材料层(2180)在第一阻隔墙(23)处断开,对导电材料层(2180)进行构图以形成导电层图案(218)。该显示基板(200)将摄像装置与显示区(21)结合在一起,具有较大的占屏比,且具有较好的显示效果与信赖性。
Description
PCT国内申请,说明书已公开。
Claims (24)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2019/095805 WO2021007712A1 (zh) | 2019-07-12 | 2019-07-12 | 显示基板及其制备方法、显示装置 |
Publications (1)
Publication Number | Publication Date |
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CN112492890A true CN112492890A (zh) | 2021-03-12 |
Family
ID=74210122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201980001037.7A Pending CN112492890A (zh) | 2019-07-12 | 2019-07-12 | 显示基板及其制备方法、显示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11527738B2 (zh) |
CN (1) | CN112492890A (zh) |
WO (1) | WO2021007712A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210016230A (ko) * | 2019-08-02 | 2021-02-15 | 삼성디스플레이 주식회사 | 표시 장치 |
EP4091199A1 (en) * | 2020-02-18 | 2022-11-23 | Google LLC | Reducing hole bezel region in displays |
EP4131396A4 (en) * | 2020-03-27 | 2023-05-24 | BOE Technology Group Co., Ltd. | DISPLAY PANEL, METHOD OF MANUFACTURING THEREOF AND ELECTRONIC DEVICE |
KR20220085110A (ko) * | 2020-12-14 | 2022-06-22 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
CN117813936A (zh) * | 2022-06-20 | 2024-04-02 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法、显示装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102427249B1 (ko) * | 2015-10-16 | 2022-08-01 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102490891B1 (ko) * | 2015-12-04 | 2023-01-25 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102381901B1 (ko) * | 2017-09-07 | 2022-04-01 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
CN108666347B (zh) | 2018-04-26 | 2021-07-30 | 上海天马微电子有限公司 | 显示面板及其制造方法、显示装置 |
CN108649052B (zh) * | 2018-04-28 | 2021-11-26 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法、显示装置 |
CN110164916B (zh) * | 2018-12-05 | 2021-02-02 | 京东方科技集团股份有限公司 | 显示面板、显示设备及制造显示面板的方法 |
CN109742121B (zh) | 2019-01-10 | 2023-11-24 | 京东方科技集团股份有限公司 | 一种柔性基板及其制备方法、显示装置 |
CN109713018B (zh) * | 2019-01-14 | 2020-08-21 | 京东方科技集团股份有限公司 | 一种显示装置及其制作方法 |
CN109904208B (zh) | 2019-03-19 | 2021-01-26 | 京东方科技集团股份有限公司 | 有机发光显示器及其制备方法、显示装置 |
CN109935621B (zh) * | 2019-03-29 | 2021-02-26 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
-
2019
- 2019-07-12 WO PCT/CN2019/095805 patent/WO2021007712A1/zh active Application Filing
- 2019-07-12 CN CN201980001037.7A patent/CN112492890A/zh active Pending
- 2019-07-12 US US16/767,663 patent/US11527738B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2021007712A1 (zh) | 2021-01-21 |
US11527738B2 (en) | 2022-12-13 |
US20220077423A1 (en) | 2022-03-10 |
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