CN1123515A - Resin-molded electronic circuit device - Google Patents
Resin-molded electronic circuit device Download PDFInfo
- Publication number
- CN1123515A CN1123515A CN94118415A CN94118415A CN1123515A CN 1123515 A CN1123515 A CN 1123515A CN 94118415 A CN94118415 A CN 94118415A CN 94118415 A CN94118415 A CN 94118415A CN 1123515 A CN1123515 A CN 1123515A
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- CN
- China
- Prior art keywords
- resin
- electronic
- circuit board
- circuit device
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The electronic elements and circuit board are covered with a protecting resin die pressing piece with almost the same thermal expansion coefficient as that of the metal forming the electronic elements and the circuit board, one end of the protecting resin piece has a connector used for connecting the external terminals of the circuit board. Owing to no need of external case for protecting resin, thus simplifying the structure, reducing the fabrication man-hour and improving the appearance of the circuit device.
Description
The present invention relates to a kind of resin-molded electronic-circuit device, more particularly, relate to a kind of electronic circuit substrate that electronic component is housed and cover the resin-molded electronic-circuit device of being protected with resin coating.
For example, in the electronic-circuit device that the igniter of two-wheel car is used, be contained in its inner electronic component, electronic circuit board etc. and all be covered with, protect them to avoid the effect of moisture content, vibration etc. with resin coating in order to the control ignition time.
Fig. 4 and Fig. 5 are respectively the plane graph and the cutaway view of the resin-molded electronic-circuit device of this quasi-tradition.Referring to these figure, can see that the end face of plastic casing 1 and front have eyelet, the left and right sides of shell is provided with fixedly the part 1a and the 1a ' of usefulness.Connector 4 as the external cabling terminal with above electronic component 3 is housed electronic circuit board 2 be connected.Protection part 4b is made of plastics, and around the terminal part 4a configuration of connector 4, connector 4 itself then is fixed on shell 1 front end by protection part 4b, is covered with the front end of shell 1.
Protection resin 5 pours in the shell 1, the electronic component 3 that shell 1 the inside disposes electronic circuit board 2 and locatees by electronic circuit board 2,4 fronts that are fixed on shell 1 of connector.Electronic circuit board 2 and electronic component 3 are being protected by protection resin 5, make its invasion and attack that are not subjected to outside moisture etc., and fix with shockproof.Electronic circuit board 2, electronic component 3, connector 4 and protection resin 5 constitute electronic-circuit device 10.
The manufacture method of electronic-circuit device is described now.With methods such as solderings the terminal part 4a of connector 4 is welded to methods such as solderings and is fixed with after the electronic circuit board 2 of electronic component 3,, and connector 4 is attached to the front end of shell 1 electronic circuit board 2 fix in position in shell 1.Then resin material is injected shell 1, make it be full of shell 1, the shell 1 that will be full of resin material is again put into baker and is heated, and resin material is solidified, thereby forms protection resin 5.In the case, because the thermal coefficient of expansion of protection resin 5 is different with the metal part of electronic component, thereby during variations in temperature, can generation stress in the soldering part of electronic component 3 and electronic circuit board 2.For reduce stress as far as possible, protection resin 5 is made by pliable and tough resin material.
In electronic-circuit device 10, shell 1 is the requisite part of distortion of injecting resin material and suppressing pliable and tough protection resin 5 to a certain extent.Though it is contemplated that; need not shell and also can cover usefulness such as electronic component 3 protection resin 5 as long as metal die is injected in the resin material pressurization; but this pressurization injection moulding is inappropriate, may damage electronic component etc. because make a bet in the pressurization situation into the resin material.
Owing to above-mentioned traditional electronic-circuit device 10 needs with shell 1, thus the man-hour that has increased parts number and made electronic-circuit device, and protect resin 5 to spill from the gap between connector 4 and the shell 1, diminish the outward appearance of electronic-circuit device 10.In addition, when resin material injected shell 1, the bubble of can emerging under electronic circuit board 2 and the electronic component 3 had bad influence to electronic component 3.Have, when the shell 1 that is filled with resin material took baker to and goes, resin material can spill from shell 1 again.For eliminating above-mentioned shortcoming, making electronic-circuit device 10 just needs more man-hour.
Therefore, this electron-like circuit arrangement 10 need make it not be with shell 10.
The present invention is intended to address the above problem, and therefore the purpose of this invention is to provide a kind of resin-molded electronic-circuit device that need not for the shell of protecting resin to use.
For achieving the above object, resin-molded electronic-circuit device provided by the invention comprises electronic circuit board, protection resin molding and connector.Many electronic components are housed on the electronic circuit board; protection resin molding covers electronic component and electronic circuit board; its thermal coefficient of expansion is identical with the metal that constitutes electronic component and electronic circuit board; connector then is installed in an end of protection resin, as the external cabling terminal of electronic circuit board.
Fig. 1 is the plane graph of the electronic-circuit device of one embodiment of the invention.
Fig. 2 is the side sectional view of electronic-circuit device shown in Figure 1.
Fig. 3 is the major part of the employed low pressure molding pressure device of protection resin of mold pressing electronic-circuit device shown in Figure 1.
Fig. 4 is the plane graph of an example of conditional electronic circuit arrangement.
Fig. 5 is the cross sectional side view of electronic circuit shown in Figure 4.
Referring now to description of drawings one embodiment of the present of invention.
Fig. 1 and Fig. 2 are respectively the plane graph and the cross sectional side view of the electronic-circuit device of one embodiment of the invention.Among the figure with Fig. 4 and electronic-circuit device shown in Figure 5 10 similar or corresponding elements represent with same numbering, no longer these elements are described here.
Referring to Fig. 1 and Fig. 2.Protection resin 6 covers the outer surface of electronic circuit board 2 and is installed in electronic component 3 on the electronic circuit board 2, and by terminal part 4a with electronic circuit board 2 be attached thereto the connector 4 that connects and be combined into an integral body.Protection resin 6 contain main resina that the mixture of epoxy resin and inorganic powder for example makes and with solidify the thermoset resin material that curing agent that main resina uses mixes.Protection resin 6 is not easy strain, and its hardness is fixed, and its thermal coefficient of expansion is limited to certain scope, makes it almost identical with the metal that constitutes electronic circuit board 2 and electronic component 3.In view of there being a large amount of inorganic powders to be added in the main resina with the restriction thermal coefficient of expansion, even thereby protection resin 6 when adding curing agent thereby being not suitable for pouring into shell 1 etc., also keep the viscose glue state.
Referring now to Fig. 3, the molding methods of electronic-circuit device 11 protection resins 6 is described.The cutaway view of the low-pressure molding device major part of molding protection resin 6 usefulness when Fig. 3 is low-pressure molding.Referring to Fig. 3, the low-pressure molding device is introduced path 25 by patrix 20, counterdie 21, space segment 22, passage 23, exhaust channel 24 and resin material and is formed.Space segment 22 is formed by patrix 20 and counterdie 21, for the usefulness of injecting resin material toward mould.Exhaust channel is for the usefulness of discharging the air in space segment 22 grades.Resin material is introduced 25 in path and is used for resin material is introduced in space segment 22 grades.
At first, above electronic component 3 is housed electronic circuit board 2 horizontal settings in the lower part of space segment 22, and will be placed among the bonding part 22a that is in space segment 22 1 ends by the plug connector 4 that terminal part 4a is connected with electronic circuit board 2.Then, resin material introduce path 25 airtight situation under deflate from exhaust channel 24 1 sides by passage 23.When the pressure in space segment 22 grades dropped to predetermined vacuum pressure, exhaust channel 24 also became airtight.At this moment upper and lower mould 20 and 21 is heated to for example 150 ℃ temperature, and keeps this state, so that the resin material that is injected in the space segment 22 is solidified.
Resin material is introduced path 25 from resin material and is injected space segment 22 by passage 23.In the case, though as top theory is crossed, resin material is to contain the mixture that epoxy resin that is mixed with a large amount of inorganic powders and the curing agent that main resina is solidified are formed, be the viscose glue state, but keep vacuum state because space segment 22 grades are inner, thereby resin material is under low pressure to introduce in the space segment 22.Resin material arrives electronic circuit board 2, electronic component 3 and patches each part of 4, is full of space segment 22 and any space of unlikely generation.Resin material solidifies soon by means of the heat of upper and lower mould 20 and 21, forms protection resin 6, thereby has made resin-molded electronic-circuit device.
As mentioned above, be molded as because protection resin 6 usefulness low pressure molding method for makings are introduced in the space segment 22 under vacuum state, even thereby resin material glue not only but also be colloidal state, under low pressure also can inject each part of space segment 22.Therefore can almost divide identical protection resin 6 that above-mentioned each part is covered with thermal coefficient of expansion, and not cause electronic component 3 damages such as grade with the metal that forms electronic circuit board 2, electronic component 3 etc.
Therefore; because protection resin 6 and electronic circuit board 2 and electronic component 3 equivalent breathing; even thereby the variations in temperature in the electronic-circuit device 11, can not produce stress and crackle in the metal part between the metal of electronic component 3 part and electronic component 3, the electronic circuit board 2 etc. yet.In view of protection resin 6 is not easy strain, and hardness fixes, even thereby electronic-circuit device 11 shaken, weld part grades also not can stress and rupture.
In addition, because electronic-circuit device 11 need not use shell 1, thereby parts number and making number in man-hour can be less than conditional electronic circuit arrangements 10, improved simultaneously and installed 10 outward appearance.Have again, do not have here to produce in the shell 1 yet bubble, resin material in shell 1 transfer process from shell, in shortcoming such as spill.
As mentioned above, the shell that the protection resin does not need molded protection resin to use, parts number and making number in man-hour have reduced, and the outward appearance of device has been improved.In addition, can prevent that soldering part Yin Wendu between electronic component and itself and the electronic circuit board is accidental changes and damages.In addition, electronic-circuit device also is not difficult to be fixed on other device by the fixedly usefulness that the protection resin is made.
Claims (3)
1. resin-molded electronic-circuit device is characterized in that it comprises:
An electronic circuit board is equipped with many electronic components above;
A resin molded guard member is used to cover described electronic component and described electronic circuit board, and its thermal coefficient of expansion is almost identical with the metal that constitutes described electronic component and described electronic circuit board; With
A connector is contained in an end of described protection resin, as the external cabling terminal of described electronic circuit board.
2. resin-molded electronic-circuit device as claimed in claim 1; it is characterized in that; described protection resin is made with low-pressure modling, and described electronic circuit board and described connector that described element is housed above being about to are placed in the mould, resin is poured in the mould to be molded as again.
3. resin-molded electronic-circuit device as claimed in claim 1; it is characterized in that; described protection resin is referred to make by the thermosetting tree, and thermosetting resin is then made by the mixture that the curing agent of epoxy resin and composite main resina of inorganic powder and the described main resina of curing is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN94118415A CN1123515A (en) | 1994-11-24 | 1994-11-24 | Resin-molded electronic circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN94118415A CN1123515A (en) | 1994-11-24 | 1994-11-24 | Resin-molded electronic circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1123515A true CN1123515A (en) | 1996-05-29 |
Family
ID=5038822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94118415A Pending CN1123515A (en) | 1994-11-24 | 1994-11-24 | Resin-molded electronic circuit device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1123515A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7145254B2 (en) | 2001-07-26 | 2006-12-05 | Denso Corporation | Transfer-molded power device and method for manufacturing transfer-molded power device |
| CN100397796C (en) * | 2001-08-06 | 2008-06-25 | 西门子信息及移动通讯有限公司 | Mobile telephone and method for its manufacture |
| CN102444526A (en) * | 2010-09-30 | 2012-05-09 | 本田技研工业株式会社 | Engine control device |
| CN103128904A (en) * | 2012-12-29 | 2013-06-05 | 上海琥达投资发展有限公司 | Composite material sanitary appliance formed through two-time injections and preparation method thereof |
| CN104718804A (en) * | 2012-10-03 | 2015-06-17 | 新电元工业株式会社 | Electronic device |
| CN105008866A (en) * | 2012-12-20 | 2015-10-28 | 大陆-特韦斯贸易合伙股份公司及两合公司 | Sensor for detecting the position of a generator element |
| CN107006132A (en) * | 2015-02-10 | 2017-08-01 | 大陆泰密克微电子有限责任公司 | Electromechanical component and the method for producing electromechanical component |
| CN108141970A (en) * | 2015-09-29 | 2018-06-08 | 日立汽车***株式会社 | Electronic control unit or its manufacturing method |
| CN111988936A (en) * | 2020-08-17 | 2020-11-24 | 中国兵器工业集团第二一四研究所苏州研发中心 | Electronic module high overload resistance reinforcing structure and method |
| CN112384025A (en) * | 2020-11-16 | 2021-02-19 | 浙江大学 | Protective device of electronic device and packaging method thereof |
-
1994
- 1994-11-24 CN CN94118415A patent/CN1123515A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7145254B2 (en) | 2001-07-26 | 2006-12-05 | Denso Corporation | Transfer-molded power device and method for manufacturing transfer-molded power device |
| CN100397796C (en) * | 2001-08-06 | 2008-06-25 | 西门子信息及移动通讯有限公司 | Mobile telephone and method for its manufacture |
| CN102444526A (en) * | 2010-09-30 | 2012-05-09 | 本田技研工业株式会社 | Engine control device |
| CN102444526B (en) * | 2010-09-30 | 2015-02-25 | 本田技研工业株式会社 | Engine control device |
| CN104718804B (en) * | 2012-10-03 | 2018-10-23 | 新电元工业株式会社 | Electronic equipment |
| CN104718804A (en) * | 2012-10-03 | 2015-06-17 | 新电元工业株式会社 | Electronic device |
| CN105008866A (en) * | 2012-12-20 | 2015-10-28 | 大陆-特韦斯贸易合伙股份公司及两合公司 | Sensor for detecting the position of a generator element |
| CN103128904A (en) * | 2012-12-29 | 2013-06-05 | 上海琥达投资发展有限公司 | Composite material sanitary appliance formed through two-time injections and preparation method thereof |
| CN107006132B (en) * | 2015-02-10 | 2019-12-24 | 大陆泰密克微电子有限责任公司 | Electromechanical component and method for producing an electromechanical component |
| CN107006132A (en) * | 2015-02-10 | 2017-08-01 | 大陆泰密克微电子有限责任公司 | Electromechanical component and the method for producing electromechanical component |
| CN108141970A (en) * | 2015-09-29 | 2018-06-08 | 日立汽车***株式会社 | Electronic control unit or its manufacturing method |
| EP3358919A4 (en) * | 2015-09-29 | 2019-05-15 | Hitachi Automotive Systems, Ltd. | Electronic control device and manufacturing method for same |
| US10517181B2 (en) | 2015-09-29 | 2019-12-24 | Hitachi Automotive Systems, Ltd. | Electronic control device and manufacturing method for same |
| CN108141970B (en) * | 2015-09-29 | 2020-06-09 | 日立汽车***株式会社 | Electronic control device and method for manufacturing the same |
| CN111988936A (en) * | 2020-08-17 | 2020-11-24 | 中国兵器工业集团第二一四研究所苏州研发中心 | Electronic module high overload resistance reinforcing structure and method |
| CN112384025A (en) * | 2020-11-16 | 2021-02-19 | 浙江大学 | Protective device of electronic device and packaging method thereof |
| CN112384025B (en) * | 2020-11-16 | 2021-10-15 | 浙江大学 | Protective device of electronic device and packaging method thereof |
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