CN111988936A - Electronic module high overload resistance reinforcing structure and method - Google Patents
Electronic module high overload resistance reinforcing structure and method Download PDFInfo
- Publication number
- CN111988936A CN111988936A CN202010825883.5A CN202010825883A CN111988936A CN 111988936 A CN111988936 A CN 111988936A CN 202010825883 A CN202010825883 A CN 202010825883A CN 111988936 A CN111988936 A CN 111988936A
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- encapsulated
- reinforced
- metal
- metal shell
- core
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a high overload resistant reinforcing structure and method for an electronic module, which comprises a circuit board, core electronic components and epoxy resin or foaming adhesive, wherein the core electronic components are encapsulated and reinforced on the circuit board, and the epoxy resin or the foaming adhesive is arranged outside a lead; the core electronic component which is encapsulated and reinforced is arranged in the metal shell and is welded with a metal leading-out end on the metal shell through a lead; and the space between the core electronic component and the metal shell after being encapsulated and reinforced is encapsulated by silica gel. According to the invention, the core electronic component is encapsulated and reinforced by using high-strength epoxy resin or foaming glue, so that the high overload resistance of the core component of the whole electronic module is facilitated; the metal shell and the metal cover plate are used for reinforcing the whole product against overload impact; the silica gel is used for damping and buffering the encapsulated and reinforced core electronic component in the case of heavy overload, so that the impact force of external force on the encapsulated and reinforced core electronic component is further reduced.
Description
Technical Field
The invention relates to a high overload resistant reinforcing structure and method for an electronic module.
Background
The existing electronic module product has poor high overload resistance and is easily influenced by the impact force of external force, so that the reliability of electronic components, circuit boards and the like in the electronic module product is poor.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a high overload resistant reinforcing structure and method for an electronic module, which improve the high overload resistance of a core component of the electronic module and reduce the impact force of external force on the core electronic component.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a kind of electronic module resists the high and overloads the reinforced structure, its characteristic is, including encapsulating and strengthening in the circuit board and core electronic unit, epoxy resin or foamed glue outside the wire on it; the core electronic component which is encapsulated and reinforced is arranged in the metal shell and is welded with a metal leading-out end on the metal shell through a lead; and the space between the core electronic component and the metal shell after being encapsulated and reinforced is encapsulated by silica gel.
Furthermore, the hardness of the silica gel is 10-50.
Furthermore, the opening of the metal shell is covered by a metal cover plate.
Further, the metal terminals are sintered on the metal housing.
A high overload resistant reinforcing method for an electronic module is characterized in that a circuit board, core electronic components and wires on the circuit board are encapsulated and reinforced by epoxy resin or foaming glue, the reinforced core electronic components are welded to a metal leading-out end on a metal shell through the wires, and silica gel is encapsulated in a space between the metal shell and the epoxy resin or the foaming glue.
Furthermore, the hardness of the silica gel is 10-50.
Furthermore, the opening of the metal shell is covered by a metal cover plate.
Further, the metal terminals are sintered on the metal housing.
The invention achieves the following beneficial effects:
1. the core electronic component is encapsulated and reinforced by high-strength epoxy resin or foaming glue, so that the high overload resistance of the core component of the whole electronic module is facilitated.
2. And the metal shell and the metal cover plate are used for reinforcing the whole product against overload impact.
3. And the silica gel with the hardness of 10-50 is used for damping and buffering the encapsulated and reinforced core electronic component during heavy overload, so that the impact force of external force on the encapsulated and reinforced core electronic component is reduced.
Drawings
Fig. 1 is a high overload resisting reinforcement structure of the electronic module in the present embodiment.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
As shown in fig. 1, the electronic module high overload resisting and reinforcing structure comprises a circuit board, core electronic components on the circuit board, and epoxy resin or foam glue 4 with higher hardness outside flexible wires. The core electronic component 3 is soldered to the metal case 2 with the metal terminals 7 sintered thereto by the flexible leads 6.
The flexible lead 6 is connected with the core electronic component 3 in advance before the epoxy resin or the foaming adhesive 4 is filled and sealed and reinforced, after the epoxy resin or the foaming adhesive 4 is filled and reinforced, the filled and reinforced core electronic component 3 is placed inside the metal shell 2, and the flexible lead 6 and the metal leading-out end 7 on the metal shell 2 are welded inside the metal shell 2. And the space between the encapsulated and reinforced core electronic component 3 and the metal shell 2 is encapsulated by silica gel 5 with the hardness of 10-50. The opening of the metal shell 2 is covered by a metal cover plate 1.
According to the method in the embodiment, high overload resistance reinforcement is performed on an electronic module product in a reinforcement and buffering mode, the internal core electronic component 3 is encapsulated and reinforced by using epoxy resin or foaming glue 4 with high hardness, then the reinforced core electronic component 3 is welded to the metal shell 2 sintered with the metal leading-out end 7 through the welded flexible lead 6, then the silica gel 5 with the hardness of 10-50 is encapsulated in the space between the metal shell 2 and the epoxy resin or foaming glue 4, and finally the opening of the metal shell 2 is covered by using the metal cover plate 1.
The invention has the following advantages:
1. the core electronic component is encapsulated and reinforced by high-strength epoxy resin or foaming glue, so that the high overload resistance of the core component of the whole electronic module is facilitated.
2. And the metal shell and the metal cover plate are used for reinforcing the whole product against overload impact.
3. And the silica gel with the hardness of 10-50 is used for damping and buffering the encapsulated and reinforced core electronic component during heavy overload, so that the impact force of external force on the encapsulated and reinforced core electronic component is reduced.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A kind of electronic module resists the high and overloads the reinforced structure, its characteristic is, including encapsulating and strengthening in the circuit board and core electronic unit, epoxy resin or foamed glue outside the wire on it; the core electronic component which is encapsulated and reinforced is arranged in the metal shell and is welded with a metal leading-out end on the metal shell through a lead; and the space between the core electronic component and the metal shell after being encapsulated and reinforced is encapsulated by silica gel.
2. The electronic module high overload resistant reinforced structure of claim 1, wherein the hardness of the silicone rubber is between 10 and 50.
3. The electronic module high overload resistant reinforced structure of claim 1, wherein the open mouth of the metal shell is covered by a metal cover plate.
4. The electronic module high overload resistant reinforcement structure of claim 1, wherein the metal terminals are sintered to the metal housing.
5. A high overload resistant reinforcing method for an electronic module is characterized in that a circuit board, core electronic components and wires on the circuit board are encapsulated and reinforced by epoxy resin or foaming glue, the reinforced core electronic components are welded to a metal leading-out end on a metal shell through the wires, and silica gel is encapsulated in a space between the metal shell and the epoxy resin or the foaming glue.
6. The method as claimed in claim 5, wherein the silicone rubber has a hardness of 10-50.
7. The method of claim 5, wherein the opening of the metal housing is covered by a metal cover.
8. The method of claim 5, wherein the metal terminals are sintered to the metal housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010825883.5A CN111988936A (en) | 2020-08-17 | 2020-08-17 | Electronic module high overload resistance reinforcing structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010825883.5A CN111988936A (en) | 2020-08-17 | 2020-08-17 | Electronic module high overload resistance reinforcing structure and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111988936A true CN111988936A (en) | 2020-11-24 |
Family
ID=73434041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010825883.5A Pending CN111988936A (en) | 2020-08-17 | 2020-08-17 | Electronic module high overload resistance reinforcing structure and method |
Country Status (1)
| Country | Link |
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| CN (1) | CN111988936A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825323A (en) * | 2021-09-08 | 2021-12-21 | 西安睿高测控技术有限公司 | Axial impact overload resistant micro sensor and manufacturing method thereof |
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| US20190086189A1 (en) * | 2017-04-18 | 2019-03-21 | Dynaenergetics Gmbh & Co. Kg | Pressure bulkhead structure with integrated selective electronic switch circuitry |
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| CN210052597U (en) * | 2019-08-08 | 2020-02-11 | 东莞市勤宏电子科技有限公司 | Over-temperature protection piezoresistor |
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2020
- 2020-08-17 CN CN202010825883.5A patent/CN111988936A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1123515A (en) * | 1994-11-24 | 1996-05-29 | 三菱电机株式会社 | Resin-molded electronic circuit device |
| TW333740B (en) * | 1996-07-18 | 1998-06-11 | Omlron Kk | Electronic apparatus with resin filled inside and the manufacturing process |
| US20020029900A1 (en) * | 1997-02-18 | 2002-03-14 | Reinhold Wimberger Friedl | Synthetic resin capping layer on a printed circuit |
| CN1219767A (en) * | 1997-12-08 | 1999-06-16 | 东芝株式会社 | Package for semiconductor power device and method for assembling the same |
| TWM255261U (en) * | 2004-01-05 | 2005-01-11 | Hong Chi Technology Co Ltd | Module structure for small ozone generator |
| CN200941712Y (en) * | 2006-08-18 | 2007-08-29 | 重庆三信电子有限公司 | Controller of electric car |
| CN201341285Y (en) * | 2009-01-22 | 2009-11-04 | 无锡天和电子有限公司 | Package shell of power supply module |
| US20130314878A1 (en) * | 2010-12-08 | 2013-11-28 | Robert Bosch Gmbh | Control module and method for producing same |
| CN102548313A (en) * | 2012-02-13 | 2012-07-04 | 惠州茂硕能源科技有限公司 | Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply |
| CN202977036U (en) * | 2012-04-16 | 2013-06-05 | 深圳市辰驹电子科技有限公司 | Anti-surge protector capable of indicating temperature |
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| CN204497976U (en) * | 2015-02-15 | 2015-07-22 | 广州金升阳科技有限公司 | A kind of radiator structure |
| CN107439059A (en) * | 2016-09-26 | 2017-12-05 | 深圳市大疆创新科技有限公司 | Electron speed regulator and head, unmanned vehicle with the electron speed regulator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113825323A (en) * | 2021-09-08 | 2021-12-21 | 西安睿高测控技术有限公司 | Axial impact overload resistant micro sensor and manufacturing method thereof |
| CN113825323B (en) * | 2021-09-08 | 2024-04-05 | 西安睿高测控技术有限公司 | Axial impact overload resistance micro sensor and manufacturing method thereof |
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Application publication date: 20201124 |
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| RJ01 | Rejection of invention patent application after publication |