DE19707757A1 - Switching device e.g. for automobile airbag - Google Patents

Switching device e.g. for automobile airbag

Info

Publication number
DE19707757A1
DE19707757A1 DE1997107757 DE19707757A DE19707757A1 DE 19707757 A1 DE19707757 A1 DE 19707757A1 DE 1997107757 DE1997107757 DE 1997107757 DE 19707757 A DE19707757 A DE 19707757A DE 19707757 A1 DE19707757 A1 DE 19707757A1
Authority
DE
Germany
Prior art keywords
housing
assembly
plastic
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE1997107757
Other languages
German (de)
Inventor
Paul Josef Dipl Ing Adler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE1997107757 priority Critical patent/DE19707757A1/en
Publication of DE19707757A1 publication Critical patent/DE19707757A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

An electric device with at least one module (1) encased in plastic (5) and including a rigid housing (4) consisting of an injection-moulded thermoplastics material. The inner plastic (5) consists of another thermoplastics material whose melting point temperature is lower than the softening temperature of the housing (4) and the housing is filled with the plastic (5) after insertion of the module (1) in an injection moulding process.

Description

Es ist bekannt, mit Bauelementen bestückte Schaltungsträger in ein Gehäuse einzusetzen und mit duroplastischem Harz aus­ zugießen. Eine derartige Fertigung ist schwierig automati­ sierbar und mit hohen Materialkosten verbunden.It is known to have circuit carriers equipped with components insert in a housing and made of thermosetting resin pour in. Such a production is difficult automatic sizable and associated with high material costs.

Ferner ist es bekannt, zunächst die Baugruppe mit einer wei­ chen Komponente zu umhüllen und in einem weiteren separaten Fertigungsschritt mit einer harten Komponente zu umspritzen. Dies ergibt eine ungenaue Gehäusekontur, da die weiche Umhül­ lung unter der Hartkomponente beim Umspritzen verformt wird.Furthermore, it is known to first assemble the module with a white Chen component to wrap and in another separate To overmold the manufacturing step with a hard component. This results in an inaccurate contour of the housing, since the soft envelope is deformed under the hard component during the encapsulation.

Der Erfindung liegt die Aufgabe zugrunde, den Fertigungsauf­ wand bei der Herstellung des Gerätes zu verringern.The invention has for its object the manufacturing reduce wall in the manufacture of the device.

Diese Aufgabe wird durch die Erfindung gemäß Anspruch 1 ge­ löst. Das Gehäuse und die Umhüllung der Baugruppe können nun in einem Verfahrenszug hergestellt werden. Zunächst wird das Gehäuse in einer Spritzgußform ausgeformt. Danach wird die Baugruppe in das Gehäuse eingesetzt und mit einem weicheren Thermoplast schnell und kostengünstig umspritzt. Dadurch wird die Baugruppe vollständig feuchtigkeitsdicht und schockdämp­ fend umhüllt. Durch die Elastizität des Umhüllwerkstoffs kön­ nen unterschiedliche thermische Ausdehnungen im Betriebsfall ausgeglichen werden. Der thermoplastische Umhüllwerkstoff ist erheblich billiger als Gießharze. Das Spritzgießen ist sehr gut automatisierbar was vor allem bei in hohen Stückzahlen gefertigten Geräten z. B. in der Automobiltechnik von Vorteil ist.This object is achieved by the invention according to claim 1 solves. The housing and the casing of the assembly can now be produced in one process. First of all, it will Housing molded in an injection mold. After that the Assembly inserted in the housing and with a softer Injection molded thermoplastic quickly and inexpensively. This will the assembly is completely moisture-proof and shock-absorbing fend enveloped. Due to the elasticity of the wrapping material different thermal expansions during operation be balanced. The thermoplastic wrapping material is considerably cheaper than casting resins. The injection molding is very easy to automate what especially in large quantities manufactured devices such. B. advantageous in automotive engineering is.

Vorteilhafte Weiterbildungen der Erfindung sind in den An­ sprüchen 2 bis 5 gekennzeichnet:
Durch die Weiterbildung nach Anspruch 2 ist die Baugruppe zwar nach der Befestigungsseite hin offen. Auf dieser Seite ist sie im Einsatzfall jedoch durch die Montageplattform ge­ gen mechanische Einflüsse geschützt. Da der innere Kunststoff die Baugruppe allseitig umhüllt, ist diese vor allen anderen Einflüssen wie z. B. vor Feuchtigkeit geschützt. Durch das Weglassen von Gehäuseteilen auf der Flanschseite werden ent­ sprechende Materialkosten eingespart. Das Ausspritzen des Ge­ häuses läßt sich an einer derartigen offenen Form erheblich leichter durchführen.Advantageous developments of the invention are characterized in the claims 2 to 5:
Through the development according to claim 2, the assembly is open towards the fastening side. On this page, however, it is protected against mechanical influences by the mounting platform. Since the inner plastic envelops the assembly on all sides, it is above all other influences such. B. protected from moisture. By omitting housing parts on the flange side, material costs are saved accordingly. The spraying of the Ge housing can be carried out much easier on such an open form.

Durch die Weiterbildung nach Anspruch 3 wird der Bedarf an Ausgußmaterial erheblich verringert.Through the training according to claim 3, the need for Pouring material significantly reduced.

Durch die Weiterbildung nach Anspruch 4 wird die in den Bau­ elementen entstehende Wärme in direktem Materialkontakt nach außen bis in die Kühlrippen transportiert.Through the training according to claim 4 is in the construction heat generated in direct contact with the material transported outside into the cooling fins.

Durch die Weiterbildung nach Anspruch 5 können elektromagne­ tische Störeinflüsse mit geringem Fertigungsaufwand von und zu der Baugruppe abgeschirmt werden.Through the training according to claim 5 can electromagnetic table interference with low manufacturing costs of and shielded to the module.

Im folgenden wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispiels näher erläutert. Die dar­ gestellte Figur zeigt einen Schnitt durch ein elektrisches Gerät mit einer elektrischen Baugruppe 1, die aus einer Lei­ terplatte 2 und Bauelementen 3 besteht. Die Baugruppe 1 ist in ein thermoplastisch im Spritzguß hergestelltes Gehäuse 4 eingesetzt, dessen Außenkonturen der Topographie der bestück­ ten Leiterplatte 2 angepaßt ist.The invention is explained in more detail below with reference to an embodiment shown in the drawing. The figure shown shows a section through an electrical device with an electrical assembly 1 , which consists of a Lei terplatte 2 and components 3 . The assembly 1 is inserted into a thermoplastic injection-molded housing 4 , the outer contours of the topography of the printed circuit board 2 is adapted.

Die eingesetzte Baugruppe 1 ist in dem Gehäuse mit einem wei­ cheren, niedriger schmelzenden thermoplastischen Kunststoff derart ausgespritzt, daß das Gehäuse lückenlos ausgefüllt ist. Das Gehäuse weist auf der den Bauelementen 3 abgewandten Seite der Leiterplatte einen Befestigungsflansch 6 auf, des­ sen Auflagefläche 7 an eine Montageplattform z. B. eines Auto­ mobils angeschraubt werden kann. Das Gehäuse 4 ist demgemäß auf dieser Seite offen. Dennoch ist die Baugruppe 1 durch den inneren Kunststoff hinreichend geschützt.The assembly 1 used is sprayed in the housing with a white, lower-melting thermoplastic material such that the housing is completely filled. The housing has on the side facing away from the components 3 of the circuit board a mounting flange 6 , the sen support surface 7 on an assembly platform z. B. a car can be screwed mobiles. The housing 4 is accordingly open on this side. Nevertheless, the assembly 1 is adequately protected by the inner plastic.

Claims (5)

1. Elektrisches Gerät mit zumindest einer mit Kunststoff (5) umgossenen Baugruppe (1) und mit einem festen Gehäuse (4), dadurch gekennzeichnet,
daß das Gehäuse (4) aus einem spritzgegossenen thermoplasti­ schen Material besteht,
daß der innere Kunststoff (5) aus einem anderen thermoplasti­ schen Material besteht, dessen Schmelztemperatur niedriger ist als die Erweichungstemperatur des Gehäuses (4) und
daß das Gehäuse (4) nach dem Einsetzen der Baugruppe (1) in einem Spritzgießverfahren mit dem Kunststoff (5) gefüllt ist.1. Electrical device with at least one plastic ( 5 ) cast around assembly ( 1 ) and with a fixed housing ( 4 ), characterized in that
that the housing ( 4 ) consists of an injection molded thermoplastic material,
that the inner plastic ( 5 ) consists of another thermoplastic material whose melting temperature is lower than the softening temperature of the housing ( 4 ) and
that the housing ( 4 ) is filled with the plastic ( 5 ) in an injection molding process after the assembly ( 1 ) has been inserted. 2. Gerät nach Anspruch 1, dadurch gekennzeichnet,
daß das Gehäuse (4) auf einer Seite z. B. flanschartige Aufla­ geflächen (7) zum Befestigen an einer Montageplattform auf­ weist,
daß das Gehäuse auf dieser Seite offen ist,
daß die Bauelemente auf der in Auflageflächen (7) abgewandten Seite einer Leiterplatte (2) der Baugruppe (1) angeordnet sind und
daß das Gehäuse (4) bis über das Niveau der Leiterplatte (2) mit dem inneren Kunststoff (5) ausgegossen ist.2. Device according to claim 1, characterized in
that the housing ( 4 ) on one side z. B. flange-like bearing surfaces ( 7 ) for attachment to an assembly platform,
that the housing is open on this side,
that the components are arranged on the side of a printed circuit board ( 2 ) of the assembly ( 1 ) facing away from the support surfaces ( 7 ) and
that the housing ( 4 ) is poured over the level of the circuit board ( 2 ) with the inner plastic ( 5 ). 3. Gerät nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Kontur des Gehäuses (4) auf der Bauteileseite der Baugruppe (1) der Topographie der bestückten Leiterplatte (2) zumindest teilweise angepaßt ist.3. Apparatus according to claim 1 or 2, characterized in that the contour of the housing ( 4 ) on the component side of the assembly ( 1 ) of the topography of the printed circuit board ( 2 ) is at least partially adapted. 4. Gerät nach Anspruch 1, 2 oder 3, dadurch gekennzeichnet, daß das Gehäuse (4) auf der Bauteileseite mit angespritzten Kühlrippen versehen ist. 4. Apparatus according to claim 1, 2 or 3, characterized in that the housing ( 4 ) is provided on the component side with molded cooling fins. 5. Gerät nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß das Gehäuse (4) mit zumindest teilweise umspritzten Schirmblechen versehen ist.5. Device according to one of the preceding claims, characterized in that the housing ( 4 ) is provided with at least partially overmoulded shield plates.
DE1997107757 1997-02-26 1997-02-26 Switching device e.g. for automobile airbag Ceased DE19707757A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1997107757 DE19707757A1 (en) 1997-02-26 1997-02-26 Switching device e.g. for automobile airbag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1997107757 DE19707757A1 (en) 1997-02-26 1997-02-26 Switching device e.g. for automobile airbag

Publications (1)

Publication Number Publication Date
DE19707757A1 true DE19707757A1 (en) 1998-08-27

Family

ID=7821584

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997107757 Ceased DE19707757A1 (en) 1997-02-26 1997-02-26 Switching device e.g. for automobile airbag

Country Status (1)

Country Link
DE (1) DE19707757A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19923015A1 (en) * 1999-05-20 2000-12-07 Testo Gmbh & Co Portable control and display device
DE10345302A1 (en) * 2003-09-30 2005-04-21 Hella Kgaa Hueck & Co Electronic device manufacturing method has electronic component enclosed by plastics housing with applied metallized layer for providing electromagnetic screening
EP1643818A1 (en) * 2003-07-03 2006-04-05 Hitachi, Ltd. Module and method for fabricating the same
DE102005034546A1 (en) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Module with cooling device, has melt-body retained in number of cooling chambers
DE102011113929A1 (en) * 2011-09-21 2013-03-21 Oechsler Aktiengesellschaft Electromechanical circuit structure for use as rack for e.g. LED in automotive environment, has deriving device deriving heat dissipated from electrical component that is contacted with injection molding casing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248715A1 (en) * 1982-12-31 1984-07-05 Bosch Gmbh Robert ELECTRICAL SWITCHGEAR, ESPECIALLY FOR MOTOR VEHICLES
DE9105034U1 (en) * 1991-04-24 1991-06-20 Siemens AG, 8000 München Electronic control unit for a device in a motor vehicle
DE4112022A1 (en) * 1991-04-12 1992-10-15 Telefunken Electronic Gmbh HOUSING FOR INSTALLATION IN MOTOR VEHICLES TO RECEIVE ELECTRONIC COMPONENTS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248715A1 (en) * 1982-12-31 1984-07-05 Bosch Gmbh Robert ELECTRICAL SWITCHGEAR, ESPECIALLY FOR MOTOR VEHICLES
DE4112022A1 (en) * 1991-04-12 1992-10-15 Telefunken Electronic Gmbh HOUSING FOR INSTALLATION IN MOTOR VEHICLES TO RECEIVE ELECTRONIC COMPONENTS
DE9105034U1 (en) * 1991-04-24 1991-06-20 Siemens AG, 8000 München Electronic control unit for a device in a motor vehicle

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19923015A1 (en) * 1999-05-20 2000-12-07 Testo Gmbh & Co Portable control and display device
US6665174B1 (en) 1999-05-20 2003-12-16 Testo Ag Control and display device
EP1643818A1 (en) * 2003-07-03 2006-04-05 Hitachi, Ltd. Module and method for fabricating the same
EP1643818A4 (en) * 2003-07-03 2006-08-16 Hitachi Ltd Module and method for fabricating the same
DE10345302A1 (en) * 2003-09-30 2005-04-21 Hella Kgaa Hueck & Co Electronic device manufacturing method has electronic component enclosed by plastics housing with applied metallized layer for providing electromagnetic screening
DE102005034546A1 (en) * 2005-07-23 2007-01-25 Conti Temic Microelectronic Gmbh Module with cooling device, has melt-body retained in number of cooling chambers
DE102011113929A1 (en) * 2011-09-21 2013-03-21 Oechsler Aktiengesellschaft Electromechanical circuit structure for use as rack for e.g. LED in automotive environment, has deriving device deriving heat dissipated from electrical component that is contacted with injection molding casing
DE102011113929B4 (en) * 2011-09-21 2016-11-24 Oechsler Aktiengesellschaft Electromechanical circuit construction

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Legal Events

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OP8 Request for examination as to paragraph 44 patent law
8131 Rejection