CN112349869A - 一种纳米压印制备oled阳极的方法 - Google Patents
一种纳米压印制备oled阳极的方法 Download PDFInfo
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- CN112349869A CN112349869A CN202110010052.7A CN202110010052A CN112349869A CN 112349869 A CN112349869 A CN 112349869A CN 202110010052 A CN202110010052 A CN 202110010052A CN 112349869 A CN112349869 A CN 112349869A
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- quartz template
- anode
- polydimethylsiloxane
- quartz
- silicon substrate
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000001127 nanoimprint lithography Methods 0.000 title claims description 5
- 239000010453 quartz Substances 0.000 claims abstract description 78
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 28
- 239000010703 silicon Substances 0.000 claims abstract description 28
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 8
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- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 27
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 27
- -1 polydimethylsiloxane Polymers 0.000 claims description 27
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 16
- 239000000243 solution Substances 0.000 claims description 16
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- 238000001035 drying Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 7
- 239000011118 polyvinyl acetate Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 238000004528 spin coating Methods 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000002209 hydrophobic effect Effects 0.000 claims description 3
- 239000002086 nanomaterial Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 238000007790 scraping Methods 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 238000009210 therapy by ultrasound Methods 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 4
- 238000010023 transfer printing Methods 0.000 abstract description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 3
- 229910018503 SF6 Inorganic materials 0.000 description 2
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- 238000000861 blow drying Methods 0.000 description 2
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- 238000012545 processing Methods 0.000 description 2
- 238000009987 spinning Methods 0.000 description 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 2
- 229960000909 sulfur hexafluoride Drugs 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001803 electron scattering Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (5)
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CN202110010052.7A CN112349869B (zh) | 2021-01-06 | 2021-01-06 | 一种纳米压印制备oled阳极的方法 |
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CN202110010052.7A CN112349869B (zh) | 2021-01-06 | 2021-01-06 | 一种纳米压印制备oled阳极的方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113193157A (zh) * | 2021-04-26 | 2021-07-30 | 睿馨(珠海)投资发展有限公司 | 一种纳米压印制备硅基oled微型显示器的方法 |
CN116525475A (zh) * | 2023-07-05 | 2023-08-01 | 湖北芯研投资合伙企业(有限合伙) | 一种基于预定位自补偿式对准的晶圆级混合键合方法 |
Citations (7)
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KR20070092368A (ko) * | 2006-03-09 | 2007-09-13 | 주식회사 엘지화학 | 나노 와이어 그리드 편광자 및 그 제조방법 |
CN101304076A (zh) * | 2008-06-23 | 2008-11-12 | 中国科学院长春应用化学研究所 | 一种有机发光显示器件阴极隔离柱的加工方法 |
CN103837919A (zh) * | 2014-03-06 | 2014-06-04 | 成都贝思达光电科技有限公司 | 一种基于双层胶纳米压印的光栅结构彩色滤光膜加工方法 |
CN107203017A (zh) * | 2017-07-06 | 2017-09-26 | 深圳市华星光电技术有限公司 | 纳米线栅偏光片的制作方法 |
CN108539054A (zh) * | 2018-04-13 | 2018-09-14 | 苏州维业达触控科技有限公司 | 有机发光显示器件阴极隔离柱的制备方法 |
CN111180497A (zh) * | 2020-01-06 | 2020-05-19 | 京东方科技集团股份有限公司 | 一种显示基板、其制作方法及显示面板、显示装置 |
CN111554715A (zh) * | 2020-05-13 | 2020-08-18 | 京东方科技集团股份有限公司 | 显示面板及其制作方法 |
-
2021
- 2021-01-06 CN CN202110010052.7A patent/CN112349869B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070092368A (ko) * | 2006-03-09 | 2007-09-13 | 주식회사 엘지화학 | 나노 와이어 그리드 편광자 및 그 제조방법 |
CN101304076A (zh) * | 2008-06-23 | 2008-11-12 | 中国科学院长春应用化学研究所 | 一种有机发光显示器件阴极隔离柱的加工方法 |
CN103837919A (zh) * | 2014-03-06 | 2014-06-04 | 成都贝思达光电科技有限公司 | 一种基于双层胶纳米压印的光栅结构彩色滤光膜加工方法 |
CN107203017A (zh) * | 2017-07-06 | 2017-09-26 | 深圳市华星光电技术有限公司 | 纳米线栅偏光片的制作方法 |
CN108539054A (zh) * | 2018-04-13 | 2018-09-14 | 苏州维业达触控科技有限公司 | 有机发光显示器件阴极隔离柱的制备方法 |
CN111180497A (zh) * | 2020-01-06 | 2020-05-19 | 京东方科技集团股份有限公司 | 一种显示基板、其制作方法及显示面板、显示装置 |
CN111554715A (zh) * | 2020-05-13 | 2020-08-18 | 京东方科技集团股份有限公司 | 显示面板及其制作方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113193157A (zh) * | 2021-04-26 | 2021-07-30 | 睿馨(珠海)投资发展有限公司 | 一种纳米压印制备硅基oled微型显示器的方法 |
CN116525475A (zh) * | 2023-07-05 | 2023-08-01 | 湖北芯研投资合伙企业(有限合伙) | 一种基于预定位自补偿式对准的晶圆级混合键合方法 |
CN116525475B (zh) * | 2023-07-05 | 2024-04-02 | 湖北芯研投资合伙企业(有限合伙) | 一种基于预定位自补偿式对准的晶圆级混合键合方法 |
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Denomination of invention: A Method for Preparing OLED Anodes by Nanoimprinting Effective date of registration: 20230628 Granted publication date: 20210330 Pledgee: Yiwu Branch of Agricultural Bank of China Ltd. Pledgor: Zhejiang Hongxi Technology Co.,Ltd. Registration number: Y2023330001283 |
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Granted publication date: 20210330 Pledgee: Yiwu Branch of Agricultural Bank of China Ltd. Pledgor: Zhejiang Hongxi Technology Co.,Ltd. Registration number: Y2023330001283 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A method for preparing OLED anode by nanoimprinting Granted publication date: 20210330 Pledgee: Yiwu Branch of Agricultural Bank of China Ltd. Pledgor: Zhejiang Hongxi Technology Co.,Ltd. Registration number: Y2024330001173 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |