CN112322203A - 粘合片 - Google Patents
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- Publication number
- CN112322203A CN112322203A CN202010773172.8A CN202010773172A CN112322203A CN 112322203 A CN112322203 A CN 112322203A CN 202010773172 A CN202010773172 A CN 202010773172A CN 112322203 A CN112322203 A CN 112322203A
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- CN
- China
- Prior art keywords
- meth
- adhesive sheet
- acrylate
- weight
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000853 adhesive Substances 0.000 title claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 65
- 229920001971 elastomer Polymers 0.000 claims abstract description 40
- 239000000806 elastomer Substances 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 34
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 30
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims abstract description 17
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims abstract description 17
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 229920002635 polyurethane Polymers 0.000 claims abstract description 10
- 239000004814 polyurethane Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 40
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 15
- 239000000194 fatty acid Substances 0.000 claims description 15
- 229930195729 fatty acid Natural products 0.000 claims description 15
- 150000004665 fatty acids Chemical class 0.000 claims description 15
- 229920000058 polyacrylate Polymers 0.000 claims description 14
- 239000000470 constituent Substances 0.000 claims description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 11
- 125000000524 functional group Chemical group 0.000 claims description 11
- 239000003522 acrylic cement Substances 0.000 claims description 5
- 230000008602 contraction Effects 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 76
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 52
- -1 2-ethylhexyl Chemical group 0.000 description 36
- 238000011156 evaluation Methods 0.000 description 25
- 239000003431 cross linking reagent Substances 0.000 description 23
- 239000010410 layer Substances 0.000 description 22
- 238000011084 recovery Methods 0.000 description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229920005862 polyol Polymers 0.000 description 13
- 150000003077 polyols Chemical class 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 229920005749 polyurethane resin Polymers 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 7
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- 229920005601 base polymer Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 4
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 3
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 3
- 229960004063 propylene glycol Drugs 0.000 description 3
- 235000013772 propylene glycol Nutrition 0.000 description 3
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 3
- 229960002317 succinimide Drugs 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- PNJNLCNHYSWUPT-UHFFFAOYSA-N 2-methylpentane-1,4-diol Chemical compound CC(O)CC(C)CO PNJNLCNHYSWUPT-UHFFFAOYSA-N 0.000 description 2
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 2
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 2
- 235000019197 fats Nutrition 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- OHMBHFSEKCCCBW-UHFFFAOYSA-N hexane-2,5-diol Chemical compound CC(O)CCC(C)O OHMBHFSEKCCCBW-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 150000007519 polyprotic acids Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- AURYLBASVGNSON-UHFFFAOYSA-N (2,5-dioxopyrrolidin-3-ylidene)methyl prop-2-enoate Chemical compound C=CC(=O)OC=C1CC(=O)NC1=O AURYLBASVGNSON-UHFFFAOYSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- CPUBMKFFRRFXIP-YPAXQUSRSA-N (9z,33z)-dotetraconta-9,33-dienediamide Chemical compound NC(=O)CCCCCCC\C=C/CCCCCCCCCCCCCCCCCCCCCC\C=C/CCCCCCCC(N)=O CPUBMKFFRRFXIP-YPAXQUSRSA-N 0.000 description 1
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- UNVGBIALRHLALK-UHFFFAOYSA-N 1,5-Hexanediol Chemical compound CC(O)CCCCO UNVGBIALRHLALK-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- AHBNSOZREBSAMG-UHFFFAOYSA-N 1,5-diisocyanato-2-methylpentane Chemical compound O=C=NCC(C)CCCN=C=O AHBNSOZREBSAMG-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- IAUGBVWVWDTCJV-UHFFFAOYSA-N 1-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound CCC(S(O)(=O)=O)NC(=O)C=C IAUGBVWVWDTCJV-UHFFFAOYSA-N 0.000 description 1
- XTKZBPGQKMDFMC-UHFFFAOYSA-N 1-butyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CCCCN1C(=O)CC(=C)C1=O XTKZBPGQKMDFMC-UHFFFAOYSA-N 0.000 description 1
- BGKQCHAKBLWCDU-UHFFFAOYSA-N 1-cyclohexyl-3-methylidenepyrrolidine-2,5-dione Chemical compound O=C1C(=C)CC(=O)N1C1CCCCC1 BGKQCHAKBLWCDU-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- UBPXWZDJZFZKGH-UHFFFAOYSA-N 1-ethenyl-3-methylpyrrolidin-2-one Chemical compound CC1CCN(C=C)C1=O UBPXWZDJZFZKGH-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
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- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
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- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
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- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明提供可供于电子部件材料的固定的粘合片,该粘合片的伸缩性优异、并且即使进行反复的伸缩操作也能维持良好的伸缩性。本发明的粘合片具备:基材、和配置于该基材的至少单侧的粘合剂层,该基材包含选自由聚氨酯系树脂、苯乙烯系弹性体及丙烯系弹性体组成的组中的至少1种。
Description
技术领域
本发明涉及粘合片。
背景技术
半导体晶圆、各种封装体类等的电子部件材料在以大径的状态制造后,有时在切断分离(切割)为元件小片(芯片)的同时各自被拾取并移至安装工序。此时,通常被加工物以贴接于粘合片的状态被供于各工序,在拾取芯片时,为了扩大芯片间隔,使粘合片伸长(扩展工序)。因此,如上所述那样地使用的粘合片所具备的基材大多使用伸长性优异的聚氯乙烯薄膜(专利文献1、2)。
在从粘合片拾取多个芯片的一部分并保管余下的芯片的情况下,从保管性的观点出发,要求粘合片在伸长后恢复。但是,以往的粘合片(例如,以聚氯乙烯薄膜为基材的粘合片)的恢复性(收缩性)不充分,特别是将固定在1张粘合片上的芯片分多次拾取的情况下,有难以使用的问题。
现有技术文献
专利文献
专利文献1:日本特开2001-207140号公报
专利文献2:日本特开2010-260893号公报
发明内容
发明要解决的问题
本发明是为了解决上述以往的问题而作出的,其目的在于,提供可供于电子部件材料的固定的、伸缩性优异、并且即使进行反复的伸缩操作也能维持良好的伸缩性的粘合片。
用于解决问题的方案
本发明的粘合片具备:基材、和配置于该基材的至少单侧的粘合剂层,该基材包含选自由聚氨酯系树脂、苯乙烯系弹性体及丙烯系弹性体组成的组中的至少1种。
1个实施方式中,上述基材包含脂肪酸酰胺。
1个实施方式中,相对于上述基材100重量份,上述脂肪酸酰胺的含有比例为0.001重量份~10重量份。
1个实施方式中,上述粘合剂层包含丙烯酸系粘合剂。
1个实施方式中,上述丙烯酸系粘合剂包含丙烯酸系聚合物,所述丙烯酸系聚合物包含源自具有极性官能团的单体的构成单元。
1个实施方式中,相对于上述丙烯酸系聚合物100重量份,上述具有极性官能团的单体的含有比例为0.01重量份~40重量份。
1个实施方式中,上述具有极性官能团的单体为(甲基)丙烯酸。
1个实施方式中,相对于上述(甲基)丙烯酸系聚合物100重量份,上述(甲基)丙烯酸的含有比例为1重量份~20重量份。
发明的效果
根据本发明,可以提供可供于电子部件材料的固定的粘合片,该粘合片的伸缩性优异,并且即使进行反复的伸缩操作也能维持良好的伸缩性。
附图说明
图1为本发明的1个实施方式的粘合片的概略截面图。
附图标记说明
10 基材
20 粘合剂层
100 粘合片
具体实施方式
A.粘合片的概要
图1为本发明的优选的实施方式的粘合片的概略截面图。粘合片100具备:基材10、和配置于基材10的至少单侧的粘合剂层20。基材10包含聚氨酯系树脂、苯乙烯系弹性体或丙烯系弹性体。它们可以单独使用或组合使用2种以上。本发明中,通过由这样的材料构成基材,从而可以提供伸缩性优异、并且即使进行反复的伸缩操作也能维持良好的伸缩性的粘合片。例如,将配置于粘合片上的多个芯片分多次进行拾取的情况下,使用本发明的粘合片时,在拾取时能够使该粘合片伸长,从而良好地拾取一部分芯片,然后,粘合片收缩恢复从而实现良好的保管性。另外,即使反复进行这样的操作的情况下,也会表现出伸缩性、维持良好的拾取性和保管性。
对于本发明的粘合片,以伸长前的粘合片材为基准,在23℃的环境下、在施加张力而使粘合片伸长150%的状态下保持5分钟并释放张力时的尺寸恢复率(以下,也简称为恢复率)优选为80%以上、更优选为82%以上、进一步优选为85%以上。该恢复率越大越优选,上限值例如为95%(优选98%)。本说明书中,恢复率通过下述的方法来测定。
对宽度10mm、长度100mm的粘合片材,在长度方向记录初始评价点间距离L0=50mm的标线。以卡盘间距离70mm安装于拉伸试验机,以拉伸速度300mm/分钟使其伸长至150%(例如,卡盘间距离:145mm),保持伸长状态5分钟后,测定伸长评价点间距离L1。其后释放张力并测定5分钟后的评价点间距离L,通过下式求出恢复率(%)。
恢复率(%)={(伸长评价点间距离L1-评价点间距离L)/(伸长评价点间距离L1-初始评价点间距离L0)}×100
上述恢复率例如可以通过适当地选择构成基材的树脂种类、调整该树脂的结构(例如聚氨酯薄膜)、PP弹性体薄膜、St弹性体薄膜等来控制。
本发明的粘合片对有机硅镜面晶圆(例如,厚度20μm)的粘合力优选为0.1N/20mm以上、更优选为0.5N/20mm~20N/20mm、进一步优选为0.8N/20mm~15N/20mm。为这样的范围时,例如,能够得到作为电子部件的制造中使用的临时固定用片有用的粘合片。是指在23℃的环境下、通过基于JIS Z 0237:2000的方法(贴合条件:2kg辊往返1次、剥离速度:300mm/分钟、剥离角度90°)测定的粘合力。
本发明的粘合片的厚度优选为30μm~500μm、更优选为40μm~300μm、进一步优选为50μm~200μm。
本发明的粘合片在23℃下的断裂伸长率优选为100%以上、更优选为250%以上、进一步优选为400%~1000%、特别优选为500%~900%。上述断裂伸长率可以依据JIS K7113进行测定。
本发明的粘合片在23℃下的25%模量优选为1N/10mm~100N/10mm、更优选为1.5N/10mm~50N/10mm、进一步优选为2N/10mm~20N/10mm。1个实施方式中,本发明的粘合片在23℃下的25%模量为20N/10mm以下。为这样的范围时,可得到良好的扩展性。25%模量的测定方法如下。
<25%模量测定方法>
将粘合片切断成宽度10mm、长度100mm的尺寸,以卡盘间距离成为50mm的方式安装于带恒温槽的拉伸试验机,以拉伸速度:300mm/分钟沿长度方向对粘合片进行拉伸,将伸长25%时的应力作为25%模量(N/10mm)。
上述粘合片只要可得到本发明的效果,就可以还具备任意适当的其他层。另外,粘合片在直到供于实用为止的期间也可以以将隔离体配置于粘合剂层上从而保护粘合剂层的带隔离体的粘合片来提供。
B.基材
如上所述,作为构成上述基材的材料,使用聚氨酯系树脂、苯乙烯系弹性体或丙烯系弹性体。
上述聚氨酯系树脂是指具有氨基甲酸酯键的树脂,还包含丙烯酸类-聚氨酯共聚物、聚酯-聚氨酯共聚物。聚氨酯系树脂代表性的是通过使多元醇与多异氰酸酯反应来得到。作为多元醇,只要在分子中具有2个以上羟基,就没有特别限定,可以使用任意适当的多元醇。例如,可列举出聚丙烯酸类多元醇、聚酯多元醇、聚醚多元醇等。其中优选为聚酯多元醇或聚醚多元醇,使用这些多元醇时,本发明的效果变得更显著。上述多元醇可以单独使用或组合使用2种以上。
上述聚丙烯酸类多元醇代表性的是通过使(甲基)丙烯酸酯与具有羟基的单体共聚来获得。作为(甲基)丙烯酸酯,例如,可列举出(甲基)丙烯酸甲酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸环己酯等。作为具有羟基的单体,例如,可列举出(甲基)丙烯酸2-羟基乙酯、(甲基)丙烯酸2-羟基丙酯、(甲基)丙烯酸3-羟基丙酯、(甲基)丙烯酸2-羟基丁酯、(甲基)丙烯酸4-羟基丁酯、(甲基)丙烯酸2-羟基戊酯等(甲基)丙烯酸的羟基烷基酯;甘油、三羟甲基丙烷等多元醇的(甲基)丙烯酸单酯;N-羟甲基(甲基)丙烯酰胺等。它们可以单独使用或组合使用2种以上。
上述聚丙烯酸类多元醇在上述单体成分的基础上还可以共聚有其他单体。作为其他单体,只要可共聚,则可以使用任意适当的单体。具体而言,可列举出(甲基)丙烯酸等不饱和单羧酸;马来酸等不饱和二羧酸以及其酸酐及单酯或二酯类;(甲基)丙烯腈等不饱和腈类;(甲基)丙烯酰胺、N-羟甲基(甲基)丙烯酰胺等不饱和酰胺类;乙酸乙烯酯、丙酸乙烯酯等乙烯基酯类;甲基乙烯基醚等乙烯基醚类;乙烯、丙烯等α-烯烃类;氯乙烯、偏氯乙烯等卤化α,β-不饱和脂肪族单体;苯乙烯、α-甲基苯乙烯等α,β-不饱和芳香族单体等。它们可以单独使用或组合使用2种以上。
上述聚酯多元醇代表性的是通过使多元酸成分与多元醇成分反应来获得。作为多元酸成分,例如,可列举出邻苯二甲酸、间苯二甲酸、对苯二甲酸、1,4-萘二羧酸、2,5-萘二羧酸、2,6-萘二羧酸、联苯二羧酸、四氢苯二甲酸等芳香族二羧酸;草酸、琥珀酸、丙二酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、癸烷二羧酸、十二烷二羧酸、十八烷二羧酸、酒石酸、烷基琥珀酸、亚油酸、马来酸、富马酸、中康酸、柠康酸、衣康酸等脂肪族二羧酸;六氢苯二甲酸、四氢苯二甲酸、1,3-环己烷二羧酸、1,4-环己烷二羧酸等脂环式二羧酸;或它们的酸酐、烷基酯、酰卤等反应性衍生物等。它们可以单独使用或组合使用2种以上。
作为上述多元醇成分,可列举出乙二醇、1,2-丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、新戊二醇、戊二醇、1,6-己二醇、1,8-辛二醇、1,10-癸二醇、1-甲基-1,3-丁二醇、2-甲基-1,3-丁二醇、1-甲基-1,4-戊二醇、2-甲基-1,4-戊二醇、1,2-二甲基-新戊二醇、2,3-二甲基-新戊二醇、1-甲基-1,5-戊二醇、2-甲基-1,5-戊二醇、3-甲基-1,5-戊二醇、1,2-二甲基丁二醇、1,3-二甲基丁二醇、2,3-二甲基丁二醇、1,4-二甲基丁二醇、二乙二醇、三乙二醇、聚乙二醇、二丙二醇、聚丙二醇、1,4-环己烷二甲醇、1,4-环己二醇、双酚A、双酚F、氢化双酚A、氢化双酚F等。它们可以单独使用或组合使用2种以上。
上述聚醚多元醇代表性的是通过使环氧烷开环聚合并与多元醇加成来获得。作为多元醇,例如,可列举出乙二醇、二乙二醇、丙二醇、二丙二醇、甘油、三羟甲基丙烷等。作为环氧烷,例如,可列举出环氧乙烷、环氧丙烷、环氧丁烷、苯乙烯氧化物、四氢呋喃等。它们可以单独使用或组合使用2种以上。
作为上述多异氰酸酯,例如,可列举出四亚甲基二异氰酸酯、十二亚甲基二异氰酸酯、1,4-丁烷二异氰酸酯、六亚甲基二异氰酸酯、2,2,4-三甲基六亚甲基二异氰酸酯、2,4,4-三甲基六亚甲基二异氰酸酯、赖氨酸二异氰酸酯、2-甲基戊烷-1,5-二异氰酸酯、3-甲基戊烷-1,5-二异氰酸酯等脂肪族二异氰酸酯;异佛尔酮二异氰酸酯、氢化苯二甲基二异氰酸酯、4,4’-环己基甲烷二异氰酸酯、1,4-环己烷二异氰酸酯、甲基亚环己基二异氰酸酯、1,3-双(异氰酸根合甲基)环己烷等脂环族二异氰酸酯;甲苯二异氰酸酯、2,2’-二苯基甲烷二异氰酸酯、2,4’-二苯基甲烷二异氰酸酯、4,4’-二苯基甲烷二异氰酸酯、4,4’-二苯基二甲基甲烷二异氰酸酯、4,4’-二苄基二异氰酸酯、1,5-萘二异氰酸酯、苯二甲基二异氰酸酯、1,3-亚苯基二异氰酸酯、1,4-亚苯基二异氰酸酯等芳香族二异氰酸酯;二烷基二苯基甲烷二异氰酸酯、四烷基二苯基甲烷二异氰酸酯、α,α,α,α-四甲基苯二甲基二异氰酸酯等芳香脂肪族二异氰酸酯等。它们可以单独使用或组合使用2种以上。
上述聚氨酯系树脂的重均分子量优选为5000~600000、进一步优选为10000~400000。上述聚氨酯系树脂的酸值优选为10以上、进一步优选为10~50、特别优选为20~45。需要说明的是,本说明书中,重均分子量可以通过GPC(溶剂:THF)进行测定。
作为上述苯乙烯系弹性体,例如,可列举出苯乙烯·丁二烯·苯乙烯三嵌段共聚物弹性体(SBS)、苯乙烯·异戊二烯·苯乙烯三嵌段共聚物弹性体(SIS)、苯乙烯-乙烯·丁烯共聚物弹性体(SEB)、苯乙烯-乙烯·丙烯共聚物弹性体(SEP)、苯乙烯-乙烯·丁烯-苯乙烯共聚物弹性体(SEBS)、苯乙烯-乙烯·丁烯-乙烯共聚物弹性体(SEBC)、氢化苯乙烯·丁二烯弹性体(HSBR)、苯乙烯-乙烯·丙烯-苯乙烯共聚物弹性体(SEPS)、苯乙烯-乙烯·乙烯·丙烯-苯乙烯共聚物弹性体(SEEPS)、苯乙烯-丁二烯·丁烯-苯乙烯共聚物弹性体(SBBS)等。其中优选为SIS、SEBS。
上述苯乙烯系弹性体中,源自苯乙烯的构成单元的含有比例优选为30重量%以下、更优选为20重量%以下。为这样的范围时,能够得到伸缩性优异的粘合片。
上述苯乙烯系弹性体的重均分子量优选为1万~50万、更优选为5万~30万。为这样的范围时,能够得到伸缩性优异的粘合片。
上述丙烯系弹性体为包含源自丙烯的构成单元的弹性体,1个实施方式中,为包含源自丙烯的构成单元的共聚物。上述丙烯系弹性体中,源自丙烯的构成单元的含有比例优选为30重量%~90重量%、更优选为50重量%~90重量%。为这样的范围时,能够得到伸缩性优异的粘合片。
作为构成上述丙烯系弹性体的其他共聚成分,例如,可列举出源自乙烯、1-丁烯、2-甲基丙烯、1-戊烯、3-甲基-1-丁烯、1-己烯、4-甲基-1-戊烯、1-辛烯等单体的构成单元。其中,优选乙烯、1-丁烯、1-戊烯、1-己烯、1-辛烯等,特别优选乙烯、1-丁烯。它们可以单独使用或组合使用2种以上。1个实施方式中,上述丙烯系弹性体包含源自乙烯的构成单元。上述丙烯系弹性体中,源自乙烯的构成单元的含有比例优选为5重量%~20重量%、更优选为8重量%~15重量%。
丙烯系弹性体的重均分子量优选为1万~50万、更优选为5万~30万。为这样的范围时,能够得到伸缩性优异的粘合片。
1个实施方式中,上述基材为单层构成。
另一实施方式中,上述基材为多层构成。基材为多层构成的情况下,优选构成基材的层中至少1层如上所述包含聚氨酯系树脂、苯乙烯系弹性体或丙烯系弹性体。包含聚氨酯系树脂、苯乙烯系弹性体或丙烯系弹性体的层的合计厚度相对于基材的总厚优选为50%以上、更优选为70%以上。
1个实施方式中,上述基材包含脂肪酸酰胺。通过含有脂肪酸酰胺,能够得到具有适度的滑动性的基材。具备包含脂肪酸酰胺的基材的粘合片的输送性优异,另外,对扩展器的平台的抓力优异、在扩展工序中能够良好伸长。上述基材为多层构成、并且在基材的单侧配置有粘合剂层的情况下,优选至少在位于粘合剂层的相反侧的该基材的最外层含有脂肪酸酰胺。
作为脂肪酸酰胺,例如,可列举出月桂酸酰胺、棕榈酸酰胺、硬脂酸酰胺、山嵛酸酰胺、油酸酰胺、芥酸酰胺、羟基硬脂酸酰胺等单酰胺类、亚乙基双月桂酸酰胺、亚乙基双硬脂酸酰胺、亚乙基双羟基硬脂酸酰胺、亚乙基双山嵛酸酰胺、六亚甲基双硬脂酸酰胺、亚乙基双油酸酰胺、六亚甲基双油酸酰胺等。构成脂肪酸酰胺系润滑剂的脂肪酸的碳数优选为12以上、更优选为12~30、进一步优选为14~28。
1个实施方式中,脂肪酸酰胺的含有比例相对于基材100重量份,优选为0.001重量份~10重量份、更优选为0.01重量份~3重量份。
1个实施方式中,上述基材为多层构成、并且在基材的单侧配置有粘合剂层的情况下,位于粘合剂层的相反侧的该基材的最外层中的脂肪酸酰胺的含有比例相对于该最外层100重量份优选为0.001重量份~10重量份、更优选为0.01重量份~3重量份。
对于上述基材,以伸长前为基准,在23℃的环境下、在施加张力而使基材伸长150%的状态下保持5分钟并释放张力时的恢复率优选为80%以上、更优选为82%以上、进一步优选为85%以上。该恢复率越大越优选,上限值例如为95%(优选98%)。
上述基材在23℃下的断裂伸长率优选为10%以上、更优选为250%以上、进一步优选为250%~1000%、特别优选为250%~800%。
上述基材在23℃下的25%模量优选为1N/10mm~100N/10mm、更优选为2N/10mm~60N/10mm、进一步优选为3N/10mm~30N/10mm。1个实施方式中,基材在23℃下的25%模量为30N/10mm以下。为这样的范围时,可得到良好的扩展性。
上述基材的依据JIS K 6253测定的硬度优选为80A~100A、更优选为85A~95A。为这样的范围时,可得到良好的扩展性。1个实施方式中,使用上述聚氨酯系树脂作为构成基材的材料,该基材的上述硬度为80A~100A(优选85A~95A)。这样的话,本发明的效果变得显著。
上述基材的厚度可以根据期望的强度或柔软性、以及使用目的等而设定为任意适当的厚度。基材的厚度优选为1000μm以下、更优选为1μm~500μm、进一步优选为1μm~300μm、特别优选为3μm~200μm、最优选为5μm~100μm。
上述基材相对于至少一面的SUS304板的动摩擦力优选为0.1N~7.0N、更优选为0.1N~5.0N、进一步优选为0.1N~3.0N。具备动摩擦系数为这样的范围的基材的粘合片的输送性优异,另外,对扩展器的平台的抓力优异,在扩展工序中能够良好地伸长。
C.粘合剂层
上述粘合剂层由任意适当的粘合剂构成。作为粘合剂,可列举出丙烯酸系粘合剂、有机硅系粘合剂、乙烯基烷基醚系粘合剂、聚酯系粘合剂、聚酰胺系粘合剂、氨基甲酸酯系粘合剂、氟系粘合剂、苯乙烯-二烯嵌段共聚物系粘合剂、活性能量射线固化型粘合剂等。1个实施方式中,使用丙烯酸系粘合剂。
作为上述丙烯酸系粘合剂,例如,可列举出将使用(甲基)丙烯酸烷基酯中的1种或2种以上作为单体成分的丙烯酸系聚合物(均聚物或共聚物)作为基础聚合物的丙烯酸系粘合剂等。作为(甲基)丙烯酸烷基酯的具体例,可列举出(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸异丁酯、(甲基)丙烯酸仲丁酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸异辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸异壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸异癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等(甲基)丙烯酸C1-20烷基酯。其中,可以优选使用具有碳数为4~18的直链状或支链状的烷基的(甲基)丙烯酸烷基酯。
源自(甲基)丙烯酸烷基酯的构成单元的含有比例相对于丙烯酸系聚合物100重量份优选为50重量份、更优选为60重量份以上、进一步优选为70重量份以上、特别优选为80重量份~97重量份。
出于内聚力、耐热性、交联性等的改性的目的,上述丙烯酸系聚合物根据需要可以包含和可与上述(甲基)丙烯酸烷基酯共聚的其他单体相对应的单元。作为这样的单体,例如,可列举出丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、衣康酸、马来酸、富马酸、巴豆酸等含羧基单体;马来酸酐、衣康酸酐等酸酐单体;(甲基)丙烯酸羟基乙酯、(甲基)丙烯酸羟基丙酯、(甲基)丙烯酸羟基丁酯、(甲基)丙烯酸羟基己酯、(甲基)丙烯酸羟基辛酯、(甲基)丙烯酸羟基癸酯、(甲基)丙烯酸羟基月桂酯、甲基丙烯酸(4-羟基甲基环己基)甲酯等含羟基单体;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯酰胺-2-甲基丙磺酸、(甲基)丙烯酰胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯酰氧基萘磺酸等含磺酸基单体;(甲基)丙烯酰胺、N,N-二甲基(甲基)丙烯酰胺、N-丁基(甲基)丙烯酰胺、N-羟甲基(甲基)丙烯酰胺、N-羟甲基丙烷(甲基)丙烯酰胺等(N-取代)酰胺系单体;(甲基)丙烯酸氨基乙酯、(甲基)丙烯酸N,N-二甲基氨基乙酯、(甲基)丙烯酸叔丁基氨基乙酯等(甲基)丙烯酸氨基烷基酯系单体;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯系单体;N-环己基马来酰亚胺、N-异丙基马来酰亚胺、N-月桂基马来酰亚胺、N-苯基马来酰亚胺等马来酰亚胺系单体;N-甲基衣康酰亚胺、N-乙基衣康酰亚胺、N-丁基衣康酰亚胺、N-辛基衣康酰亚胺、N-2-乙基己基衣康酰亚胺、N-环己基衣康酰亚胺、N-月桂基衣康酰亚胺等衣康酰亚胺系单体;N-(甲基)丙烯酰氧基亚甲基琥珀酰亚胺、N-(甲基)丙烯酰基-6-氧代六亚甲基琥珀酰亚胺、N-(甲基)丙烯酰基-8-氧代八亚甲基琥珀酰亚胺等琥珀酰亚胺系单体;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯烷酮、甲基乙烯基吡咯烷酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌嗪、乙烯基吡嗪、乙烯基吡咯、乙烯基咪唑、乙烯基噁唑、乙烯基吗啉、N-乙烯基羧酸酰胺类、苯乙烯、α-甲基苯乙烯、N-乙烯基己内酰胺等乙烯基系单体;丙烯腈、甲基丙烯腈等氰基丙烯酸酯单体;(甲基)丙烯酸缩水甘油酯等含环氧基丙烯酸系单体;(甲基)丙烯酸聚乙二醇酯、(甲基)丙烯酸聚丙二醇酯、(甲基)丙烯酸甲氧基乙二醇酯、(甲基)丙烯酸甲氧基聚丙二醇酯等二醇系丙烯酸酯单体;(甲基)丙烯酸四氢糠基酯、氟(甲基)丙烯酸酯、有机硅(甲基)丙烯酸酯等具有杂环、卤素原子、硅原子等的丙烯酸酯系单体;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羟甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、环氧丙烯酸酯、聚酯丙烯酸酯、氨基甲酸酯丙烯酸酯等多官能单体;异戊二烯、丁二烯、异丁烯等烯烃系单体;乙烯基醚等乙烯基醚系单体等。这些单体可以单独使用或组合使用2种以上。
1个实施方式中,上述丙烯酸系聚合物包含源自具有极性官能团的单体的构成单元。基材包含脂肪酸酰胺的情况下,使用包含源自具有极性官能团的单体的构成单元的丙烯酸系聚合物时,能够防止脂肪酸酰胺向粘合剂层的转移,能够得到耐久性优异的粘合片。源自具有极性官能团的单体的构成单元的含有比例相对于丙烯酸系聚合物100重量份优选为0.01重量份~40重量份、更优选为1重量份~30重量份、进一步优选为2重量份~20重量份、特别优选为3重量份~15重量份。作为上述极性官能团,例如,可列举出羧基、羟基等。
1个实施方式中,作为具有极性官能团的单体,可使用(甲基)丙烯酸。该实施方式中,源自(甲基)丙烯酸的构成单元的含有比例相对于丙烯酸系聚合物100重量份优选为1重量份~40重量份、更优选为1重量份~20重量份、进一步优选为1重量份~10重量份。
上述粘合剂根据需要可包含任意适当的添加剂。作为该添加剂,例如,可列举出引发剂、交联剂、增粘剂、增塑剂、颜料、染料、填充剂、防老剂、导电剂、抗静电剂、紫外线吸收剂、光稳定剂、剥离调整剂、软化剂、表面活性剂、阻燃剂、抗氧化剂等。
1个实施方式中,上述粘合剂包含交联剂。
作为上述交联剂,例如,可列举出异氰酸酯系交联剂、环氧系交联剂、三聚氰胺系交联剂、过氧化物系交联剂、以及尿素系交联剂、金属醇盐系交联剂、金属螯合物系交联剂、金属盐系交联剂、碳二亚胺系交联剂、噁唑啉系交联剂、氮丙啶系交联剂、胺系交联剂等。其中优选为异氰酸酯系交联剂或环氧系交联剂。
作为上述异氰酸酯系交联剂的具体例,可列举出亚丁基二异氰酸酯、六亚甲基二异氰酸酯等低级脂肪族多异氰酸酯类;亚环戊基二异氰酸酯、亚环己基二异氰酸酯、异佛尔酮二异氰酸酯等脂环族异氰酸酯类;2,4-甲苯二异氰酸酯、4,4’-二苯基甲烷二异氰酸酯、苯二甲基二异氰酸酯等芳香族异氰酸酯类;三羟甲基丙烷/甲苯二异氰酸酯三聚体加成物(Nippon Polyurethane Industry Co.,Ltd.制、商品名“CORONATE L”)、三羟甲基丙烷/六亚甲基二异氰酸酯三聚体加成物(Nippon Polyurethane Industry Co.,Ltd.制、商品名“CORONATE HL”)、六亚甲基二异氰酸酯的异氰脲酸酯体(Nippon Polyurethane IndustryCo.,Ltd.制、商品名“CORONATE HX”)等异氰酸酯加成物;等。异氰酸酯系交联剂的含量可以根据期望的粘合力、粘合剂层的弹性等设定为任意适当的量,相对于基础聚合物100重量份,代表性的为0.1重量份~20重量份,更优选为0.5重量份~10重量份。
作为前述环氧系交联剂,例如,可列举出N,N,N’,N’-四缩水甘油基-间苯二胺、二缩水甘油基苯胺、1,3-双(N,N-缩水甘油基氨基甲基)环己烷(三菱瓦斯化学株式会社制、商品名“TETRAD C”)、1,6-己二醇二缩水甘油醚(共荣社化学株式会社制、商品名“Epolight1600”)、新戊二醇二缩水甘油醚(共荣社化学株式会社制、商品名“Epolight 1500NP”)、乙二醇二缩水甘油醚(共荣社化学株式会社制、商品名“Epolight 40E”)、丙二醇二缩水甘油醚(共荣社化学株式会社制、商品名“Epolight 70P”)、聚乙二醇二缩水甘油醚(日本油脂株式会社制、商品名“EPIOL E-400”)、聚丙二醇二缩水甘油醚(日本油脂株式会社制、商品名“EPIOL P-200”)、山梨糖醇聚缩水甘油醚(Nagase ChemteX Corporation制、商品名“DENACOL EX-611”)、甘油聚缩水甘油醚(Nagase ChemteX Corporation制、商品名“DENACOL EX-314”)、季戊四醇聚缩水甘油醚、聚甘油聚缩水甘油醚(Nagase ChemteXCorporation制、商品名“DENACOL EX-512”)、山梨糖醇酐聚缩水甘油醚、三羟甲基丙烷聚缩水甘油醚、己二酸二缩水甘油酯、邻苯二甲酸二缩水甘油酯、三缩水甘油基-三(2-羟基乙基)异氰脲酸酯、间苯二酚二缩水甘油醚、双酚-S-二缩水甘油醚、分子内具有2个以上环氧基的环氧系树脂等。环氧系交联剂的含量可以根据期望的粘合力、粘合剂层的弹性等而设定为任意适当的量,相对于基础聚合物100重量份,代表性的为0.01重量份~10重量份、更优选为0.03重量份~5重量份。
上述粘合剂层的厚度优选为1μm~50μm、更优选为1μm~30μm、进一步优选为2μm~20μm。
上述粘合剂层的基于纳米压痕法的弹性模量优选为0.005~5MPa、更优选为0.01~2MPa。为这样的范围时,能够形成不易阻碍基材的伸缩性的粘合剂层,本发明的效果更显著。另外,可以形成具有适当的粘合力的粘合剂层。上述弹性模量例如可以通过粘合剂层中包含的粘合剂的组成;作为粘合剂的基础聚合物的树脂材料的种类、分子量、交联度等来调整。需要说明的是,对于基于纳米压痕法的弹性模量,在负载时、卸载时连续测定在将压头压入试样(不存在热膨胀性微球的部位)时对压头的负载载荷和压入深度,根据得到的负载载荷-压入深度曲线来求出。本说明书中,基于纳米压痕法的弹性模量是测定条件设为载荷:1mN、负载·卸载速度:0.1mN/s、保持时间:1s、环境温度:23℃并如上所述地测定的弹性模量。
D.粘合片的制造方法
本发明的粘合片可以通过任意适当的方法来制造。本发明的粘合片可以在基材上形成粘合剂层而得到。作为粘合剂层的形成方法,例如,可列举出在基材上涂布粘合剂的方法、将在任意适当的薄膜上涂布粘合剂而形成的涂布层转印至中间层的方法等。
作为上述粘合剂的涂布方法,可以采用任意适当的涂布方法。例如,可以在涂布后进行干燥而形成各层。作为涂布方法,例如,可列举出使用多层涂布机(Multi Coater)、模涂机、凹版涂布机、涂抹器等的涂布方法。作为干燥方法,例如,可列举出自然干燥、加热干燥等。
E.用途
本发明的粘合片在制造电子部件时可以适当地作为对电子部件材料进行临时固定的片使用。1个实施方式中,本发明的粘合片可以用作芯片拾取用的粘合片。作为将电子部件材料切断时的临时固定片使用。作为该电子部件材料,例如,可列举出半导体芯片、LED芯片、陶瓷电容器等。
[实施例]
以下,通过实施例具体地对本发明进行说明,但本发明不受这些实施例限定。实施例中的评价方法如以下。需要说明的是,下述评价中,使用将隔离体剥离了的粘合片。另外,实施例中,只要没有特别说明,则“份”及“%”为重量基准。
(1)恢复率
对宽度10mm、长度100mm的粘合片材,在长度方向记录初始评价点间距离L0=50mm的标线。在23℃的环境温度下、以卡盘间距离70mm安装于拉伸试验机,以拉伸速度300mm/分钟使其伸长至150%(卡盘间距离:145mm),保持伸长状态5分钟后,测定伸长评价点间距离L1。其后释放张力,测定5分钟后的评价点间距离L,通过下式求出恢复率(%)。
恢复率(%)={(伸长评价点间距离L1-评价点间距离L)/(伸长评价点间距离L1-初始评价点间距离L0)}×100
对于恢复率,对规定方向I和与该方向I正交的方向II的2个样品进行测定。
另外,在40℃的环境温度下、通过上述的方法使粘合片伸缩并求出恢复率。
(2)动摩擦力
将粘合带以基材薄膜面朝上的方式贴附于工作台上,在粘合带上以与基材薄膜面接触的方式放置SUS304板(重量200g、63mm×63mm),使SUS304板在基材薄膜面上移动(100mm/分钟),测量此时产生的平均载荷(N),将其作为动摩擦力。
[实施例1]
制备包含由丙烯酸2-乙基己酯(2EHA)/丙烯酸(AA)=90/10(重量比)构成的丙烯酸系聚合物100重量份、多异氰酸酯系交联剂(商品名“CORONATE L”、Nippon PolyurethaneIndustry Co.,Ltd.制)5重量份、缩水甘油胺系交联剂(商品名“TETRAD-C”、三菱瓦斯化学株式会社制)0.05重量份、及乙酸乙酯的粘合剂。将该粘合剂涂布于对单面用有机硅进行了剥离处理的厚度38μm的聚酯薄膜(商品名:MRF、三菱化学聚酯株式会社制)的剥离处理面,在120℃下加热2分钟,形成厚度20μm的粘合剂层。接着,将该粘合剂层面转印至作为基材的含有0.1重量份硬脂酸酰胺的聚氨酯系薄膜A(厚度:70μm、大石产业株式会社制),在50℃下保存48小时,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[实施例2]
作为基材,使用聚氨酯系薄膜B(厚度:60μm、Nihon Matai Co.,Ltd.制),除此以外,与实施例1同样地实施,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[实施例3]
作为基材,使用含有0.05重量份硬脂酸酰胺的聚丙烯系弹性体(PP弹性体)薄膜(厚度:100μm、日东电工株式会社制),除此以外,与实施例1同样地实施,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[实施例4]
作为基材,使用由聚乙烯(PE;厚度:10μm)/苯乙烯系弹性体(St弹性体;厚度:60μm)薄膜/聚乙烯(厚度:10μm)构成的层叠体(厚度:80μm、Nihon Matai Co.,Ltd.制),除此以外,与实施例1同样地实施,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[实施例5]
作为基材,使用由乙烯乙酸乙烯酯共聚物薄膜(EVA;厚度:10μm)/苯乙烯系弹性体薄膜(厚度:60μm)/乙烯乙酸乙烯酯共聚物薄膜(厚度:10μm)构成的层叠体(厚度:80μm、Nihon Matai Co.,Ltd.制),除此以外,与实施例1同样地实施,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[比较例1]
作为基材,使用含有0.7重量份硬脂酸酰胺的聚氯乙烯薄膜(PVC;厚度:70μm、DiaPlus Film Inc.制),除此以外,与实施例1同样地实施,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[比较例2]
作为基材,使用聚乙烯薄膜(PE;厚度:100μm、日东电工株式会社制),除此以外,与实施例1同样地实施,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[比较例3]
作为基材,使用由聚丙烯薄膜(PP;厚度:55μm)/聚乙烯薄膜(PE;厚度:25μm)构成的层叠体(厚度:80μm、大仓工业株式会社制),除此以外,与实施例1同样地实施,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[比较例4]
作为基材,使用乙烯乙酸乙烯酯共聚物薄膜(厚度:100μm、日东电工株式会社制),除此以外,与实施例1同样地操作,得到粘合片。
将得到的粘合片供于上述(1)及(2)的评价。将结果示于表1。
[表1]
Claims (8)
1.一种粘合片,其具备:基材、和配置于该基材的至少单侧的粘合剂层,
该基材包含选自由聚氨酯系树脂、苯乙烯系弹性体及丙烯系弹性体组成的组中的至少1种。
2.根据权利要求1所述的粘合片,其中,所述基材包含脂肪酸酰胺。
3.根据权利要求2所述的粘合片,其中,相对于所述基材100重量份,所述脂肪酸酰胺的含有比例为0.001重量份~10重量份。
4.根据权利要求1~3中任一项所述的粘合片,其中,所述粘合剂层包含丙烯酸系粘合剂。
5.根据权利要求4所述的粘合片,其中,所述丙烯酸系粘合剂包含丙烯酸系聚合物,所述丙烯酸系聚合物包含源自具有极性官能团的单体的构成单元。
6.根据权利要求5所述的粘合片,其中,相对于所述丙烯酸系聚合物100重量份,所述具有极性官能团的单体的含有比例为0.01重量份~40重量份。
7.根据权利要求5所述的粘合片,其中,所述具有极性官能团的单体为(甲基)丙烯酸。
8.根据权利要求7所述的粘合片,其中,相对于所述(甲基)丙烯酸系聚合物100重量份,所述(甲基)丙烯酸的含有比例为1重量份~20重量份。
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