CN112322203A - Adhesive sheet - Google Patents
Adhesive sheet Download PDFInfo
- Publication number
- CN112322203A CN112322203A CN202010773172.8A CN202010773172A CN112322203A CN 112322203 A CN112322203 A CN 112322203A CN 202010773172 A CN202010773172 A CN 202010773172A CN 112322203 A CN112322203 A CN 112322203A
- Authority
- CN
- China
- Prior art keywords
- meth
- adhesive sheet
- acrylate
- weight
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 65
- 229920001971 elastomer Polymers 0.000 claims abstract description 40
- 239000000806 elastomer Substances 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 34
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 30
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims abstract description 17
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims abstract description 17
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 229920002635 polyurethane Polymers 0.000 claims abstract description 10
- 239000004814 polyurethane Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 40
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 15
- 239000000194 fatty acid Substances 0.000 claims description 15
- 229930195729 fatty acid Natural products 0.000 claims description 15
- 150000004665 fatty acids Chemical class 0.000 claims description 15
- 229920000058 polyacrylate Polymers 0.000 claims description 14
- 239000000470 constituent Substances 0.000 claims description 13
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 11
- 125000000524 functional group Chemical group 0.000 claims description 11
- 239000003522 acrylic cement Substances 0.000 claims description 5
- 230000008602 contraction Effects 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 76
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 52
- -1 2-ethylhexyl Chemical group 0.000 description 36
- 238000011156 evaluation Methods 0.000 description 25
- 239000003431 cross linking reagent Substances 0.000 description 23
- 239000010410 layer Substances 0.000 description 22
- 238000011084 recovery Methods 0.000 description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229920005862 polyol Polymers 0.000 description 13
- 150000003077 polyols Chemical class 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 229920005749 polyurethane resin Polymers 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 7
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- 229920005601 base polymer Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 4
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 3
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920005906 polyester polyol Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 3
- 229960004063 propylene glycol Drugs 0.000 description 3
- 235000013772 propylene glycol Nutrition 0.000 description 3
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 3
- 229960002317 succinimide Drugs 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- PNJNLCNHYSWUPT-UHFFFAOYSA-N 2-methylpentane-1,4-diol Chemical compound CC(O)CC(C)CO PNJNLCNHYSWUPT-UHFFFAOYSA-N 0.000 description 2
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 2
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 2
- 235000019197 fats Nutrition 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- OHMBHFSEKCCCBW-UHFFFAOYSA-N hexane-2,5-diol Chemical compound CC(O)CCC(C)O OHMBHFSEKCCCBW-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 150000007519 polyprotic acids Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- AURYLBASVGNSON-UHFFFAOYSA-N (2,5-dioxopyrrolidin-3-ylidene)methyl prop-2-enoate Chemical compound C=CC(=O)OC=C1CC(=O)NC1=O AURYLBASVGNSON-UHFFFAOYSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- CPUBMKFFRRFXIP-YPAXQUSRSA-N (9z,33z)-dotetraconta-9,33-dienediamide Chemical compound NC(=O)CCCCCCC\C=C/CCCCCCCCCCCCCCCCCCCCCC\C=C/CCCCCCCC(N)=O CPUBMKFFRRFXIP-YPAXQUSRSA-N 0.000 description 1
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- UNVGBIALRHLALK-UHFFFAOYSA-N 1,5-Hexanediol Chemical compound CC(O)CCCCO UNVGBIALRHLALK-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- AHBNSOZREBSAMG-UHFFFAOYSA-N 1,5-diisocyanato-2-methylpentane Chemical compound O=C=NCC(C)CCCN=C=O AHBNSOZREBSAMG-UHFFFAOYSA-N 0.000 description 1
- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- IAUGBVWVWDTCJV-UHFFFAOYSA-N 1-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound CCC(S(O)(=O)=O)NC(=O)C=C IAUGBVWVWDTCJV-UHFFFAOYSA-N 0.000 description 1
- XTKZBPGQKMDFMC-UHFFFAOYSA-N 1-butyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CCCCN1C(=O)CC(=C)C1=O XTKZBPGQKMDFMC-UHFFFAOYSA-N 0.000 description 1
- BGKQCHAKBLWCDU-UHFFFAOYSA-N 1-cyclohexyl-3-methylidenepyrrolidine-2,5-dione Chemical compound O=C1C(=C)CC(=O)N1C1CCCCC1 BGKQCHAKBLWCDU-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- UBPXWZDJZFZKGH-UHFFFAOYSA-N 1-ethenyl-3-methylpyrrolidin-2-one Chemical compound CC1CCN(C=C)C1=O UBPXWZDJZFZKGH-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
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- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- GTCCGKPBSJZVRZ-UHFFFAOYSA-N pentane-2,4-diol Chemical compound CC(O)CC(C)O GTCCGKPBSJZVRZ-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920001098 polystyrene-block-poly(ethylene/propylene) Polymers 0.000 description 1
- 229920002743 polystyrene-poly(ethylene-ethylene/propylene) block-polystyrene Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2425/00—Presence of styrenic polymer
- C09J2425/006—Presence of styrenic polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an adhesive sheet which can be used for fixing electronic component materials, has excellent elasticity, and can maintain good elasticity even if repeated expansion and contraction operations are carried out. The adhesive sheet of the present invention comprises: the adhesive layer is disposed on at least one side of the base material, and the base material contains at least 1 selected from the group consisting of polyurethane-based resins, styrene-based elastomers, and propylene-based elastomers.
Description
Technical Field
The present invention relates to an adhesive sheet.
Background
After electronic component materials such as semiconductor wafers and various packages are manufactured in a large diameter state, the electronic component materials are sometimes cut and separated (diced) into component chips (chips) and picked up and transferred to a mounting process. In this case, the work is generally subjected to the respective steps in a state of being stuck to the adhesive sheet, and the adhesive sheet is stretched in order to widen the chip pitch when picking up the chips (expanding step). Therefore, polyvinyl chloride films having excellent elongation properties are often used as substrates of pressure-sensitive adhesive sheets used as described above (patent documents 1 and 2).
In the case where a part of a plurality of chips is picked up from an adhesive sheet and the remaining chips are stored, the adhesive sheet is required to recover after being stretched from the viewpoint of storability. However, conventional pressure-sensitive adhesive sheets (for example, pressure-sensitive adhesive sheets based on a polyvinyl chloride film) have insufficient recovery properties (shrinkability), and in particular, when a chip fixed to 1 pressure-sensitive adhesive sheet is picked up several times, the pressure-sensitive adhesive sheet is difficult to use.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2001-207140
Patent document 2: japanese patent laid-open publication No. 2010-260893
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-described conventional problems, and an object thereof is to provide an adhesive sheet which can be used for fixing an electronic component material, has excellent stretchability, and can maintain good stretchability even when subjected to repeated stretching operations.
Means for solving the problems
The adhesive sheet of the present invention comprises: the adhesive layer is disposed on at least one side of the base material, and the base material contains at least 1 selected from the group consisting of polyurethane-based resins, styrene-based elastomers, and propylene-based elastomers.
In 1 embodiment, the substrate comprises a fatty acid amide.
In one embodiment, the fatty acid amide is contained in an amount of 0.001 to 10 parts by weight based on 100 parts by weight of the substrate.
In 1 embodiment, the adhesive layer includes an acrylic adhesive.
In 1 embodiment, the acrylic adhesive contains an acrylic polymer containing a constituent unit derived from a monomer having a polar functional group.
In 1 embodiment, the polar functional group-containing monomer is contained in an amount of 0.01 to 40 parts by weight based on 100 parts by weight of the acrylic polymer.
In 1 embodiment, the monomer having a polar functional group is (meth) acrylic acid.
In 1 embodiment, the content ratio of the (meth) acrylic acid is 1 to 20 parts by weight with respect to 100 parts by weight of the (meth) acrylic polymer.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, it is possible to provide an adhesive sheet which is excellent in stretchability and can maintain good stretchability even when subjected to repeated stretching operations, and which can be used for fixing electronic component materials.
Drawings
Fig. 1 is a schematic cross-sectional view of a pressure-sensitive adhesive sheet according to 1 embodiment of the present invention.
Description of the reference numerals
10 base material
20 adhesive layer
100 adhesive sheet
Detailed Description
A. Outline of adhesive sheet
Fig. 1 is a schematic sectional view of a pressure-sensitive adhesive sheet according to a preferred embodiment of the present invention. The adhesive sheet 100 includes: a substrate 10, and an adhesive layer 20 disposed on at least one side of the substrate 10. The substrate 10 includes a polyurethane resin, a styrene elastomer, or a propylene elastomer. These may be used alone or in combination of 2 or more. In the present invention, by constituting the substrate with such a material, it is possible to provide a pressure-sensitive adhesive sheet which has excellent stretchability and can maintain good stretchability even when subjected to repeated stretching operations. For example, when a plurality of chips arranged on an adhesive sheet are picked up in multiple portions, the adhesive sheet of the present invention can be stretched at the time of picking up to pick up a part of the chips well, and then the adhesive sheet can be recovered by shrinkage to realize good storability. Even when such an operation is repeated, stretchability is exhibited, and good pick-up performance and storage performance are maintained.
The pressure-sensitive adhesive sheet of the present invention preferably has a dimensional recovery rate (hereinafter, also simply referred to as recovery rate) of 80% or more, more preferably 82% or more, and still more preferably 85% or more, when the pressure-sensitive adhesive sheet is held for 5 minutes in a state where the pressure-sensitive adhesive sheet is extended by 150% under tension in an environment of 23 ℃. The higher the recovery rate is, the more preferable the upper limit value is, for example, 95% (preferably 98%). In the present specification, the recovery rate is measured by the following method.
For an adhesive sheet having a width of 10mm and a length of 100mm, the distance L between the initial evaluation points was recorded in the longitudinal direction050mm mark. The test piece was mounted on a tensile tester at a distance between chucks of 70mm, elongated at a tensile rate of 300 mm/min to 150% (for example, distance between chucks: 145mm), and after keeping the elongated state for 5 minutes, the distance L between elongation evaluation points was measured1. Thereafter, the tension was released and the distance L between evaluation points after 5 minutes was measured to obtain the recovery rate (%) by the following formula.
Recovery rate (%) { (distance between elongation evaluation points L)1-distance between evaluation points L)/(distance between elongation evaluation points L1-distance L between initial evaluation points0)}×100
The recovery rate can be controlled by, for example, appropriately selecting the type of resin constituting the base material, adjusting the structure of the resin (for example, a urethane film), a PP elastomer film, an St elastomer film, or the like.
The adhesive force of the adhesive sheet of the present invention to a silicone mirror wafer (for example, 20 μm thick) is preferably 0.1N/20mm or more, more preferably 0.5N/20mm to 20N/20mm, and still more preferably 0.8N/20mm to 15N/20 mm. In the case where the amount is within such a range, for example, an adhesive sheet useful as a temporary fixing sheet used for manufacturing electronic components can be obtained. Means that the composition is prepared by a method based on JIS Z0237: the adhesive force measured by the method of 2000 (bonding conditions: 1 reciprocal movement of a 2kg roller, peeling speed: 300 mm/min, peeling angle: 90 ℃).
The thickness of the pressure-sensitive adhesive sheet of the present invention is preferably 30 μm to 500. mu.m, more preferably 40 μm to 300. mu.m, and still more preferably 50 μm to 200. mu.m.
The adhesive sheet of the present invention has an elongation at break at 23 ℃ of preferably 100% or more, more preferably 250% or more, further preferably 400% to 1000%, and particularly preferably 500% to 900%. The elongation at break can be measured according to JIS K7113.
The 25% modulus of the pressure-sensitive adhesive sheet of the present invention at 23 ℃ is preferably 1N/10mm to 100N/10mm, more preferably 1.5N/10mm to 50N/10mm, and still more preferably 2N/10mm to 20N/10 mm. In 1 embodiment, the pressure-sensitive adhesive sheet of the present invention has a 25% modulus at 23 ℃ of 20N/10mm or less. Within such a range, good expandability can be obtained. The 25% modulus was determined as follows.
< 25% modulus measurement method >
The pressure-sensitive adhesive sheet was cut into a size of 10mm in width and 100mm in length, mounted on a thermostatic bath-equipped tensile tester so that the distance between chucks became 50mm, and the tensile rate: the pressure-sensitive adhesive sheet was stretched in the longitudinal direction at 300 mm/min, and the stress at 25% elongation was defined as the 25% modulus (N/10 mm).
The pressure-sensitive adhesive sheet may further include any other suitable layer as long as the effects of the present invention are obtained. The adhesive sheet may be provided as a separator-attached adhesive sheet in which a separator is disposed on the adhesive layer to protect the adhesive layer until the sheet is put to practical use.
B. Base material
As described above, a polyurethane resin, a styrene elastomer, or a propylene elastomer is used as a material constituting the base material.
The polyurethane resin is a resin having a urethane bond, and includes an acrylic-polyurethane copolymer and a polyester-polyurethane copolymer. The polyurethane resin is typically obtained by reacting a polyol with a polyisocyanate. The polyol is not particularly limited as long as it has 2 or more hydroxyl groups in the molecule, and any suitable polyol can be used. Examples thereof include polyacrylic polyols, polyester polyols, and polyether polyols. Among them, polyester polyol or polyether polyol is preferable, and when these polyols are used, the effect of the present invention becomes more remarkable. The above polyols may be used singly or in combination of 2 or more.
The above polyacrylic polyol is typically obtained by copolymerizing a (meth) acrylate with a monomer having a hydroxyl group. Examples of the (meth) acrylic acid ester include methyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and cyclohexyl (meth) acrylate. Examples of the monomer having a hydroxyl group include hydroxyalkyl esters of (meth) acrylic acid such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 2-hydroxypentyl (meth) acrylate; (meth) acrylic acid monoesters of polyhydric alcohols such as glycerin and trimethylolpropane; n-methylol (meth) acrylamide and the like. These may be used alone or in combination of 2 or more.
The polyacrylic polyol may be copolymerized with another monomer in addition to the monomer component. As the other monomer, any suitable monomer may be used as long as it is copolymerizable. Specific examples thereof include unsaturated monocarboxylic acids such as (meth) acrylic acid; unsaturated dicarboxylic acids such as maleic acid, anhydrides thereof, and monoesters or diesters thereof; unsaturated nitriles such as (meth) acrylonitrile; unsaturated amides such as (meth) acrylamide and N-methylol (meth) acrylamide; vinyl esters such as vinyl acetate and vinyl propionate; vinyl ethers such as methyl vinyl ether; α -olefins such as ethylene and propylene; halogenated α, β -unsaturated aliphatic monomers such as vinyl chloride and vinylidene chloride; and α, β -unsaturated aromatic monomers such as styrene and α -methylstyrene. These may be used alone or in combination of 2 or more.
The polyester polyol is typically obtained by reacting a polybasic acid component with a polyhydric alcohol component. Examples of the polybasic acid component include aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, 1, 4-naphthalenedicarboxylic acid, 2, 5-naphthalenedicarboxylic acid, 2, 6-naphthalenedicarboxylic acid, biphenyldicarboxylic acid, and tetrahydrophthalic acid; aliphatic dicarboxylic acids such as oxalic acid, succinic acid, malonic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, decanedicarboxylic acid, dodecanedicarboxylic acid, octadecanedicarboxylic acid, tartaric acid, alkylsuccinic acid, linoleic acid, maleic acid, fumaric acid, mesaconic acid, citraconic acid, and itaconic acid; alicyclic dicarboxylic acids such as hexahydrophthalic acid, tetrahydrophthalic acid, 1, 3-cyclohexanedicarboxylic acid, and 1, 4-cyclohexanedicarboxylic acid; or reactive derivatives thereof such as acid anhydrides, alkyl esters, and acid halides. These may be used alone or in combination of 2 or more.
Examples of the polyol component include ethylene glycol, 1, 2-propanediol, 1, 3-butanediol, 1, 4-butanediol, neopentyl glycol, pentanediol, 1, 6-hexanediol, 1, 8-octanediol, 1, 10-decanediol, 1-methyl-1, 3-butanediol, 2-methyl-1, 3-butanediol, 1-methyl-1, 4-pentanediol, 2-methyl-1, 4-pentanediol, 1, 2-dimethyl-neopentyl glycol, 2, 3-dimethyl-neopentyl glycol, 1-methyl-1, 5-pentanediol, 2-methyl-1, 5-pentanediol, 3-methyl-1, 5-pentanediol, 1, 3-methyl-1, 5-pentanediol, 1, 2-dimethylbutylene glycol, 1, 3-dimethylbutylene glycol, 2, 3-dimethylbutylene glycol, 1, 4-dimethylbutylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, polypropylene glycol, 1, 4-cyclohexanedimethanol, 1, 4-cyclohexanediol, bisphenol A, bisphenol F, hydrogenated bisphenol A, hydrogenated bisphenol F, and the like. These may be used alone or in combination of 2 or more.
The above polyether polyol is typically obtained by ring-opening polymerization of an alkylene oxide and addition to a polyol. Examples of the polyhydric alcohol include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, glycerin, and trimethylolpropane. Examples of the alkylene oxide include ethylene oxide, propylene oxide, butylene oxide, styrene oxide, and tetrahydrofuran. These may be used alone or in combination of 2 or more.
Examples of the polyisocyanate include aliphatic diisocyanates such as tetramethylene diisocyanate, dodecamethylene diisocyanate, 1, 4-butane diisocyanate, hexamethylene diisocyanate, 2, 4-trimethylhexamethylene diisocyanate, 2,4, 4-trimethylhexamethylene diisocyanate, lysine diisocyanate, 2-methylpentane-1, 5-diisocyanate, and 3-methylpentane-1, 5-diisocyanate; alicyclic diisocyanates such as isophorone diisocyanate, hydrogenated xylylene diisocyanate, 4' -cyclohexylmethane diisocyanate, 1, 4-cyclohexane diisocyanate, methylcyclohexylene diisocyanate, and 1, 3-bis (isocyanatomethyl) cyclohexane; aromatic diisocyanates such as tolylene diisocyanate, 2 '-diphenylmethane diisocyanate, 2, 4' -diphenylmethane diisocyanate, 4 '-diphenyldimethylmethane diisocyanate, 4' -dibenzyl diisocyanate, 1, 5-naphthalene diisocyanate, xylylene diisocyanate, 1, 3-phenylene diisocyanate, and 1, 4-phenylene diisocyanate; and aromatic aliphatic diisocyanates such as dialkyldiphenylmethane diisocyanate, tetraalkyldiphenylmethane diisocyanate, and α, α, α, α -tetramethylxylylene diisocyanate. These may be used alone or in combination of 2 or more.
The weight average molecular weight of the polyurethane resin is preferably 5000 to 600000, and more preferably 10000 to 400000. The acid value of the polyurethane resin is preferably 10 or more, more preferably 10 to 50, and particularly preferably 20 to 45. In the present specification, the weight average molecular weight can be measured by GPC (solvent: THF).
As the above-mentioned styrene-based elastomer, for example, examples thereof include styrene-butadiene-styrene triblock copolymer elastomer (SBS), styrene-isoprene-styrene triblock copolymer elastomer (SIS), styrene-ethylene-butylene copolymer elastomer (SEB), styrene-ethylene-propylene copolymer elastomer (SEP), styrene-ethylene-butylene-styrene copolymer elastomer (SEBs), styrene-ethylene-butylene-ethylene copolymer elastomer (SEBC), hydrogenated styrene-butadiene elastomer (HSBR), styrene-ethylene-propylene-styrene copolymer elastomer (SEPs), styrene-ethylene-propylene-styrene copolymer elastomer (SEEPS), styrene-butadiene-butylene-styrene copolymer elastomer (SBBS), and the like. Among them, SIS and SEBS are preferable.
In the styrene elastomer, the content ratio of the styrene-derived constituent unit is preferably 30 wt% or less, and more preferably 20 wt% or less. Within such a range, a psa sheet with excellent stretchability can be obtained.
The weight average molecular weight of the styrene elastomer is preferably 1 to 50 ten thousand, more preferably 5 to 30 ten thousand. Within such a range, a psa sheet with excellent stretchability can be obtained.
The propylene-based elastomer is an elastomer containing a constituent unit derived from propylene, and in 1 embodiment, it is a copolymer containing a constituent unit derived from propylene. In the propylene-based elastomer, the content ratio of the constituent unit derived from propylene is preferably 30 to 90% by weight, and more preferably 50 to 90% by weight. Within such a range, a psa sheet with excellent stretchability can be obtained.
Examples of other copolymerizable components constituting the propylene-based elastomer include constitutional units derived from monomers such as ethylene, 1-butene, 2-methylpropene, 1-pentene, 3-methyl-1-butene, 1-hexene, 4-methyl-1-pentene, and 1-octene. Among them, ethylene, 1-butene, 1-pentene, 1-hexene, 1-octene and the like are preferable, and ethylene and 1-butene are particularly preferable. These may be used alone or in combination of 2 or more. In 1 embodiment, the propylene-based elastomer includes a constituent unit derived from ethylene. In the propylene-based elastomer, the content ratio of the ethylene-derived constituent unit is preferably 5 to 20% by weight, and more preferably 8 to 15% by weight.
The weight average molecular weight of the propylene-based elastomer is preferably 1 to 50 ten thousand, more preferably 5 to 30 ten thousand. Within such a range, a psa sheet with excellent stretchability can be obtained.
In 1 embodiment, the substrate is a single layer.
In another embodiment, the substrate has a multilayer structure. When the substrate is composed of a plurality of layers, at least 1 of the layers constituting the substrate preferably contains the polyurethane-based resin, the styrene-based elastomer, or the propylene-based elastomer as described above. The total thickness of the layers containing the polyurethane resin, the styrene elastomer, or the propylene elastomer is preferably 50% or more, and more preferably 70% or more, based on the total thickness of the base material.
In 1 embodiment, the substrate comprises a fatty acid amide. By containing the fatty acid amide, a substrate having appropriate slidability can be obtained. The pressure-sensitive adhesive sheet having a base material containing a fatty acid amide is excellent in transferability, has excellent grip on the stage of an expander, and can be stretched well in the expanding step. When the substrate has a multilayer structure and the pressure-sensitive adhesive layer is disposed on one side of the substrate, the fatty acid amide is preferably contained at least in the outermost layer of the substrate located on the opposite side of the pressure-sensitive adhesive layer.
Examples of the fatty acid amide include monoamides such as lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, oleic acid amide, erucic acid amide, and hydroxystearic acid amide, ethylene bis-lauric acid amide, ethylene bis-stearic acid amide, ethylene bis-hydroxystearic acid amide, ethylene bis-behenic acid amide, hexamethylene bis-stearic acid amide, ethylene bis-oleic acid amide, and hexamethylene bis-oleic acid amide. The fatty acid amide lubricant preferably contains 12 or more, more preferably 12 to 30, and still more preferably 14 to 28 carbon atoms in the fatty acid.
In embodiment 1, the content of the fatty acid amide is preferably 0.001 to 10 parts by weight, more preferably 0.01 to 3 parts by weight, based on 100 parts by weight of the substrate.
In 1 embodiment, when the substrate has a multilayer structure and the pressure-sensitive adhesive layer is disposed on one side of the substrate, the content of the fatty acid amide in the outermost layer of the substrate on the opposite side of the pressure-sensitive adhesive layer is preferably 0.001 to 10 parts by weight, more preferably 0.01 to 3 parts by weight, based on 100 parts by weight of the outermost layer.
The recovery rate of the substrate when the substrate is held for 5 minutes in an environment of 23 ℃ under tension applied to elongate the substrate by 150% and the tension is released is preferably 80% or more, more preferably 82% or more, and still more preferably 85% or more, based on the substrate before the elongation. The higher the recovery rate is, the more preferable the upper limit value is, for example, 95% (preferably 98%).
The elongation at break of the substrate at 23 ℃ is preferably 10% or more, more preferably 250% or more, further preferably 250% to 1000%, and particularly preferably 250% to 800%.
The 25% modulus of the substrate at 23 ℃ is preferably 1N/10mm to 100N/10mm, more preferably 2N/10mm to 60N/10mm, and still more preferably 3N/10mm to 30N/10 mm. In 1 embodiment, the 25% modulus of the substrate at 23 ℃ is 30N/10mm or less. Within such a range, good expandability can be obtained.
The hardness of the base material is preferably 80A to 100A, more preferably 85A to 95A, as measured according to JIS K6253. Within such a range, good expandability can be obtained. In 1 embodiment, the polyurethane resin is used as a material constituting a base material, and the hardness of the base material is 80A to 100A (preferably 85A to 95A). In this case, the effect of the present invention becomes remarkable.
The thickness of the substrate may be set to any appropriate thickness according to the desired strength, flexibility, use purpose, and the like. The thickness of the substrate is preferably 1000 μm or less, more preferably 1 to 500. mu.m, still more preferably 1 to 300. mu.m, particularly preferably 3 to 200. mu.m, most preferably 5 to 100. mu.m.
The kinetic friction force of the base material with respect to the SUS304 plate on at least one surface is preferably 0.1N to 7.0N, more preferably 0.1N to 5.0N, and still more preferably 0.1N to 3.0N. The pressure-sensitive adhesive sheet having a base material with a dynamic friction coefficient in such a range is excellent in transferability, has excellent gripping force on the stage of the expander, and can be well stretched in the expanding step.
C. Adhesive layer
The adhesive layer is made of any suitable adhesive. Examples of the adhesive include acrylic adhesives, silicone adhesives, vinyl alkyl ether adhesives, polyester adhesives, polyamide adhesives, urethane adhesives, fluorine adhesives, styrene-diene block copolymer adhesives, and active energy ray-curable adhesives. In 1 embodiment, an acrylic adhesive is used.
Examples of the acrylic pressure-sensitive adhesive include acrylic pressure-sensitive adhesives in which an acrylic polymer (homopolymer or copolymer) containing 1 or 2 or more kinds of alkyl (meth) acrylates as monomer components is used as a base polymer. Specific examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, and the like, C1-20 alkyl (meth) acrylates such as pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, nonadecyl (meth) acrylate, and eicosyl (meth) acrylate. Among them, alkyl (meth) acrylates having a linear or branched alkyl group having 4 to 18 carbon atoms can be preferably used.
The content ratio of the constituent unit derived from the alkyl (meth) acrylate is preferably 50 parts by weight, more preferably 60 parts by weight or more, further preferably 70 parts by weight or more, and particularly preferably 80 to 97 parts by weight, based on 100 parts by weight of the acrylic polymer.
The acrylic polymer may contain units corresponding to other monomers copolymerizable with the alkyl (meth) acrylate, as necessary, for the purpose of modification of cohesive force, heat resistance, crosslinking property, and the like. Examples of such monomers include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyl group-containing monomers such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, hydroxyhexyl (meth) acrylate, hydroxyoctyl (meth) acrylate, hydroxydecyl (meth) acrylate, hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl methacrylate; sulfonic acid group-containing monomers such as styrenesulfonic acid, allylsulfonic acid, 2- (meth) acrylamido-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalenesulfonic acid; (N-substituted) amide monomers such as (meth) acrylamide, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol (meth) acrylamide and N-methylol propane (meth) acrylamide; aminoalkyl ester (meth) acrylate monomers such as aminoethyl (meth) acrylate, N-dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate; alkoxyalkyl (meth) acrylate monomers such as methoxyethyl (meth) acrylate and ethoxyethyl (meth) acrylate; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide and N-phenylmaleimide; itaconimide-based monomers such as N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexyl itaconimide, N-cyclohexylitaconimide and N-lauryl itaconimide; succinimide monomers such as N- (meth) acryloyloxymethylene succinimide, N- (meth) acryloyl-6-oxohexamethylene succinimide, and N- (meth) acryloyl-8-oxooctamethylene succinimide; vinyl monomers such as vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methyl-vinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, N-vinylcarboxylic acid amides, styrene, alpha-methylstyrene and N-vinylcaprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth) acrylate; glycol-based acrylate monomers such as polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, and methoxypolypropylene glycol (meth) acrylate; acrylate monomers having a heterocycle, a halogen atom, a silicon atom, and the like, such as tetrahydrofurfuryl (meth) acrylate, fluoro (meth) acrylate, and silicone (meth) acrylate; polyfunctional monomers such as hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy acrylate, polyester acrylate, and urethane acrylate; olefin monomers such as isoprene, butadiene, and isobutylene; vinyl ether monomers such as vinyl ether. These monomers may be used alone or in combination of 2 or more.
In 1 embodiment, the acrylic polymer includes a constituent unit derived from a monomer having a polar functional group. When the substrate contains a fatty acid amide, when an acrylic polymer containing a constituent unit derived from a monomer having a polar functional group is used, transfer of the fatty acid amide to the pressure-sensitive adhesive layer can be prevented, and a pressure-sensitive adhesive sheet having excellent durability can be obtained. The content ratio of the constituent unit derived from the monomer having a polar functional group is preferably 0.01 to 40 parts by weight, more preferably 1 to 30 parts by weight, still more preferably 2 to 20 parts by weight, and particularly preferably 3 to 15 parts by weight, based on 100 parts by weight of the acrylic polymer. Examples of the polar functional group include a carboxyl group and a hydroxyl group.
In 1 embodiment, (meth) acrylic acid may be used as the monomer having a polar functional group. In this embodiment, the content ratio of the constituent unit derived from (meth) acrylic acid is preferably 1 to 40 parts by weight, more preferably 1 to 20 parts by weight, and still more preferably 1 to 10 parts by weight, based on 100 parts by weight of the acrylic polymer.
The binder may contain any suitable additive as required. Examples of the additives include initiators, crosslinking agents, tackifiers, plasticizers, pigments, dyes, fillers, anti-aging agents, conductive agents, antistatic agents, ultraviolet absorbers, light stabilizers, release control agents, softeners, surfactants, flame retardants, and antioxidants.
In 1 embodiment, the adhesive comprises a crosslinking agent.
Examples of the crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, and amine-based crosslinking agents. Among them, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferable.
Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; aromatic isocyanates such as 2, 4-tolylene diisocyanate, 4' -diphenylmethane diisocyanate, and xylylene diisocyanate; isocyanate adducts such as trimethylolpropane/tolylene diisocyanate trimer adduct (Nippon Polyurethane Industry Co., Ltd., product name "CORONATE L"), trimethylolpropane/hexamethylene diisocyanate trimer adduct (Nippon Polyurethane Industry Co., Ltd., product name "CORONATE HL"), isocyanurate of hexamethylene diisocyanate (Nippon Polyurethane Industry Co., Ltd., product name "CORONATE HX"); and the like. The content of the isocyanate-based crosslinking agent may be set to any appropriate amount depending on the desired adhesive strength, elasticity of the pressure-sensitive adhesive layer, and the like, and is typically 0.1 to 20 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the base polymer.
Examples of the epoxy-based crosslinking agent include N, N, N ', N' -tetraglycidyl-m-phenylenediamine, diglycidylaniline, 1, 3-bis (N, N-glycidylaminomethyl) cyclohexane (trade name "TETRAD C" manufactured by Mitsubishi gas chemical Co., Ltd.), 1, 6-hexanediol diglycidyl ether (trade name "Eplight 1600" manufactured by Co., Ltd.), neopentyl glycol diglycidyl ether (trade name "Eplight 1500 NP" manufactured by Co., Ltd.), ethylene glycol diglycidyl ether (trade name "Eplight 40E" manufactured by Co., Ltd.), propylene glycol diglycidyl ether (trade name "Eplight 70P" manufactured by Co., Ltd.), polyethylene glycol diglycidyl ether (trade name "Eplight 70P" manufactured by Nippon oil & fat chemical Co., Ltd., "ethylene glycol diglycidyl ether"), Trade name "EPIOL E-400"), polypropylene glycol diglycidyl ether (product name "EPIOL P-200" manufactured by Nippon fat and oil Co., Ltd.), sorbitol polyglycidyl ether (product name "DENACOL EX-611" manufactured by Nagase ChemteX Corporation), glycerol polyglycidyl ether (product name "DENACOL EX-314" manufactured by Nagase ChemteX Corporation), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (product name "DENACOL EX-512" manufactured by Nagase ChemteX Corporation), sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, epoxy resins having 2 or more epoxy groups in the molecule, and the like. The content of the epoxy crosslinking agent may be set to any appropriate amount depending on the desired adhesive strength, elasticity of the pressure-sensitive adhesive layer, and the like, and is typically 0.01 to 10 parts by weight, more preferably 0.03 to 5 parts by weight, based on 100 parts by weight of the base polymer.
The thickness of the pressure-sensitive adhesive layer is preferably 1 to 50 μm, more preferably 1 to 30 μm, and still more preferably 2 to 20 μm.
The elastic modulus of the adhesive layer by nanoindentation is preferably 0.005 to 5MPa, and more preferably 0.01 to 2 MPa. In the case where the amount is within such a range, a pressure-sensitive adhesive layer in which the stretchability of the base material is not easily inhibited can be formed, and the effect of the present invention is more remarkable. In addition, an adhesive layer having appropriate adhesive force may be formed. The above elastic modulus may be determined by, for example, the composition of the adhesive contained in the adhesive layer; the kind, molecular weight, degree of crosslinking, and the like of the resin material as the base polymer of the binder are adjusted. The elastic modulus by the nanoindentation method was obtained from the load-indentation depth curve obtained by continuously measuring the load and indentation depth of the indenter when the indenter was pressed into the sample (a portion where the thermally expandable microspheres were not present) at the time of loading and unloading. In the present specification, the elastic modulus by the nanoindentation method is measured under the following conditions: 1mN, load/unload speed: 0.1mN/s, retention time: 1s, ambient temperature: modulus of elasticity at 23 ℃ and determined as described above.
D. Method for producing adhesive sheet
The adhesive sheet of the present invention can be produced by any suitable method. The pressure-sensitive adhesive sheet of the present invention can be obtained by forming a pressure-sensitive adhesive layer on a substrate. Examples of the method for forming the pressure-sensitive adhesive layer include a method of applying a pressure-sensitive adhesive to a substrate, and a method of transferring a coating layer formed by applying a pressure-sensitive adhesive to an arbitrary appropriate film to an intermediate layer.
As the method for applying the adhesive, any suitable application method can be adopted. For example, each layer may be formed by drying after coating. Examples of the coating method include a coating method using a multilayer Coater (Multi Coater), a die Coater, a gravure Coater, an applicator, or the like. Examples of the drying method include natural drying and heat drying.
E. Use of
The adhesive sheet of the present invention can be suitably used as a sheet for temporarily fixing an electronic component material in the production of an electronic component. In 1 embodiment, the adhesive sheet of the present invention can be used as an adhesive sheet for chip pickup. The adhesive sheet is used as a temporary fixing sheet for cutting an electronic component material. Examples of the electronic component material include a semiconductor chip, an LED chip, and a ceramic capacitor.
[ examples ]
The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. The evaluation methods in the examples are as follows. In the following evaluation, an adhesive sheet from which a separator was peeled was used. In the examples, "part(s)" and "%" are based on weight unless otherwise specified.
(1) Recovery rate
For an adhesive sheet having a width of 10mm and a length of 100mm, the distance L between the initial evaluation points was recorded in the longitudinal direction050mm mark. The test piece was mounted on a tensile testing machine at an ambient temperature of 23 ℃ and a distance between chucks of 70mm, and the test piece was elongated at a tensile rate of 300 mm/min to 150% (distance between chucks: 145mm) and held in the elongated state for 5 minutes, and then the distance L between the elongation evaluation points was measured1. Thereafter, the tension was released, and the distance L between evaluation points after 5 minutes was measured to obtain the recovery rate (%) by the following formula.
Recovery rate (%) { (distance between elongation evaluation points L)1-distance between evaluation points L)/(distance between elongation evaluation points L1-distance L between initial evaluation points0)}×100
For the recovery, 2 samples in a predetermined direction I and a direction II orthogonal to the direction I were measured.
The recovery rate was determined by stretching the adhesive sheet at an ambient temperature of 40 ℃ by the above-described method.
(2) Dynamic friction force
An adhesive tape was attached to a table with the base film facing upward, an SUS304 plate (weight 200g, 63mm × 63mm) was placed on the adhesive tape so as to be in surface contact with the base film, the SUS304 plate was moved (100 mm/min) on the base film, and the average load (N) generated at this time was measured and used as the kinetic friction force.
[ example 1]
An adhesive was prepared which contained 100 parts by weight of an acrylic polymer composed of 2-ethylhexyl acrylate (2 EHA)/Acrylic Acid (AA) 90/10 (weight ratio), 5 parts by weight of a polyisocyanate-based crosslinking agent (trade name "CORONATE L", manufactured by Nippon Polyurethane Industry co., ltd.), 0.05 parts by weight of a glycidylamine-based crosslinking agent (trade name "TETRAD-C", manufactured by mitsubishi gas chemical co., ltd.), and ethyl acetate. The pressure-sensitive adhesive was applied to a release-treated surface of a 38 μm thick polyester film (trade name: MRF, manufactured by Mitsubishi chemical polyester Co., Ltd.) whose one surface was release-treated with silicone, and heated at 120 ℃ for 2 minutes to form a pressure-sensitive adhesive layer having a thickness of 20 μm. Then, the pressure-sensitive adhesive layer was transferred to a polyurethane film A (thickness: 70 μm, manufactured by Daishi industries, Ltd.) containing 0.1 part by weight of stearic acid amide as a substrate, and stored at 50 ℃ for 48 hours to obtain a pressure-sensitive adhesive sheet.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
[ example 2]
An adhesive sheet was obtained in the same manner as in example 1, except that a urethane film B (thickness: 60 μm, manufactured by Nihon Matai co., ltd.) was used as the base material.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
[ example 3]
A pressure-sensitive adhesive sheet was obtained in the same manner as in example 1, except that a polypropylene elastomer (PP elastomer) film (thickness: 100 μm, manufactured by Nindon electric Co., Ltd.) containing 0.05 part by weight of stearic acid amide was used as the substrate.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
[ example 4]
An adhesive sheet was obtained in the same manner as in example 1, except that a laminate (thickness: 80 μm, manufactured by Nihon Matai Co., Ltd.) comprising polyethylene (PE; thickness: 10 μm)/styrene elastomer (St elastomer; thickness: 60 μm) film/polyethylene (thickness: 10 μm) was used as the base material.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
[ example 5]
An adhesive sheet was obtained in the same manner as in example 1 except that a laminate (thickness: 80 μm, manufactured by Nihon Matai co., ltd.) composed of an ethylene vinyl acetate copolymer film (EVA; thickness: 10 μm)/a styrene-based elastomer film (thickness: 60 μm)/an ethylene vinyl acetate copolymer film (thickness: 10 μm) was used as a base material.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
Comparative example 1
An adhesive sheet was obtained in the same manner as in example 1 except that a polyvinyl chloride Film (PVC; thickness: 70 μm, manufactured by DiaPlus Film inc.) containing 0.7 part by weight of stearic acid amide was used as the substrate.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
Comparative example 2
A pressure-sensitive adhesive sheet was obtained in the same manner as in example 1, except that a polyethylene film (PE; thickness: 100 μm, manufactured by Nindon electric Co., Ltd.) was used as the substrate.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
Comparative example 3
An adhesive sheet was obtained in the same manner as in example 1 except that a laminate (thickness: 80 μm, manufactured by Dakoku Kogyo Co., Ltd.) comprising a polypropylene film (PP; thickness: 55 μm)/polyethylene film (PE; thickness: 25 μm) was used as the substrate.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
Comparative example 4
A pressure-sensitive adhesive sheet was obtained in the same manner as in example 1, except that an ethylene-vinyl acetate copolymer film (thickness: 100 μm, manufactured by Nindon electric Co., Ltd.) was used as the substrate.
The obtained pressure-sensitive adhesive sheet was subjected to the evaluations (1) and (2). The results are shown in Table 1.
[ Table 1]
Claims (8)
1. An adhesive sheet comprising: a base material and an adhesive layer disposed on at least one side of the base material,
the base material contains at least 1 selected from the group consisting of polyurethane-based resins, styrene-based elastomers, and propylene-based elastomers.
2. The adhesive sheet according to claim 1, wherein the substrate comprises a fatty acid amide.
3. The adhesive sheet according to claim 2, wherein the fatty acid amide is contained in an amount of 0.001 to 10 parts by weight based on 100 parts by weight of the substrate.
4. The adhesive sheet according to any one of claims 1 to 3, wherein the adhesive layer comprises an acrylic adhesive.
5. The adhesive sheet according to claim 4, wherein the acrylic adhesive comprises an acrylic polymer comprising a constituent unit derived from a monomer having a polar functional group.
6. The adhesive sheet according to claim 5, wherein the polar functional group-containing monomer is contained in an amount of 0.01 to 40 parts by weight based on 100 parts by weight of the acrylic polymer.
7. The adhesive sheet according to claim 5, wherein the monomer having a polar functional group is (meth) acrylic acid.
8. The adhesive sheet according to claim 7, wherein the (meth) acrylic acid is contained in an amount of 1 to 20 parts by weight based on 100 parts by weight of the (meth) acrylic polymer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-143868 | 2019-08-05 | ||
| JP2019143868A JP2021024949A (en) | 2019-08-05 | 2019-08-05 | Pressure sensitive adhesive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112322203A true CN112322203A (en) | 2021-02-05 |
Family
ID=74303675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010773172.8A Pending CN112322203A (en) | 2019-08-05 | 2020-08-04 | Adhesive sheet |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2021024949A (en) |
| KR (1) | KR20210018077A (en) |
| CN (1) | CN112322203A (en) |
| TW (1) | TW202113000A (en) |
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| JP3029102B1 (en) * | 1998-10-20 | 2000-04-04 | 和泰股▲ふん▼有限公司 | Elastic nonwoven composition |
| US20020098349A1 (en) * | 2000-08-23 | 2002-07-25 | Nitto Denko Corporation | Medical pressure-sensitive adhesive tape or sheet, and first aid adhesive tape |
| JP2003049132A (en) * | 2001-08-06 | 2003-02-21 | Nitto Denko Corp | Surface protecting sheet |
| JP2005029907A (en) * | 2003-07-08 | 2005-02-03 | Kanebo Ltd | Stretchable nonwoven fabric, method for producing the same and pressure-sensitive adhesive sheet using the same |
| WO2010001959A1 (en) * | 2008-07-03 | 2010-01-07 | 電気化学工業株式会社 | Pressure-sensitive adhesive film, laminate using the pressure-sensitive adhesive film and method for protecting molded article |
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| JPS6269640A (en) * | 1985-09-24 | 1987-03-30 | Nippon Carbide Ind Co Ltd | Adhesive film for wafer dicing |
| WO1991002377A1 (en) * | 1989-08-01 | 1991-02-21 | Mitsui Toatsu Chemicals, Incorporated | Film for wafer processing |
| JP2001207140A (en) | 2000-01-26 | 2001-07-31 | Sumitomo Bakelite Co Ltd | Adhesive tape for processing semiconductor wafer |
| JP4286043B2 (en) * | 2003-03-31 | 2009-06-24 | ロンシール工業株式会社 | Wafer dicing adhesive tape |
| JP5140910B2 (en) * | 2005-08-30 | 2013-02-13 | 住友ベークライト株式会社 | Film base and adhesive tape for semiconductor wafer processing |
| JP2010260893A (en) | 2009-04-30 | 2010-11-18 | Nitto Denko Corp | Laminated film and method for producing semiconductor device |
| KR20150099769A (en) * | 2012-12-28 | 2015-09-01 | 린텍 가부시키가이샤 | Dicing-sheet substrate film and dicing sheet |
| JP6107230B2 (en) * | 2013-02-28 | 2017-04-05 | 住友ベークライト株式会社 | Dicing film |
| KR102528636B1 (en) * | 2016-06-30 | 2023-05-03 | 린텍 가부시키가이샤 | Sheet for semiconductor processing |
| JP6807234B2 (en) * | 2017-01-10 | 2021-01-06 | 日東電工株式会社 | Adhesive sheet |
-
2019
- 2019-08-05 JP JP2019143868A patent/JP2021024949A/en active Pending
-
2020
- 2020-07-29 TW TW109125548A patent/TW202113000A/en unknown
- 2020-07-29 KR KR1020200094278A patent/KR20210018077A/en active Search and Examination
- 2020-08-04 CN CN202010773172.8A patent/CN112322203A/en active Pending
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|---|---|---|---|---|
| JPH08143766A (en) * | 1994-08-12 | 1996-06-04 | Kuraray Co Ltd | Thermoplastic polymer composition |
| JP3029102B1 (en) * | 1998-10-20 | 2000-04-04 | 和泰股▲ふん▼有限公司 | Elastic nonwoven composition |
| US20020098349A1 (en) * | 2000-08-23 | 2002-07-25 | Nitto Denko Corporation | Medical pressure-sensitive adhesive tape or sheet, and first aid adhesive tape |
| JP2003049132A (en) * | 2001-08-06 | 2003-02-21 | Nitto Denko Corp | Surface protecting sheet |
| JP2005029907A (en) * | 2003-07-08 | 2005-02-03 | Kanebo Ltd | Stretchable nonwoven fabric, method for producing the same and pressure-sensitive adhesive sheet using the same |
| WO2010001959A1 (en) * | 2008-07-03 | 2010-01-07 | 電気化学工業株式会社 | Pressure-sensitive adhesive film, laminate using the pressure-sensitive adhesive film and method for protecting molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021024949A (en) | 2021-02-22 |
| TW202113000A (en) | 2021-04-01 |
| KR20210018077A (en) | 2021-02-17 |
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