CN111891750A

CN111891750A - Full-automatic chip pad pasting coil stock equipment

Info

Publication number: CN111891750A
Application number: CN202010682947.0A
Authority: CN
Inventors: 曹昭
Original assignee: Cozao Technology Ltd
Current assignee: Cozao Technology Ltd
Priority date: 2020-07-15
Filing date: 2020-07-15
Publication date: 2020-11-06

Abstract

The invention belongs to the technical field of automation of chip film pasting and rolling materials, and relates to full-automatic IC chip strip film pasting and rolling equipment which comprises an IC chip strip material feeding device, a feeding and conveying device, a material taking manipulator device, a visual adhesive pasting device, a film pasting device, a strip material rolling device and a device loading platform rack. The IC chip strip material film pasting and lengthening device can facilitate the film pasting and the strip material rolling of IC chip strips, so that the film pasting and the strip material rolling of the IC chip strips are accurate and efficient, and the working efficiency is improved.

Description

Full-automatic chip pad pasting coil stock equipment

Technical Field

Background

At present, in the field of production and manufacture of contact type memory IC chips, IC chip strips have a certain length, when electronic chips are continuously attached, films are attached manually and then are connected into strips by using a punching machine, and then the punching and film cutting are manually carried out on the operation punching machine. In the production process of punching and cutting the film, the punching blade is easy to cause damage to human bodies, the speed of manually pasting the release film is low, and the overall production efficiency is low.

Disclosure of Invention

The invention aims to provide full-automatic IC chip film pasting and material rolling equipment which has the advantages of quickly jointing IC chip strips and rolling the IC chip strips, and improving the working efficiency.

The above object of the present invention is achieved by the following technical solutions:

the utility model provides a full-automatic IC chip pad pasting coil stock equipment, includes IC chip strip material loading attachment, pay-off transmission device, reclaimer manipulator device, vision rubberizing device, pad pasting device, area material coiling mechanism to and device microscope carrier frame. And a feeding device positioning plate is arranged at the feeding end of the device carrier rack and is arranged on the right side of a feeding path of the feeding device.

According to the technical scheme, the material storage position and the material loading position of the feeding platform are manually placed by 10 layers of plastic suction discs for placing raw material IC chip strips, the feeding platform comprises a servo motor, a material ejecting cylinder, a material clamping cylinder and a material clamping plate, the 10 layers of plastic suction discs are ejected by the material ejecting cylinder, then the material clamping cylinder is driven to the material clamping plate to clamp the penultimate plastic suction disc, the plastic suction disc at the lowest layer falls onto a plastic suction disc belt line due to gravity, the servo motor rotates and drives the plastic suction disc belt line to rotate, the plastic suction disc is conveyed to the material loading position, and layered material loading is completed. The feeding sensor is mainly used for sensing whether the material taking manipulator device is above a feeding position and does not act above the feeding position so as to control the movement of the IC chip feeding device.

Further, the feeding motor is arranged on the belt rack, and the feeding belt and the feeding motor are assembled.

By implementing the technical scheme, when the material taking manipulator device finishes one-time adsorption and transfer of the IC chip strip 10, the control system gives a signal to the feeding motor to drive the feeding belt to move for a certain distance, and the IC chip strip on the feeding belt is conveyed to a specified position.

Furthermore, the mechanical X-axis, the mechanical Y-axis and the mechanical Z-axis are arranged and assembled to form a three-axis manipulator which can move in the XYZ-axis direction. 4 clean type suction nozzle settings are installed on the sucking disc fixed plate, and the sucking disc fixed plate sets up again and installs on mechanical Z axle.

According to the technical scheme, the three-axis manipulator moves 4 cleaning type suction nozzles to be right above the feeding position of the feeding platform according to a program, then the mechanical Z axis descends to enable the cleaning type suction nozzles to contact IC chip strips in the plastic sucking disc, then air suction is started, the XYZ axis is moved, the IC chip strips are sucked and placed on the feeding and conveying device, and the incoming material sucking and transferring actions are completed.

Further, the vision rubberizing device is provided with a pad pasting frame, a pad pasting motion shaft, a pad pasting vision CCD camera lens and a pad pasting mechanism assembly, and the pad pasting mechanism assembly is provided with a pad pasting lifting cylinder, a pad pasting sucker support and a pad pasting sucker.

Further, the film stripping device is provided with a film stripping platform, a die cutting film discharging frame and a film stripping motor, the die cutting film discharging frame is provided with an installation die cutting film, and the film stripping motor is arranged to automatically strip the film by the film stripping platform when rotating.

Implement above-mentioned technical scheme, the pad pasting motion axle sets up to left and right sides X and removes, moves earlier directly over the feeding belt, shoots IC chip strip material on it, removes directly over peeling off the membrane platform again, shoots the mould cutting membrane on it, after shooing twice and carrying out the data contrast, send data to the pad pasting motion axle, remove the pad pasting sucking disc to peeling off directly over the membrane platform, adsorb the cross cutting membrane that peels off, remove directly over IC chip strip material according to the calculated distance of shooing again, pad pasting lift cylinder descends to move the pad pasting sucking disc and aligns the laminating of adsorbed mould cutting membrane to 2 IC chip strip material junctions, accomplish accurate pad pasting.

Further, the belt material winding device is provided with a winding disc mechanism, a rotary damper and a material receiving motor, wherein the material receiving disc mechanism comprises 2 material disc blocking pieces, an inflatable main shaft, a material disc support and a material winding roller. The 2 material tray retaining pieces and the inflatable main shaft are arranged to clamp the IC chip belt material and are arranged and installed on the material tray bracket.

According to the technical scheme, firstly, the filmed IC chip strip is arranged to penetrate through the rolling material roller to be stuck on the inflatable main shaft, the rolling material roller is connected with the rotary damper and the material receiving motor, the material receiving motor rotates all the time and drives the rolling material roller and the rotary damper, and when the IC chip strip is tightened up, the force is too large, the rotary damper idles, so that the strip is prevented from being broken. And after the material receiving motor is started, the material winding roller is driven to rotate, the chip strip is automatically wound up, and the IC chip film pasting and material winding work is completed.

Drawings

Fig. 1 is a first perspective view of an embodiment of the present application.

Fig. 2 is a second drawing of the embodiment of the present application.

Fig. 3 is a front view three of an embodiment of the present application.

Fig. 4 is a fourth enlarged view of the loading of the examples in this application.

Fig. 5 is an enlarged view five of the adhesive film of the examples in the present application.

FIG. 6 is a sixth view of a web roll of an embodiment of the present application.

Reference numerals: 1. a feeding device; 10. an IC chip strip; 11, plastic uptake; 12 a feeding mechanism; 13. a feeding platform; 14, sucking a plastic disc belt line; 15. a feeding sensor; 101. storing the material level; 102 feeding level; 2, a feeding and conveying device; 21. a feeding belt; 22. a feeding motor; 23. a belt frame; 3. a material taking manipulator device; a 30-triaxial manipulator; 31. a mechanical X-axis; 32. a mechanical Y-axis; 33. a mechanical Z axis; 34. a sucker fixing plate; 35. a cleaning type suction nozzle; 36. visually positioning the CCD lens; 4. a visual adhesive tape sticking device; 41. a film pasting frame; 42. a motion shaft for film pasting; 43. a film-sticking vision CCD lens; 44. a film pasting mechanism component; 441. a film sticking lifting cylinder; 442. sticking a film and sucking disc bracket; 443; sticking a film sucker; 5. a film stripping device; 50. a membrane stripping platform; 51. a die cutting film discharging frame; 52. a film stripping motor; 501. die cutting the film; 6. a strip winding device; 60. a winding disc mechanism; 61. a rotary damper; 62. a material receiving motor; 600. chip belt material; 601. a material tray baffle plate; 602. a main inflatable shaft; 603. a tray support; 604. a material winding roller; 7. a device stage frame; 71. a feeding device positioning block.

Detailed Description

The specific embodiments of the present application are as follows: a full-automatic IC chip film pasting and material rolling device comprises an IC chip strip material feeding device 1, a feeding and conveying device 2, a material taking mechanical arm device 3, a visual adhesive tape pasting device 4, a film pasting device 5, a strip material rolling device 6 and a device carrying platform rack 7, wherein the IC chip strip material feeding device 1, the feeding and conveying device 2, the material taking mechanical arm device 3, the visual adhesive tape pasting device 4, the film pasting device 5, the strip material rolling device 6 and the device. IC chip pad pasting coil stock equipment adopts vision CCD cooperation servo motor and lead screw, lift cylinder rapid draing, clean type suction nozzle continuous operation, cancels artifical punching press and cuts membrane work, and automatic high-efficient pad pasting connects the area, uses multiclass sensor to guarantee the joint accuracy.

The IC chip loading device 1 described with reference to fig. 2 and 3 is firstly placed at a designated position of the device carrier frame 7, and is connected by the loading positioning block 71 in a positioning manner, the raw material IC chip strip 10 is manually placed on the storage position 101 and the loading position 102 of the feeding platform 13 by the plastic sucking discs 11, a total of 10 layers are placed, the feeding platform 13 includes a servo motor 131, a material ejecting cylinder 132, a material clamping cylinder 133 and a material clamping plate 134, the 10 layers of plastic sucking discs 11 are ejected by the material ejecting cylinder 132, then the material clamping cylinder 133 is brought to the material clamping plate 134 to clamp the last layer of plastic sucking discs 11, the last layer of plastic sucking discs 11 falls onto the plastic disc line 14, the servo motor 131 rotates to drive the feeding mechanism 12 and the plastic sucking disc line 14 to rotate, the plastic sucking discs 11 are conveyed to the loading position 102, and the component layer loading is completed. The loading sensor 15 is mainly used to sense whether the material taking robot 3 is above the loading level 102, and does not act above the loading level, so as to control the movement of the IC chip loading device 1.

The feeding and conveying device 2 shown in fig. 2 and 3 comprises a feeding belt 21, a feeding motor 22 and a belt frame 23. When the material taking manipulator device 3 finishes the work of adsorbing and transferring the IC chip strip 10 once, the control system gives a signal to the feeding motor 22 to drive the feeding belt 21 to move, so that the IC chip strip 10 on the feeding belt is conveyed and moved by the length distance.

As shown in fig. 4, the material taking manipulator device 3 includes a mechanical X-axis 31, a mechanical Y-axis 32, a mechanical Z-axis 33, a suction

cup fixing plate

34, 4 cleaning type suction nozzles 35, and a vision positioning CCD lens 36, wherein the mechanical X-axis 31, the mechanical Y-axis 32, and the mechanical Z-axis 33 are assembled into a three-axis manipulator 30, which can perform XYZ-axis direction transfer, the 4 cleaning type suction nozzles 35 are mounted on the suction cup fixing plate 34, the suction cup fixing plate 34 is further mounted on the mechanical Z-axis 33, the three-axis manipulator 30 moves in a linkage manner to sequentially move the 4 cleaning type suction nozzles 35 above a loading level 102 of the feeding platform 13 according to a program during operation, the mechanical Z-axis 33 lowers the cleaning type suction nozzles 35, starts suction after contacting the IC chip strip 10 in the plastic sucking plate 11, and then moves the XYZ-axis to place the IC chip strip 10 on the feeding and conveying device 2, thereby completing the incoming material. The vision positioning CCD lens 36 photographs and detects that the last three-axis manipulator 30 places the IC chip strip 10 at the position of the feeding belt 21, then intelligently calculates, adjusts the moving position of the next three-axis manipulator 30, ensures that the front and back IC chip strips 10 are closely connected end to end, and the placing precision is 0.01 mm.

The vision rubberizing device 4 and the film stripping device 5 are shown in fig. 5, wherein the vision rubberizing device 4 comprises a film pasting frame 41, a film pasting moving shaft 42, and a film pasting vision CCD lens 43 and a film pasting mechanism assembly 44 which are simultaneously fixed on the film pasting frame 41, and the film pasting mechanism assembly 44 comprises a film pasting lifting cylinder 441, a film pasting suction cup bracket 442 and a film pasting suction cup 443. The film stripping device 5 comprises a film stripping platform 50, a die cutting film discharging frame 51 and a film stripping motor 52, wherein the die cutting film discharging frame 51 is provided with a die cutting film 501 for automatic film stripping. The film sticking motion shaft 42 can move left and right in an X mode, firstly moves right above the feeding belt 21 to shoot the IC chip strip 10 on the film sticking motion shaft, then moves right above the film peeling platform 50 to shoot the die-cut film 501 on the film peeling platform, after data comparison is carried out on two times of shooting, data are sent to the film sticking motion shaft 52 to move the film sticking mechanism assembly 54 and the film sticking sucker 443 on the film sticking motion shaft to right above the film peeling platform 50 to adsorb the peeled die-cut film 501, then the die-cut film is moved right above the IC chip strip 10 according to the shooting calculation distance, the film sticking lifting air cylinder 441 descends to move the film sticking sucker 443 to align and stick the adsorbed die-cut film 501 to the joint of the 2 IC chip strips 10, and accurate film sticking is completed.

The strip winding device 6 shown in fig. 6 comprises a winding disc mechanism 60, a rotary damper 61 and a material receiving motor 62, wherein the material receiving disc mechanism 60 comprises 2 tray baffles 601, an inflatable spindle 602, a tray support 603 and a winding roller 604. Firstly, the filmed chip strip 600 passes through the material rolling roller 604 to be pasted on the inflatable main shaft 602, the material rolling roller 604 is connected with the rotary damper 61 and the material receiving motor 62, the material receiving motor 62 is started to drive the material rolling roller 604 to rotate, the chip strip 64 is automatically rolled up, and the IC chip film pasting and material rolling operation is completed.

Claims

1. The utility model provides a full-automatic chip pad pasting coil stock equipment which characterized in that: the utility model provides a full-automatic IC chip pad pasting coil stock equipment, this equipment includes IC chip strip material loading attachment 1, pay-off transmission device 2, material taking manipulator device 3, vision rubberizing device 4, pad pasting device 5, area material coiling mechanism 6, device microscope carrier frame 7.

2. The reclaiming robot apparatus 3 of claim 1, wherein: the mechanical X-axis 31, the mechanical Y-axis 32, the mechanical Z-axis 33, the suction disc fixing plate 34, the 4 cleaning type suction nozzles 35 and the visual positioning CCD lens 36 are assembled, wherein the mechanical X-axis 31, the mechanical Y-axis 32 and the mechanical Z-axis 33 are assembled into the three-axis manipulator 30, the visual positioning CCD lens 36 is installed on the back of the three-axis manipulator 30, the 4 cleaning type suction nozzles 35 are installed on the suction disc fixing plate 34, and the suction disc fixing plate 34 is installed on the mechanical Z-axis 33.

3. The visual tape sticking apparatus 4 according to claim 1, wherein: the film sticking motion shaft 42 is provided with a film sticking vision CCD lens 43 and a film sticking mechanism assembly 44.

4. The film attachment mechanism assembly 44 of claim 4, wherein: comprises the film sticking lifting cylinder 441, a film sticking sucker bracket 442 and a film sticking sucker 443.

5. The strip take-up device 6 according to claim 1, characterized in that: the winding disc mechanism 60 comprises a winding disc mechanism 60, a rotary damper 61 and a material receiving motor 62, wherein the material receiving disc mechanism 60 comprises 2 material disc blocking pieces 601, an inflatable main shaft 602, a material disc support 603 and a material winding roller 604, and the material winding roller 604 is connected with the rotary damper 61 and the material receiving motor 62 in a flush mode.

6. The device stage frame 7 of claim 1, wherein: a feeding device positioning plate 71 is arranged at the feeding end, and is arranged on the right side of a feeding path of the feeding device.