CN111223794A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
CN111223794A
CN111223794A CN201911074538.6A CN201911074538A CN111223794A CN 111223794 A CN111223794 A CN 111223794A CN 201911074538 A CN201911074538 A CN 201911074538A CN 111223794 A CN111223794 A CN 111223794A
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Prior art keywords
substrate
standby
drying
processing
substrates
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CN201911074538.6A
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CN111223794B (en
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铃木启悟
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention provides a substrate processing apparatus and a substrate processing method suitable for simultaneous processing of a plurality of substrates and individual processing of the plurality of substrates. The substrate processing apparatus includes an upstream processing section, a downstream processing section, a first standby section, a second standby section, and a transfer robot. The upstream processing unit sequentially processes a plurality of substrates one by one. The downstream processing unit can simultaneously process the two substrates processed by the upstream processing unit. The first standby unit makes a first substrate, which is a substrate processed by the upstream processing unit, stand by. The second standby unit causes a second substrate, which is a substrate processed by the upstream processing unit and is a substrate next to the first substrate, to be in standby. The transfer robot can take out both the first substrate and the second substrate, only the first substrate, and only the second substrate as transfer targets, and can transfer the transfer targets to a downstream processing section.

Description

Substrate processing apparatus and substrate processing method
Technical Field
The present invention relates to a substrate processing apparatus and a substrate processing method.
Background
A coater/developer (coater/developer) apparatus having a plurality of processing apparatuses is known. For example, in a coater/developer apparatus described in patent document 1, a plurality of substrates taken out from a cassette (cassette) mounted on an indexer (indexer) section are sequentially introduced into a cleaning apparatus, and then sequentially pass through a dehydration baking apparatus, a resist coating apparatus, a pre-baking apparatus, an exposure apparatus, a developing apparatus, and a post-baking apparatus, and are again accommodated in the cassette.
The following two types of processing apparatuses are mixedly present in the coater/developer apparatus. That is, the advection processing apparatus and the variable conveyance type processing apparatus are mixed. In the above-described advection processing apparatus, substrates are carried in one by one. The advection processing apparatus sequentially conveys the substrates in one direction and processes the substrates one by one. The advection processing apparatus is exemplified by a cleaning apparatus and a developing apparatus.
In the variable transfer type processing apparatus, substrates are also carried in one by one. The variable transport type processing apparatus includes: a plurality of processing units, and a substrate conveying member for conveying substrates to the plurality of processing units. The substrate conveying member includes: a hand (hand) for receiving the substrate, and a moving mechanism for moving the hand to each processing unit. The substrate conveying member receives substrates one by one from an upstream apparatus and transfers the substrates to the processing section. The substrate transfer member may transfer substrates between the processing units. The variable transport type processing apparatus is exemplified by a dehydration baking apparatus. The dehydration baking apparatus is provided with a heating section and a cooling section as a plurality of processing sections.
[ Prior art documents ]
[ patent document ]
[ patent document 1] Japanese patent laid-open No. 2015-156426
Disclosure of Invention
[ problems to be solved by the invention ]
However, in each processing unit of such a variable transport type processing apparatus, for example, substrates are transported one by one from an upstream side advection apparatus, and each processing unit processes the substrates one by one. Therefore, there is a problem that the throughput (throughput) of substrate processing is low.
Therefore, it is considered to simultaneously process a plurality of substrates by each processing unit of the variable transport processing apparatus. Thereby improving the productivity of substrate processing.
However, it is not always preferable that each processing unit of the variable transport type processing apparatus simultaneously process a plurality of substrates, and it is also preferable that each processing unit processes one substrate. The following description is briefly made.
For example, in the advection processing apparatus, after processing of a preceding substrate (hereinafter referred to as a preceding substrate) is completed, a substrate (hereinafter referred to as a subsequent substrate) flowing in subsequent to the preceding substrate is processed. Therefore, the preceding substrate needs to wait for the end of the processing of the subsequent substrate, and the state of the preceding substrate may change with time during the standby period of the preceding substrate. Therefore, the states of the preceding substrate and the succeeding substrate may be different from each other at the time point when the processing of the succeeding substrate is finished. When the difference in the state between the preceding substrate and the succeeding substrate becomes large as described above, it is not preferable to wait for the completion of the processing of the succeeding substrate in the advection processing apparatus. Therefore, it is preferable that the preceding substrate and the following substrate are sequentially conveyed to each processing unit of the downstream variable conveyance type processing apparatus, and the preceding substrate and the following substrate are individually processed one by one. Thus, a substrate having no difference in state can be processed.
On the other hand, if the difference is small, it is preferable that each processing section of the downstream variable conveyance type processing apparatus simultaneously processes the preceding substrate and the succeeding substrate. Thereby, productivity can be improved.
However, the difference between these processing methods has not been considered, and a substrate processing apparatus suitable for these two processing methods has not been proposed.
The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing apparatus and a substrate processing method suitable for both simultaneous processing of a plurality of substrates and individual processing of a plurality of substrates.
[ means for solving problems ]
The first aspect of the substrate processing apparatus includes: an upstream processing unit for sequentially processing a plurality of substrates one by one; a downstream processing unit capable of simultaneously processing the two substrates processed by the upstream processing unit; a first standby unit that makes a first substrate, which is a substrate processed by the upstream processing unit, stand by; a second standby unit configured to standby a second substrate that is a substrate processed by the upstream processing unit and is a substrate next to the first substrate; and a transfer robot that can take out, as transfer objects, either one of the first substrate waiting in the first standby section and the second substrate waiting in the second standby section, only the first substrate waiting in the first standby section, and only the second substrate waiting in the second standby section, and can transfer the transfer objects to the downstream processing section.
The second aspect of the substrate processing apparatus is the substrate processing apparatus of the first aspect, wherein the first standby part has a first lifting mechanism that lifts the first substrate, the second standby part has a second lifting mechanism that lifts the second substrate, and the first lifting mechanism and the second lifting mechanism are driven independently of each other.
A third aspect of the substrate processing apparatus is the substrate processing apparatus of the second aspect, wherein the upstream processing portion has a conveying portion that sequentially conveys the plurality of substrates one by one in a conveying direction, the first standby portion is located on a downstream side of the conveying portion in the conveying direction, the second standby portion is located between the conveying portion and the first standby portion in the conveying direction, and has a function of conveying the first substrate from the conveying portion to the first standby portion, the first substrate is lifted by the first lifting mechanism when the first substrate is conveyed from the second standby portion to the first standby portion, and the second substrate is conveyed from the conveying portion to the second standby portion in a state where the first substrate is lifted by the first lifting mechanism.
A fourth aspect of the substrate processing apparatus is the substrate processing apparatus according to any one of the first to third aspects, wherein the downstream processing section has a plurality of drying sections for performing a drying process, the transfer robot transfers the first substrate to one of the plurality of drying sections and transfers the second substrate to another of the plurality of drying sections when a necessary drying time required for drying each of the first substrate and the second substrate is a first time, and the transfer robot receives both the first substrate and the second substrate and transfers the substrates in bulk to one of the plurality of drying sections when the necessary drying time is a second time longer than the first time.
The substrate processing method includes: a first step of sequentially processing a plurality of substrates one by one; a second step of waiting for a first substrate that is a substrate processed in the first step; a third step of waiting for a second substrate, which is a substrate processed in the first step and is a substrate next to the first substrate; a fourth step of taking out a transfer target by a transfer robot capable of taking out both the first substrate and the second substrate, only the first substrate, and only the second substrate as the transfer target; and a fifth step of conveying the conveyance target by the conveyance robot to a downstream processing unit capable of simultaneously processing two substrates.
[ Effect of the invention ]
According to the first aspect of the substrate processing apparatus and the aspect of the substrate processing method, the transfer robot may transfer both the first substrate and the second substrate to the downstream processing section in a batch, or may transfer the first substrate and the second substrate to the downstream processing section individually. When both the first substrate and the second substrate are transported in bulk to the downstream processing unit, the downstream processing apparatus simultaneously processes both the first substrate and the second substrate. Thereby, productivity can be improved. On the other hand, when the first substrate and the second substrate are individually conveyed to the downstream processing unit, the downstream processing unit individually processes the first substrate and the second substrate. Thus, the downstream processing unit can process the first substrate and the second substrate in accordance with the processing conditions for the first substrate and the second substrate, respectively.
According to the second aspect of the substrate processing apparatus, since the first lifting mechanism and the second lifting mechanism are driven independently of each other, it is possible to lift only the first substrate, only the second substrate, and both the first substrate and the second substrate.
According to the third aspect of the substrate processing apparatus, the first substrate can be raised at an earlier timing. Thus, the first substrate can be supported from the transfer section. This reduces the amount of heat that moves between the conveying unit and the substrate. Thus, the difference in temperature state between the first substrate and the second substrate can be reduced.
According to the fourth aspect of the substrate processing apparatus, the upstream processing unit sequentially processes the first substrate and the second substrate one by one, and therefore the end timing of the processing differs between the first substrate and the second substrate. Specifically, the end time of the first substrate is earlier than the end time of the second substrate. Thus, the dry state of the first substrate after the end of the processing on the first substrate and the second substrate is different from the dry state of the second substrate.
When the necessary drying time is short, both the first substrate and the second substrate are easily dried, and the difference in the degree of drying caused by the difference in the end timing of the processing is relatively large. In this case, the transfer robot transfers the first substrate and the second substrate to different drying sections. Thus, the drying process can be performed for a drying time suitable for each of the first substrate and the second substrate.
On the other hand, when the necessary drying time is long, both the first substrate and the second substrate are difficult to dry, and the difference in the degree of drying caused by the difference in the end timing of the processing is relatively small. In this case, the transfer robot transfers the first substrate and the second substrate in a batch to one drying section. This can improve the yield required for drying.
Drawings
Fig. 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus.
Fig. 2 is a functional block diagram schematically showing an example of the configuration of the control unit.
Fig. 3 is a side view schematically showing an example of the configuration of the coating device and the transfer robot.
Fig. 4 is a flowchart showing an example of the operation of the control unit.
Fig. 5 is a side view schematically showing an example of the configuration of the coating apparatus.
Description of the symbols
1: substrate processing apparatus
2. 2A: coating device
3: downstream processing part (decompression drying device)
4. 72: transfer robot
5: handover unit
6: controller
7: heat treatment apparatus
21: substrate introducing part
22: upstream processing unit (processing apparatus main body)
23: base plate standby machine part
31. 31a to 31 c: drying section
41: hand (W.E.)
42: moving mechanism
43: rotating mechanism
44: lifting mechanism
61：CPU
62：ROM
63：RAM
64: storage device
65: bus line
66: input unit
67: display unit
68: communication unit
71: heating unit
211A, 211B, 236A, 236B: rotating shaft
212A, 212B, 237A, 237B, 2211: roller
221: transfer unit
222: floating platform
223: conveying part (substrate conveying part)
224: nozzle with a nozzle body
225. 233: outlet floating platform
231: first standby machine part
232: second standby part
234: first lifting mechanism
235: second lifting mechanism
411: finger-shaped member
412: base end member
2212: inlet floating platform
2213. 2341, 2351: knock pin
2214. 2342, 2352: lifting mechanism
2231: base plate sucking disc part
2232: advancing and retreating mechanism
R1: coating area
S1, S2, S3: step (ii) of
T1: necessary drying time
Tref: reference time
W: substrate
W1: first substrate
W2: second substrate
X, Y, Z: shaft
Detailed Description
A first embodiment.
< 1 > one example of the outline of the overall configuration and overall operation of the substrate processing apparatus
Fig. 1 is a plan view schematically showing an example of the configuration of a substrate processing apparatus 1. In the drawings referred to below, the dimensions and the number of the respective portions are exaggerated or simplified as necessary for easy understanding. In the drawings, an XYZ rectangular coordinate system is shown as appropriate to explain the positional relationship of the respective components. Here, the Z axis is disposed in a posture along the vertical direction, and the X axis and the Y axis are disposed along a horizontal plane. Hereinafter, one side in the X-axis direction is also referred to as + X side, and the other side is also referred to as-X side. The Y-axis and Z-axis are also the same. Hereinafter, the + Z side means the vertical upper side.
The substrate processing apparatus 1 includes a coating apparatus 2, a decompression drying apparatus 3, a transfer robot 4, and a controller 6. In the coating apparatus 2, a substrate W is carried in from the upstream side. The substrate W may be appropriately subjected to a process such as a cleaning process before being carried into the coating apparatus 2. The coating device 2 sequentially conveys a plurality of substrates W one by one in the conveying direction and performs a coating process on the substrates W one by one. Thereby, a coating film is formed on the upper surface of the substrate W. As the coating liquid to be applied to the substrate W, for example, a coating liquid for a photoresist or a coating liquid for an insulating film can be used.
The decompression drying device 3 is provided on the downstream side of the coating device 2, and includes a plurality of drying sections 31. Each of the plurality of drying units 31 can receive N (N is an integer of 2 or more) pieces of substrates W processed by the coating apparatus 2. Hereinafter, a case where two substrates are used as the N substrates W will be described as an example. The drying unit 31 performs a reduced-pressure drying process on the loaded substrate W. That is, when two substrates W are carried into the drying unit 31, the drying unit 31 simultaneously performs the reduced-pressure drying process on the two substrates W. When one substrate W is carried into the drying unit 31, the drying unit 31 performs a reduced-pressure drying process on the one substrate W. By the reduced-pressure drying treatment, the coating film of the substrate W is dried to some extent. The processing periods of the two substrates in the drying section 31 do not need to be completely identical, and at least a part of each processing period may overlap. In short, the term "simultaneously" as used herein means that the respective processing periods do not overlap with each other at all.
The transfer robot 4 can take out two substrates W processed by the coating device 2 in a batch as a transfer target and transfer the transfer target to the drying section 31 in a batch. Hereinafter, a case where two substrates are used as the N substrates W will be described as an example.
The transfer robot 4 may take out the substrates W processed by the coating device 2 one by one as a transfer target, and sequentially transfer the substrates W to the drying sections 31 different from each other. As described in detail later, the number of substrates W conveyed by the conveyance robot 4 is changed depending on the process content (specifically, the type of coating liquid) of the coating apparatus 2.
The transfer robot 4 transfers the substrate W processed by the decompression drying device 3 to the transfer unit 5. The transfer unit 5 is disposed above the drying unit 31 and can receive two substrates W. When two substrates W are simultaneously processed in the drying section 31, the transfer robot 4 takes out the two substrates W from the drying section 31 and transfers the two substrates W in batch to the delivery unit 5. On the other hand, when one substrate W is processed in the drying section 31, the transfer robot 4 takes out the one substrate W and transfers the one substrate W to the transfer unit 5. Further, the transfer robot 4 takes out one substrate W processed by the other drying section 31 and transfers the one substrate W to the transfer unit 5. Thereby, two substrates W are carried into the transfer unit 5.
The two substrates W carried into the delivery unit 5 are taken out in bulk by a conveyance robot 72 provided downstream of the delivery unit 5, and conveyed to the heating unit 71 of the heat treatment apparatus 7 located downstream. The heating unit 71 performs heating processing on two substrates W at the same time. Thereby, the coating films of the two substrates W are almost completely dried.
The control unit 6 controls the processing in each processing apparatus and the conveyance of the substrate W. Fig. 2 is a functional block diagram schematically showing an example of the configuration of the control unit 6. The control Unit 6 is a control circuit, and includes, as shown in fig. 2, a general computer in which a Central Processing Unit (CPU) 61, a Read Only Memory (ROM) 62, a Random Access Memory (RAM) 63, a storage device 64, and the like are connected to each other via a bus (bus line) 65. The ROM 62 stores basic programs and the like, and the RAM 63 is provided as an operation area for the CPU 61 to perform predetermined processing. The storage device 64 includes a nonvolatile storage device such as a flash memory or a hard disk device.
In the control unit 6, an input unit 66, a display unit 67, and a communication unit 68 are also connected to the bus 65. The input unit 66 includes various switches, a touch panel, and the like, and receives various input setting instructions such as a process recipe (recipe) from an operator. The display unit 67 includes a liquid crystal display device, a lamp, and the like, and displays various information based on control by the CPU 61. The communication unit 68 has a data communication function via a Local Area Network (LAN) or the like.
The control unit 6 is connected to the respective robots (the transfer robot 4, the transfer robot 72, and the like) and the respective processing devices as control targets. That is, the controller 6 functions as a conveyance controller that controls conveyance of the substrate W.
The function of the control section 6 can be realized by the CPU 61 executing a program stored in the ROM 62 or the storage device 64. That is, the function of the control unit 6 can be realized by software. Alternatively, a part or all of the functions of the control unit 6 may be realized by hardware including a dedicated logic circuit or the like.
< 1-1. coating apparatus
The coating device 2 includes a substrate introduction portion 21, a processing device main body 22, and a substrate standby portion 23. The substrate introduction portion 21 receives the substrate W. For example, two substrates W are carried in batch into the substrate introduction portion 21. The processing apparatus main body 22 sequentially receives the substrates W conveyed from the substrate introduction section 21 and conveys the substrates W in the conveyance direction. Here, the conveyance direction in the processing apparatus main body 22 is the X-axis direction, the upstream side in the conveyance direction is the-X side, and the downstream side in the conveyance direction is the + X side. The coating device 2 is an upstream processing unit located on the upstream side (on the (-X) side) of the vacuum drying device 3.
The processing apparatus main body 22 sequentially carries the substrates W to the + X side and sequentially applies coating processing to the substrates W one by one. The substrates W after the coating process are sequentially transferred from the processing apparatus main body 22 to the substrate standby portion 23. The substrate standby section 23 sequentially receives the substrates W transferred from the processing apparatus main body 22. The substrate standby unit 23 can standby two substrates W received in sequence. The term "standby" as used herein means that the substrate W is stopped at this position regardless of the length of the standby time of the substrate W. The substrate W standing by in the substrate standby portion 23 is taken out by the transfer robot 4 and transferred to the decompression drying device 3 on the downstream side.
< 1-1-1. substrate introduction part >
Fig. 3 is a side view schematically showing an example of the configuration of the coating device 2 and the transfer robot 4. In the example of fig. 3, the substrate introduction portion 21 includes, for example, a roller conveyor (coro conveyor). The roller conveyor includes a plurality of rotating shafts 211A, a plurality of rotating shafts 211B, a plurality of rollers 212A, and a plurality of rollers 212B. The rotation shaft 211A and the rotation shaft 211B are respectively disposed in a posture in which their central axes are along the Y axis. The plurality of rotary shafts 211A are arranged at intervals in the X-axis direction, and the plurality of rotary shafts 211B are arranged at intervals in the X-axis direction on the downstream side of the plurality of rotary shafts 211A. The rotary shaft 211A and the rotary shaft 211B are provided at substantially the same height position. The rotation shafts 211A and 211B are rotatable about their center axes as rotation axes.
A plurality of rollers 212A are provided on the outer peripheral surface of each rotating shaft 211A, and a plurality of rollers 211B are provided on the outer peripheral surface of each rotating shaft 211B. The rollers 212A and 212B have an annular shape and are disposed in a posture in which the central axis thereof is along the Y axis.
The substrate W is placed on the plurality of rollers 212A and the plurality of rollers 212B. That is, the uppermost portions of the outer circumferential surfaces of the plurality of rollers 212A contact the lower surface of the substrate W, and the uppermost portions of the outer circumferential surfaces of the plurality of rollers 212B contact the lower surface of the substrate W.
The plurality of rotating shafts 211A are driven by a driving unit (not shown) and rotate in the same predetermined direction at substantially the same rotational speed (synchronous rotation). By the rotation, the plurality of rollers 212A also rotate in the same direction at substantially equal rotational speeds. The drive unit has a motor and is controlled by the control unit 6. The rotation of the roller 212A causes the substrate W placed on the roller 212A to be conveyed to the + X side. The plurality of rotating shafts 211B are also driven by a driving unit (not shown) to rotate synchronously. Thereby, the substrate W placed on the roller 212B is conveyed to the + X side. The rotation shaft 211A and the rotation shaft 211B are controlled independently of each other.
One substrate W may be placed on each of the rollers 212A and 212B. For example, two substrates W may be placed on the roller 212A and the roller 212B from an upstream apparatus. In this state, the control unit 6 rotates only the rotation shaft 211B in synchronization. This enables the substrate W on the roller 212B to be conveyed to the processing apparatus main body 22. Subsequently, the control unit 6 rotates both the rotary shaft 211A and the rotary shaft 211B in synchronization. This enables the substrate W on the roller 212A to be conveyed to the processing apparatus main body 22.
< 1-1-2. overview of processing apparatus body
The processing apparatus main body 22 sequentially carries the substrates W and sequentially applies coating processing to the substrates W. In the example of fig. 1 and 3, the processing apparatus main body 22 includes a transfer unit 221, a floating platform 222, a substrate transfer unit 223, and a nozzle 224.
The transfer unit 221 is a unit that transfers the substrate W transferred from the substrate introduction unit 21 to the upper floating platform 222, and is a unit that switches the transfer method. That is, in the substrate introducing section 21, the substrate W is conveyed by the roller conveyance method, and on the other hand, the later-described floating platform 22 conveys the substrate W by the floating conveyance method, and therefore the transfer unit 21 switches the conveyance method between them.
A plurality of outlets from which the gas is ejected are provided on the upper surface of the upper floating platform 222. Thereby, the substrate W is given buoyancy by the gas in the floating platform 222.
The substrate transfer section 223 transfers the substrate W from the transfer unit 221 to the substrate standby section 23 via the floating platform 222 while holding both end portions of the substrate W in the Y axis direction. Since the substrate conveying section 223 holds only both end portions of the substrate W, the substrate W can be deflected near the center thereof. However, the floating platform 222 ejects gas from the ejection port toward the lower surface of the substrate W, thereby imparting buoyancy to the substrate W. This can suppress the deflection of the substrate W. Therefore, the substrate W can pass through the floating platform 222 in a horizontal posture.
The nozzle 224 is disposed in the space above the upper deck 222. The substrate transfer section 223 moves the substrate W to the + X side above the upper stage 222, and thereby the substrate W passes right below the nozzle 224. The nozzle 224 applies the coating liquid to the substrate W directly below. This enables a coating film to be formed on the substrate W. The nozzle 224 may be configured to be movable between a processing position and a standby position. The processing position is a position at which the nozzle 224 discharges the coating liquid onto the substrate W, and the standby position is a position at which the nozzle 224 is caused to stand by. In the standby position, a mechanism for cleaning the nozzle opening of the nozzle 224 or the like may be provided.
The substrate W with the coating film formed thereon is conveyed to the substrate standby portion 23 by the substrate conveying portion 223. The substrate conveying section 223 releases the holding of the substrate W in the substrate standby section 23. Then, the substrate conveying section 223 returns to the transfer unit 221 again to hold the next substrate W.
< 1-1-2-1. transfer unit >
In the example of fig. 3, the transfer unit 221 includes a plurality of rollers 2211, an entrance floating platform 2212, and a plurality of lift pins 2213. The plurality of rollers 2211 have the same configuration as the rollers of the substrate introduction portion 21, and are arranged at intervals in the X-axis direction. The rotation of the roller 2211 is controlled by the control portion 6. The roller 2211 receives the substrate W conveyed from the substrate introduction part 21 and conveys the substrate W to the + X side by its own rotation.
The inlet float platform 2212 is disposed at the more downstream side (+ X side) than the plurality of rollers 2211. A plurality of discharge ports (not shown) are formed on the upper surface of the inlet float 2212. The ejection ports are arranged in a matrix shape, for example, in a plan view (i.e., as viewed along the Z-axis direction). Each of the ejection ports is connected to a gas supply source (not shown) through a gas supply path formed inside the inlet floating platform 2212. The gas from the gas supply source is ejected from the ejection port. This can provide buoyancy to the substrate W on the inlet float table 2212.
The plurality of knock pins 2213 have a rod-like shape extending in the Z-axis direction and are provided so as to be movable up and down. Some of the plurality of knock pins 2213 are provided corresponding to the rollers 2211, and the remaining knock pins 2213 are provided corresponding to the inlet float platforms 2212. Knock pins 2213 corresponding to the rollers 2211 are provided in the gaps between the plurality of rollers 2211. A plurality of through holes are formed in the inlet float 2212 so as not to interfere with any of the plurality of discharge ports. The through hole penetrates the inlet float platform 2212 in the Z-axis direction. The remaining knock pins 2213 are arranged to penetrate through the through holes, respectively. As illustrated in fig. 3, a plurality of knock pins 2213 may be connected to each other at the base end portion on the-Z side.
The knock pin 2213 is lifted and lowered by the lifting mechanism 2214. The lifting mechanism 2214 is, for example, an air cylinder, and is controlled by the control unit 6.
In a state where the knock pin 2213 is lowered, the + Z-side tip portion of the knock pin 2213 is positioned on the-Z side with respect to either the uppermost portion of the outer peripheral surface of the roller 2211 or the upper surface of the inlet float table 2212. In a state where the knock-out pin 2213 is raised, the tip portion is located on the + Z side from either the uppermost portion of the roller 2211 or the upper surface of the inlet lifting flat 2212, and can be brought into contact with the lower surface of the substrate W to lift the substrate W. The substrate W is held by the substrate conveying section 223 in a state of being lifted by the lift pin 2213.
< 1-1-2-2. Floating platform
The upper float platform 222 is disposed at the + X side more than the inlet upper float platform 2212. A plurality of discharge ports (not shown) are also formed on the upper surface of the upper floating platform 222. The ejection ports are arranged in a matrix shape, for example, in a plan view. Each of the discharge ports is connected to a gas supply source via a gas supply path formed inside the floating platform 222. The gas from the gas supply source is ejected from the ejection port.
In addition, a plurality of suction ports may be formed on the upper surface of the upper floating platform 222. The suction ports are formed at a position different from the ejection ports, and are arranged in a matrix, for example. Each suction port is connected to a suction device (for example, a pump) via a gas suction path formed inside the floating platform 222. A part of the gas ejected from the ejection port of the floating platform 222 is sucked from the suction port. Therefore, the buoyancy applied to the substrate W can be more precisely controlled. Further, the deflection of the substrate W can be further reduced.
< 1-1-2-3. substrate conveying part >
In the example of fig. 1, the substrate conveying section 223 includes a substrate chuck section 2231 and an advancing-retreating mechanism 2232. The substrate chuck portions 2231 hold end surfaces of the substrate W on both sides in the Y axis direction. In the example of fig. 1, a pair of substrate chuck portions 2231 are provided on both sides of the substrate W in the Y axis direction. The pair of substrate chuck sections 2231 are provided at intervals in the X-axis direction. Each substrate chuck 2231 has a support portion that supports an end portion of the lower surface of the substrate W in the Y axis direction. An adsorption port is formed in the upper surface of the support portion, for example, and the adsorption port is connected to a suction device (e.g., a pump) via a suction path inside the support portion. The substrate chuck 2231 can hold the substrate W by adsorbing the substrate W by sucking the gas from the adsorption port.
The advancing-retreating mechanism 2232 moves the substrate chuck section 2231 in the X-axis direction. The advancing-retreating mechanism 2232 is, for example, a linear motor. The advancing-retreating mechanism 2232 is controlled by the control unit 6. The advancing/retreating mechanism 2232 moves the substrate chuck section 2231 from the transfer unit 221 to the substrate standby section 23 via the floating platform 222. Thus, the substrate W held by the substrate chuck section 2231 is also moved from the transfer unit 221 to the substrate standby section 23 via the floating platform 222.
< 1-1-2-4. nozzle
The nozzle 224 is disposed in the space above the upper deck 222. At the lower end of the nozzle 224, a nozzle opening corresponding to the coating region R1 of the substrate W is formed. The nozzle 224 is a long nozzle whose nozzle orifice is long in the Y-axis direction. The length of the nozzle (length in the Y-axis direction) substantially coincides with the length of the coating region R1 (length in the Y-axis direction).
The nozzles 224 are each connected to a coating liquid supply source via a coating liquid supply pipe not shown. A pump, not shown, is provided in the middle of the coating liquid supply pipe, and the discharge/stop of the coating liquid from the nozzle 224 is switched by controlling the drive of the pump. The pump is controlled by the control unit 6.
The substrate conveying section 223 moves the substrate W to the + X side, whereby the substrate W passes right under the nozzle 224. The nozzle 224 discharges the coating liquid when the substrate W traverses. Specifically, when the end on the + X side of the coating region R1 of the substrate W is positioned directly below the nozzle 224, the nozzle 224 starts the ejection of the coating liquid, and when the end on the-X side of the coating region R1 is positioned directly below the nozzle 224, the nozzle 224 ends the ejection of the coating liquid. Thereby, the coating liquid is applied to the coating region R1, and a coating film is formed on the coating region R1.
The nozzle 224 may be capable of discharging a plurality of coating liquids onto the substrate W. More specifically, a plurality of nozzles 224 corresponding to a plurality of kinds of coating liquids, respectively, may be provided. As the various coating liquids, for example, a coating liquid for a photoresist and a coating liquid for an insulating film can be used.
< 1-1-3. baseboard standby part
The substrate standby portion 23 sequentially receives the substrates W processed by the processing apparatus main body 22. The substrate standby section 23 can standby two substrates W. The substrate standby part 23 includes a first standby part 231 and a second standby part 232. The first standby unit 231 may standby one substrate W, and the second standby unit 232 may standby one substrate W.
In the example of fig. 1 and 3, the first standby unit 231 and the second standby unit 232 are arranged along the conveying direction (i.e., the X-axis direction) of the processing apparatus main body 22. More specifically, the first standby portion 231 is disposed at the + X side of the processing device main body 22, and the second standby portion 232 is disposed between the processing device main body 22 and the first standby portion 231. The second standby unit 232 also has a function of transferring the substrate W transferred from the processing apparatus main body 22 to the first standby unit 231.
One substrate W (hereinafter referred to as a first substrate W1) processed by the processing apparatus main body 22 is transported to the first standby portion 231 by the substrate transport portion 223 through the second standby portion 232. The first standby unit 231 may standby the first substrate W1. The second substrate W2 processed after the first substrate W1 is relayed by the processing apparatus main body 22 is conveyed to the second standby unit 232 by the substrate conveying unit 223. The second standby unit 232 may standby the second substrate W2.
As a more specific example, the substrate standby part 23 includes an outlet floating platform 233, a first lifting mechanism 234, and a second lifting mechanism 235. The outlet floating platform 233 is disposed on the + X side of the floating platform 222. A plurality of nozzles for ejecting gas are also formed on the upper surface of the outlet float platform 233, similarly to the inlet float platform 2212. The length (length along the X-axis direction) of the outlet floating platform 233 is set to be longer than the sum of the lengths (lengths along the X-axis direction) of the two substrates W.
The first substrate W1 is conveyed to the downstream portion of the outlet float stage 233. The first lifting mechanism 234 lifts the first substrate W1 located at the downstream portion. The first lifting mechanism 234 is controlled by the control unit 6. In the example of fig. 3, the first lifting mechanism 234 includes a plurality of lift pins 2341 and a lifting mechanism 2342. Each of the lift pins 2341 has a rod-like shape and is disposed in an orientation in which the longitudinal direction thereof is along the Z axis. As illustrated in fig. 3, the proximal end portions of the plug 2341 on the-Z side may be coupled to each other. The outlet floating platform 233 has a plurality of through holes extending in the Z-axis direction so as not to interfere with any of the plurality of nozzles. The lift pins 2341 are respectively disposed to penetrate through the through holes of the outlet floating platform 233.
The lifting mechanism 2342 is, for example, an air cylinder, and lifts the plurality of lift pins 2341. The lift mechanism 2342 is controlled by the control unit 6. In a state where the top pin 2341 is lowered, the tip end portion of the top pin 2341 is positioned on the-Z side with respect to the upper surface of the outlet float plate 233. On the other hand, in the state where the lift pin 2341 is raised, the tip of the lift pin 2341 is positioned on the + Z side with respect to the upper surface of the outlet float plate 233. In a state where the suction of the first substrate W1 by the substrate chuck section 2231 is released, the lift mechanism 2342 raises the lift pin 2341. By the rise, the tip end portion of the lift pin 2341 may contact the lower surface of the first substrate W1 to lift the first substrate W1. The lift pins 2341 raise the first substrate W1 to a height at which the gas ejected from the outlet float table 233 does not substantially reach. Thereby, the first substrate W1 is supported by the lift pins 2341.
In the example of fig. 3, the first standby portion 231, which makes the first substrate W1 stand by, includes a downstream portion of the outlet float stage 233 and the first lift mechanism 234.
The second substrate W2 processed subsequent to the first substrate W1 is conveyed to the upstream portion of the outlet float stage 233. The upstream portion of the outlet float stage 233 is located on the-X side with respect to the downstream portion. The second lifting mechanism 235 lifts the second substrate W2 located at the upstream portion. The second lifting mechanism 235 is controlled by the control unit 6 independently of the first lifting mechanism 234. In the example of fig. 3, the second lifting mechanism 235 includes a plurality of lift pins 2351 and a lifting mechanism 2352. The lift pin 2351 and the lifting mechanism 2352 are the same as the lift pin 2341 and the lifting mechanism 2342, respectively, and thus detailed description thereof is omitted.
In the same manner as the lifting mechanism 2342, the lifting mechanism 2352 raises the lift pin 2351 in a state where the suction of the second substrate W2 by the substrate suction disc part 2231 is released. By the rise, the tip end portion of the lift pin 2351 may contact with the lower surface of the second substrate W2 to lift the second substrate W2. The second substrate W2 is supported by the lift pins 2351.
In the example of fig. 3, the second standby unit 232 that causes the second substrate W2 to stand by includes an upstream portion of the outlet float stage 233 and the second lift mechanism 235.
As described above, since the first lifting mechanism 234 and the second lifting mechanism 235 are driven independently of each other, only the first substrate W1 may be lifted, only the second substrate W2 may be lifted, and both the first substrate W1 and the second substrate W2 may be lifted.
The first substrate W1 and the second substrate W2 are respectively taken out by the transfer robot 4 in a state of being supported by the lift pins 2341 and 2351.
< 1-2. transfer robot
In the example of fig. 3, the transfer robot 4 is located on the + X side of the board standby portion 23. The transfer robot 4 can take out both the first substrate W1 and the second substrate W2 from the substrate standby portion 23 in batch. The transfer robot 4 may take out the first substrate W1 and the second substrate W2 from the standby space 23 individually.
In the example of fig. 1 and 3, the transfer robot 4 includes a hand 41, a moving mechanism 42, a rotating mechanism 43, and an elevating mechanism 44. The hand 41 has a size enough to place two substrates W in a state of being aligned in the X-axis direction. For example, the hand 41 includes a plurality of finger members 411 and a base end member 412 that links the base ends of the finger members 411. The finger members 411 have an elongated shape, and a substrate W is placed on the upper surface thereof. Two substrates W are arranged and mounted along the longitudinal direction of the finger members 411. Therefore, the length of the finger members 411 in the longitudinal direction is set according to the length of the substrate W corresponding to two sheets and the interval between the substrates W.
The moving mechanism 42 can move the hand 41 in the horizontal direction. For example, the moving mechanism 42 includes a pair of arms (not shown). Each arm has a plurality of elongated coupling members, the ends of which are rotatably coupled to each other. One end of each arm is connected to the hand 41 (specifically, the base end member 412), and the other end is connected to the rotating mechanism 43. By controlling the connection angle of the connection member, the hand 41 can be moved in the horizontal direction. The rotation mechanism 43 can rotate the other end of the arm of the movement mechanism 42 about a rotation axis along the Z-axis direction. Thereby, the hand 41 moves along the circular arc. By the movement, the direction of the hand 41 can be changed. The rotation mechanism 43 includes a motor, for example. The lifting mechanism 44 lifts and lowers the rotation mechanism 43 in the Z-axis direction, thereby lifting and lowering the hand 41. The lifting mechanism 44 includes, for example, a ball screw (ball screw) mechanism. The moving mechanism 42, the rotating mechanism 43, and the lifting mechanism 44 are controlled by the control unit 6.
The transfer robot 4 can move the hand 41 to the substrate standby portion 23, the drying portion 31, and the delivery unit 5 by appropriately moving and rotating the hand 41.
For example, the transfer robot 4 drives the rotation mechanism 43 to make the hand 41 face the board standby portion 23. Next, the transfer robot 4 drives the elevating mechanism 44 to position the hand 41 on the-Z side with respect to the first substrate W1 and the second substrate W2. Next, the transfer robot 4 drives the moving mechanism 42 to move the hand 41 to the-X side, and causes the hand 41 to face both the first substrate W1 and the second substrate W2 in the Z-axis direction. Next, the transport robot 4 drives the lifting mechanism 44 to lift the hand 41. Thus, the transfer robot 4 can receive both the first substrate W1 and the second substrate W2 from the substrate standby unit 23.
The transfer robot 4 can transfer the first substrate W1 and the second substrate W2 to the drying unit 31 in a batch manner by appropriately rotating and moving the hand 41. Specifically, the transfer robot 4 drives the rotation mechanism 43 to make the hand 41 face the drying unit 31. Next, the transfer robot 4 drives the lifting mechanism 44 to make the hand 41 face the flap of the drying section 31. Next, the transfer robot 4 drives the moving mechanism 42 to cause the hand 41 to enter the drying section 31 through the shutter, and causes the first substrate W1 and the second substrate W2 to face the substrate holding section in the Z-axis direction. Next, the transfer robot 4 drives the elevating mechanism 44 to lower the hand 41, and delivers the first substrate W1 and the second substrate W2 to the substrate holding unit. Next, the transfer robot 4 drives the moving mechanism 42 to retract the hand 41 from the inside of the drying unit 31.
The transfer robot 4 may take out the first substrate W1 and the second substrate W2 individually. However, in order to take out the first and second substrates W1 and W2 in bulk, both the first and second substrates W1 and W2 need to be on standby in the substrate standby portion 23. That is, after the first substrate W1 is transferred to the standby space 23, it is necessary to wait for the next second substrate W2 to be transferred to the standby space 23. In contrast, when the first substrate W1 and the second substrate W2 are taken out individually, the first substrate W1 can be taken out from the standby space 23 even in a state where the second substrate W2 has not been conveyed to the standby space 23. Therefore, the transfer robot 4 can take out the first substrate W1 from the substrate standby portion 23 without waiting for the second substrate W2 when performing individual transfer.
The transfer robot 4 can take out only the first substrate W1 from the substrate standby portion 23. As a specific example, the transfer robot 4 performs the takeout operation in a state where the second substrate W2 is not transferred to the substrate standby portion 23 (i.e., in a state where the second substrate W2 is processed in the processing apparatus main body 22). That is, the transfer robot 4 moves the hand 41 toward the substrate standby portion 23 by the rotation of the rotation mechanism 43, and then moves the hand 41 toward the-Z side with respect to the first substrate W1 by the vertical movement of the vertical movement mechanism 44. Then, the transfer robot 4 drives the moving mechanism 42 to move the hand 41 to the-X side, and causes the tip end side portion of the hand 41 to face only the first substrate W1. Then, the transfer robot 4 raises the hand 41. Thus, the transfer robot 4 can receive only the first substrate W1 from the substrate standby unit 23. The transfer robot 4 transfers only the first substrate W1 to the drying unit 31.
In addition, in a state where the first substrate W1 has been taken out, the transfer robot 4 may take out only the second substrate W2 from the substrate standby portion 23 as follows. That is, the transfer robot 4 moves the hand 41 toward the substrate standby portion 23 by the rotation of the rotation mechanism 43, and then moves the hand 41 toward the-Z side with respect to the second substrate W2 by the vertical movement of the vertical movement mechanism 44. Then, the transfer robot 4 drives the moving mechanism 42 to make the hand 41 face the second substrate W2. Then, the transport robot 4 drives the lifting mechanism 44 to lift the hand 41. Thus, the transfer robot 4 can receive only the second substrate. The transfer robot 4 transfers only the second substrate W2 to the drying unit 31.
As described above, the transfer robot 4 can sequentially take out the substrates W sequentially transferred to the substrate standby portion 23 one by one and sequentially transfer the substrates W to the drying portion 31. In addition, in such individual conveyance, the first substrate W1 is already taken out when the second substrate W2 is conveyed to the substrate standby portion 23, and therefore the second substrate W2 can also be conveyed to the first standby portion 231.
The method for determining the number of substrates W taken out of the substrate standby portion 23 by the transfer robot 4 will be described in detail later.
< 1-3. vacuum drying apparatus
The drying unit 31 of the vacuum drying apparatus 3 can perform vacuum drying processing on the two substrates W in a batch. The reduced-pressure drying device 3 is a downstream processing unit located on the downstream side (+ X side) of the coating device 2.
As the plurality of drying sections 31, for example, three drying sections 31a to 31c are provided. In the example of fig. 1, two drying units 31 are provided around the transfer robot 4 in a plan view. For example, the drying section 31a is provided on the + Y side with respect to the transfer robot 4, and the drying section 31c is provided on the + X side with respect to the transfer robot 4. The drying unit 31b is provided on the + Z side with respect to the drying unit 31 a. That is, the drying section 31b is stacked on the + Z side of the drying section 31 a.
The drying unit 31 includes a chamber, a substrate holding unit, and a decompression mechanism, which are not shown. The chamber forms an enclosed space. A baffle (not shown) for carrying in and out the substrate W is provided on a side surface of the chamber facing the transfer robot 4. By closing the shutter, the chamber forms a closed space. By opening the shutter, the transfer robot 4 can transfer the substrate W to and from the substrate holding portion in the chamber. The substrate holding portion can hold two substrates W in a horizontally aligned state. The transfer robot 4 may transfer two substrates W in a batch to the substrate holding portion, or may transfer one substrate W to the substrate holding portion. The pressure reducing mechanism sucks the gas in the chamber to reduce the pressure in the chamber. Specifically, for example, the pressure in the chamber is reduced to the vaporization pressure of the solvent of the coating liquid. This evaporates the solvent of the coating film on the substrate W, and the coating film on the substrate W can be appropriately dried. Namely, the drying treatment under reduced pressure was performed.
< 1-4. Cross-connect Unit >
The transfer unit 5 is a unit that transfers the substrate W between the vacuum drying apparatus 3 and the heat treatment apparatus 7. For example, the delivery unit 5 is located between the transfer robot 4 and the heat treatment apparatus 7. As a more specific example, the passing unit 5 may be provided on the + Z side of the drying section 31 c. That is, the delivery unit 5 may be stacked on the + Z side of the drying unit 31 c.
The transfer unit 5 includes a substrate holding unit that holds two substrates W in a horizontally aligned state. The transfer robot 4 may transfer the two substrates W to the substrate holding portion in a batch, or may transfer the substrates W to the substrate holding portion one by one to hold the two substrates W in the substrate holding portion. For example, the transfer robot 4 transfers the first substrate W1 to the inner portion of the substrate holder as viewed from the transfer robot 4, and transfers the second substrate W2 to the front portion of the substrate holder. Thus, the first substrate W1 and the second substrate W2 are placed on the substrate holding portion.
< 2. Heat treatment apparatus
In the example of fig. 1, a heat treatment device 7 is also shown. The heat treatment apparatus 7 includes a heating unit 71 and a transfer robot 72. The transfer robot 72 has the same configuration as the transfer robot 4, and takes out both the first substrate W1 and the second substrate W2 from the transfer unit 5 in bulk. The transfer robot 72 transfers the first substrate W1 and the second substrate W2 to the heating unit 71 in bulk.
The heating units 71 each include a substrate holding portion and a heater, not shown. The substrate holding portions may hold both the first substrate W1 and the second substrate W2 in a horizontally aligned state. The heater applies heat to the first and second substrates W1 and W2. Thereby, the coating films on the first and second substrates W1 and W2 were almost completely dried.
When a coating liquid for a photoresist is used as the coating liquid to be applied from the processing apparatus main body 22, a so-called prebaking process before the exposure process can be performed by heating with the heating unit 71.
< 3. actions of transfer robot
As described above, the processing apparatus main body 22 (upstream processing unit) sequentially performs the coating process on the substrates W one by one while conveying the substrates W. That is, after the coating process on the first substrate W1 is completed, the coating process is performed on the second substrate W2 following the first substrate W1. Since the substrate W after the coating process is naturally dried with the lapse of time, the dried state of the first substrate W1 in which the coating process is completed first may be different from the dried state of the second substrate W2 in which the coating process is completed later. The degree of the difference in the dry state depends on, for example, the thickness (film thickness) of the coating film formed on the substrate.
For example, when a photoresist solution for forming an etching-resistant film is applied as a coating solution (hereinafter referred to as a first coating solution), the film thickness of the coating film is relatively thin. When the film thickness is small, the amount of solvent contained in the coating film is small. As a result, the necessary drying time required for drying is relatively short. That is, the first coating liquid is dried at a relatively high speed. In this case, the difference in the dry state of the two substrates W due to the difference in the natural drying time is relatively large. Therefore, it is desirable to perform the vacuum drying process on the first substrate W1 and the second substrate W2 for separate drying times.
On the other hand, for example, when a polyimide-based or acrylic-based coating liquid (hereinafter referred to as a second coating liquid) for forming an insulating film is applied, the film thickness of the coating film is made relatively thick (for example, a film thickness corresponding to a multiple of the film thickness of the photoresist liquid). When the film thickness is large, the amount of solvent contained in the coating film increases. As a result, the second coating liquid is dried at a relatively slow speed. In this case, the difference in the dry state of the two substrates W caused by the difference in the natural drying time is small.
Therefore, the transfer robot 4 switches the transfer method according to the necessary drying time required for drying the substrate W. Specifically, when the necessary drying time required for drying the substrate W is the first time, the transfer robot 4 transfers the first substrate W1 to one of the drying sections 31 and transfers the second substrate W2 to the other drying section 31 of the drying sections 31. Thus, the first substrate W1 and the second substrate W2 can be dried under reduced pressure for a suitable drying time.
On the other hand, when the necessary drying time is the second time longer than the first time, the transfer robot 4 receives both the first substrate W1 and the second substrate W2 and transfers the substrates in bulk to one of the drying sections 31 of the plurality of drying sections 31. Thereby, productivity can be improved.
Since the necessary drying time depends on, for example, the film thickness of the coating film, the transfer robot 4 can be said to switch the transfer method according to the film thickness of the coating film. That is, when the nozzle 224 of the processing apparatus main body 22 ejects the first coating liquid onto the substrate W to form a relatively thin coating film, the transfer robot 4 takes out the first substrate W1 and the second substrate W2 from the substrate standby portion 23 individually. More specifically, the transfer robot 4 takes out only the first substrate W1 from the substrate standby portion 23 and transfers the first substrate W1 to, for example, the drying portion 31a without waiting for the second substrate W2 to be transferred to the substrate standby portion 23. The drying unit 31a performs the reduced-pressure drying process on the first substrate W1 for a predetermined first drying time. When the second substrate W2 is transferred to the standby space 23, the transfer robot 4 takes out only the second substrate W2 from the standby space 23 and transfers the second substrate W2 to the drying section 31b different from the first substrate W1. The drying unit 31b performs the reduced-pressure drying process on the second substrate W2 for a predetermined second drying time.
When the reduced-pressure drying process performed by the drying section 31a is completed, the transfer robot 4 takes out the first substrate W1 from the drying section 31a and transfers it to the transfer unit 5, and when the reduced-pressure drying process performed by the drying section 31b is completed, the transfer robot 4 takes out the second substrate W2 from the drying section 31b and transfers it to the transfer unit 5.
As described above, the first substrate W1 and the second substrate W2, which may have a large difference in dry state due to natural drying, are individually conveyed without being conveyed at the same time. In the individual conveyance, the first substrate W1 is taken out without waiting for the second substrate W2 after the individual conveyance, and therefore the difference in the dry state between the first substrate W1 and the second substrate W2 at each taking-out time is small. Then, the drying units 31a and 31b perform the vacuum drying process on the first substrate W1 and the second substrate W2 for a first drying time and a second drying time, respectively, which are substantially equal to each other. The first drying time and the second drying time are, for example, predetermined and are, for example, 40 seconds. Since the difference between the dry state of the first substrate W1 immediately before being conveyed to the drying section 31a and the dry state of the second substrate W2 immediately before being conveyed to the drying section 31b is small, the difference between the dry states of the first substrate W1 and the second substrate W2 after the reduced-pressure drying process is also small.
On the other hand, when the nozzle 224 of the processing apparatus main body 22 discharges the second coating liquid to form a relatively thick coating film, the transfer robot 4 takes out both the first substrate W1 and the second substrate W2 in batch. The transfer robot 4 transfers both the first substrate W1 and the second substrate W2 to the drying unit 31 (for example, the drying unit 31a) in a batch. The drying unit 31a performs a vacuum drying process on both the first substrate W1 and the second substrate W2 in a batch for a predetermined drying time (for example, 80 seconds). The drying time is also preset, for example. In this way, the transfer robot 4 can transfer both the first substrate W1 and the second substrate W2 to the drying unit 31 in a batch without fear of a difference in the dry state due to natural drying becoming large.
More specifically, the difference in the standby time between the first substrate W1 and the second substrate W2, i.e., the difference in the natural drying state, is assumed to be 5 seconds. When the first coating liquid was discharged onto the substrate W to form a relatively thin coating film, the first substrate W1 and the second substrate W2 were dried under reduced pressure for 40 seconds, respectively, as described above. In this case, when the first substrate W1 and the second substrate W2 were dried under reduced pressure simultaneously in a batch, two substrates having a difference of 5 seconds in the natural dry state were dried under reduced pressure simultaneously. Since the time difference (5 seconds) between the natural drying and the reduced-pressure drying time (40 seconds) is relatively large, the state of the coating film on the first substrate W1 after the reduced-pressure drying treatment may be different from the state of the coating film on the second substrate W2. Therefore, as described above, the first and second substrates W1 and W2 are conveyed to the drying section 31a and the drying section 31b one by one, respectively, and the reduced-pressure drying process is performed so that the difference in standby time between the first and second substrates W1 and W2 (time difference in the natural drying state) does not occur.
When the first coating liquid was discharged onto the substrate W to form a relatively thick coating film, the first substrate W1 and the second substrate W2 were simultaneously dried under reduced pressure for 80 seconds, respectively, as described above. Even when the first substrate W1 and the second substrate W2 are dried under reduced pressure in batch and at the same time, the time difference (5 seconds) between natural drying and the reduced-pressure drying time (80 seconds) is relatively small, and thus the state of the coating film on the first substrate W1 and the state of the coating film on the second substrate W2 after the reduced-pressure drying process do not differ to such an extent that a problem in terms of process is not caused.
When the reduced-pressure drying process performed in the drying section 31a is completed, the transfer robot 4 takes out both the first substrate W1 and the second substrate W2 from the drying section 31a in a batch and transfers them to the transfer unit 5.
Thus, the first substrate W1 and the second substrate W2 can be dried in a batch. Thereby, productivity can be improved.
When the coating device 2 (the processing device main body 22) applies one kind of coating liquid, the transfer robot 4 adopts one transfer method corresponding to the kind (film thickness) of the coating liquid. According to the substrate processing apparatus 1 of the present embodiment, the transfer robot 4 can switch the transfer method, and therefore, as the coating apparatus 2, a coating apparatus that applies the first coating liquid or a coating apparatus that applies the second coating liquid can be used. In other words, the substrate processing apparatus 1 can be applied to either a system of the coating apparatus 2 that needs to apply the first coating liquid or a system of the coating apparatus 2 that needs to apply the second coating liquid. That is, the substrate processing apparatus 1 is suitable for both simultaneous processing of a plurality of substrates W and individual processing of a plurality of substrates W.
On the other hand, the coating apparatus 2 may selectively coat the first coating liquid and the second coating liquid according to the substrate W. In this case, the information (film thickness information) about the type of the coating liquid to be applied in the coating apparatus 2 may be notified to the control section 6 from an apparatus on the upstream side of the substrate processing apparatus 1, or may be input by an operator. The control unit 6 switches the conveying method by the conveying robot 4 as described above according to the type of the coating liquid.
Fig. 4 is a flowchart showing an example of the determination operation of the conveying method when the control unit 6 switches the conveying method. For example, the flowchart of fig. 4 may be executed each time the substrate W is loaded into the substrate processing apparatus 1. First, in step S1, the controller 6 determines whether or not the necessary drying time T1 required to dry the substrate W is equal to or less than the reference time Tref. Information indicating the necessary drying time T1 is input to the control unit 6 by an apparatus or an operator on the upstream side of the substrate processing apparatus 1. The reference time Tref is set in advance, for example, and is stored in the storage device 64 or the like, for example.
When determining that the necessary drying time T1 is equal to or less than the reference time Tref, the controller 6 adopts the following conveying method (individual conveyance) in step S2: the first substrate W1 and the second substrate W2 are taken out from the substrate standby portion 23 individually, and the first substrate W1 and the second substrate W2 are conveyed to mutually different drying portions 31 one by one.
On the other hand, when determining that the necessary drying time T1 is longer than the reference time Tref, the control unit 6 adopts the following conveying method (simultaneous conveyance) in step S3: the first and second substrates W1 and W2 are taken out in bulk from the substrate standby section 23, and the first and second substrates W1 and W2 are conveyed in bulk to one drying section 31.
< 4. Standby >
In the above example, when the first substrate W1 is conveyed to the first standby portion 231, the first lifting mechanism 234 lifts the first substrate W1. Therefore, in the simultaneous conveyance, the second substrate W2 is conveyed from the substrate conveying section 223 to the second standby section 232 in a state where the first lifting mechanism 234 lifts the first substrate W1. In other words, the first substrate W1 waits for the second substrate W2 or the transfer robot 4 while being supported by the lift pins 2341.
For comparison, consider a case where the first substrate W1 is on standby on the outlet float stage 233. For example, the first substrate W1 may be caused to stand by on the outlet floating platform 233 in a state where the gas ejection from the downstream portion of the outlet floating platform 233 is stopped. In this case, the contact area between the lower surface of the first substrate W1 and the upper surface of the outlet float stage 233 is large. Therefore, the amount of heat transferred between the first substrate W1 and its support (outlet float stage 233) is relatively large.
Alternatively, the first substrate W1 may be kept on standby by a predetermined chuck mechanism while being ejected by the gas from the outlet floating platform 233. In this case, the gas flow is generated at the lower surface of the first substrate W1, and thus the amount of heat moving between the first substrate W1 and the gas flow is relatively large.
In contrast, when the first substrate W1 is supported by the top pins 2341, the contact area between the first substrate W1 and the top pins 2341 is small. Accordingly, the amount of heat transferred between the first substrate W1 and the support (the lift pins 2341) is relatively small. The first substrate W1 may be on standby at a position where the gas does not reach the lower surface of the first substrate W1. This reduces the amount of heat transferred between the first substrate W1 and the gas. Therefore, the influence of the support and the gas on the temperature state (i.e., the dry state) of the first substrate W1 can be reduced. In other words, the difference in the dry state between the first substrate W1 and the second substrate W2 during simultaneous conveyance can be reduced.
A second embodiment.
An example of the configuration of the substrate processing apparatus 1 according to the second embodiment is the same as that of the first embodiment. However, the substrate processing apparatus 1 according to the second embodiment includes a coating apparatus 2A instead of the coating apparatus 2.
Fig. 5 is a side view showing an example of the configuration of the coating device 2A. The coating device 2A has the same configuration as the coating device 2 except for the configuration of the processing device main body 22 and the configuration of the substrate standby portion 23. In comparison with the processing apparatus body 22 of fig. 3, the processing apparatus body 22 of the coating apparatus 2A further includes an outlet float platform 225. The outlet float platform 225 has the same configuration as the outlet float platform 233.
The substrate standby portion 23 is, for example, a roller conveyor, and includes a plurality of rotating shafts 236A, a plurality of rotating shafts 236B, a plurality of rollers 237A, and a plurality of rollers 237B. The substrate standby portion 23 has the same configuration as the substrate introduction portion 21. Here, since the substrate W is taken out by the transfer robot 4, the substrate standby portion 23 is configured not to interfere with the hand 41 of the transfer robot 4. In the substrate standby portion 23, the rotation shaft 236B and the roller 237B constitute the first standby portion 231, and the rotation shaft 236A and the roller 237A constitute the second standby portion 232.
The first substrate processed by the processing apparatus main body 22 is transferred from the outlet floating platform 225 to the first standby portion 231 via the second standby portion 232. The first substrate W1 stands by on the roller 237B. The second substrate W2 processed by the processing apparatus main body 22 is transported from the outlet float table 225 to the second standby unit 232. The second substrate W2 stands by on the roller 237A.
As in the first embodiment, the transfer robot 4 may take out both the first substrate W1 and the second substrate W2 from the substrate standby portion 23 in batch, and may take out the first substrate W1 and the second substrate W2 individually.
In the second embodiment, as in the first embodiment, a first lifting mechanism 234 and a second lifting mechanism 235 may be provided.
While the embodiments of the substrate transfer apparatus and the substrate transfer method have been described above, various modifications may be made in addition to those described above without departing from the spirit of the embodiments. The various embodiments and modifications can be implemented in appropriate combinations.
For example, the conveyance method may be changed according to the type of the coating liquid, instead of changing the conveyance method according to the difference in film thickness. For example, in the case of a coating liquid containing a highly volatile solvent, the reduced-pressure drying time is relatively short. In this case, the time difference in the natural drying state greatly affects the reduced pressure drying. Therefore, the substrate is preferably conveyed one by one to a vacuum drying apparatus. On the contrary, in the case of a coating liquid containing a solvent having low volatility, the reduced-pressure drying time is relatively long. In this case, the time difference in the natural drying state has little influence on the reduced pressure drying. Therefore, it is preferable to transport a plurality of substrates in a batch to a vacuum drying apparatus to improve productivity.
In order to perform the reduced pressure drying, one drying section may be provided instead of a plurality of drying sections. When the time interval between a plurality of substrates carried out from the coating apparatus is long, even one drying section is empty when the reduced pressure drying process of the preceding substrate is completed, and therefore the substrates can be carried in one by one.
For example, the substrate processing apparatus 1 may be provided with a registration mechanism for adjusting the positions and postures of the first substrate W1 and the second substrate W2. The alignment mechanism may be provided in at least any one of the substrate standby unit 23, the decompression drying device 3, and the transfer unit 5, for example. As the alignment mechanism, for example, a gap adjusting portion and an alignment portion disclosed in japanese patent laid-open publication No. 2018-160586 can be used.

Claims (5)

1. A substrate processing apparatus, comprising:
an upstream processing unit for sequentially processing a plurality of substrates one by one;
a downstream processing unit capable of simultaneously processing the two substrates processed by the upstream processing unit;
a first standby unit that makes a first substrate, which is a substrate processed by the upstream processing unit, stand by;
a second standby unit configured to standby a second substrate that is a substrate processed by the upstream processing unit and is a substrate next to the first substrate; and
and a transfer robot configured to take out, as transfer objects, either one of the first substrate waiting in the first standby section and the second substrate waiting in the second standby section, only the first substrate waiting in the first standby section, and only the second substrate waiting in the second standby section, and transfer the transfer objects to the downstream processing section.
2. The substrate processing apparatus of claim 1, wherein
The first standby part has a first lifting mechanism for lifting the first substrate,
the second standby unit has a second lifting mechanism for lifting the second substrate,
the first lifting mechanism and the second lifting mechanism are driven independently of each other.
3. The substrate processing apparatus of claim 2, wherein
The upstream processing section has a conveying section for sequentially conveying the plurality of substrates one by one along a conveying direction,
the first standby part is located on a downstream side of the conveying part in the conveying direction,
the second standby portion is located between the conveying portion and the first standby portion in the conveying direction, and also has a function of conveying the first substrate from the conveying portion to the first standby portion,
when the first substrate is conveyed from the second standby portion to the first standby portion, the first lifting mechanism lifts the first substrate,
the second substrate is conveyed from the conveying section to the second standby section in a state where the first substrate is lifted by the first lifting mechanism.
4. The substrate processing apparatus according to any one of claims 1 to 3,
the downstream processing section has a plurality of drying sections for performing drying processing,
the transfer robot transfers the first substrate to one of the plurality of drying units and transfers the second substrate to another one of the plurality of drying units when a necessary drying time required for drying each of the first substrate and the second substrate is a first time,
when the necessary drying time is a second time longer than the first time, the transfer robot receives both the first substrate and the second substrate and transfers the substrates in bulk to one of the plurality of drying sections.
5. A method of processing a substrate, comprising:
a first step of sequentially processing a plurality of substrates one by one;
a second step of waiting for a first substrate that is a substrate processed in the first step;
a third step of waiting for a second substrate, which is a substrate processed in the first step and is a substrate next to the first substrate;
a fourth step of taking out a transfer target by a transfer robot capable of taking out both the first substrate and the second substrate, only the first substrate, and only the second substrate as the transfer target; and
and a fifth step of conveying the conveyance target by the conveyance robot to a downstream processing unit capable of simultaneously processing two substrates.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114256093A (en) * 2020-09-23 2022-03-29 株式会社斯库林集团 Substrate processing apparatus and substrate processing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022178486A (en) * 2021-05-20 2022-12-02 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002263548A (en) * 2001-03-12 2002-09-17 Tokyo Ohka Kogyo Co Ltd Coating forming apparatus and coating forming method
JP2003051434A (en) * 2001-08-07 2003-02-21 Dainippon Screen Mfg Co Ltd Schedule creating method for sub substrate processing apparatus, and program therefor
JP2009239000A (en) * 2008-03-27 2009-10-15 Dainippon Screen Mfg Co Ltd Substrate treatment system
CN102074456A (en) * 2009-10-16 2011-05-25 东京毅力科创株式会社 Decompression drying apparatus
CN104617012A (en) * 2013-11-05 2015-05-13 株式会社荏原制作所 Substrate processing apparatus
CN104662640A (en) * 2012-09-21 2015-05-27 斯克林集团公司 Schedule creation apparatus, schedule creation program, schedule creation method, substrate processing apparatus, and substrate processing method
US20170287742A1 (en) * 2016-03-31 2017-10-05 Tokyo Electron Limited Substrate processing apparatus
CN108630565A (en) * 2017-03-23 2018-10-09 株式会社斯库林集团 Base plate processing system and substrate processing method using same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI261875B (en) * 2002-01-30 2006-09-11 Tokyo Electron Ltd Processing apparatus and substrate processing method
JP4397646B2 (en) * 2003-07-30 2010-01-13 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
JP4908771B2 (en) * 2005-04-27 2012-04-04 東京エレクトロン株式会社 Processing device system
JP5161335B2 (en) * 2011-04-06 2013-03-13 中外炉工業株式会社 Substrate transport apparatus and substrate processing apparatus provided with the same
JP6279343B2 (en) 2014-02-20 2018-02-14 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus, program, and substrate processing method
JP6792368B2 (en) * 2016-07-25 2020-11-25 株式会社Ｓｃｒｅｅｎホールディングス Heat treatment equipment, substrate processing equipment and heat treatment method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002263548A (en) * 2001-03-12 2002-09-17 Tokyo Ohka Kogyo Co Ltd Coating forming apparatus and coating forming method
JP2003051434A (en) * 2001-08-07 2003-02-21 Dainippon Screen Mfg Co Ltd Schedule creating method for sub substrate processing apparatus, and program therefor
JP2009239000A (en) * 2008-03-27 2009-10-15 Dainippon Screen Mfg Co Ltd Substrate treatment system
CN102074456A (en) * 2009-10-16 2011-05-25 东京毅力科创株式会社 Decompression drying apparatus
CN104662640A (en) * 2012-09-21 2015-05-27 斯克林集团公司 Schedule creation apparatus, schedule creation program, schedule creation method, substrate processing apparatus, and substrate processing method
CN104617012A (en) * 2013-11-05 2015-05-13 株式会社荏原制作所 Substrate processing apparatus
US20170287742A1 (en) * 2016-03-31 2017-10-05 Tokyo Electron Limited Substrate processing apparatus
CN108630565A (en) * 2017-03-23 2018-10-09 株式会社斯库林集团 Base plate processing system and substrate processing method using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114256093A (en) * 2020-09-23 2022-03-29 株式会社斯库林集团 Substrate processing apparatus and substrate processing method
CN114256093B (en) * 2020-09-23 2024-03-01 株式会社斯库林集团 Substrate processing apparatus and substrate processing method

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