CN111212527A - Through hole filling and plating method applied to optical module high-density interconnection HDI board - Google Patents
Through hole filling and plating method applied to optical module high-density interconnection HDI board Download PDFInfo
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- CN111212527A CN111212527A CN202010040136.0A CN202010040136A CN111212527A CN 111212527 A CN111212527 A CN 111212527A CN 202010040136 A CN202010040136 A CN 202010040136A CN 111212527 A CN111212527 A CN 111212527A
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- hole
- filling
- circuit board
- hdi
- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a through hole filling and plating method applied to an HDI board of an optical module high-density interconnection, which comprises the steps of copper reduction, positive and negative drilling, trepanning and drilling, glue removal and copper deposition, first exposure and development, through hole electroplating, film stripping, board grinding, second exposure and development and hole filling electroplating which are sequentially carried out. According to the through hole filling and plating method applied to the optical module high-density interconnection HDI board, the cross section of the through hole is in the shape of a step with a small middle part and two large ends by drilling twice, and the two filling steps of the middle part and the two ends of the through hole are matched respectively, so that the through hole is filled and plated step by step, the core-spun phenomenon of the through hole in the filling and plating process is prevented, and the signal transmission stability of a circuit board is effectively improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a through hole filling and plating method applied to an HDI (high density interconnect) board of an optical module.
Background
The optical module printed circuit board generally needs to be electrified for a long time in the using process, and the through hole of the optical module printed circuit board is generally designed by adopting thin copper plating because the optical module printed circuit board is manufactured by high-precision thin circuits, so that the thickness of hole copper of the whole through hole is smaller, and the cross-sectional area of the whole copper layer is smaller. And under the condition of long-term electrification, a large amount of heat is easily generated, so that the stability of equipment operation is influenced, and meanwhile, the thicker the hole copper thickness of the through hole is, the smaller the influence on signal transmission between the plate layers is.
Therefore, in the prior art, the through holes are subjected to filling plating treatment, and the thickness of hole copper of the through holes is increased, so that the heat dissipation performance and the signal transmission performance of the circuit board are enhanced. However, the through hole is generally filled once in the filling and plating process, and since the aperture of the through hole is large, a core-spun phenomenon (i.e., a void phenomenon) is easily generated in the through hole, which further causes distortion of signal transmission of the circuit board and reduces the stability of signal transmission.
Disclosure of Invention
In order to solve the technical problem that the core-spun phenomenon is easy to occur in the filling and plating process of the through hole of the optical module printed circuit board, the invention provides the through hole filling and plating method which can increase the hole copper thickness of the through hole and prevent the core-spun phenomenon from occurring and is applied to the HDI board for the high-density interconnection of the optical module.
The invention discloses a through hole filling and plating method applied to an HDI (high density interconnect) board of an optical module, which comprises the following steps of:
copper is reduced, and surface copper of the circuit board is reduced; drilling holes in the front side and the back side of the circuit board in the same depth to form two same blind holes; drilling a trepanning hole, namely drilling a micro hole for communicating the two blind holes between the two blind holes to form a step-shaped through hole; removing glue and depositing copper, namely removing glue and depositing copper on the circuit board after twice drilling; exposing and developing for the first time, attaching dry films to the front and back sides of the circuit board, and then exposing and developing for the first time for the through hole; electroplating the through hole until the micro hole is completely plated with copper and filled; removing the film, and removing the redundant dry film on the circuit board; grinding the circuit board to remove burrs;
exposing and developing for the second time, attaching dry films to the front and back sides of the circuit board, and then exposing and developing for the second time for the through hole; and filling hole electroplating, namely electroplating the through hole until the through hole is filled, and filling and plating the through hole.
According to one embodiment of the present invention, the circuit board position is maintained during the positive and negative drilling steps.
According to an embodiment of the present invention, the circuit board is maintained at the same position in the trepanning and hole-drilling steps as in the front and back drilling steps.
According to an embodiment of the present invention, the number of the steps of removing the photoresist and depositing the copper is at least two.
According to an embodiment of the present invention, the first exposing and developing step further includes: and carrying out anti-oxidation treatment on the developed circuit board.
According to one embodiment of the present invention, the diameter of the through hole after development in the first exposure development step is at least 0.5mil larger than the actual opening.
According to one embodiment of the present invention, the hole-filling electroplating step and the through-hole electroplating step are performed with less than 6ASF current.
According to an embodiment of the invention, the through hole filling and plating method applied to the optical module high-density interconnection HDI board further comprises a secondary copper deposition step after the board grinding step, wherein the copper deposition is performed on the through hole opening.
According to the through hole filling and plating method applied to the optical module high-density interconnection HDI board, the cross section of the through hole is in the shape of a step with a small middle part and two large ends by drilling twice, and the two filling steps of the middle part and the two ends of the through hole are matched respectively, so that the through hole is filled and plated step by step, the core-spun phenomenon of the through hole in the filling and plating process is prevented, and the signal transmission stability of a circuit board is effectively improved.
Drawings
FIG. 1 is a schematic diagram of a circuit board via hole structure according to the present invention.
Detailed Description
The through hole filling and plating method applied to the optical module high-density interconnect HDI board according to the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings.
Please refer to fig. 1, which is a schematic structural diagram of a circuit board via hole according to the present invention.
The invention provides a through hole filling and plating method applied to an HDI (high density interconnect) board of an optical module.
And reducing the copper, namely reducing the surface copper of the circuit board to 6-8 mu m from 1/3 oz.
And (3) drilling holes in the front and the back of the circuit board in the same depth, namely drilling holes in the same positions on the front surface and the back surface of the circuit board in the same depth to form two same blind holes 10, wherein for example, a drill bit with the depth of 0.2mm is adopted for drilling holes, and the depth is 0.8 mm. The position of the circuit board in the front-side and back-side drilling is kept unchanged, and the CPK value between the expansion and contraction of the circuit board and the drilling equipment is effectively ensured. In order to further ensure the drilling precision, the drill bit is ground at most once, and the service life of the drill bit is controlled within 1500 holes.
Trepanning and drilling, namely drilling a micro hole 20 which is communicated with the two blind holes 10 between the two blind holes 10 to form a step-shaped through hole, wherein the aperture of the micro hole 20 is smaller than that of the blind hole 10, for example, the aperture of the blind hole 10 is 0.2mm, and the aperture of the micro hole 20 is 0.12 mm. Wherein in order to guarantee the precision of drilling, keep the circuit board the same with circuit board position among the positive and negative drilling step in the trepanning commentaries on classics hole step, for example, accomplish the back drilling in the positive and negative drilling process after, do not move circuit board position, directly carry out the trepanning drilling step.
And removing glue and depositing copper, namely removing glue and depositing copper on the circuit board after twice drilling, wherein the times of the steps of removing glue and depositing copper are at least twice, so that the chemical copper layer in the tiny hole is kept good, and the post-electroplating performance is improved.
Exposing and developing for the first time, attaching a dry film to the front side and the back side of the circuit board, and then exposing and developing for the first time for the position of the through hole, wherein the diameter of the through hole after developing in the step of exposing and developing for the first time is at least 0.5mil larger than that of an actual opening hole, so that the generation of a copper nodule is effectively avoided. In the application, a 20-micron positive film dry film is adopted in the first exposure and development step, so that the production requirement of a high-precision circuit board is met. When the method is applied specifically, the development process is carried out at least twice in the first exposure development step, so that the dry film in the tiny holes is completely removed, and the electroplating capacity of the tiny holes is improved. It is worth noting that the first exposure developing step further includes performing an anti-oxidation treatment on the developed circuit board, for example, the developed circuit board is placed in a room with a temperature of 20 ± 2 ℃ and a humidity of less than 40% for storage and airing, so as to prevent a punctate hole breaking phenomenon caused by oxidation of a copper deposition layer in the through hole, and further improve the electroplating performance of the through hole. The circuit pretreatment method of the circuit board is carried out by adopting a method other than etching.
And (3) electroplating the through hole, wherein the plated area is determined according to engineering data according to production requirements, and long-time low-current electroplating is adopted until the micro hole is completely plated with copper and filled. Because the aperture of the blind hole is larger than that of the micro hole, the orifice of the through hole is effectively prevented from being sealed, and the core-spun phenomenon is effectively avoided.
And (5) removing the film, and removing the redundant dry film on the circuit board.
And grinding the circuit board to remove burrs generated by drilling the circuit board, thereby ensuring the performance of the subsequent circuit.
And (5) carrying out exposure and development for the second time, attaching dry films to the front and back sides of the circuit board, and then carrying out exposure and development for the second time on the through hole.
And (4) filling hole electroplating, namely, electroplating the through hole for a long time by adopting a small current similarly until the through hole is filled, and filling and plating the through hole.
In the application, the current less than 6ASF is adopted for electroplating in the hole filling electroplating step and the through hole electroplating step, the speed of the electroplating process is effectively controlled by utilizing low-current electroplating, the electroplating speed is prevented from being too high, the uniform electroplating effect is ensured, and the electroplating time can be 40-80 mins.
In order to further improve the electroplating effect of the circuit board in the hole filling electroplating step, the through hole filling electroplating method applied to the HDI board of the optical module high-density interconnection further comprises a secondary copper deposition step after the board grinding step, specifically, copper deposition is carried out on the hole opening of the through hole in the secondary copper deposition step, so that the situation that the bonding force with electroplating copper is insufficient due to the fact that surface copper is not increased under the condition of board grinding is prevented, the copper layer falling off from the hole opening of the through hole due to board grinding is effectively supplemented through secondary copper deposition, and the electroplating performance of the through hole in the hole filling electroplating process is guaranteed.
In conclusion, the through hole filling and plating method applied to the high-density interconnection HDI board of the optical module enables the cross section of the through hole to be in the shape of a step with a small middle part and two large ends by drilling twice, and realizes the step filling and plating of the through hole by matching with the two hole filling steps of the middle part and the two ends of the through hole, so that the core-spun phenomenon of the through hole in the filling and plating process is prevented, and the signal transmission stability of the circuit board is effectively improved.
While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, all such alternatives, modifications, and variations are intended to be included within the spirit and scope of the present invention.
Claims (8)
1. A through hole filling and plating method applied to an HDI (high density interconnect) board of an optical module is characterized by comprising the following steps:
copper is reduced, and surface copper of the circuit board is reduced;
drilling holes in the front side and the back side of the circuit board in the same depth to form two same blind holes;
drilling a trepanning hole, namely drilling a micro hole for communicating the two blind holes between the two blind holes to form a step-shaped through hole;
removing glue and depositing copper, namely removing glue and depositing copper on the circuit board after twice drilling;
exposing and developing for the first time, attaching dry films to the front and back sides of the circuit board, and then exposing and developing for the first time for the through hole;
electroplating the through hole until the micro hole is completely plated with copper and filled;
removing the film, and removing the redundant dry film on the circuit board;
grinding the circuit board to remove burrs;
exposing and developing for the second time, attaching dry films to the front and back sides of the circuit board, and then exposing and developing for the second time for the through hole; and
and (4) filling hole electroplating, namely electroplating the through hole until the through hole is filled, and filling and plating the through hole.
2. The method for filling and plating the through hole of the HDI board for optical module High Density Interconnection (HDI) as claimed in claim 1, wherein the position of the circuit board is kept unchanged in the forward and backward drilling step.
3. The method for filling and plating the through hole of the HDI board for optical module High Density Interconnection (HDI) as claimed in claim 2, wherein the step of trepanning and rotating the hole keeps the position of the circuit board the same as that of the circuit board in the step of drilling the front and back holes.
4. The method for filling and plating the through hole of the HDI board for optical module High Density Interconnection (HDI) as claimed in claim 1, wherein the number of the steps of removing glue and depositing copper in the step of removing glue and depositing copper is at least two.
5. The method for filling and plating the through hole of the HDI board for optical module High Density Interconnection (HDI) as claimed in claim 1, wherein the filling and plating step and the through hole plating step are performed by electroplating with less than 6ASF current.
6. The via fill plating method applied to an HDI (high density interconnect) board of an optical module as claimed in claim 1, wherein the diameter of the via hole after development in the first exposure and development step is at least 0.5mil larger than the actual opening.
7. The via fill plating method applied to the HDI board for optical module High Density Interconnection (HDI) as claimed in any one of claims 1 to 6, wherein the first exposure and development step further comprises: and carrying out anti-oxidation treatment on the developed circuit board.
8. The method for filling and plating the through hole of the HDI board for the optical module high-density interconnection as recited in any one of claims 1 to 6, further comprising a secondary copper deposition step of depositing copper on the through hole aperture after the board grinding step.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010040136.0A CN111212527A (en) | 2020-01-15 | 2020-01-15 | Through hole filling and plating method applied to optical module high-density interconnection HDI board |
| PCT/CN2020/105799 WO2021143102A1 (en) | 2020-01-15 | 2020-07-30 | Through hole filling and plating method applied to optical module high density interconnect hdi board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010040136.0A CN111212527A (en) | 2020-01-15 | 2020-01-15 | Through hole filling and plating method applied to optical module high-density interconnection HDI board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111212527A true CN111212527A (en) | 2020-05-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010040136.0A Pending CN111212527A (en) | 2020-01-15 | 2020-01-15 | Through hole filling and plating method applied to optical module high-density interconnection HDI board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111212527A (en) |
| WO (1) | WO2021143102A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112606544A (en) * | 2020-11-19 | 2021-04-06 | 浙江硕克科技有限公司 | Metal plate and processing technology thereof |
| CN112738998A (en) * | 2020-10-23 | 2021-04-30 | 广东科翔电子科技股份有限公司 | Circuit board micro-via processing technology |
| CN112888193A (en) * | 2020-12-17 | 2021-06-01 | 大连崇达电子有限公司 | Manufacturing method of stepped hole |
| WO2021143102A1 (en) * | 2020-01-15 | 2021-07-22 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high density interconnect hdi board |
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- 2020-01-15 CN CN202010040136.0A patent/CN111212527A/en active Pending
- 2020-07-30 WO PCT/CN2020/105799 patent/WO2021143102A1/en active Application Filing
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| Publication number | Publication date |
|---|---|
| WO2021143102A1 (en) | 2021-07-22 |
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Application publication date: 20200529 |