CN110167286A - A kind of pcb board hole wall method for processing plating layer - Google Patents
A kind of pcb board hole wall method for processing plating layer Download PDFInfo
- Publication number
- CN110167286A CN110167286A CN201910568237.2A CN201910568237A CN110167286A CN 110167286 A CN110167286 A CN 110167286A CN 201910568237 A CN201910568237 A CN 201910568237A CN 110167286 A CN110167286 A CN 110167286A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- hole
- coating
- internal diameter
- board group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 91
- 239000011248 coating agent Substances 0.000 claims abstract description 90
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 239000000126 substance Substances 0.000 claims abstract description 9
- 230000008859 change Effects 0.000 claims abstract description 8
- 230000007423 decrease Effects 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002356 single layer Substances 0.000 claims description 4
- 230000001186 cumulative effect Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention discloses a kind of pcb board hole wall method for processing plating layer, and coating hole is drilled in pcb board group, and coating hole is internal diameter gradual change hole, and the internal diameter in coating hole successively successively decreases from opening to center, and coating hole is big close to the internal diameter of open side, smaller apart from the remoter internal diameter of aperture；Pcb board group is put into metal ion solution, chemical plating is carried out to pcb board group, takes out pcb board group after completing chemical plating；Pcb board group is put into electroplate liquid again, pcb board group is electroplated, takes out pcb board group after completing plating；The internal diameter in coating hole is not uniform aperture, internal diameter close to outer end is big, when metal ion enters aperture with solution, outer end is first reached, then to hole internal motion, metal ion contained in solution is first deposited on the outer end in hole, make the plating thickness of outer end, but since outer end internal diameter is big, the aperture that thicker coating not will cause coating hole reduces excessive, still ensure that solution normally circulates, it is ensured that the thickness of coating of hole inner end.
Description
Technical field
The present invention relates to electronic component processing technique fields, further relate to a kind of pcb board hole wall method for processing plating layer.
Background technique
As rate is continuously improved, the requirement to server product reliability is also higher and higher, to PCB (Printed
Circuit Board, Chinese are printed circuit board) reliability requirement it is also higher and higher, the reliability for improving PCB is to set
The key link of meter and production process.
Pcb board group is formed by multiple single layer pcb board stack combinations, and the cabling of server pcb board is generally used and opened up at present
The form of through-hole is walked line density with pcb board and is improved, and the number of plies of pcb board group is more and more, and the thickness of entire pcb board group is more next
It is thicker.
The through-hole wall of pcb board group needs to be arranged copper coating, and the thickness of coating is the key that measure pcb board reliability to refer to
Mark.An important factor for influencing thickness of coating is the covering power of PCB plating, and pcb board group thickness increase causes radius-thickness ratio to increase, right
The requirement of covering power also correspondinglys increase.
Plating generallys use direct current electrode position technique at present, and the metal ion in electroplate liquid is flowed out of hole extroversion hole, plating
When distribution of charges not can guarantee substantially uniformity, the ion diffusance in hole middle position is deteriorated, and the covering power of electroplate liquid reduces, and makes
At the plating thickness at aperture, the coating on the inside of hole is thinner；The internal diameter of through-hole end opening constantly reduces, and influences to be electroplated
Liquid stream is dynamic, further reduced the thickness of coating in hole.
Aperture plating thickness, center coating are thin, be easy to cause cracking after pcb board is subjected to cooling thermal impact, cause open circuit, reduce
The reliability of product.For those skilled in the art, the through-hole inner end diameter how reduced on pcb board is small, in centre
The big problem of diameter is the current technical issues that need to address.
Summary of the invention
The present invention provides a kind of pcb board hole wall method for processing plating layer, and the internal diameter that through-hole increases nose end ensures hole inner end
Thickness of coating, concrete scheme are as follows:
A kind of pcb board hole wall method for processing plating layer, comprising:
It is drilled with coating hole in pcb board group, the coating hole is internal diameter gradual change hole, and the internal diameter in the coating hole is from opening
Successively successively decrease to center；
The pcb board group is put into metal ion solution, chemical plating is carried out to the pcb board group；
The pcb board group is put into electroplate liquid, the pcb board group is electroplated.
Optionally, the coating hole is the smooth through hole of internal diameter.
Optionally, the coating hole is round taper hole, is drilled with processing from a side to the other side using the drill bit of cone.
Optionally, the coating hole is that two conical surfaces dock to be formed, using the drill bit of cone respectively from two sidetrackings
If processing.
Optionally, the coating hole is that two bell faces dock to be formed, and is drilled with and is added from two sides respectively using bell drill bit
Work.
Optionally, the coating hole is stepped hole, and the single layer aperture for forming the pcb board group is equal, and each layer aperture is cumulative
Or decrescence.
Optionally, the internal diameter maximum in the coating hole and the difference at internal diameter minimum are 25~50 μm.
It is optionally, described that coating hole is drilled in pcb board group, comprising:
Metal plate first is pressed on the surface of the pcb board group, then the coating hole is drilled with by drill bit.
The present invention provides a kind of pcb board hole wall method for processing plating layer, and coating hole is drilled in pcb board group, and coating hole is interior
The internal diameter in diameter gradual change hole, coating hole successively successively decreases from opening to center, and coating hole is big close to the internal diameter of open side, apart from aperture
Remoter internal diameter is smaller；Pcb board group is put into metal ion solution, chemical plating is carried out to pcb board group, in the feelings of no impressed current
By suitable reducing agent under condition, metal ion is made to be reduced into metal, and deposits to coating hole surface, it will after completion chemical plating
Pcb board group is taken out；Pcb board group is put into electroplate liquid again, pcb board group is electroplated, is completed pcb board group after being electroplated
It takes out；The internal diameter in coating hole is not uniform aperture, and the internal diameter close to outer end is big, and metal ion enters aperture with solution
When, first reach outer end, then to hole internal motion, metal ion contained in solution is first deposited on the outer end in hole, makes the plating of outer end
Thickness, but since outer end internal diameter is big, the aperture that thicker coating not will cause coating hole reduces excessively, still ensures that solution is normal
Circulation, it is ensured that the thickness of coating of hole inner end.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the sectional view that the first form coating hole is opened up in pcb board group；
Fig. 2 is the sectional view that second of form coating hole is opened up in pcb board group；
Fig. 3 is the sectional view that the third form coating hole is opened up in pcb board group；
Fig. 4 is the sectional view that the 4th kind of form coating hole is opened up in pcb board group.
Include: in figure
Pcb board group 1, coating hole 2.
Specific embodiment
Core of the invention is to provide a kind of pcb board hole wall method for processing plating layer, and the internal diameter that through-hole increases nose end ensures
The thickness of coating of hole inner end.
In order to make those skilled in the art more fully understand technical solution of the present invention, below in conjunction with attached drawing and specifically
Embodiment, explanation is described in detail to pcb board hole wall method for processing plating layer of the invention.
Pcb board hole wall method for processing plating layer of the invention the following steps are included:
Coating hole 2 is drilled in pcb board group 1, coating hole 2 is internal diameter gradual change hole, and the internal diameter in coating hole 2 is from opening in
The heart successively successively decreases；Pcb board group 1 is made of multiple individual pcb board fixed overlays, and the length direction in coating hole 2 is pcb board group 1
Thickness direction, the opening that coating hole 2 is in communication with the outside closer to end, internal diameter is bigger, and the length apart from opening is got over
Far, internal diameter is smaller；Drilling equipment used in thus is not cylindrical drill bit, and the diameter of drill bit answers one end big, another
It holds small.
Pcb board group 1 is put into metal ion solution, chemical plating is carried out to pcb board group 1；Chemical plating is urging in metal
Under change effect, the deposition process of metal is generated by controllable redox reaction, metal ion in plating solution is made to be reduced into gold
Belong to, and deposits to piece surface；Chemical plating is not required to DC power supply device, and the coating of formation is uniform, pin hole is small；It is plated to complete chemistry
After journey, pcb board group 1 is taken out, carries out subsequent operation.
Then pcb board group 1 is put into electroplate liquid, pcb board group 1 is electroplated；Plating is to utilize electrolysis principle
Plate the process of the other metal or alloy of a thin layer on certain metal surfaces, coated metal is to be plated as anode when plating
Workpiece is reduced to form coating as cathode, the cation of coated metal in workpiece surface to be plated.
Using pcb board hole wall method for processing plating layer of the invention, the internal diameter in coating hole 2 is not uniform aperture, is leaned on
The internal diameter of nearly outer end is big, when metal ion enters aperture with solution, first reaches outer end, from the opening of outer end to hole internal motion,
Metal ion contained in solution is first deposited on the outer end in hole, and the amount of metal ion of outer end in contact is larger, thus the coating of outer end
Thickness, but since outer end internal diameter is big, the aperture that thicker coating not will cause coating hole reduces excessively, still is being able to guaranteeing solution just
Often circulation, since the internal diameter of 2 outer end of coating hole is big, the coat of metal of deposition can be such that aperture reduces, but the deposition of thick of the coat of metal
Degree is directly proportional to its internal diameter, and internal diameter is bigger, and the coat of metal is thicker, correspondingly makes internal diameter reduction degree bigger, by big outside internal diameter
Interior small setting, after final coating is formed, the hole internal diameter in coating hole 2 keeps of substantially equal everywhere, that is to say, that in coating process
In, the internal diameter at outer end opening will not excessively be reduced always because of the accumulation of coating, not influence the flowing of liquid, liquid can be normal
The inside for reaching coating hole makes 2 middle section of coating hole have enough covering powers, it is ensured that the thickness of coating of hole inner end,
Avoid occurring the phenomenon that fault rupture is plated in coating hole 2 in use process.
On the basis of above scheme, the coating hole 2 in the present invention is the smooth through hole namely coating hole 2 of internal diameter
Internal diameter keeps slow transition, and broken-line position is not present, not will form step at the inner wall in coating hole 2.
Specifically, the present invention provides some specific examples herein:
The first is drilled with using the drill bit of cone from a side to the other side as shown in Figure 1, coating hole 2 is round taper hole
Processing, 2 one end internal diameter of coating hole is big, and other end internal diameter is small, this structure only needs to be drilled with processing once, forms the logical of taper type
Pore structure, suitable for the structure that only one end penetrates through of coating hole 2.This structure is processed using taper bit, relative to traditional cylinder
For shape drill bit, the minimum diameter of conical drill bit is equal with the diameter of traditional cylindrical drill bit, thus intensity is higher, not easily broken
It splits, can disposably be worked into bottom, it is not necessary to extract drill bit cooling out repeatedly.
Second, as shown in Fig. 2, coating hole 2 be two conical surfaces dock to be formed, using cone drill bit respectively from
Two sides are drilled with processing；2 both ends internal diameter of coating hole is big, and middle section internal diameter is small, and internal diameter gradually contracts from upper and lower ends to centre
It is small.This structure needs at least to be drilled twice using taper bit respectively from upper and lower two side to central bore.Since both ends are opened
Mouth is larger, and solution flowing is rapider, is conducive to promote coating synthesis speed.
The third, as shown in figure 3, coating hole 2 is that two bell faces dock to be formed, using bell drill bit respectively from two sides
It is drilled with processing；Similar with structure shown in Fig. 2, also big in both ends internal diameter, intermediate internal diameter is small, but the shape of 2 internal diameter of coating hole is
Difference, from section, 2 inner wall of coating hole of Fig. 3 is linear, and 2 inner wall of coating hole of Fig. 3 is curved.
4th kind, as shown in figure 4, coating hole 2 is stepped hole, the single layer aperture for forming pcb board group 1 is equal, each layer aperture
It gradually changes, aperture gradually increases or is gradually reduced；On the whole, the internal diameter in entire coating hole 2 is in tapered change from outside to inside
Change trend.Using this structure, the bit bore processing of ladder shaft-like can be used, it is possible to use the cylindrical drill of different-diameter point
Repeatedly processing.
Preferably, the internal diameter maximum in coating hole 2 and the difference at internal diameter minimum are 25~50 μm, it is ensured that finally formed
Coating internal diameter approximation is cylindrical.
Preferably, the present invention be drilled in pcb board group 1 coating hole 2 process specifically includes the following steps:
Two metal plates first are pressed in the upper and lower surface of pcb board group 1, the surface holding of metal plate and pcb board group 1 is relatively solid
It is fixed, without relative displacement, pcb board group 1 is compressed by metal plate；Coating hole 2 is drilled with by drill bit again, drill bit initially passes through metal
Plate, then drill to pcb board group 1；It by pressing metal plate, prevents drill bit from damaging on the surface of pcb board group 1, forms burr,
Improve the fineness of processing.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, this hair
It is bright to be not intended to be limited to the embodiments shown herein, and be to fit to and the principles and novel features disclosed herein phase
Consistent widest scope.
Claims (8)
1. a kind of pcb board hole wall method for processing plating layer characterized by comprising
It is drilled on pcb board group (1) coating hole (2), the coating hole (2) is internal diameter gradual change hole, the internal diameter of the coating hole (2)
Successively successively decrease from opening to center；
The pcb board group (1) is put into metal ion solution, chemical plating is carried out to the pcb board group (1)；
The pcb board group (1) is put into electroplate liquid, the pcb board group (1) is electroplated.
2. pcb board hole wall method for processing plating layer according to claim 1, which is characterized in that the coating hole (2) is internal diameter
Smooth through hole.
3. pcb board hole wall method for processing plating layer according to claim 2, which is characterized in that the coating hole (2) is circular cone
Shape hole is drilled with processing from a side to the other side using the drill bit of cone.
4. pcb board hole wall method for processing plating layer according to claim 2, which is characterized in that the coating hole (2) is two
Conical surface docks to be formed, and is drilled with processing from two sides respectively using the drill bit of cone.
5. pcb board hole wall method for processing plating layer according to claim 2, which is characterized in that the coating hole (2) is two
Bell face docks to be formed, and is drilled with processing from two sides respectively using bell drill bit.
6. pcb board hole wall method for processing plating layer according to claim 1, which is characterized in that the coating hole (2) is ladder
Hole, the single layer aperture for forming the pcb board group (1) is equal, and each layer aperture is cumulative or decrescence.
7. pcb board hole wall method for processing plating layer according to claim 1, which is characterized in that the internal diameter of the coating hole (2)
Difference at maximum and internal diameter minimum is 25~50 μm.
8. pcb board hole wall method for processing plating layer according to claim 1, which is characterized in that described on pcb board group (1)
It is drilled with coating hole (2), comprising:
Metal plate first is pressed on the surface of the pcb board group (1), then the coating hole (2) is drilled with by drill bit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910568237.2A CN110167286B (en) | 2019-06-27 | 2019-06-27 | PCB hole wall plating processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910568237.2A CN110167286B (en) | 2019-06-27 | 2019-06-27 | PCB hole wall plating processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110167286A true CN110167286A (en) | 2019-08-23 |
| CN110167286B CN110167286B (en) | 2021-03-26 |
Family
ID=67636860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910568237.2A Active CN110167286B (en) | 2019-06-27 | 2019-06-27 | PCB hole wall plating processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110167286B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212527A (en) * | 2020-01-15 | 2020-05-29 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high-density interconnection HDI board |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311919A (en) * | 2003-02-21 | 2004-11-04 | Shinko Electric Ind Co Ltd | Through-hole filling method |
| CN101790281A (en) * | 2006-02-22 | 2010-07-28 | 揖斐电株式会社 | Printed wiring board |
| CN101841968A (en) * | 2010-04-30 | 2010-09-22 | 深圳崇达多层线路板有限公司 | Circuit board with step-shaped blind hole and manufacturing method |
| CN103929901A (en) * | 2013-01-11 | 2014-07-16 | 立诚光电股份有限公司 | Circuit board and manufacturing method thereof |
| US20140208590A1 (en) * | 2013-01-30 | 2014-07-31 | Nvidia Corporation | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate |
| CN104053311A (en) * | 2013-03-13 | 2014-09-17 | 欣兴电子股份有限公司 | Manufacturing method of conducting hole |
| CN105009697A (en) * | 2013-03-05 | 2015-10-28 | 安费诺有限公司 | High speed printed circuit board with uniform via inside diameter |
| CN105338759A (en) * | 2015-10-29 | 2016-02-17 | 杭州方正速能科技有限公司 | Preparation method of PCB and PCB |
| CN106507611A (en) * | 2015-09-07 | 2017-03-15 | 欣兴电子股份有限公司 | The manufacture method of wiring board |
| CN108925048A (en) * | 2018-07-18 | 2018-11-30 | 盐城维信电子有限公司 | A kind of production method and products thereof being avoided that COF flexible base board empty in through-hole |
| CN109673101A (en) * | 2017-10-13 | 2019-04-23 | 鹏鼎控股(深圳)股份有限公司 | The production method and circuit substrate of circuit substrate |
-
2019
- 2019-06-27 CN CN201910568237.2A patent/CN110167286B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004311919A (en) * | 2003-02-21 | 2004-11-04 | Shinko Electric Ind Co Ltd | Through-hole filling method |
| CN101790281A (en) * | 2006-02-22 | 2010-07-28 | 揖斐电株式会社 | Printed wiring board |
| CN101841968A (en) * | 2010-04-30 | 2010-09-22 | 深圳崇达多层线路板有限公司 | Circuit board with step-shaped blind hole and manufacturing method |
| CN103929901A (en) * | 2013-01-11 | 2014-07-16 | 立诚光电股份有限公司 | Circuit board and manufacturing method thereof |
| US20140208590A1 (en) * | 2013-01-30 | 2014-07-31 | Nvidia Corporation | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate |
| CN105009697A (en) * | 2013-03-05 | 2015-10-28 | 安费诺有限公司 | High speed printed circuit board with uniform via inside diameter |
| CN104053311A (en) * | 2013-03-13 | 2014-09-17 | 欣兴电子股份有限公司 | Manufacturing method of conducting hole |
| CN106507611A (en) * | 2015-09-07 | 2017-03-15 | 欣兴电子股份有限公司 | The manufacture method of wiring board |
| CN105338759A (en) * | 2015-10-29 | 2016-02-17 | 杭州方正速能科技有限公司 | Preparation method of PCB and PCB |
| CN109673101A (en) * | 2017-10-13 | 2019-04-23 | 鹏鼎控股(深圳)股份有限公司 | The production method and circuit substrate of circuit substrate |
| CN108925048A (en) * | 2018-07-18 | 2018-11-30 | 盐城维信电子有限公司 | A kind of production method and products thereof being avoided that COF flexible base board empty in through-hole |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212527A (en) * | 2020-01-15 | 2020-05-29 | 广东科翔电子科技股份有限公司 | Through hole filling and plating method applied to optical module high-density interconnection HDI board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110167286B (en) | 2021-03-26 |
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