CN111200908A - 印刷电路板及具有该印刷电路板的电子装置 - Google Patents

印刷电路板及具有该印刷电路板的电子装置 Download PDF

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Publication number
CN111200908A
CN111200908A CN201911093068.8A CN201911093068A CN111200908A CN 111200908 A CN111200908 A CN 111200908A CN 201911093068 A CN201911093068 A CN 201911093068A CN 111200908 A CN111200908 A CN 111200908A
Authority
CN
China
Prior art keywords
insulating layer
rigid
flexible
flexible insulating
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911093068.8A
Other languages
English (en)
Chinese (zh)
Inventor
朴正桓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN111200908A publication Critical patent/CN111200908A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CN201911093068.8A 2018-11-16 2019-11-11 印刷电路板及具有该印刷电路板的电子装置 Pending CN111200908A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180141583A KR102653216B1 (ko) 2018-11-16 2018-11-16 인쇄회로기판 및 이를 포함하는 전자기기
KR10-2018-0141583 2018-11-16

Publications (1)

Publication Number Publication Date
CN111200908A true CN111200908A (zh) 2020-05-26

Family

ID=70726959

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911093068.8A Pending CN111200908A (zh) 2018-11-16 2019-11-11 印刷电路板及具有该印刷电路板的电子装置

Country Status (3)

Country Link
US (1) US11032901B2 (ko)
KR (1) KR102653216B1 (ko)
CN (1) CN111200908A (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200067607A (ko) * 2018-12-04 2020-06-12 삼성전기주식회사 인쇄회로기판
EP3723122B1 (en) * 2019-04-10 2023-02-15 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier comprising a double layer structure
CN112349676B (zh) * 2019-08-06 2022-04-05 奥特斯奥地利科技与***技术有限公司 半柔性的部件承载件及其制造方法
CN112351571B (zh) * 2019-08-06 2022-08-16 奥特斯(中国)有限公司 半柔性部件承载件及其制造方法
US11916007B2 (en) * 2019-10-23 2024-02-27 Infineon Technologies Ag Semiconductor device with embedded flexible circuit
DE102020206769B3 (de) * 2020-05-29 2021-06-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Mikroelektronische anordnung und verfahren zur herstellung derselben

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206463A (en) * 1990-07-24 1993-04-27 Miraco, Inc. Combined rigid and flexible printed circuits and method of manufacture
JP2008034702A (ja) * 2006-07-31 2008-02-14 Sumitomo Bakelite Co Ltd リジッドフレックス回路基板およびその製造方法
US7342802B2 (en) * 2003-07-02 2008-03-11 Tessera Interconnect Materials, Inc. Multilayer wiring board for an electronic device
JP2009081342A (ja) * 2007-09-27 2009-04-16 Sharp Corp 多層プリント配線板とその製造方法
US20120132458A1 (en) * 2010-11-30 2012-05-31 Yamaichi Electronics Co. Ltd. Flexible circuit board
US20140375876A1 (en) * 2013-03-27 2014-12-25 Murata Manufacturing Co., Ltd. Camera module

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US6818469B2 (en) * 2002-05-27 2004-11-16 Nec Corporation Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same
AU2003284573A1 (en) * 2002-11-27 2004-06-18 Sumitomo Bakelite Company Limited Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board
KR101097075B1 (ko) 2003-04-15 2011-12-22 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판과 그 제조 방법
CN1765161B (zh) * 2003-04-18 2011-06-22 揖斐电株式会社 刚挠性电路板
JP2007013113A (ja) * 2005-05-30 2007-01-18 Hitachi Chem Co Ltd 多層配線板
EP2000833A4 (en) * 2006-03-24 2010-03-31 Ibiden Co Ltd PHOTOELECTRIC WIRING PANEL, OPTICAL COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING OPTICAL COMMUNICATION DEVICE
FI122216B (fi) * 2009-01-05 2011-10-14 Imbera Electronics Oy Rigid-flex moduuli
US8275223B2 (en) * 2009-02-02 2012-09-25 Ibiden Co., Ltd. Opto-electrical hybrid wiring board and method for manufacturing the same
KR101051491B1 (ko) * 2009-10-28 2011-07-22 삼성전기주식회사 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법
US8759687B2 (en) * 2010-02-12 2014-06-24 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
KR20110127913A (ko) * 2010-05-20 2011-11-28 삼성전자주식회사 카메라 모듈
KR101968637B1 (ko) * 2012-12-07 2019-04-12 삼성전자주식회사 유연성 반도체소자 및 그 제조방법
TWI501713B (zh) * 2013-08-26 2015-09-21 Unimicron Technology Corp 軟硬板模組以及軟硬板模組的製造方法
JP2016066711A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 フレックスリジッド配線板
KR20160073766A (ko) * 2014-12-17 2016-06-27 삼성전기주식회사 연성 인쇄회로기판 및 그 제조 방법
US20170196094A1 (en) * 2015-12-30 2017-07-06 AT&S Austria Electronic component packaged in a flexible component carrier
TWI604763B (zh) * 2016-11-18 2017-11-01 同泰電子科技股份有限公司 軟硬複合板結構
US20190103360A1 (en) * 2017-09-30 2019-04-04 Industrial Technology Research Institute Flexible chip package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206463A (en) * 1990-07-24 1993-04-27 Miraco, Inc. Combined rigid and flexible printed circuits and method of manufacture
US7342802B2 (en) * 2003-07-02 2008-03-11 Tessera Interconnect Materials, Inc. Multilayer wiring board for an electronic device
JP2008034702A (ja) * 2006-07-31 2008-02-14 Sumitomo Bakelite Co Ltd リジッドフレックス回路基板およびその製造方法
JP2009081342A (ja) * 2007-09-27 2009-04-16 Sharp Corp 多層プリント配線板とその製造方法
US20120132458A1 (en) * 2010-11-30 2012-05-31 Yamaichi Electronics Co. Ltd. Flexible circuit board
US20140375876A1 (en) * 2013-03-27 2014-12-25 Murata Manufacturing Co., Ltd. Camera module

Also Published As

Publication number Publication date
US11032901B2 (en) 2021-06-08
US20200163203A1 (en) 2020-05-21
KR20200057329A (ko) 2020-05-26
KR102653216B1 (ko) 2024-04-01

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