CN111162022A - 显示面板的修复装置 - Google Patents

显示面板的修复装置 Download PDF

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CN111162022A
CN111162022A CN202010257641.0A CN202010257641A CN111162022A CN 111162022 A CN111162022 A CN 111162022A CN 202010257641 A CN202010257641 A CN 202010257641A CN 111162022 A CN111162022 A CN 111162022A
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chip
display panel
light emitting
defect
releasing
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张玮
柳铭岗
孙洋
陈书志
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TCL China Star Optoelectronics Technology Co Ltd
TCL Huaxing Photoelectric Technology Co Ltd
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TCL Huaxing Photoelectric Technology Co Ltd
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Priority to CN202010257641.0A priority Critical patent/CN111162022A/zh
Priority to US16/764,900 priority patent/US20220115251A1/en
Priority to PCT/CN2020/086037 priority patent/WO2021196310A1/zh
Publication of CN111162022A publication Critical patent/CN111162022A/zh
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Abstract

本申请提供一种显示面板的修复装置，其包括：缺陷传感器，用于对显示面板进行缺陷检查，获得缺陷信息；芯片取放部，用于拾取、存储和释放发光芯片，所述芯片取放部包括芯片容置腔和控制器，所述芯片容置腔用于存储发光芯片，所述控制器用于拾取和释放芯片；芯片移动部，所述芯片移动部与所述芯片取放部连接，用于根据所述缺陷信息将所述芯片取放部移动至所述缺陷的位置；以及芯片绑定部，用于将所述发光芯片绑定在所述显示面板上。

Description

显示面板的修复装置
技术领域
本申请涉及显示领域，尤其涉及一种显示面板的修复装置。
背景技术
微型发光二极管（Micro-light emitting diodes，MicroLED）具有亮度高，发光效率好，功耗低，寿命长且轻薄等优点。有望成为下一代主流显示技术。
MicroLED的制造方法主要是将微缩后的几微米到几十微米的LED在基板上进行阵列排布，而形成具有高密度微小尺寸的LED阵列。然而，通过巨量转移制造的MicroLED显示装置的点亮良率仍不能达到量产阶段99.9999%的技术要求。因此，在完成转移制程后还需要对显示面板进行修复。在修复制程中，对于不同像素规格的基板需准备不同的工艺治具，导致制程复杂、耗费工时长等问题。
发明内容
有鉴于此，本申请目的在于提供一种能够简化制程、缩短工时的显示面板的修复装置。
本申请提供一种显示面板的修复装置，其包括：
缺陷传感器，用于对显示面板进行缺陷检查，获得缺陷信息；
芯片取放部，用于拾取、存储和释放发光芯片，所述芯片取放部包括芯片容置腔和控制器，所述芯片容置腔用于存储发光芯片，所述控制器用于拾取和释放芯片 ；
芯片移动部，所述芯片移动部与所述芯片取放部连接，用于根据所述缺陷信息将所述芯片取放部移动至所述缺陷的位置；以及
芯片绑定部，用于将所述发光芯片绑定在所述显示面板上。
在一种实施方式中，所述芯片容置腔具有沿第一方向延伸的腔体，所述芯片容置腔用于供所述发光芯片层叠设置于所述芯片容置腔中。
在一种实施方式中，所述腔体为圆柱形腔体，所述第一方向与所述圆柱形腔体的中心轴平行。
在一种实施方式中，所述显示面板的修复装置包括多个芯片取放部，每一所述芯片取放部用于存储一种颜色的所述发光芯片。
在一种实施方式中，所述芯片取放部用于拾取并存储至少一个发光芯片，并在每一所述缺陷的位置逐一释放所述发光芯片。
在一种实施方式中，所述控制器包括用于拾取所述发光芯片的芯片拾取部，所述芯片拾取部包括电磁力拾取部件、静电力拾取部件、真空吸附拾取部件中的一个或多个。
在一种实施方式中，所述控制器包括用于将所述发光芯片释放于所述缺陷的位置的芯片释放部，所述芯片释放部包括压力释放部件、静电力释放部件、电磁力释放部件、流体释放部件中的一个或多个。
在一种实施方式中，所述控制器包括用于拾取所述发光芯片的芯片拾取部和用于将所述发光芯片释放于所述缺陷的位置的芯片释放部，所述芯片拾取部与所述芯片释放部为同一部件。
在一种实施方式中，所述缺陷信息包括缺陷的位置、数量和颜色。
在一种实施方式中，所述芯片绑定部包括回流焊绑定部件和热压键合绑定部件的一个或多个。
相较于现有技术，本申请的显示面板的修复装置，将用于进行缺陷修复的MicroLED发光芯片收集并存储在芯片取放部中，并根据扫描显示面板获得的缺陷信息，在缺陷位置释放发光芯片并绑定。能够获得简化修复制程、缩短工时的有益效果。
附图说明
为了更清楚地说明本申请中的技术方案，下面将对实施方式描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请所提供的具有缺陷的显示面板的平面示意图。
图2是本申请所提供的显示面板的修复装置对具有缺陷的显示面板进行修复的示意图。
图3是本申请所提供的圆形发光芯片的示意图。
图4是本申请所提供的控制器的模块图。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请中的技术方案进行清楚、完整地描述。显然，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
请参考图1和图2，本申请第一实施方式提供一种显示面板的修复装置100，其用于对具有缺陷200a的显示面板200进行缺陷修复。显示面板200为微发光二极管显示面板（Micro Light-Eimitting Diode，MicroLED）。显示面板200包括多个发光芯片201。多个发光芯片201呈阵列式排布。发光芯片201可以全部为蓝色发光芯片，也可以为不同颜色的发光芯片，例如红色、绿色和蓝色发光芯片。在本实施方式中，发光芯片201包括第一发光芯片2011，第二发光芯片2012以及第三发光芯片2013。第一发光芯片2011，第二发光芯片2012以及第三发光芯片2013分别发出不同颜色的光。第一发光芯片2011，第二发光芯片2012以及第三发光芯片2013按照此顺序排列成行。显示面板200上具有缺陷200a。缺陷200a是指在制程中MicroLED没有被成功转移或者转移之后无法点亮，导致在显示面板200上出现无法点亮而需要进行发光芯片补充之处。
显示面板的修复装置100包括缺陷传感器10，用于对显示面板200进行缺陷检查，获得缺陷信息；芯片取放部20，用于拾取、存储和释放发光芯片201，芯片取放部20包括芯片容置腔21和控制器22，芯片容置腔21用于存储发光芯片201，控制器22用于拾取和释放芯片201；芯片移动部30，芯片移动部30与芯片取放部20连接，用于根据缺陷信息将芯片取放部20移动至缺陷200a的位置；芯片绑定部40，用于将发光芯片201绑定在显示面板200上。
缺陷传感器10用于对缺陷200a进行定向寻址。例如，缺陷传感器10可以是照相机。当将显示面板200点亮时，缺陷传感器10对显示面板200进行检查，获取缺陷信息。缺陷信息包括缺陷的位置、数量和颜色。即，需要补充的发光芯片201的坐标、数量以及颜色。
显示面板的修复装置100可以包括一个或多个芯片取放部20。多个芯片取放部20中的每一个用于存储一种颜色的发光芯片201。芯片容置腔21具有沿第一方向X延伸的腔体，芯片容置腔21用于供发光芯片201层叠设置于其中。本申请中不限定发光芯片201的结构，其可为正装结构芯片、垂直结构芯片或者倒装结构芯片。若为倒装结构芯片，腔体可以设置为圆柱形腔体，第一方向X与圆柱形腔体的中心轴平行。请参考图3，圆形发光芯片300包括一个内圆310和包围在内圆310外侧的外圈320。圆形发光芯片300的两个电极（即正极和负极）分别设置在内圆310和外圈320上。此，在拾取圆形发光芯片300时候不需要区分两个电极。而矩形的发光芯片的两个电极分别设置在左右两侧，在拾取时需要区分两个电极。因此，芯片容置腔21的截面设置为圆形，能够提高对于圆形发光芯片300的拾取和释放效率。若芯片为垂直结构芯片，则不受上述限制。芯片容置腔21的截面可为矩形、圆形、三角形等，腔体形状可根据发光芯片201形状进行调整，只要能够与发光芯片201形状匹配即可。
此外，芯片取放部20用于拾取并存储至少一个发光芯片201，并在每一缺陷200a的位置逐一释放所述发光芯片。
在本申请其他实施方式中，一个芯片取放部20也可以用于存储多种颜色的发光芯片201。
请参考图4，控制器22包括用于拾取发光芯片的芯片拾取部221和用于将发光芯片释放于缺陷的位置的芯片释放部222。控制器22可以从晶圆或者放置发光芯片201的临时基板上拾取发光芯片201并存储在芯片容置腔21中。芯片拾取部221与芯片释放部222可以单独设置，也可以由同一个部件完成，也即是说芯片拾取部221与芯片释放部222可以为同一部件。芯片拾取部221可以包括电磁力拾取部件、静电力拾取部件、真空吸附拾取部件中的一个或多个。芯片释放部222可以包括压力释放部件、静电力释放部件、电磁力释放部件、流体释放部件中的一个或多个。
芯片移动部30可以包括例如滑轨等部件，用于移动芯片拾取部21。
芯片绑定部40可以包括回流焊绑定部件和热压键合绑定部件的一个或多个。芯片绑定部40用于在芯片取放部20将发光芯片201放置于缺陷200a的位置时，再对显示面板200整面进行回流焊或热压键合芯片的绑定过程，完成修复动作。
在对显示面板200进行修复的过程中，将显示面板200点亮时，缺陷传感器10对显示面板200进行检查，获取缺陷信息，并将该信心发送至控制器（未图示）。控制器22根据缺陷信息控制芯片取放部20拾取、收集发光芯片201并存储在芯片容置腔21内。可以理解，芯片取放部20也可以预先存储有发光芯片201。芯片移动部30将芯片取放部20移动至需要补充发光芯片201的缺陷200a位置。此时，芯片取放部20的腔体20a相对于显示面板200的显示面垂直。对位后，芯片取放部20释放发光芯片201。芯片绑定部40再对显示面板200整面进行回流焊或热压键合芯片的绑定过程。
相较于现有技术，本申请的显示面板的修复装置，将用于进行缺陷修复的MicroLED发光芯片收集并存储在芯片取放部中，并根据扫描显示面板获得的缺陷信息，在缺陷位置释放发光芯片并绑定。能够获得简化修复制程、缩短工时的有益效果。
以上对本申请实施方式提供了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施方式的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (10)

1.一种显示面板的修复装置，其特征在于，包括：
缺陷传感器，用于对显示面板进行缺陷检查，获得缺陷信息；
芯片取放部，用于拾取、存储和释放发光芯片，所述芯片取放部包括芯片容置腔和控制器，所述芯片容置腔用于存储发光芯片，所述控制器用于拾取和释放芯片；
芯片移动部，所述芯片移动部与所述芯片取放部连接，用于根据所述缺陷信息将所述芯片取放部移动至所述缺陷的位置；以及
芯片绑定部，用于将所述发光芯片绑定在所述显示面板上。
2.如权利要求1所述的显示面板的修复装置，其特征在于，所述芯片容置腔具有沿第一方向延伸的腔体，所述芯片容置腔用于供所述发光芯片层叠设置于所述芯片容置腔中。
3.如权利要求2所述的显示面板的修复装置，其特征在于，所述芯片取放部用于拾取、存储和释放倒装结构芯片，所述腔体为圆柱形腔体，所述第一方向与所述圆柱形腔体的中心轴平行。
4.如权利要求1所述的显示面板的修复装置，其特征在于，所述显示面板的修复装置包括多个芯片取放部，每一所述芯片取放部用于存储一种颜色的所述发光芯片。
5.如权利要求1所述的显示面板的修复装置，其特征在于，所述芯片取放部用于拾取并存储至少一个发光芯片，并在每一所述缺陷的位置逐一释放所述发光芯片。
6.如权利要求1所述的显示面板的修复装置，其特征在于，所述控制器包括用于拾取所述发光芯片的芯片拾取部，所述芯片拾取部包括电磁力拾取部件、静电力拾取部件、真空吸附拾取部件中的一个或多个。
7.如权利要求1或6所述的显示面板的修复装置，其特征在于，所述控制器包括用于将所述发光芯片释放于所述缺陷的位置的芯片释放部，所述芯片释放部包括压力释放部件、静电力释放部件、电磁力释放部件、流体释放部件中的一个或多个。
8.如权利要求1所述的显示面板的修复装置，其特征在于，所述控制器包括用于拾取所述发光芯片的芯片拾取部和用于将所述发光芯片释放于所述缺陷的位置的芯片释放部，所述芯片拾取部与所述芯片释放部为同一部件。
9.如权利要求1所述的显示面板的修复装置，其特征在于，所述缺陷信息包括缺陷的位置、数量和颜色。
10.如权利要求1所述的显示面板的修复装置，其特征在于，所述芯片绑定部包括回流焊绑定部件和热压键合绑定部件的一个或多个。
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