CN111151895A - Process and system for cutting transparent material by utilizing filamentation effect - Google Patents
Process and system for cutting transparent material by utilizing filamentation effect Download PDFInfo
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- CN111151895A CN111151895A CN202010031182.4A CN202010031182A CN111151895A CN 111151895 A CN111151895 A CN 111151895A CN 202010031182 A CN202010031182 A CN 202010031182A CN 111151895 A CN111151895 A CN 111151895A
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- laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
Abstract
The invention provides a process and a system for cutting a transparent material by utilizing a filamentation effect, wherein a nonlinear optical phenomenon generated when ultrafast laser is transmitted in the transparent material is utilized, the dynamic balance between self-focusing and plasma defocusing generated by weak ionization is caused to form a long-distance narrow light beam, and meanwhile, the fine processing of the transparent brittle materials such as glass, sapphire and the like can be realized by controlling the energy and the length of the light beam. The ultra-fast laser is used for processing the sapphire, basically has no microcrack, small broken edge and small section roughness, and has high processing speed. The heat influence of the sapphire with the ink is small, and the ink on the edge is not jagged.
Description
Technical Field
The invention relates to the field of fine processing of transparent materials, in particular to a process and a system for cutting a transparent material by utilizing a filamentation effect.
Background
With the rapid development of the photoelectric industry and the optical communication industry, brittle transparent materials such as glass, sapphire and the like are widely applied due to good comprehensive properties. Therefore, the requirements on the processing quality and the processing efficiency of the brittle material are continuously improved, and the problems of edge breakage, section roughness and the like after the brittle transparent material is processed are more and more emphasized. At present, the processing method of the brittle transparent material mainly comprises the technologies of mechanical cutting, laser ablation cutting, laser invisible cutting, laser Bessel cutting and the like. The two modes of mechanical cutting and laser ablation cutting are not suitable for fine processing, the invisible cutting edge breakage effect is good, but the material efficiency is low when the section roughness is too large and the processing thickness is large, and the laser Bessel cutting edge breakage and the section roughness can meet the requirements but are not suitable for processing multilayer overlapped products.
Therefore, it is a problem to be studied how to solve the problems of efficiency, microcracks, and edge chipping in the process of processing transparent materials.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the process and the system for cutting the transparent material by utilizing the filamentation effect have the advantages of less micro-cracks, small broken edges, small section roughness and high processing speed.
In order to solve the technical problems, the invention adopts the technical scheme that: a process for cutting a transparent material using a filamentation effect, comprising the steps of:
a. pre-cutting of materials: adjusting output parameters of a first laser and confirming a cutting path, wherein laser pulses output by the first laser are gradually released, the laser pulses comprise a pulse envelope, at least 2 sub-pulses are arranged in the pulse envelope, and the laser pulses sequentially pass through a concave lens and a convex lens and then reach the surface of a transparent material;
b. material splitting: the second laser splits the transparent material along the cutting path of the first laser.
Further, in the step a, the first laser is an infrared picosecond laser.
Further, in the step a, the pulse width of the first laser is less than 15 picoseconds, and the single pulse energy of the first laser is greater than 150 μ j.
Further, in the step b, the second laser is a CO2 laser.
Further, in the step b, an industrial positioning camera is used for positioning the cutting path of the transparent material.
Further, the transparent material is sapphire.
Further, in the step a, the pulse envelope of the laser pulse has 3-5 sub-pulses.
Furthermore, in the output parameters of the step a, the cutting thickness is 0.1-10mm, the cutting speed is 50-1000mm/s, the dot spacing is 4-10 μm, and the Q frequency is 50-200 KHz.
Further, in the output parameter of the step a, a focal position of the laser beam of the first laser is a positive focus.
Meanwhile, the invention also provides a system for the process, which comprises a first laser, a reflector, a filamentation cutting head, a precision moving platform, an industrial positioning camera, a second laser and a control system;
the first laser, the filamentation cutting head, the precision moving platform, the industrial positioning camera and the second laser are in electric signal connection with the control system;
the filamentation cutting head comprises a concave lens and a convex lens;
the first laser, the reflector, the concave lens, the convex lens and the precise moving platform are sequentially arranged along a laser light path.
The invention has the beneficial effects that: the method utilizes a nonlinear optical phenomenon, namely optical Kerr effect or filamentation effect, generated when ultrafast laser is transmitted in a transparent material, and the dynamic balance between self-focusing and plasma defocusing generated by weak ionization is caused to form a long-distance narrow light beam, and the high-precision processing of the transparent brittle materials such as glass, sapphire and the like can be realized by controlling the energy and the length of the light beam. The ultra-fast laser is used for processing the sapphire, basically has no microcrack, small broken edge, small section roughness and high processing speed.
Drawings
The specific structure of the invention is detailed below with reference to the accompanying drawings:
FIG. 1 is a schematic diagram of the system operation of the present invention;
FIG. 2 is a schematic diagram of a first laser pulse envelope of the present invention 1;
FIG. 3 is a schematic diagram of a first laser pulse envelope of the present invention 2;
fig. 4 is a schematic diagram 3 of a first laser pulse envelope according to the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 4, the present invention provides a process for cutting a transparent material by using a filamentation effect, comprising the following steps:
a. pre-cutting of materials: adjusting output parameters of the first laser 1 and confirming a cutting path, wherein laser pulses output by the first laser 1 are gradually released, the laser pulses comprise a pulse envelope, at least 2 sub-pulses are arranged in the pulse envelope, and the laser pulses sequentially pass through the concave lens 31 and the convex lens 32 and then reach the surface of the transparent material 8.
b. Material splitting: the second laser splits the transparent material 8 along the cutting path of the first laser.
After the ultra-fast laser processing is adopted, an effect called avalanche ionization can be generated on the transparent material 8, and the processing efficiency is greatly improved. Under the action of intense pulsed light, a small number of electrons directly jump from a 'forbidden band' to a 'conduction band' to become free electrons. These free electrons further strike the adjacent lattice, releasing more free electrons. This chain reaction ablates the material efficiently. This "cold working" mechanism results in the transparent material 8 being processed without microcracks, with small edge breakages and small cross-sectional roughness.
The above-described pulse envelope has at least 2 sub-pulses, which ensures that there is sufficient energy replenishment as the laser penetrates into the material.
The principle utilized in the pre-cutting stage of the material of the invention is as follows: the laser beam of the first laser 1 sequentially passes through the concave lens 31 and the convex lens 32 to introduce a very large spherical aberration, a long-distance focusing focal depth is formed in the beam propagation direction after focusing, and when the focused ultra-wide laser beam irradiates on a transparent brittle material such as glass/sapphire and the like, the refractive index of a medium is changed by high-intensity light, namely the optical kerr effect or the filamentation effect. Since the laser is a gaussian distribution, the energy in the middle region is strong, and the two sides are weak, the change of the refractive index in the beam range is not uniform. The middle area has large refractive index and two small sides, so that the medium area becomes a structure similar to a 'lens', and when the light beam becomes smaller and reaches an critical value, the medium is ionized, the central refractive index is suddenly reduced, the medium area becomes a structure similar to a 'negative lens', and the light beam starts to diverge. When the beam diverges for a distance, the medium is no longer ionized, and again becomes a "lens" structure. Thus, the light beam repeatedly focuses and defocuses in the material, and then self-focuses and defocuses to form a narrow 'light ray' with long distance and concentrated energy, wherein the length at least exceeds the Rayleigh length by a plurality of times. The material is cut apart like a "smooth knife" in the material.
In the step b, the second laser adopts a laser with stronger thermal effect, and the transparent material is split along the cutting path of the first laser. The material near the cutting path falls off along the cutting path due to the effect of expansion with heat and contraction with cold, so that the splinter effect is achieved.
Meanwhile, the invention also provides a system capable of realizing the process, which comprises a first laser 1, a reflector 2, a filamentation cutting head 3, a precision moving platform 4, an industrial positioning camera 5, a second laser 6 and a control system 7;
the first laser 1, the filamentation cutting head 3, the precision moving platform 4, the industrial positioning camera 5 and the second laser 6 are connected with the control system 7 through electric signals;
the filamentation cutting head 3 comprises a concave lens 31 and a convex lens 32;
in the system, a first laser 1, a reflecting mirror 2, a concave lens 31, a convex lens 32 and a precision moving platform 4 are sequentially arranged along a laser light path.
The system works under the unified coordination of the control system 7, and the first laser 1 emits pulse envelope which is reflected by the reflector 2 and then reaches the filamentation cutting head 3. The filamentation cutting head 3 comprises a concave lens 31 and a convex lens 32, the pulse envelope emitted by the first laser 1 introduces very large spherical aberration after passing through the concave lens 31 and the convex lens 32, a long-distance focusing focal depth is formed in the light beam propagation direction after focusing, and when the focused ultra-wide laser is irradiated on a transparent brittle material, such as glass/sapphire and the like, the refractive index of a medium is changed by high-intensity light. The working principle is consistent with the material pre-cutting principle in the process, and the effect of material pre-cutting can be realized.
The control system 7 is connected with the precision moving platform 4, and the transparent material 8 is placed on the precision moving platform 4, so that the cutting path of the transparent material 8 can be precisely controlled.
The control system 7 is also connected with an industrial positioning camera 5, and the industrial positioning camera 5 feeds back the position information to the control system 7 so as to drive the movement of the precision moving platform 4, so that the machining position and the cutting path can be confirmed.
The control system 7 is further connected with a second laser 6, the second laser 6 adopts a laser with a strong heat effect, when a light beam of the second laser 6 passes through a cutting path, materials near the cutting path fall off along the cutting path due to the effects of expansion with heat and contraction with cold, and the splitting effect is achieved.
From the above description, the beneficial effects of the present invention are: the method is characterized in that a laser beam sequentially passes through a concave lens and a convex lens to introduce a very large spherical aberration, a long-distance focusing focal depth is formed in the beam propagation direction after focusing, and when the focused ultra-wide laser beam irradiates on a transparent brittle material such as glass/sapphire and the like, high-intensity light can change the refractive index of a medium, namely the optical Kerr effect or the filamentation effect. High precision processing of transparent brittle materials such as glass and sapphire. At least 2 sub-pulses in the pulse envelope ensure that there is sufficient energy replenishment as the laser penetrates into the material. The transparent material is processed by the process, basically no microcrack exists, the edge breakage is small, the section roughness is small, and the processing speed is high.
Example 1
In the processing process of the transparent material, in order to ensure that the laser has enough energy in the cutting process and can go deep into the material, and further achieve the cutting effect, the first laser 1 in this embodiment selects the infrared picosecond laser to perform pre-cutting of the material.
Because of its advantages of high mohs hardness, excellent electrical insulation performance, high optical transmittance, strong mechanical properties, etc., sapphire is widely used in the fields of national defense and civil industry such as microfluid, window material, LED semiconductor substrate, etc., and modern electronic manufacturing. At present, the processing demand of sapphire is developing towards various aspects such as large thickness, high precision and high efficiency. In this embodiment, the transparent material may be sapphire with a wide range of applications.
The infrared picosecond laser has a pulse width of less than 15 picoseconds to satisfy the avalanche effect that sapphire can form. Meanwhile, the single pulse energy of the infrared picosecond laser is more than 150 mu j, and the threshold value that the sapphire can be filamentated is reached. For different transparent materials, the pulse width and the single pulse energy of the infrared picosecond laser can be adjusted, and the processing requirements of different transparent materials are met.
In the process and the system provided by the invention, the second laser 6 adopts a laser with stronger thermal effect, and when the light beam of the second laser 6 passes through the cutting path, the material near the cutting path falls off along the cutting path due to the effect of expansion with heat and contraction with cold, so that the splitting effect is achieved. In this embodiment, the second laser 6 is a CO2 laser with a strong thermal effect.
In the process and the system provided by the invention, the first laser 1 processes the transparent material according to the cutting path, and the processing position needs to be confirmed in the processing process, so as to realize the processing pattern to be completed on the transparent material. In this embodiment, the machining position is identified by an industrial positioning camera, and the industrial positioning camera employs a CCD camera.
Example 2
In the cutting process, the selection of the output parameters will affect the processing effect, so in this embodiment, the output parameters are further optimized, thereby achieving a better cutting effect, which is specifically as follows:
in the pre-cutting process, the number of the sub-pulses of the pulse envelope is set to be 3-5, so that the pre-cutting effect is convenient for splitting.
In the cutting process of the transparent material, different cutting paths and different products have different requirements on cutting depth, and the processing technology provided by the invention can provide different cutting thicknesses.
Specifically, the cutting of materials with different thicknesses can be realized by changing the laser single pulse energy, the focal length of the concave lens and the convex lens or the distance between the two lenses to change the beam length, so as to achieve different cutting thicknesses, and in the embodiment, the cutting thickness can be selected from 0.1-10 mm.
The cutting speed can be set to be 50-1000mm/s, when the speed is high, the cutting efficiency is higher, and when the speed is low, the control is convenient, and the processing precision is high.
The dot pitch is 4-10 μm, and too small, resulting in too rough cross section after cutting, too large dot pitch, and difficult splintering. When the dot spacing is kept between 4 and 10 mu m, the subsequent splitting work can be facilitated while the small section roughness is ensured.
The Q frequency is 50-200KHz, and the single pulse energy of filamentation effect can be met during the pre-laser cutting.
The focal point position of the laser beam is a positive focal point, the focal point is positioned at the position of zero to dozens of micrometers above the transparent material 8, and the positive focal point can form a filamentation effect.
In summary, the process for cutting a transparent material by using a filamentation effect provided by the present invention utilizes a nonlinear optical phenomenon, i.e., the optical kerr effect or the filamentation effect, generated when ultrafast laser is transmitted in the transparent material, to cause a dynamic balance between self-focusing and plasma defocusing generated by weak ionization to form a long-distance narrow beam, and simultaneously, by controlling the energy and length of the beam, high precision processing of transparent brittle materials such as glass and sapphire can be realized. The ultra-fast laser is used for processing the sapphire, basically has no microcrack, small broken edge and small section roughness, and has high processing speed. The heat influence of the sapphire with the ink is small, and the ink on the edge is not jagged. The cutting of materials with different thicknesses is realized by changing the laser single pulse energy, the focal length of the concave lens and the convex lens or the distance between the two lenses to change the length of the light beam, so as to achieve different cutting thicknesses. Choose for use the precision finishing platform, cooperation industrial positioning camera, improvement machining precision that can be better.
The first … … and the second … … are only used for name differentiation and do not represent how different the importance and position of the two are.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A process for cutting transparent materials by filamentation, comprising the steps of:
a. pre-cutting of materials: adjusting output parameters of a first laser and confirming a cutting path, wherein laser pulses output by the first laser are gradually released, the laser pulses comprise a pulse envelope, at least 2 sub-pulses are arranged in the pulse envelope, and the laser pulses sequentially pass through a concave lens and a convex lens and then reach the surface of a transparent material;
b. material splitting: the second laser splits the transparent material along the cutting path of the first laser.
2. The process for cutting a transparent material using filamentation according to claim 1, wherein: in the step a, the first laser is an infrared picosecond laser.
3. The process for cutting a transparent material using filamentation according to claim 2, wherein: in the step a, the pulse width of the first laser is less than 15 picoseconds, and the single pulse energy of the first laser is greater than 150 μ j.
4. The process for cutting a transparent material using filamentation according to claim 1, wherein: in the step b, the second laser is a CO2 laser.
5. The process for cutting a transparent material using filamentation according to claim 1, wherein: and b, positioning the cutting path of the transparent material by adopting an industrial positioning camera.
6. A process for cutting a transparent material using filamentation according to claim 3, wherein: the transparent material is sapphire.
7. The process for cutting a transparent material using filamentation according to any one of claims 1 to 6, wherein: in the step a, the pulse envelope of the laser pulse has 3-5 sub-pulses.
8. The process for cutting a transparent material using filamentation according to claim 7, wherein: in the output parameters of the step a, the cutting thickness is 0.1-10mm, the cutting speed is 50-1000mm/s, the dot spacing is 4-10 mu m, and the Q frequency is 50-200 KHz.
9. The process for cutting a transparent material using filamentation according to claim 8, wherein: in the output parameters of the step a, the focal position of the laser beam of the first laser is a positive focus.
10. A system for use in the process of any one of claims 1 to 9, wherein: the device comprises a first laser, a reflector, a filamentation cutting head, a precision moving platform, an industrial positioning camera, a second laser and a control system;
the first laser, the filamentation cutting head, the precision moving platform, the industrial positioning camera and the second laser are in electric signal connection with the control system;
the filamentation cutting head comprises a concave lens and a convex lens;
the first laser, the reflector, the concave lens, the convex lens and the precise moving platform are sequentially arranged along a laser light path.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113075908A (en) * | 2021-03-23 | 2021-07-06 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
| CN113333966A (en) * | 2021-05-13 | 2021-09-03 | 西安交通大学 | Femtosecond laser fiber effect-based thin quartz glass cutting method |
| CN114149171A (en) * | 2021-12-27 | 2022-03-08 | 浙江华工光润智能装备技术有限公司 | Nanosecond laser glass splitting method |
| CN115041814A (en) * | 2021-02-26 | 2022-09-13 | 深圳市大族半导体装备科技有限公司 | Laser processing device and method for brittle material |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785031A (en) * | 2012-08-15 | 2012-11-21 | 武汉隽龙科技有限公司 | Method and device for cutting transparent material by using ultra-short pulse laser |
| CN104334312A (en) * | 2012-03-16 | 2015-02-04 | Ipg微***有限公司 | Laser scribing with extended depth affectation into a workpiece |
| CN104625433A (en) * | 2014-12-31 | 2015-05-20 | 武汉华工激光工程有限责任公司 | Method for cutting LED lamp filament transparent material support |
| CN104722928A (en) * | 2009-12-07 | 2015-06-24 | Ipg微***有限公司 | Laser machining and scribing systems and methods |
| CN104959736A (en) * | 2015-07-23 | 2015-10-07 | 深圳英诺激光科技有限公司 | Apparatus and method for processing micropore through filamentous laser |
| CN106392341A (en) * | 2016-11-07 | 2017-02-15 | 武汉华工激光工程有限责任公司 | Brittle material punching method |
| CN108705213A (en) * | 2018-08-08 | 2018-10-26 | 广东正业科技股份有限公司 | A kind of laser processing and device |
| CN108789886A (en) * | 2018-05-31 | 2018-11-13 | 中国科学院西安光学精密机械研究所 | A kind of cutting splitting method of transparent hard brittle material |
| CN109604838A (en) * | 2018-12-24 | 2019-04-12 | 大族激光科技产业集团股份有限公司 | Semiconductor laser processing unit (plant) |
| CN109693032A (en) * | 2019-02-27 | 2019-04-30 | 大族激光科技产业集团股份有限公司 | Laser cutting method and device |
| EP3536440A1 (en) * | 2014-07-14 | 2019-09-11 | Corning Incorporated | Glass article with a defect pattern |
-
2020
- 2020-01-13 CN CN202010031182.4A patent/CN111151895A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104722928A (en) * | 2009-12-07 | 2015-06-24 | Ipg微***有限公司 | Laser machining and scribing systems and methods |
| CN104334312A (en) * | 2012-03-16 | 2015-02-04 | Ipg微***有限公司 | Laser scribing with extended depth affectation into a workpiece |
| CN102785031A (en) * | 2012-08-15 | 2012-11-21 | 武汉隽龙科技有限公司 | Method and device for cutting transparent material by using ultra-short pulse laser |
| EP3536440A1 (en) * | 2014-07-14 | 2019-09-11 | Corning Incorporated | Glass article with a defect pattern |
| CN104625433A (en) * | 2014-12-31 | 2015-05-20 | 武汉华工激光工程有限责任公司 | Method for cutting LED lamp filament transparent material support |
| CN104959736A (en) * | 2015-07-23 | 2015-10-07 | 深圳英诺激光科技有限公司 | Apparatus and method for processing micropore through filamentous laser |
| CN106392341A (en) * | 2016-11-07 | 2017-02-15 | 武汉华工激光工程有限责任公司 | Brittle material punching method |
| CN108789886A (en) * | 2018-05-31 | 2018-11-13 | 中国科学院西安光学精密机械研究所 | A kind of cutting splitting method of transparent hard brittle material |
| CN108705213A (en) * | 2018-08-08 | 2018-10-26 | 广东正业科技股份有限公司 | A kind of laser processing and device |
| CN109604838A (en) * | 2018-12-24 | 2019-04-12 | 大族激光科技产业集团股份有限公司 | Semiconductor laser processing unit (plant) |
| CN109693032A (en) * | 2019-02-27 | 2019-04-30 | 大族激光科技产业集团股份有限公司 | Laser cutting method and device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115041814A (en) * | 2021-02-26 | 2022-09-13 | 深圳市大族半导体装备科技有限公司 | Laser processing device and method for brittle material |
| CN113075908A (en) * | 2021-03-23 | 2021-07-06 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
| CN113075908B (en) * | 2021-03-23 | 2022-04-19 | 王豪 | Method for processing gem and jade artware through numerical control engraving and milling |
| CN113333966A (en) * | 2021-05-13 | 2021-09-03 | 西安交通大学 | Femtosecond laser fiber effect-based thin quartz glass cutting method |
| CN113333966B (en) * | 2021-05-13 | 2022-12-09 | 西安交通大学 | Femtosecond laser fiber effect-based thin quartz glass cutting method |
| CN114149171A (en) * | 2021-12-27 | 2022-03-08 | 浙江华工光润智能装备技术有限公司 | Nanosecond laser glass splitting method |
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Application publication date: 20200515 |
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