CN111146167A - Heat dissipation device and method for pump-driven thin film evaporation high-heat-flux electronic device - Google Patents
Heat dissipation device and method for pump-driven thin film evaporation high-heat-flux electronic device Download PDFInfo
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- CN111146167A CN111146167A CN202010027236.XA CN202010027236A CN111146167A CN 111146167 A CN111146167 A CN 111146167A CN 202010027236 A CN202010027236 A CN 202010027236A CN 111146167 A CN111146167 A CN 111146167A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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Abstract
The invention discloses a heat dissipation device and a heat dissipation method for a pump-driven thin film evaporation high-heat-flux electronic device. The cooling working medium is stored in the liquid storage device, enters the evaporator through the piezoelectric micropump, is driven by the micropump to be cooled to a liquid state through the condenser, and finally enters the liquid storage device. In addition, redundant liquid cooling working medium in the evaporator also enters the liquid storage device. In the evaporator, a liquid cooling working medium is supplemented to the surface of the microstructure from the vertical direction by a liquid supplementing device, and a micro-liquid film with uniform and continuous thickness can be formed between the nano porous film and the surface of the microstructure through the combined action of the liquid supplementing device, the nano porous film, the surface of the microstructure and a liquid channel, so that the heat dissipation under the ultrahigh heat flow density can be realized.
Description
Technical Field
The invention relates to the technical field of cooling and heat exchange enhancement of electronic chips, in particular to a heat dissipation device and method for a pump-driven thin film evaporation high-heat-flux electronic device.
Background
Modern society has already stepped into the electronic information era, and with the change of science and technology, the electronic industry has also developed vigorously. The application of electronic devices covers the military fields of radars, laser weapons, electromagnetic guns and the like; terahertz device and circuit research, spherical radio telescope 'sky eye' and other scientific and technological fields; 5G base station, microwave millimeter wave multilayer circuit substrate and other civilian fields. The development of electronic devices has shown the characteristics of high integration, miniaturization of size, and high frequency of chips, with the concomitant great increase in power of electronic devices. Gallium nitride which belongs to the third generation semiconductor material has larger bandwidth and can generate larger power, the traditional heat dissipation mode can not completely meet the heat dissipation requirement of the electronic device with ultrahigh heat flow density, and the heat dissipation mode which utilizes the phase change mechanism, namely the film evaporation, can utilize the principle that liquid is directly evaporated to gas, and can realize the high-efficiency heat exchange of the electronic device.
The principle of film evaporation, which can accelerate evaporation, is that under the decompression condition, liquid forms a film and has a great vaporization surface area, heat is spread quickly and uniformly, the liquid is directly evaporated into gas, and the thermal failure of the chip can be prevented well by continuously supplementing the liquid to the surface of the chip. The key point that film evaporation can be continuously carried out lies in that the thickness of a thin liquid film can be stably maintained, most of the existing heat dissipation devices based on film evaporation adopt a mode of carrying out liquid supplement from the side surface, the mode of supplementing liquid cannot timely convey fresh liquid to a hot point of a chip center, which is easy to dry and burn, and the heat dissipation capability of the heat dissipation device is difficult to further improve. In addition, this lateral replenishment of liquid does not allow precise control of the thickness of the thin liquid film, and the liquid film may be too thick or too thin. The film is evaporated to boil due to the excessive thickness of the liquid film, and a large amount of bubbles are generated to limit the critical heat flux density of the heat sink. Too small a thickness of the liquid film can result in too little liquid on the surface of the chip, and further generate a large amount of hot spots for dry burning, thereby reaching the heat transfer limit in advance.
Disclosure of Invention
Aiming at the obvious limitations of the existing film evaporation heat dissipation device in fresh liquid supplement and thin liquid film thickness control, the invention provides a heat dissipation device and a heat dissipation method for a pump-driven film evaporation high heat flow density electronic device.
In order to achieve the purpose, the invention adopts the following technical scheme:
a pump-driven thin-film evaporation high-heat-flux-density electronic device heat dissipation device comprises a liquid storage device for storing a cooling working medium, wherein the outlet end of the liquid storage device is connected to an evaporator through a piezoelectric micropump, the steam outlet of the evaporator is connected to a condenser through a micropump, the outlet end of the condenser is connected to the liquid storage device, the liquid outlet of the evaporator is connected to the liquid storage device, and the liquid storage device is provided with a cooling working medium inlet and a cooling working medium outlet;
the evaporator comprises a top cover and a bottom plate which are connected in a matched mode, a hollow cavity is arranged inside the top cover, a mounting hole is formed in the top wall of the hollow cavity, a liquid supplementing device is arranged in the mounting hole in an inserting mode, a mounting groove is formed in the bottom wall of the hollow cavity and located under the liquid supplementing device, a nano porous membrane is fixed in the mounting groove, a micro-structure surface is arranged at the center position of the upper surface of the bottom plate and located under the nano porous membrane, liquid channels are arranged around the micro-structure surface and communicated with liquid outlets, the liquid outlets are formed in the outer edge of the hollow cavity, and steam outlets are formed in the side wall of the hollow cavity.
Further, the top cover and the bottom plate are bonded together by a strong adhesive.
Further, the nano porous membrane is a hydrophilic lyophobic material.
Further, a super-hydrophilic structure is arranged on the surface of the micro-structure.
Furthermore, a first valve is arranged at the outlet end of the liquid storage device, a second valve is arranged at the outlet end of the piezoelectric micropump, a third valve is arranged at the steam outlet of the evaporator, a fourth valve is arranged at the outlet end of the condenser, a fifth valve is arranged at the liquid outlet of the evaporator, a sixth valve is arranged at the cooling working medium inlet of the liquid storage device, and a seventh valve is arranged at the cooling working medium outlet of the liquid storage device.
A pump-driven thin film evaporation high heat flow density electronic device heat dissipation method, cooling working medium is stored in a liquid storage device, enters an evaporator through a piezoelectric micropump, and the generated gaseous cooling working medium is driven by a micropump, cooled to a liquid state through a condenser and finally enters the liquid storage device;
in the evaporator, liquid cooling working medium is supplemented to the surface of the microstructure through the nano porous membrane from the vertical direction by a liquid supplementing device, gaseous cooling working medium generated in the process is discharged out of the evaporator through a steam outlet, redundant liquid cooling working medium is collected through a liquid channel and then is discharged out of the evaporator through a liquid outlet, and meanwhile, a layer of liquid cooling working medium thin film with uniform and continuous thickness is formed between the nano porous membrane and the surface of the microstructure, so that heat dissipation under ultrahigh heat flow density is realized.
Compared with the prior art, the invention has the following beneficial technical effects:
1. according to the invention, by utilizing the principle of thin film evaporation, liquid is supplied to the center position above the surface of the heat radiator microstructure through the pump drive, the thickness of the formed micro liquid film is controlled by controlling the distance between the nano porous film and the surface of the heat radiator microstructure, and redundant liquid can be timely discharged from a liquid channel formed between the nano porous film and the surface of the heat radiator microstructure to the periphery, so that fresh liquid can be timely supplemented to the surface of the heat radiation microstructure, the liquid required by continuous evaporation is ensured, the dry burning phenomenon in a local area is avoided, and the heat radiation capability of the heat radiation device is improved.
2. The nano porous membrane related to the invention is a thin membrane which can pass gas but can not pass liquid, and the evaporated gaseous cooling working medium is pumped by a gas pump to move away, so that the evaporation rate is accelerated, and the heat dissipation capability of the heat dissipation device can be further improved.
3. The super-hydrophilic structure is arranged on the surface of the micro-structure of the radiator, so that the formation of a micro-liquid film and the supplement of fresh liquid are facilitated, and the heat radiation capability of the radiator can be further improved.
Drawings
FIG. 1 is a schematic diagram of the apparatus of the present invention;
FIG. 2 is a three-dimensional view of the evaporator of the present invention;
FIG. 3 is an exploded view of the evaporator of the present invention;
FIG. 4 is a front view of the evaporator of the present invention;
FIG. 5 is a top plan view of the evaporator of the present invention;
FIG. 6 is a view of the A-A side of the evaporator of the present invention;
FIG. 7 is a three-dimensional view of the top cover of the present invention;
FIG. 8 is a front view of the top cover of the present invention;
FIG. 9 is a top view of the overcap of the present invention;
FIG. 10 is a view of side B-B of the overcap of the present invention;
FIG. 11 is a bottom view of the top cover of the present invention;
FIG. 12 is a three-dimensional view of the base plate of the present invention;
FIG. 13 is a top view of the base plate of the present invention;
figure 14 is a C-C side view of the base plate of the present invention.
Wherein, 1, a liquid storage device; 2. a piezoelectric micropump; 3. an evaporator; 4. a micro-pump; 5. a condenser; 6. a first valve; 7. a second valve; 8. a third valve; 9. a fourth valve; 10. a fifth valve; 11. a sixth valve; 12. a seventh valve; 13. a liquid supplementing device; 14. a top cover; 15. a base plate; 16. a nanoporous membrane; 17. mounting holes; 18. a steam outlet; 19. a liquid outlet; 20. mounting grooves; 21. a microstructured surface; 22. a liquid passage.
Detailed Description
The invention is described in further detail below:
referring to fig. 1 to 14, a heat dissipation device for an electronic device with high heat flux density based on pump-driven thin film evaporation comprises a liquid storage device 1 for storing a cooling working medium, a piezoelectric micropump 2 for driving the cooling working medium to circulate, an evaporator 3 for generating steam, a micropump 4 for driving a gaseous cooling working medium, a condenser 5 for cooling the gaseous cooling working medium, and pipelines and valves for connecting the components.
The evaporator 3 is composed of a liquid supplementing device 13, a top cover 14, a bottom plate 15, a nano porous membrane 16 and a surface microstructure 21, wherein the center of the upper surface of the top cover 14 is provided with a mounting hole 17 for mounting the liquid supplementing device 13, the side surface is provided with a steam outlet 18 for discharging gaseous cooling working medium, the periphery of the upper surface is provided with a liquid outlet 19 for discharging redundant liquid cooling working medium, the center of the lower surface is provided with a mounting groove 20 for fixing the nano porous membrane 16, the nano porous membrane 16 is mounted above the center of the bottom plate 15 and is fixed through the mounting groove 20 of the lower surface of the top cover 14, the center of the upper surface of the bottom plate 15 is provided with a microstructure surface 21, the center and the periphery of the upper surface are provided with a liquid channel 22 for discharging redundant liquid cooling working medium, the top cover 14 and the bottom plate 15 are bonded together through a strong adhesive, the super-hydrophilic structure is arranged on the surface 21 of the micro-structure, which is more beneficial to the formation of a micro-liquid film.
The cooling working medium is stored in the liquid storage device 1, is driven by the piezoelectric micropump 2 through the first valve 6, and enters the evaporator 3 through the second valve 7. The gaseous cooling working medium generated in the evaporator 3 enters the condenser 5 through the third valve 8 and driven by the micro pump 4, is condensed to a liquid state, and finally enters the liquid storage device 1 through the fourth valve 9. The redundant liquid cooling working medium in the evaporator 3 enters the liquid storage device 1 through the fifth valve 10, and the whole circulation process is completed. In addition, the liquid storage device 1 is also provided with a sixth valve 11 for adding a cooling working medium and a seventh valve 12 for discharging the cooling working medium.
The liquid supplementing mode can timely convey the fresh liquid to the hot spot where the chip is easy to dry and burn. The nano porous membrane is a material which is hydrophilic and lyophobic, can ensure the smooth passing of steam, and simultaneously limits liquid on one side of the membrane. The super-hydrophilic microstructure can timely convey fresh liquid. The coupling structure of the micro-nano porous membrane and the super-hydrophilic microstructure can ensure the stability of the thickness of a liquid film and can convey liquid to a hot spot on the surface of a chip in time. Based on the structure, the invention can meet the heat dissipation requirement under the ultrahigh heat flow density.
The invention is described in further detail below with reference to the following figures and specific embodiments:
referring to fig. 2, 3, 4, 5, 6, the liquid cooling medium passes through the fluid infusion device 13, passes through the nanoporous membrane 16, and reaches the microstructure surface 21. The liquid cooling working medium passes through the channel formed between the nanoporous membrane 16 and the microstructure surface 21 to form a stable thin liquid film.
Referring to fig. 7, 8, 9, 10 and 11, a hollow cavity is formed inside the top cover 14 for temporarily accommodating the generated gaseous cooling medium. The top cover 14 is provided with a mounting hole 17 for mounting the liquid supplementing device 13, a steam outlet 18 for discharging the generated gaseous cooling working medium, a liquid outlet 19 for discharging the redundant liquid cooling working medium, and a mounting groove 20 for fixing the nano porous membrane 16. The liquid infusion device 13 is arranged in a mounting hole 17 in the center of the upper surface of the top cover 14, and the cooling working medium can uniformly flow from the center of the microstructure surface 21 to the periphery.
Referring to fig. 12, 13, 14, the base plate 15 is provided with a microstructured surface 21, liquid channels 22. The microstructure surface 21 is provided with a hydrophilic structure and the liquid channel 22 is used for discharging the surplus liquid cooling working medium out of the evaporator 3.
The working principle of the invention is as follows:
the cooling working medium is stored in the liquid storage device 1, enters the evaporator 3 through the piezoelectric micropump 2, is driven by the micropump 4 to be cooled to a liquid state through the condenser 5, and finally enters the liquid storage device 1. In addition, redundant liquid cooling working medium in the evaporator also enters the liquid storage device 1.
In the evaporator 3, the liquid cooling working medium is supplemented to the microstructure surface 21 from the vertical direction by the liquid supplementing device 13, the generated gaseous cooling working medium is discharged out of the evaporator 3 in time due to the hydrophilic and hydrophobic effects of the nano porous membrane 16, and the liquid channel 22 is arranged, so that the redundant liquid cooling working medium is discharged out of the evaporator 3 in time. The structures can limit the liquid cooling working medium at the lower side of the nano porous membrane 16, so that a layer of liquid cooling working medium thin film with uniform and continuous thickness can be formed between the nano porous membrane 16 and the microstructure surface 21, and heat dissipation under ultrahigh heat flow density can be realized. Meanwhile, the super-hydrophilic microstructures are arranged on the microstructure surface 21, so that the cooling working medium can be more uniformly distributed on the microstructure surface, a micro liquid film can be more favorably formed, the dry burning phenomenon of the microstructure surface 21 can be avoided, and the critical heat flux density can be further improved.
When the heat dissipation device is used, the heat dissipation device is attached to a heating chip (or other heating components), an electronic device needing heat dissipation is attached to the lower surface of the microstructure through heat conduction glue or other modes, heat generated by the electronic device is conducted to the surface of the microstructure, and then the heat is taken away through evaporation of a liquid film formed between the surface of the microstructure and the nano porous film, so that heat dissipation under ultrahigh heat flow density can be met, the development trend of the electronic device towards the ultrahigh heat flow density direction is well met, and the heat dissipation device has a wide application prospect. The key point of the invention is to form a cooling working medium film, namely, the cooling working medium film between the microstructure surface and the nano porous film is formed, and a large amount of heat is taken away through the continuous and stable film to realize heat dissipation under high heat flux density.
Claims (6)
1. A pump-driven thin-film evaporation high-heat-flux-density electronic device heat dissipation device is characterized by comprising a liquid storage device (1) used for storing a cooling working medium, wherein the outlet end of the liquid storage device (1) is connected to an evaporator (3) through a piezoelectric micropump (2), a steam outlet (18) of the evaporator (3) is connected to a condenser (5) through a micropump (4), the outlet end of the condenser (5) is connected to the liquid storage device (1), a liquid outlet (19) of the evaporator (3) is connected to the liquid storage device (1), and the liquid storage device (1) is provided with a cooling working medium inlet and a cooling working medium outlet;
the evaporator (3) comprises a top cover (14) and a bottom plate (15) which are connected in a matched mode, a hollow cavity is arranged inside the top cover (14), a mounting hole (17) is formed in the top wall of the hollow cavity, a liquid supplementing device (13) is arranged in the mounting hole (17) in an inserting mode, a mounting groove (20) is formed in the bottom wall of the hollow cavity, the mounting groove (20) is located right below the liquid supplementing device (13), a nano porous membrane (16) is fixed in the mounting groove (20), a micro structure surface (21) is arranged in the center of the upper surface of the bottom plate (15), the micro structure surface (21) is located right below the nano porous membrane (16), and liquid channels (22) are arranged on the periphery of the micro structure surface (21, and the liquid passage (22) is communicated with the liquid outlet (19), the liquid outlet (19) is arranged on the outer edge of the hollow cavity, and the steam outlet (18) is arranged on the side wall of the hollow cavity.
2. A pump drive membrane evaporative high heat flux density electronic device heat sink as claimed in claim 1 wherein said top cover (14) and base plate (15) are bonded together by a strong adhesive.
3. The heat sink for pump-drive thin film evaporative high heat flux high thermal density electronic devices of claim 1, wherein the nanoporous membrane is a lyophilic and lyophobic material.
4. The heat sink for pump-driven thin film evaporative high heat flux high heat density electronic devices as claimed in claim 1, wherein the micro-structured surface (21) is provided with super-hydrophilic structures.
5. The heat dissipation device for the pump-driven thin-film evaporation high-heat-flux-density electronic device as claimed in claim 1, wherein the outlet end of the liquid storage device (1) is provided with a first valve (6), the outlet end of the piezoelectric micropump (2) is provided with a second valve (7), the steam outlet (18) of the evaporator (3) is provided with a third valve (8), the outlet end of the condenser (5) is provided with a fourth valve (9), the liquid outlet (19) of the evaporator (3) is provided with a fifth valve (10), the cooling medium inlet of the liquid storage device (1) is provided with a sixth valve (11), and the cooling medium outlet of the liquid storage device (1) is provided with a seventh valve (12).
6. A heat dissipation method for a pump-driven thin film evaporation high heat flux density electronic device is characterized in that a cooling working medium is stored in a liquid storage device (1), enters an evaporator (3) through a piezoelectric micropump (2), is driven by a micropump (4), is cooled to be in a liquid state through a condenser (5), and finally enters the liquid storage device (1), and in addition, redundant liquid cooling working medium in the evaporator (3) also enters the liquid storage device (1);
in the evaporator (3), a liquid cooling working medium is supplemented to the surface (21) of the microstructure through the nano porous membrane (16) from the vertical direction by a liquid supplementing device (13), a gaseous cooling working medium generated in the process is discharged out of the evaporator (3) through a steam outlet (18), redundant liquid cooling working medium is collected through a liquid channel (22) and then discharged out of the evaporator (3) through a liquid outlet (19), and meanwhile, a layer of liquid cooling working medium film with uniform and continuous thickness is formed between the nano porous membrane (16) and the surface (21) of the microstructure, so that heat dissipation under ultrahigh heat flow density is realized.
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| CN202010027236.XA CN111146167B (en) | 2020-01-10 | 2020-01-10 | Pump-driven film evaporation third-generation semiconductor electronic device heat dissipation device and method |
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| CN202010027236.XA CN111146167B (en) | 2020-01-10 | 2020-01-10 | Pump-driven film evaporation third-generation semiconductor electronic device heat dissipation device and method |
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| CN111146167A true CN111146167A (en) | 2020-05-12 |
| CN111146167B CN111146167B (en) | 2021-08-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111613592A (en) * | 2020-06-05 | 2020-09-01 | 中国科学院工程热物理研究所 | Electronic device cooling device |
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| CN108444325A (en) * | 2018-03-19 | 2018-08-24 | 桂林电子科技大学 | A kind of cooling device that nano thin-film is combined with microchannel |
| CN109979900A (en) * | 2019-04-15 | 2019-07-05 | 北京工业大学 | A kind of microchannel of GaN HEMT device substrate grade-nanoporous composite construction evaporator |
| CN110650614A (en) * | 2019-09-10 | 2020-01-03 | 西安交通大学 | Electronic chip heat dissipation experimental device based on thin film evaporation |
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2020
- 2020-01-10 CN CN202010027236.XA patent/CN111146167B/en active Active
Patent Citations (6)
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| US6948556B1 (en) * | 2003-11-12 | 2005-09-27 | Anderson William G | Hybrid loop cooling of high powered devices |
| EP3361201A1 (en) * | 2017-02-10 | 2018-08-15 | Hamilton Sundstrand Corporation | Dual-mode thermal management loop |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111613592A (en) * | 2020-06-05 | 2020-09-01 | 中国科学院工程热物理研究所 | Electronic device cooling device |
| CN111613592B (en) * | 2020-06-05 | 2022-05-17 | 中国科学院工程热物理研究所 | Electronic device cooling device |
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