CN111613592A - Electronic device cooling device - Google Patents
Electronic device cooling device Download PDFInfo
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- CN111613592A CN111613592A CN202010509524.9A CN202010509524A CN111613592A CN 111613592 A CN111613592 A CN 111613592A CN 202010509524 A CN202010509524 A CN 202010509524A CN 111613592 A CN111613592 A CN 111613592A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present disclosure provides an electronic device cooling apparatus, including: the working body (1) is a sealed cavity, a cooling medium is arranged in the sealed cavity, a plurality of micro-channels (2) are arranged on the inner bottom surface of the sealed cavity, a nano porous film (3) with capillary force is arranged on the upper portions of the micro-channels (2), a heat conduction structure (4) is arranged outside the bottom surface of the sealed cavity, and an electronic device (12) exchanges heat with the cooling medium through the heat conduction structure (4); a heat sink (5) provided on an outer surface of the working body (1) to dissipate heat in the working body (1); and the energy storage device (6) is arranged at the upper part of the working body (1) and is used for stabilizing the pressure in the working body.
Description
Technical Field
The present disclosure relates to the field of electronic device thermal management technologies, and in particular, to an electronic device cooling apparatus.
Background
With the rapid development of high performance, miniaturization and integration of electronic equipment, the power consumption per unit volume and the heat flow density of the electronic equipment are increased sharply. It is predicted that the average heat flux density of the electronic chip will reach 500W/cm2The local hot spot heat flow density will exceed 1000W/cm2. The control of the temperature of the chip is crucial, and for an electronic chip which stably and continuously works, the maximum temperature cannot exceed 85 ℃, and the chip can be damaged due to overhigh temperature. Research shows that in the range of 70-80 ℃, the reliability of the system is reduced by 50% when the temperature of a single electronic element is increased by 10 ℃. Statistically, over 55% of electronic devices fail due to excessive temperatures. Therefore, in order to ensure normal, stable and reliable operation of the electronic equipment, the electronic equipment must be timely operatedThe waste heat generated by power dissipation is taken away, otherwise, the local temperature of the chip is overhigh, the working performance, the stability and the service life of equipment are greatly reduced, even the thermal deformation and the system breakdown of the chip are caused, and the heat dissipation is a bottleneck problem restricting the development of the chip. At present, the traditional cooling methods such as air cooling, forced water cooling, heat pipe, semiconductor refrigeration and microchannel have limited space for improving cooling capacity, and are difficult to meet the actual heat dissipation requirements of electronic equipment with continuously improved power density. Therefore, the development of a new advanced efficient micro-scale heat management technology is urgently needed, the heat management problem of a neck clamp in a core technology is effectively solved, and the national political safety, economic safety, military safety and social safety are fundamentally guaranteed.
Disclosure of Invention
Technical problem to be solved
The utility model provides an electron device cooling device to satisfy the actual heat dissipation demand of the electronic equipment that power density constantly improves, promote electron device's heat-sinking capability.
(II) technical scheme
The present disclosure provides an electronic device cooling apparatus, including: the working body 1 is a sealed cavity, a cooling medium is arranged in the sealed cavity, a plurality of micro-channels 2 are arranged on the inner bottom surface of the sealed cavity, a nano porous film 3 with capillary force is arranged on the upper portions of the micro-channels 2, a heat conducting structure 4 is arranged outside the bottom surface of the sealed cavity, and the electronic device 12 exchanges heat with the cooling medium through the heat conducting structure 4; a heat sink 5 provided on an outer surface of the working body 1 to dissipate heat in the working body 1; and the energy storage device 6 is arranged at the upper part of the working body 1 and is used for stabilizing the pressure in the working body.
Alternatively, the working body 1 includes an evaporation section 7 and a condensation section 8, the bottom of the condensation section 8 is lower than the bottom of the evaporation section 7, and the plurality of microchannels 2 are provided on the inner bottom surface of the evaporation section 7.
Alternatively, the evaporation section 7 and the condensation section 8 are connected by two pipes 13, wherein one pipe 13 connects the lower portions of the evaporation section 7 and the condensation section 8, the height of the pipe 13 is lower than the upper surface of the nanoporous membrane 3, and the other pipe 13 connects the upper portions of the evaporation section 7 and the condensation section 8.
Optionally, the energy storage means 6 is provided on the upper pipe 13.
Optionally, a heat sink 5 is provided on the outer surface of the condenser 8.
Optionally, the heat sink 5 comprises fins 9 and a fan 10.
Optionally, the heat sink 5 further comprises a thermoelectric heat exchange device 11, and the fan 10 is operated by the electric energy generated by the thermoelectric heat exchange device 11.
Optionally, a heat conducting structure 4 is arranged between the thermoelectric heat exchange device 11 and the working body 1.
Optionally, the thickness of the nanoporous film 3 is 100-500 nm, and the inner pore diameter of the nanoporous film 3 is 50-200 nm.
Optionally, the length or width of the micro-channels 2 is 1-5 μm, and the distance between the micro-channels 2 is 1.5-5.5 μm.
(III) advantageous effects
The present disclosure provides an electronic device cooling device, which at least achieves the following technical effects:
can realize 500-1000W/cm under the conditions that the surface temperature of the electronic device 12 is not higher than 85 ℃ and no external power is input2The heat dissipation capacity of (1);
the evaporation and heat dissipation of the cooling medium on the nano porous film are relied on, so that the heat exchange is stable, the surface temperature distribution of the electronic device is uniform, and the condition of heat exchange capacity fluctuation in the existing boiling heat exchange can not occur;
the capillary force of the nano porous film is far higher than the flow resistance of a cooling medium to be overcome, so that the liquid is stably conveyed and cannot dry up, and the whole system is safe and reliable.
Drawings
Fig. 1 schematically illustrates a schematic structural view of an electronic device cooling apparatus according to an embodiment of the present disclosure;
fig. 2 schematically illustrates a structural schematic diagram of another electronic device cooling apparatus according to an embodiment of the present disclosure.
[ description of the drawings ]
1-a working body; 2-a microchannel; 3-a nanoporous film; 4-a thermally conductive structure; 5-a heat dissipation device; 6-an energy storage device; 7-an evaporation section; 8-a condensation section; 9-a fin; 10-a fan; 11-a thermoelectric heat exchange device; 12-an electronic device; 13-a pipeline; 14-motor.
Detailed Description
An electronic device cooling apparatus includes a working body 1, a heat dissipating device 5, and an energy storage device 6, wherein: the working body 1 is a sealed cavity, a cooling medium is arranged in the sealed cavity, a plurality of micro-channels 2 are arranged on the inner bottom surface of the sealed cavity, a nano porous film 3 with capillary force is arranged on the upper portions of the micro-channels 2, a heat conducting structure 4 is arranged outside the bottom surface of the sealed cavity, and the electronic device 12 exchanges heat with the cooling medium through the heat conducting structure 4; a heat sink 5 provided on an outer surface of the working body 1 to dissipate heat in the working body 1; and the energy storage device 6 is arranged at the upper part of the working body 1 and is used for stabilizing the pressure in the working body.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
The working body 1, the working body 1 can be arranged in various ways, such as a split design shown in fig. 1. At this time, the working body 1 comprises an evaporation part 7 and a condensation part 8 which are connected through two pipelines 13, wherein one pipeline 13 is connected with the lower parts of the evaporation part 7 and the condensation part 8 and is used for the flow of liquid cooling media between the evaporation part 7 and the condensation part 8 to ensure that the highest liquid level of the evaporation part 7 and the condensation part 8 are the same, the bottom of the condensation part 8 is lower than the bottom of the evaporation part 7, and the liquid amount in the condensation part 8 is 2-6 times of the liquid amount in the evaporation part 7; another pipe 13 connects the upper parts of the evaporation section 7 and the condensation section 8 for the flow of liquid cooling medium therebetween. A plurality of micro-channels 2 are arranged on the inner bottom surface of the evaporation part 7, the micro-channels 2 are of a convex structure, and a cooling medium can be stored in the micro-channels 2. The microchannel coating may be formed by vapor deposition and then etched to form the microchannel structure. The length and width of the micro-channel 2 are too large, so that the thermal resistance is increased; the size is too small, the liquid of the micro-channel is easy to dry, therefore, the length or width range of the micro-channel 2 in the embodiment of the present disclosure is preferably 1 to 5 μm, the space between the micro-channels 2 determines the liquid supply amount of the channel, the rib between the micro-channel and the micro-channel also maintains enough strength to support the upper nano-film, therefore, the space between the micro-channels 2 in the embodiment of the present disclosure is preferably 1.5 to 5.5 μm, and an etching method can be adopted. The upper part of the micro-channel 2 supports a nano-porous film 3 with capillary force, and the nano-porous film 3 is supported by the micro-channel 2 below the nano-porous film and can be jointed together through melting diffusion. The micro-channel 2 can be made of silicon, silicon carbide, diamond, alumina and other materials. The micro-channel 2 is internally stored with a cooling medium which can stably supply liquid for the nano-porous film 3, thereby ensuring the heat exchange stability and preventing the liquid in the nano-porous film 3 from drying up. The cooling medium is evaporated in the nano porous film 3, power can be provided for conveying the cooling medium, and the highest pressure can reach 1 MPa. The thickness of the nano porous film 3 is preferably 100-500 nm, if the size of the nano porous film 3 is too large, the capillary force is reduced, and insufficient liquid supply is caused, the inner pore diameter of the nano porous film 3 in the embodiment of the disclosure is preferably 50-200nm, an etching processing method can be adopted, the distribution uniformity of nano pores is better, and the capillary force is stronger. The material of the nano-porous film 3 can be silicon, silicon carbide, diamond, alumina and other materials. When the cooling medium is filled, the filling is stopped when the cooling medium in the evaporation part 7 just passes through the upper part of the nano-porous film 3. The lower part of the micro channel 2 is provided with a heat conducting structure 4, which may be heat conducting silica gel in the embodiment of the present disclosure, the heat conducting structure 4 is arranged outside the bottom surface of the evaporation portion 7, the lower part of the heat conducting structure 4 is provided with an electronic device 12, and the electronic device 12 exchanges heat with a cooling medium through the heat conducting structure 4. The cooling medium in the disclosed embodiment may be water, R245fa, n-pentane, methanol, or the like.
The heat sink 5 may include fins 9, a fan 10, a thermoelectric heat exchange device 11, and the like. The heat dissipation device 5 is arranged on the outer surface of the condensation part 8 of the working body 1 to strengthen the heat exchange of the condensation part 8, for example, the fins 9 increase the condensation area and strengthen the heat exchange; the thermoelectric heat exchange device 11 receives heat emitted by cooling medium steam, and rapidly emits the heat to ambient air through fins in the thermoelectric heat exchange device; the top of condensation part can set up the fan, increases the speed of air vortex, also can accelerate the condensation process, and thermoelectric heat exchange device 11 can also produce the electric energy when giving off the heat, through supplying power for motor 14 to the drive fan rotates, does not need external input electric power. The heat conducting structure 4 can be arranged between the thermoelectric heat exchange device 11 and the working body 1 to reduce the heat conducting resistance between the thermoelectric heat exchange device and the working body.
The energy storage device 6 is arranged at the upper part of the working body 1 and is used for stabilizing the pressure in the working body 1. Preferably a diaphragm accumulator. For example, may be provided on an upper pipe connecting the evaporation section 7 and the condensation section 8 to secure a pressure difference between the evaporation section 7 and the condensation section 8.
The working body 1 in the embodiment of the present disclosure may also adopt an integrated structure as shown in fig. 2, where the evaporation portion 7 and the condensation portion 8 are a chamber, the cooling medium evaporates at the lower portion of the chamber to generate steam, the cooling medium steam moves to the upper portion of the chamber under the driving of pressure, and is rapidly condensed into a liquid state under the action of the heat dissipation device 5, and the liquid flows back to the lower portion of the chamber along the wall surface under the action of gravity, so as to perform heat dissipation in a reciprocating cycle.
The working process of the split cooling device is described as follows:
before the electronic device works, the electronic device cooling device is vacuumized, then the condensing part is filled with cooling medium, the highest liquid level of the evaporating part 7 and the highest liquid level of the condensing part 8 are the same as each other because the evaporating part 7 and the condensing part 8 are connected through a pipeline, and the lowest liquid level of the condensing part 8 is lower than that of the evaporating part 7, so that the liquid amount in the condensing part 8 is 2-6 times of that in the evaporating part 7. When the cooling medium is filled, the filling is stopped when the cooling medium in the evaporation part 7 just submerges the upper surface of the nanoporous film 3. After the electronic device works, heat begins to be emitted, the heat is transmitted to the bottom of the evaporation part 7 through the heat conduction structure 4, the cooling medium in the evaporation part 7 begins to evaporate in the nano porous film 3 after absorbing the heat, and the evaporation speed is increased along with the increase of input heat. The nano porous film 3 can form a capillary force of about 1MPa, and the cooling medium in the nano porous film 3 is continuously absorbed and supplemented by the capillary force of the nano porous film 3 after being evaporated, so that the nano porous film 3 is ensured to be continuously evaporated, and the cooling medium cannot be dried. The nano-porous film 3 is supported by the structure of the micro-channel 2 below the nano-porous film 3, and meanwhile, the micro-channel 2 stores cooling media which stably supply liquid for the nano-porous film 3, so that the heat exchange stability is ensured, and the liquid in the nano-porous film 3 is prevented from being dried up. After the cooling medium is evaporated, the pressure in the evaporation cavity is increased, and the inside of the condensation part 8 is still vacuum, so that the steam enters the condensation part 8 and starts to condense under the driving of the pressure difference. At this time, the inside of the energy storage device 6 is still maintained in a vacuum state, and a pressure difference is also formed between the evaporation part 7 and the energy storage device 6 to provide power for the steam output from the evaporation part 7. Because the condensing part 8 is externally provided with the fins 9, the condensing area can be increased, the heat exchange is strengthened, meanwhile, the outside of the condensing part 8 is also provided with the thermoelectric heat exchange device 11, after the heat dissipated by the cooling medium steam is transmitted into the thermoelectric heat exchange device 11, the heat dissipation end of the thermoelectric heat exchange device 11 rapidly dissipates the heat into the surrounding air through the fins 9. The top of the condensation section 8 may also be provided with a fan 10 to increase the air turbulence rate and also speed up the condensation process. After the liquid is condensed, the pressure in the condensation part 8 is reduced, so that the pressure difference between the evaporation part 7 and the condensation part 8 is also maintained, and the power for conveying the cooling medium steam to the condensation part 8 is provided. The thermoelectric heat exchange device 11 generates electric power while emitting heat, and drives the fan 10 to rotate by supplying power to the motor 14, so that external input of electric power is not required.
In summary, the electronic device cooling device can realize 500-1000W/cm under the conditions that the surface temperature of the electronic device 12 is not higher than 85 ℃ and no external power is input2The heat dissipation capacity of (1); because the heat exchange is stable and the surface temperature of the electronic device is uniformly distributed, the condition of heat exchange capacity fluctuation in the existing boiling heat exchange can not occur; the capillary force of the nano porous film is far higher than the flow resistance of a cooling medium to be overcome, so that the liquid is stably conveyed and cannot dry up, and the whole system is safe and reliable.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An electronic device cooling apparatus comprising:
the working body (1) is a sealed cavity, a cooling medium is arranged in the sealed cavity, a plurality of micro-channels (2) are arranged on the bottom surface of the interior of the sealed cavity, a nano porous film (3) with capillary force is arranged on the upper portions of the micro-channels (2), a heat conduction structure (4) is arranged outside the bottom surface of the sealed cavity, and an electronic device (12) exchanges heat with the cooling medium through the heat conduction structure (4);
a heat sink (5) provided on an outer surface of the working body (1) to dissipate heat in the working body (1);
and the energy storage device (6) is arranged at the upper part of the working body (1) and is used for stabilizing the pressure in the working body.
2. The cooling device according to claim 1, wherein the working body (1) comprises an evaporation portion (7) and a condensation portion (8), a bottom of the condensation portion (8) is lower than a bottom of the evaporation portion (7), and the plurality of microchannels (2) are provided in an inner bottom surface of the evaporation portion (7).
3. The cooling device according to claim 2, wherein the evaporation section (7) and the condensation section (8) are connected by two pipes (13), wherein one pipe (13) connects the lower part of the evaporation section (7) and the condensation section (8), the height of the pipe (13) is lower than the upper surface of the nanoporous membrane (3), and the other pipe (13) connects the upper part of the evaporation section (7) and the condensation section (8).
4. A cooling device according to claim 3, said energy accumulating means (6) being provided on the upper pipe (13).
5. A cooling device according to claim 2, said heat sink (5) being provided on an outer surface of said condenser (8).
6. Cooling device according to claim 5, the heat sink (5) comprising fins (9) and a fan (10).
7. Cooling device according to claim 6, the heat sink (5) further comprising a thermoelectric heat exchanging device (11), the electric energy generated by the thermoelectric heat exchanging device (11) being used for operating the fan (10).
8. Cooling device according to claim 7, a heat conducting structure (4) being provided between the thermoelectric heat exchange device (11) and the working body (1).
9. The cooling device according to claim 1, wherein the thickness of the nanoporous film (3) is 100 to 500nm, and the inner pore diameter of the nanoporous film (3) is 50 to 200 nm.
10. The cooling device according to claim 1, wherein the length or width of the micro-channels (2) is in the range of 1-5 μm, and the spacing between the micro-channels (2) is in the range of 1.5-5.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010509524.9A CN111613592B (en) | 2020-06-05 | 2020-06-05 | Electronic device cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010509524.9A CN111613592B (en) | 2020-06-05 | 2020-06-05 | Electronic device cooling device |
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| Publication Number | Publication Date |
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| CN111613592A true CN111613592A (en) | 2020-09-01 |
| CN111613592B CN111613592B (en) | 2022-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010509524.9A Active CN111613592B (en) | 2020-06-05 | 2020-06-05 | Electronic device cooling device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113225991A (en) * | 2021-04-30 | 2021-08-06 | 深圳市汇川技术股份有限公司 | Heat dissipation device and electronic device |
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| CN108444325A (en) * | 2018-03-19 | 2018-08-24 | 桂林电子科技大学 | A kind of cooling device that nano thin-film is combined with microchannel |
| CN111146167A (en) * | 2020-01-10 | 2020-05-12 | 西安交通大学 | Heat dissipation device and method for pump-driven thin film evaporation high-heat-flux electronic device |
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2020
- 2020-06-05 CN CN202010509524.9A patent/CN111613592B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20030051859A1 (en) * | 2001-09-20 | 2003-03-20 | Chesser Jason B. | Modular capillary pumped loop cooling system |
| US20080164010A1 (en) * | 2007-01-09 | 2008-07-10 | Shung-Wen Kang | Loop heat pipe with flat evaportor |
| CN103327790A (en) * | 2013-05-17 | 2013-09-25 | 华为技术有限公司 | Heat radiating device and heat radiating system |
| CN103415192A (en) * | 2013-08-20 | 2013-11-27 | 南京理工大学 | Temperature averaging device of steam chamber heat pipe/microchannel cold plate composite structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113225991A (en) * | 2021-04-30 | 2021-08-06 | 深圳市汇川技术股份有限公司 | Heat dissipation device and electronic device |
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