CN111063607A - 晶片的加工方法 - Google Patents

晶片的加工方法 Download PDF

Info

Publication number: CN111063607A
Authority: CN; China
Prior art keywords: wafer; polyolefin sheet; sheet; frame; dividing
Prior art date: 2018-10-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

CN201910966765.3A

Other languages

English (en)

Chinese (zh)

Inventor

原田成规

松泽稔

木内逸人

淀良彰

荒川太朗

上里昌充

河村慧美子

藤井祐介

宫井俊辉

大前卷子

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Disco Corp

Original Assignee

Disco Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2018-10-17

Filing date

2019-10-12

Publication date

2020-04-24

2019-10-12 Application filed by Disco Corp filed Critical Disco Corp

2020-04-24 Publication of CN111063607A publication Critical patent/CN111063607A/zh

Status Pending legal-status Critical Current

Links

238000000034 method Methods 0.000 title claims abstract description 25
229920000098 polyolefin Polymers 0.000 claims abstract description 132
238000010438 heat treatment Methods 0.000 claims abstract description 24
230000010354 integration Effects 0.000 claims abstract description 21
238000003672 processing method Methods 0.000 claims abstract description 13
230000001678 irradiating effect Effects 0.000 claims abstract description 6
-1 polyethylene Polymers 0.000 claims description 14
239000004698 Polyethylene Substances 0.000 claims description 7
239000004743 Polypropylene Substances 0.000 claims description 7
239000004793 Polystyrene Substances 0.000 claims description 7
229920000573 polyethylene Polymers 0.000 claims description 7
229920001155 polypropylene Polymers 0.000 claims description 7
229920002223 polystyrene Polymers 0.000 claims description 7
239000011521 glass Substances 0.000 claims description 6
229910001218 Gallium arsenide Inorganic materials 0.000 claims description 4
239000002390 adhesive tape Substances 0.000 description 18
238000002679 ablation Methods 0.000 description 17
239000002585 base Substances 0.000 description 15
238000004140 cleaning Methods 0.000 description 11
238000002844 melting Methods 0.000 description 8
230000008018 melting Effects 0.000 description 8
239000000463 material Substances 0.000 description 7
238000005520 cutting process Methods 0.000 description 5
239000007788 liquid Substances 0.000 description 5
238000003825 pressing Methods 0.000 description 5
239000011347 resin Substances 0.000 description 5
229920005989 resin Polymers 0.000 description 5
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
229910002601 GaN Inorganic materials 0.000 description 3
JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
230000006866 deterioration Effects 0.000 description 3
230000002093 peripheral effect Effects 0.000 description 3
239000000853 adhesive Substances 0.000 description 2
230000001070 adhesive effect Effects 0.000 description 2
150000001336 alkenes Chemical class 0.000 description 2
238000003754 machining Methods 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
239000004065 semiconductor Substances 0.000 description 2
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
229910010271 silicon carbide Inorganic materials 0.000 description 2
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
239000005977 Ethylene Substances 0.000 description 1
BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
239000003513 alkali Substances 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
230000000903 blocking effect Effects 0.000 description 1
238000007664 blowing Methods 0.000 description 1
239000005388 borosilicate glass Substances 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
238000004891 communication Methods 0.000 description 1
238000006731 degradation reaction Methods 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
239000000806 elastomer Substances 0.000 description 1
238000005485 electric heating Methods 0.000 description 1
XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
150000002505 iron Chemical class 0.000 description 1
239000005355 lead glass Substances 0.000 description 1
239000000155 melt Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
239000000178 monomer Substances 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920005606 polypropylene copolymer Polymers 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
239000010453 quartz Substances 0.000 description 1
239000010980 sapphire Substances 0.000 description 1
229910052594 sapphire Inorganic materials 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
239000005361 soda-lime glass Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1
239000000758 substrate Substances 0.000 description 1
238000005406 washing Methods 0.000 description 1

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Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
High Energy & Nuclear Physics (AREA)
Toxicology (AREA)
Health & Medical Sciences (AREA)
Electromagnetism (AREA)
Optics & Photonics (AREA)
Dicing (AREA)
Laser Beam Processing (AREA)
Mechanical Treatment Of Semiconductor (AREA)

CN201910966765.3A 2018-10-17 2019-10-12 晶片的加工方法 Pending CN111063607A (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2018-195607		2018-10-17
JP2018195607A JP7166718B2 (ja)	2018-10-17	2018-10-17	ウェーハの加工方法

Publications (1)

Publication Number	Publication Date
CN111063607A true CN111063607A (zh)	2020-04-24

Family

ID=70279764

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN201910966765.3A Pending CN111063607A (zh)	2018-10-17	2019-10-12	晶片的加工方法

Country Status (8)

Country	Link
US (1)	US10720355B2 (ja)
JP (1)	JP7166718B2 (ja)
KR (1)	KR20200043906A (ja)
CN (1)	CN111063607A (ja)
DE (1)	DE102019215999B4 (ja)
MY (1)	MY192244A (ja)
SG (1)	SG10201909522RA (ja)
TW (1)	TWI813794B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7430515B2 (ja) *	2019-11-06	2024-02-13	株式会社ディスコ	ウエーハの処理方法
US11420173B2 (en)	2020-03-31	2022-08-23	Yokogawa Electric Corporation	Reaction analysis device, reaction analysis system, and reaction analysis method
JP2023012964A (ja) *	2021-07-14	2023-01-26	株式会社ディスコ	貼着方法及び貼着装置

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