CN111031695B - Production process of LED keyboard circuit board - Google Patents
Production process of LED keyboard circuit board Download PDFInfo
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- CN111031695B CN111031695B CN201911396415.4A CN201911396415A CN111031695B CN 111031695 B CN111031695 B CN 111031695B CN 201911396415 A CN201911396415 A CN 201911396415A CN 111031695 B CN111031695 B CN 111031695B
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- circuit board
- hole
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- preset
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Abstract
The invention provides a production process of an LED keyboard circuit board, and belongs to the technical field of production of keyboard circuit boards. The production process of the LED keyboard circuit board comprises the following steps: s1: obtaining a first mold and a second mold; s2: acquiring a first circuit board, a partition board and a second circuit board; s3: filling silver paste with a first preset volume into the injection tube; s4: arranging a first mould right above the first circuit board, uniformly injecting silver paste on the first circuit board along the first connecting through hole, arranging a second mould right above the second circuit board, and uniformly injecting the silver paste on the second circuit board along the second connecting through hole; s5: cleaning the injection tube and filling a second preset volume of conductive paste into the injection tube; s6: and uniformly injecting the conductive paste on the second circuit board along the first resistance through holes. The invention has higher precision and simple and convenient operation.
Description
Technical Field
The invention belongs to the technical field of keyboard circuit board production, and relates to a production process of an LED keyboard circuit board.
Background
A keyboard for operating a command and data input device of the apparatus; and also refers to a set of function keys (e.g., typewriter, computer keyboard) arranged to operate a machine or device through the system. The keyboard is the most common computer input device, and is widely applied to microcomputers and various terminal devices. The computer operator inputs various instructions and data to the computer through the keyboard to direct the work of the computer. The running condition of the computer is output to the display, and an operator can conveniently utilize the keyboard and the display to converse with the computer, modify and edit the program, and control and observe the running of the computer.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a production process of an LED keyboard circuit board, which aims to solve the technical problems that: how to provide a production process of an LED keyboard circuit board.
The purpose of the invention can be realized by the following technical scheme:
a production process of an LED keyboard circuit board comprises the following steps:
s1: obtaining a first mold with a first circuit pattern through hole and a second mold with a second circuit pattern through hole, wherein the first circuit pattern through hole comprises a first connecting through hole, and the second circuit pattern through hole comprises a second connecting through hole and a first resistance through hole;
s2: acquiring a first circuit board and a partition board which have the same area as the first mold, and a second circuit board which has the same area as the second mold;
s3: filling silver paste with a first preset volume into the injection tube;
s4: arranging a first mould right above the first circuit board, uniformly injecting silver paste on the first circuit board along the first connecting through hole, arranging a second mould right above the second circuit board, and uniformly injecting the silver paste on the second circuit board along the second connecting through hole;
s5: cleaning the injection tube and filling a second preset volume of conductive paste into the injection tube;
s6: and uniformly injecting the conductive paste on the second circuit board along the first resistance through holes.
Preferably, the first circuit board and the second circuit board are both plastic films, and the partition board is a light guide plate.
Preferably, step S4 further includes bonding a light emitting LED on the first circuit board.
Preferably, step S4 includes: clamping a first circuit board on a first workbench and clamping a second circuit board on a second workbench; clamping a first mould on a first support frame positioned right above a first workbench and clamping a second mould on a second support frame positioned right above a second workbench; and adjusting the first support frame to the top end of the first workbench to enable the first mold to be abutted against the first circuit board, and adjusting the second support frame to the top end of the second workbench to enable the second mold to be abutted against the second circuit board.
Preferably, step S1 includes: acquiring a first circuit diagram and a second circuit diagram, wherein the first circuit diagram comprises a first connection diagram, and the second circuit diagram comprises a second connection diagram and a first resistance diagram; printing the first circuit diagram and the second circuit diagram; acquiring a first rectangular rubber plate with a bottom area of a first preset area and a height of a first preset distance and a second rectangular rubber plate with a bottom area of a second preset area, a height of a second preset area and a height of a first preset distance; and cutting the first rectangular rubber plate according to the first connection diagram to form a first mold with a first connection through hole and cutting the second rectangular rubber plate according to the second connection diagram and the first resistance diagram to form a second mold with a second connection through hole and a first resistance through hole.
Preferably, the first mold and the second mold are respectively polished to polish the first connection through hole of the first mold, the second connection through hole of the second mold, and the first resistance through hole of the second mold.
Preferably, the first circuit diagram or the second circuit diagram is obtained by one of drawing the first circuit diagram or the second circuit diagram by using a mobile terminal, drawing the first circuit diagram or the second circuit diagram by using a computer, and downloading the first circuit diagram or the second circuit diagram by using the internet; printing a first circuit pattern on a first thermal transfer sheet to form a first printing sheet containing a first circuit pattern and printing a second circuit pattern on a second thermal transfer sheet to form a second printing sheet containing a second circuit pattern; cutting the first printed drawing into a first cutting drawing with the same area as the first circuit pattern area and cutting the second printed drawing into a second cutting drawing with the same area as the second circuit pattern area; adhering the first cutting drawing to the first rectangular rubber plate to form a first adhering plate and adhering the second cutting drawing to the second rectangular rubber plate to form a second adhering plate; and cutting according to a first connecting through hole on the first cutting drawing to form a first die.
Preferably, step S6 specifically includes:
s61: acquiring a preset resistance value of a resistor at a preset position on a second circuit board;
s62: acquiring the preset volume of the current type of conductive paste at the preset resistance value;
s63: and uniformly injecting a preset volume of conductive paste on the second circuit board along the first resistance through holes.
Preferably, the step S4 further includes placing the first circuit board and the second circuit board in the microwave drying chamber, respectively, adjusting the temperature of the microwave drying chamber by means of gradient cooling to solidify the silver paste on the first circuit board and the silver paste on the second circuit board, respectively, setting the initial temperature of the gradient cooling to the temperature when the silver paste is stored, setting the finishing temperature of the gradient cooling to the preset temperature of the silver paste solidification, and decreasing the initial temperature to the preset temperature by 0.1-0.2 ℃ each time by means of the gradient cooling.
Preferably, the step S6 further includes placing the second circuit board in a microwave drying chamber, adjusting the temperature of the microwave drying chamber in a gradient cooling manner to solidify the conductive paste on the second circuit board, where an initial temperature of the gradient cooling is set as a temperature when the conductive paste is stored, an end temperature of the gradient cooling is set as a preset temperature for solidifying the conductive paste, and the gradient cooling manner is that the temperature is decreased by 0.2-0.3 ℃ from the initial temperature to the preset temperature each time.
The invention firstly obtains a first mould with a first circuit pattern through hole and a second mould with a second circuit pattern through hole, then obtains a first circuit board with the area equal to that of the first mould, a spacing plate and a second circuit board with the area equal to that of the second mould, then silver paste with a first preset volume is filled in an injection tube, then the first mould is arranged right above the first circuit board, the silver paste is evenly injected on the first circuit board along a first connecting through hole, the second mould is arranged right above the second circuit board, the silver paste is evenly injected on the second circuit board along a second connecting through hole, the preparation of circuit patterns on the first circuit board and the second circuit board is realized, then the injection tube is cleaned and conductive paste with a second preset volume is filled in the injection tube, and finally the conductive paste is evenly injected on the second circuit board along the first resistance through hole, the preparation of the resistor on the second circuit board is realized, the circuit pattern on the circuit board is prepared through the die, the resistor on the circuit board is prepared, the precision is high, and the operation is simple and convenient.
Drawings
FIG. 1 is a schematic flow diagram of the present invention.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
Referring to fig. 1, the production process of the LED keyboard circuit board in the embodiment includes the following steps:
s1: acquiring a first die with a first circuit pattern through hole and a second die with a second circuit pattern through hole, wherein the first circuit pattern through hole comprises a first connecting through hole, and the second circuit pattern through hole comprises a second connecting through hole and a first resistor through hole;
s2: acquiring a first circuit board and a partition board which have the same area as the first mold, and a second circuit board which has the same area as the second mold;
s3: filling silver paste with a first preset volume into the injection tube;
s4: arranging a first mould right above the first circuit board, uniformly injecting silver paste on the first circuit board along the first connecting through hole, arranging a second mould right above the second circuit board, and uniformly injecting the silver paste on the second circuit board along the second connecting through hole;
s5: cleaning the injection tube and filling a second preset volume of conductive paste into the injection tube;
s6: and uniformly injecting the conductive paste on the second circuit board along the first resistance through holes.
The method comprises the steps of firstly obtaining a first die with a first circuit pattern through hole and a second die with a second circuit pattern through hole, then obtaining a first circuit board with the area equal to that of the first die, a spacing plate and a second circuit board with the area equal to that of the second die, then filling silver paste with a first preset volume into an injection tube, then arranging the first die right above the first circuit board, uniformly injecting the silver paste onto the first circuit board along a first connecting through hole, arranging the second die right above the second circuit board, uniformly injecting the silver paste onto the second circuit board along a second connecting through hole to finish the preparation of circuit patterns on the first circuit board and the second circuit board, then cleaning the injection tube, filling conductive paste with a second preset volume into the injection tube, and finally uniformly injecting the conductive paste onto the second circuit board along the first resistance through hole, the preparation of the resistor on the second circuit board is realized, the circuit pattern on the circuit board is prepared through the die, the resistor on the circuit board is prepared, the precision is high, and the operation is simple and convenient.
The first circuit board and the second circuit board are both plastic films, and the partition board is a light guide plate. The first circuit board and the second circuit board can be made of polyester films, and the weight of the circuit boards is reduced.
Step S4 also includes bonding a light emitting LED to the first circuit board, which facilitates mounting.
Step S4 includes: clamping a first circuit board on a first workbench and clamping a second circuit board on a second workbench; clamping a first mould on a first support frame positioned right above a first workbench and clamping a second mould on a second support frame positioned right above a second workbench; and adjusting the first support frame to the top end of the first workbench to enable the first mold to be abutted against the first circuit board, and adjusting the second support frame to the top end of the second workbench to enable the second mold to be abutted against the second circuit board.
Step S1 includes: acquiring a first circuit diagram and a second circuit diagram, wherein the first circuit diagram comprises a first connection diagram, and the second circuit diagram comprises a second connection diagram and a first resistance diagram; printing the first circuit diagram and the second circuit diagram; acquiring a first rectangular rubber plate with a bottom area of a first preset area and a height of a first preset distance and a second rectangular rubber plate with a bottom area of a second preset area, a height of a second preset area and a height of a first preset distance; and cutting the first rectangular rubber plate according to the first connection diagram to form a first mold with a first connection through hole and cutting the second rectangular rubber plate according to the second connection diagram and the first resistance diagram to form a second mold with a second connection through hole and a first resistance through hole.
The first die and the second die are respectively polished to polish the first connecting through hole of the first die, the second connecting through hole of the second die and the first resistor through hole of the second die smoothly, so that the situation that a lot of burrs are remained on the first die and the second die after cutting to influence the pouring of silver paste and conductive paste is avoided.
The method comprises the steps that a first circuit diagram or a second circuit diagram is obtained in one mode of drawing the first circuit diagram or the second circuit diagram by adopting a mobile terminal, drawing the first circuit diagram or the second circuit diagram by a computer, and downloading the first circuit diagram or the second circuit diagram through the Internet; printing a first circuit pattern on a first thermal transfer sheet to form a first printing sheet containing a first circuit pattern and printing a second circuit pattern on a second thermal transfer sheet to form a second printing sheet containing a second circuit pattern; cutting the first printed drawing into a first cutting drawing with the same area as the first circuit pattern area and cutting the second printed drawing into a second cutting drawing with the same area as the second circuit pattern area; adhering the first cutting drawing to the first rectangular rubber plate to form a first adhering plate and adhering the second cutting drawing to the second rectangular rubber plate to form a second adhering plate; and cutting according to a first connecting through hole on the first cutting drawing to form a first die.
Step S6 specifically includes:
s61: acquiring a preset resistance value of a resistor at a preset position on a second circuit board;
s62: acquiring the preset volume of the current type of conductive paste at the preset resistance value;
s63: and uniformly injecting a preset volume of conductive paste on the second circuit board along the first resistance through holes.
The step S4 further comprises the steps of placing the first circuit board and the second circuit board in a microwave drying chamber respectively, adjusting the temperature of the microwave drying chamber in a gradient cooling mode to solidify the silver paste on the first circuit board and the silver paste on the second circuit board respectively, setting the initial temperature of the gradient cooling to be the temperature when the silver pastes are stored, setting the finishing temperature of the gradient cooling to be the preset temperature of silver paste solidification, and setting the gradient cooling mode to be that the initial temperature and the preset temperature are reduced by 0.1-0.2 ℃ every time. Through the mode of gradient cooling, avoid the cooling too fast and cause the harm to silver thick liquid.
The step S6 further includes the steps of placing the second circuit board in a microwave drying chamber, adjusting the temperature of the microwave drying chamber in a gradient cooling mode to solidify the conductive paste on the second circuit board, setting the initial temperature of the gradient cooling to be the temperature when the conductive paste is stored, setting the finishing temperature of the gradient cooling to be the preset temperature for solidifying the conductive paste, and setting the gradient cooling mode to be 0.2-0.3 ℃ of temperature reduction from the initial temperature to the preset temperature each time. Through the mode of gradient cooling, avoid the cooling too fast and cause the harm to silver thick liquid.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (9)
1. A production process of an LED keyboard circuit board is characterized by comprising the following steps:
s1: obtaining a first mold with a first circuit pattern through hole and a second mold with a second circuit pattern through hole, wherein the first circuit pattern through hole comprises a first connecting through hole, and the second circuit pattern through hole comprises a second connecting through hole and a first resistance through hole;
s2: acquiring a first circuit board and a partition board which have the same area as the first mold, and a second circuit board which has the same area as the second mold;
s3: filling silver paste with a first preset volume into the injection tube;
s4: arranging a first mould right above the first circuit board, uniformly injecting silver paste on the first circuit board along the first connecting through hole, arranging a second mould right above the second circuit board, and uniformly injecting the silver paste on the second circuit board along the second connecting through hole;
s5: cleaning the injection tube and filling a second preset volume of conductive paste into the injection tube;
s6: uniformly injecting conductive slurry on the second circuit board along the first resistance through holes; step S1 includes: acquiring a first circuit diagram and a second circuit diagram, wherein the first circuit diagram comprises a first connection diagram, and the second circuit diagram comprises a second connection diagram and a first resistance diagram; printing the first circuit diagram and the second circuit diagram; acquiring a first rectangular rubber plate with a bottom area of a first preset area and a height of a first preset distance and a second rectangular rubber plate with a bottom area of a second preset area, a height of a second preset area and a height of a first preset distance; and cutting the first rectangular rubber plate according to the first connection diagram to form a first mold with a first connection through hole and cutting the second rectangular rubber plate according to the second connection diagram and the first resistance diagram to form a second mold with a second connection through hole and a first resistance through hole.
2. The production process of the LED keyboard circuit board according to claim 1, characterized in that: the first circuit board and the second circuit board are both plastic films, and the partition board is a light guide plate.
3. The production process of the LED keyboard circuit board as claimed in claim 1 or 2, wherein: step S4 further includes bonding a light emitting LED on the first wiring board.
4. The production process of the LED keyboard circuit board according to claim 3, characterized in that: step S4 includes: clamping a first circuit board on a first workbench and clamping a second circuit board on a second workbench; clamping a first mould on a first support frame positioned right above a first workbench and clamping a second mould on a second support frame positioned right above a second workbench; and adjusting the first support frame to the top end of the first workbench to enable the first mold to be abutted against the first circuit board, and adjusting the second support frame to the top end of the second workbench to enable the second mold to be abutted against the second circuit board.
5. The production process of the LED keyboard circuit board according to claim 4, characterized in that: and respectively polishing the first die and the second die to polish the first connecting through hole of the first die, the second connecting through hole of the second die and the first resistor through hole of the second die.
6. The production process of the LED keyboard circuit board according to claim 4, characterized in that: the method comprises the steps that a first circuit diagram or a second circuit diagram is obtained in one mode of drawing the first circuit diagram or the second circuit diagram by adopting a mobile terminal, drawing the first circuit diagram or the second circuit diagram by a computer, and downloading the first circuit diagram or the second circuit diagram through the Internet; printing a first circuit pattern on a first thermal transfer sheet to form a first printing sheet containing a first circuit pattern and printing a second circuit pattern on a second thermal transfer sheet to form a second printing sheet containing a second circuit pattern; cutting the first printed drawing into a first cutting drawing with the same area as the first circuit pattern area and cutting the second printed drawing into a second cutting drawing with the same area as the second circuit pattern area; adhering the first cutting drawing to the first rectangular rubber plate to form a first adhering plate and adhering the second cutting drawing to the second rectangular rubber plate to form a second adhering plate; and cutting according to a first connecting through hole on the first cutting drawing to form a first die.
7. The production process of the LED keyboard circuit board according to claim 1 or 2, wherein the step S6 specifically comprises:
s61: acquiring a preset resistance value of a resistor at a preset position on a second circuit board;
s62: acquiring the preset volume of the current type of conductive paste at the preset resistance value;
s63: and uniformly injecting a preset volume of conductive paste on the second circuit board along the first resistance through holes.
8. The production process of the LED keyboard circuit board as claimed in claim 1 or 2, wherein: the step S4 further comprises the steps of placing the first circuit board and the second circuit board in a microwave drying chamber respectively, adjusting the temperature of the microwave drying chamber in a gradient cooling mode to solidify the silver paste on the first circuit board and the silver paste on the second circuit board respectively, setting the initial temperature of the gradient cooling to be the temperature when the silver pastes are stored, setting the finishing temperature of the gradient cooling to be the preset temperature of silver paste solidification, and setting the gradient cooling mode to be that the initial temperature and the preset temperature are reduced by 0.1-0.2 ℃ every time.
9. The production process of the LED keyboard circuit board as claimed in claim 1 or 2, wherein: the step S6 further includes the steps of placing the second circuit board in a microwave drying chamber, adjusting the temperature of the microwave drying chamber in a gradient cooling mode to solidify the conductive paste on the second circuit board, setting the initial temperature of the gradient cooling to be the temperature when the conductive paste is stored, setting the finishing temperature of the gradient cooling to be the preset temperature for solidifying the conductive paste, and setting the gradient cooling mode to be 0.2-0.3 ℃ of temperature reduction from the initial temperature to the preset temperature each time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911396415.4A CN111031695B (en) | 2019-12-30 | 2019-12-30 | Production process of LED keyboard circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911396415.4A CN111031695B (en) | 2019-12-30 | 2019-12-30 | Production process of LED keyboard circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN111031695A CN111031695A (en) | 2020-04-17 |
| CN111031695B true CN111031695B (en) | 2021-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911396415.4A Active CN111031695B (en) | 2019-12-30 | 2019-12-30 | Production process of LED keyboard circuit board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1401210A (en) * | 2000-02-23 | 2003-03-05 | 凯斯技术有限公司 | Method of printing and printing machine |
| WO2003103353A1 (en) * | 2002-05-29 | 2003-12-11 | Fry's Metals, Inc. Doing Business As Alpha Metals, Inc. | Solder printing using a stencil having a reverse-tapered aperture |
| CN102741945A (en) * | 2010-01-19 | 2012-10-17 | 国立大学法人京都大学 | Conductive film and method for manufacturing same |
| CN103298266A (en) * | 2013-05-02 | 2013-09-11 | 精模电子科技（深圳）有限公司 | Manufacturing method of flexible circuit board of keyboard |
-
2019
- 2019-12-30 CN CN201911396415.4A patent/CN111031695B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1401210A (en) * | 2000-02-23 | 2003-03-05 | 凯斯技术有限公司 | Method of printing and printing machine |
| WO2003103353A1 (en) * | 2002-05-29 | 2003-12-11 | Fry's Metals, Inc. Doing Business As Alpha Metals, Inc. | Solder printing using a stencil having a reverse-tapered aperture |
| CN102741945A (en) * | 2010-01-19 | 2012-10-17 | 国立大学法人京都大学 | Conductive film and method for manufacturing same |
| CN103298266A (en) * | 2013-05-02 | 2013-09-11 | 精模电子科技（深圳）有限公司 | Manufacturing method of flexible circuit board of keyboard |
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| Publication number | Publication date |
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| CN111031695A (en) | 2020-04-17 |
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