CN103034266A - Temperature control system and method for reflow soldering machine - Google Patents
Temperature control system and method for reflow soldering machine Download PDFInfo
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- CN103034266A CN103034266A CN2012105930718A CN201210593071A CN103034266A CN 103034266 A CN103034266 A CN 103034266A CN 2012105930718 A CN2012105930718 A CN 2012105930718A CN 201210593071 A CN201210593071 A CN 201210593071A CN 103034266 A CN103034266 A CN 103034266A
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Abstract
The invention discloses a temperature control system and a method for a reflow soldering machine. The system comprises a touch display screen, a computer control center, a heater and a temperature sensor; a time-temperature control curve is manually edited on the touch display screen, and a signal is sent according to the edited control curve; the computer control center is connected with the touch display screen, receives the signal sent by the touch display screen, and sends a temperature control signal according to the signal; the heater is connected with the computer control center, and heats according to the received temperature control signal; the temperature sensor is connected with the computer control center, detects the real-time temperature of a welding piece in a welding cavity, and sends a temperature signal to the computer control center; the computer control center edits an actual temperature curve according to the received temperature signal, and displays the actual temperature curve on the touch display screen; the time-temperature control curve is edited again according to the comparison between the actual temperature curve and an ideal temperature curve; and the operation is repeated until the actual temperature curve meets the requirements. The system and the method can accurately control the temperature in the welding cavity.
Description
Technical field
The present invention relates to the reflow machine technical field, specifically a kind of reflow machine control temperature system and method.
Background technology
Because chip component has appearred in the needs of the continuous miniaturization of electronic product pcb board, traditional welding method can not meet the needs of.Along with the development of surface mounting technology, also developed accordingly as the reflow machine of a surface mounting technology part, its application is increasingly extensive, almost all is applied in all electronic product fields.Have well heater in the welding chamber that forms in the welding casing of reflow machine, pass through the solder(ing) paste that melts and welding circuit board together in order to will weld the elements on circuit board chamber in.Because different solder(ing) pastes has different characteristics, so in welding, need to control temperature by the ideal temperature curve that meets this solder(ing) paste welding performance according to used solder(ing) paste, in order to obtain high-quality welding product.Yet the temperature control system of existing reflow machine and method operation are very complicated, need the technical professional could work out out operable curve, obtain actual temperature and the ideal temperature curve differs far away, the weldment that obtains simultaneously is difficult to reach higher quality level.
This shows, above-mentioned existing reflow machine obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.The inventor is research and innovation in addition actively, to founding a kind of reflow machine temperature-controlling system and method for new structure, makes it have more practicality.
Summary of the invention
In order to solve the above-mentioned problems in the prior art, the invention provides a kind of reflow machine temperature-controlling system of accurate control welding cavity temperature.
In order to solve the problems of the technologies described above, the invention provides following technical scheme:
The reflow machine temperature-controlling system comprises:
Touch display screen, the curve of manual editing's Time-temperature control thereon, and according to the control curve transmitted signal of editing;
Computer control center is connected with touch display screen, receives the signal that sends according to touch display screen, and sends temperature control signals according to this signal;
Well heater, control center is connected with computer, heats by the temperature control signals that receives;
Temperature sensor, control center is connected with computer, surveys the real time temperature of weldment in the welding chamber, and temperature signal is reached computer control center; Wherein
Computer control center is according to the temperature signal editor actual temperature curve that receives, and be presented on the touch display screen, update Time-temperature control curve according to the contrast of actual temperature curve and ideal temperature curve, so repeatedly until the actual temperature curve reaches requirement.
Another object of the present invention is for providing a kind of reflow machine temperature control method of accurate control welding cavity temperature.The technical scheme that realizes this purpose is as follows: the reflow machine temperature control method comprises the steps:
A. edit session-temperature control curve, and according to this control curve controlled well heater heating;
B. the real time temperature according to weldment in the welding chamber of detecting generates the actual temperature curve;
C. update Time-temperature control curve according to the contrast of actual temperature curve and ideal temperature curve, so repeatedly until the actual temperature curve reaches requirement.
As preferably, above-mentioned temperature control method, wherein edit session-temperature control curve is realized by directly drag curve on touch display screen.
As preferably, the said temperature control method is wherein edited the overall offset that comprises the different time sections curve and the fine setting of part curve to described Time-temperature control curve.
As preferably, the said temperature control method, wherein said Time-temperature control curve is associated with the time-temperature data, and wherein each in two of Time-temperature control curve and the time-temperature data changes then another respective change.
As preferably, the said temperature control method is wherein come the control heater heating by controlling the related time-temperature data input temp controller of curve with Time-temperature.
Compared with prior art, beneficial effect of the present invention is:
The present invention comes control heater to heat by the Time-temperature control curve by editor, and according to the actual temperature generation actual temperature curve that detects, the ideal temperature curve of the solder(ing) paste that provides according to actual temperature curve and producer to recently adjusting Time-temperature control curve, finally, actual temperature in the realization welding chamber conforms to the ideal temperature curve or approaches, can accurately control the welding cavity temperature, improve the quality of weldment.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, below with preferred embodiment of the present invention and cooperate accompanying drawing to be described in detail as follows.
Description of drawings
Fig. 1 is the structural representation of reflow machine temperature-controlling system of the present invention;
Fig. 2 is the schematic flow sheet of reflow machine temperature control method of the present invention.
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, its embodiment of break-off type radome, structure, feature and effect thereof to foundation the present invention proposes are described in detail as follows.In following explanation, the not necessarily same embodiment that different " embodiment " or " embodiment " refer to.In addition, special characteristic, structure or the characteristics among one or more embodiment can be by any suitable form combination.
Fig. 1 is the structural representation of reflow machine temperature-controlling system of the present invention.As shown in Figure 1, the reflow machine temperature-controlling system comprises:
Touch display screen, the curve of manual editing's Time-temperature control thereon, and according to the control curve transmitted signal of editing;
Computer control center is connected with touch display screen, receives the signal that sends according to touch display screen, and sends temperature control signals according to this signal;
Well heater, control center is connected with computer, heats by the temperature control signals that receives;
Temperature sensor, control center is connected with computer, surveys the real time temperature of weldment in the welding chamber, and temperature signal is reached computer control center;
Wherein
Computer control center is according to the temperature signal editor actual temperature curve that receives, and be presented on the touch display screen, update Time-temperature control curve according to the contrast of actual temperature curve and ideal temperature curve, so repeatedly until the actual temperature curve reaches requirement.
The technical scheme of reflow machine temperature control method provided by the invention is as follows: Fig. 2 is the schematic flow sheet of reflow machine temperature control method of the present invention.As shown in Figure 2, the reflow machine temperature control method comprises the steps:
A. edit session-temperature control curve, and according to this control curve controlled well heater heating;
B. the real time temperature according to weldment in the welding chamber of detecting generates the actual temperature curve;
C. update Time-temperature control curve according to the contrast of actual temperature curve and ideal temperature curve, so repeatedly until the actual temperature curve reaches requirement.
Preferred as the present embodiment, wherein edit session-temperature control curve is realized by directly drag curve on touch display screen.By dragging editor, realize visualized operation, more directly perceived, easy operating.
One preferred again as above-described embodiment wherein edited the overall offset that comprises the different time sections curve and the fine setting of part curve to described Time-temperature control curve.Can guarantee that the actual welding curve under some time period reaches the process curve requirement, obtains the time-temperature setting operation of complete matching technique curve at last.
One preferred again as above-described embodiment, wherein Time-temperature control curve is associated with the time-temperature data, and wherein each in two of Time-temperature control curve and the time-temperature data changes then another respective change.Be associated by both, can come curve is finely tuned by changing data, the data that go out by the curve association simultaneously can derive, and it is convenient and easy to control temperature with these data.
One preferred again as above-described embodiment wherein comes the control heater heating by controlling the related time-temperature data input temp controller of curve with Time-temperature.The present invention directly imports temperature controller by the data that will derive and comes control heater to heat the step that simplifies the operation.
Reflow machine in the utility model is preferably the vacuum back-flow welding machine.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (6)
1. the reflow machine temperature-controlling system is characterized in that, comprising:
Touch display screen, the curve of manual editing's Time-temperature control thereon, and according to the control curve transmitted signal of editing;
Computer control center is connected with touch display screen, receives the signal that sends according to touch display screen, and sends temperature control signals according to this signal;
Well heater, control center is connected with computer, heats by the temperature control signals that receives;
Temperature sensor, control center is connected with computer, surveys the real time temperature of weldment in the welding chamber, and temperature signal is reached computer control center; Wherein
Computer control center is according to the temperature signal editor actual temperature curve that receives, and be presented on the touch display screen, update Time-temperature control curve according to the contrast of actual temperature curve and ideal temperature curve, so repeatedly until the actual temperature curve reaches requirement.
2. the reflow machine temperature control method is characterized in that, comprises the steps:
A. edit session-temperature control curve, and according to this control curve controlled well heater heating;
B. the real time temperature according to weldment in the welding chamber of detecting generates the actual temperature curve;
C. update Time-temperature control curve according to the contrast of actual temperature curve and ideal temperature curve, so repeatedly until the actual temperature curve reaches requirement.
3. reflow machine temperature control method according to claim 2 is characterized in that, above-mentioned temperature control method, and wherein edit session-temperature control curve is realized by directly drag curve on touch display screen.
4. reflow machine temperature-controlled process according to claim 2 is characterized in that, wherein described Time-temperature control curve is edited the overall offset that comprises the different time sections curve and the fine setting of part curve.
5. reflow machine temperature-controlled process according to claim 2, it is characterized in that, wherein said Time-temperature control curve is associated with the time-temperature data, and wherein each in two of Time-temperature control curve and the time-temperature data changes then another respective change.
6. reflow machine temperature-controlled process according to claim 5 is characterized in that, wherein comes the control heater heating by controlling the related time-temperature data input temp controller of curve with Time-temperature.
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| CN2012105930718A CN103034266A (en) | 2012-12-31 | 2012-12-31 | Temperature control system and method for reflow soldering machine |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014101705A1 (en) * | 2012-12-31 | 2014-07-03 | 北京中科同志科技有限公司 | Temperature control method for reflow soldering machine |
| CN104139226A (en) * | 2013-05-07 | 2014-11-12 | 珠海格力电器股份有限公司 | Bend welding system and method of refrigerating system |
| CN104252189A (en) * | 2013-06-26 | 2014-12-31 | 旭达电脑（昆山）有限公司 | Circuit board repairing solder machine |
| CN104625309A (en) * | 2013-11-12 | 2015-05-20 | 珠海格力电器股份有限公司 | Flame welding constant-temperature control system and method and heat exchanger welding device |
| CN105472959A (en) * | 2014-09-04 | 2016-04-06 | 上海唐盛信息科技有限公司 | BGA repairing encapsulation method |
| CN107639316A (en) * | 2016-07-21 | 2018-01-30 | 鸿骐新技股份有限公司 | Chamber profile reflow oven board and its temperature self-compensation control method |
| WO2018176448A1 (en) * | 2017-04-01 | 2018-10-04 | 深圳市鑫华威机电设备有限公司 | Method and system for controlling welding of semi-automatic electric welding machine |
| CN109688727A (en) * | 2018-12-26 | 2019-04-26 | 无锡市同步电子制造有限公司 | One kind having lead pb-free solder method |
| CN110884081A (en) * | 2019-12-03 | 2020-03-17 | 苏州富翔塑胶有限公司 | Injection mold temperature control method and system |
| CN112997231A (en) * | 2018-11-16 | 2021-06-18 | 松下知识产权经营株式会社 | Brazing work assistance method, program, and brazing work assistance system |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245469A (en) * | 1985-08-26 | 1987-02-27 | Nippei Toyama Corp | Control method for laser soldering device |
| CN1948873A (en) * | 2006-11-09 | 2007-04-18 | 上海交通大学 | Operating and optimization control method of differential pressure precooling fan |
| CN201455487U (en) * | 2009-03-26 | 2010-05-12 | 赵永先 | Precision desktop reflow soldering machine with temperature testing and analyzing system |
| CN102049587A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for large temperature difference adjustment of reflow soldering machine and temperature control method |
| CN102053640A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system and temperature control method for reflow soldering machine |
| CN102183912A (en) * | 2011-03-03 | 2011-09-14 | 北京凡元兴科技有限公司 | Operation control system for combustion gas pulse soot blower |
| CN103028802A (en) * | 2012-12-31 | 2013-04-10 | 北京中科同志科技有限公司 | Temperature control method for reflow welding machine |
-
2012
- 2012-12-31 CN CN2012105930718A patent/CN103034266A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245469A (en) * | 1985-08-26 | 1987-02-27 | Nippei Toyama Corp | Control method for laser soldering device |
| CN1948873A (en) * | 2006-11-09 | 2007-04-18 | 上海交通大学 | Operating and optimization control method of differential pressure precooling fan |
| CN201455487U (en) * | 2009-03-26 | 2010-05-12 | 赵永先 | Precision desktop reflow soldering machine with temperature testing and analyzing system |
| CN102049587A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for large temperature difference adjustment of reflow soldering machine and temperature control method |
| CN102053640A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system and temperature control method for reflow soldering machine |
| CN102183912A (en) * | 2011-03-03 | 2011-09-14 | 北京凡元兴科技有限公司 | Operation control system for combustion gas pulse soot blower |
| CN103028802A (en) * | 2012-12-31 | 2013-04-10 | 北京中科同志科技有限公司 | Temperature control method for reflow welding machine |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014101705A1 (en) * | 2012-12-31 | 2014-07-03 | 北京中科同志科技有限公司 | Temperature control method for reflow soldering machine |
| CN104139226A (en) * | 2013-05-07 | 2014-11-12 | 珠海格力电器股份有限公司 | Bend welding system and method of refrigerating system |
| CN104252189A (en) * | 2013-06-26 | 2014-12-31 | 旭达电脑（昆山）有限公司 | Circuit board repairing solder machine |
| CN104625309A (en) * | 2013-11-12 | 2015-05-20 | 珠海格力电器股份有限公司 | Flame welding constant-temperature control system and method and heat exchanger welding device |
| CN105472959A (en) * | 2014-09-04 | 2016-04-06 | 上海唐盛信息科技有限公司 | BGA repairing encapsulation method |
| CN107639316A (en) * | 2016-07-21 | 2018-01-30 | 鸿骐新技股份有限公司 | Chamber profile reflow oven board and its temperature self-compensation control method |
| WO2018176448A1 (en) * | 2017-04-01 | 2018-10-04 | 深圳市鑫华威机电设备有限公司 | Method and system for controlling welding of semi-automatic electric welding machine |
| CN112997231A (en) * | 2018-11-16 | 2021-06-18 | 松下知识产权经营株式会社 | Brazing work assistance method, program, and brazing work assistance system |
| CN109688727A (en) * | 2018-12-26 | 2019-04-26 | 无锡市同步电子制造有限公司 | One kind having lead pb-free solder method |
| CN110884081A (en) * | 2019-12-03 | 2020-03-17 | 苏州富翔塑胶有限公司 | Injection mold temperature control method and system |
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Application publication date: 20130410 |