CN110952017B - High-entropy ultra-silver solder alloy and preparation method thereof - Google Patents
High-entropy ultra-silver solder alloy and preparation method thereof Download PDFInfo
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- CN110952017B CN110952017B CN201911371698.7A CN201911371698A CN110952017B CN 110952017 B CN110952017 B CN 110952017B CN 201911371698 A CN201911371698 A CN 201911371698A CN 110952017 B CN110952017 B CN 110952017B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
Abstract
The invention discloses a high-entropy ultra-silver solder alloy and a preparation method thereof. The material comprises the following substances in percentage by mole: 20-30% of CuP alloy; 20-30% of NiSn alloy; 20-25% Ag; 20-25% of rare earth Re. The preparation method adopts a multi-target direct current magnetron sputtering codeposition power supply to simultaneously deposit CuP, Re, Ni, Sn, Ag metal or alloy on the surface of a substrate to prepare the six-element high-entropy ultra-silver solder alloy. The invention provides technical support for innovative connection of related pipelines and rotors in the field of large motors, is mainly used for high-reliability connection of large motors, positions the prefabricated brazing filler metal at the brazing connection part, and avoids phenomena of turbulent flow, penetration of the brazing filler metal, corrosion and the like in joints.
Description
Technical Field
The invention belongs to the technical field of metal welding materials, and particularly relates to a high-entropy ultra-silver solder alloy and a preparation method thereof.
Background
Silver solder as an important hard solder can be used for soldering all materials except light metals such as aluminum and magnesium alloy, and is widely applied to the industries of household appliances, aerospace and the like. Then, the silver solder has high silver content, so that the cost is too high for enterprises and customers, and the actual industry requirements cannot be met. The development of low-silver and silver-substituted brazing filler metals or ultra-silver brazing filler metals, namely brazing filler metals with the performance superior to that of silver brazing filler metals, is urgently needed, and the development of the low-silver and silver-substituted brazing filler metals or ultra-silver brazing filler metals has important engineering significance.
For silver solder, relevant research is carried out in domestic and overseas related universities, enterprises, research institutes and the like, and the invention patent ZL 20161115355 discloses a low-cadmium silver solder, wherein the Sn content is 0.001-0.005% which is a trace element and is too low; the invention patent ZL2012105538806 discloses a multi-element silver solder which does not contain Sn, and the strength of brazing carbon steel reaches 489 MPa; the invention patent ZL011417560 discloses a cadmium-free silver-based solder, the content of Sn is 5.5-6.0%, and reliable connection can not be realized for members with special requirements; patent application 2017106341215A low silver solder is mainly copper solder, Sn1.3 ~ 2%. The invention patent ZL2015108675870 discloses a supersaturated solder and a preparation method thereof, and provides a method for preparing a high-tin-silver solder through electroforming and diffusion compounding, but the requirement on a diffusion treatment process is high.
The high-entropy alloy has a plurality of excellent properties, such as high strength, high hardness, high wear resistance, high fracture toughness, excellent low-temperature performance and structural stability, and good corrosion resistance and oxidation resistance. The high-entropy alloy is not based on one main element, but contains 5 or more elements, and the content of each element is 5-35%. Surprisingly, high entropy alloys, although complex in composition, have a simple phase composition, typically a single phase, or a dual phase structure, with both good stability and flexibility in microstructure control. A high flux preparation method (201910557829.4) of Sn-Zn-Cu solder, which prepares high entropy Sn-based solder by a two-target co-sputtering deposition method; the application number 2019102725855 patent application discloses a brazing connection method of a CoCrCuFeNi high-entropy alloy, and discloses a copper-based brazing filler metal taking CoCrCuFeNi as a main element, which is used for brazing a CoCrCuFeNi high-entropy alloy plate and has the highest strength of 411 MPa; the invention patent application with application number 2019105263190 discloses a tin-silver-copper-silicon high-entropy alloy solder and a preparation method thereof, wherein the shear strength of a T2 copper alloy joint is 102.3 MPa. The patent application with the application number of 2019108920673 discloses a preparation method and application of a high-entropy alloy solder, wherein a solder alloy of 15-35% of Ni powder, 15-35% of Cr, 15-35% of Co and 15-35% of Fe is prepared by ball milling. Patent application publication of invention with application number 2019105259655The cobalt-iron-nickel-chromium-manganese high-entropy alloy solder comprises the following substances in parts by mass: 15-25% of Co, 15-25% of Fe, 15-25% of Ni, 15-25% of Cr and 15-25% of Mn, and the shear strength of the brazing filler metal is greater than 185 MPa. The patent application with the application number of 2018106639093 discloses a manufacturing method of a high-entropy alloy brazing cubic boron nitride grinding wheel, and the high-entropy alloy brazing cubic boron nitride grinding wheel is made of Co, NiP, Cr and TiH2And carrying out gas atomization after Cu alloying to prepare the brazing filler metal. The invention patent application with application number 201811013732.9 discloses an amorphous high-entropy alloy brazing filler metal for brazing tantalum Ta1 and 1Cr18Ni9 stainless steel, which comprises the following components: 7.0-9.0% of Cr, 5.0-8.0% of Si, 5.0-7.0% of Fe, 6.0-8.0% of Zr, 2.0-3.0% of Ta, 2.5-4.5% of B and the balance of Ni, wherein the brazing filler metal is mainly a nickel-based brazing filler metal.
Disclosure of Invention
The high-entropy alloy brazing filler metal is classified into high-temperature series such as cobalt-based and nickel-based; low temperature series such as tin-based, aluminum-based. The copper-phosphorus-based super-silver solder is a blank at home and abroad at present and needs to be developed.
The invention aims to provide a high-entropy ultra-silver solder alloy and a preparation method thereof.
The object of the invention is achieved in the following way:
the high-entropy ultra-silver solder alloy comprises the following substances in percentage by mole: 20-30% of CuP alloy; 20-30% of NiSn alloy; 20-25% Ag; 20-25% of rare earth Re.
The high-entropy ultra-silver solder alloy preferably comprises the following substances in percentage by mole: 30% of a CuP alloy; 20% NiSn alloy; 25% Ag; 25% of rare earth Re.
The high-entropy ultra-silver solder alloy preferably comprises the following substances in percentage by mole: 25% of a CuP alloy; 25% NiSn alloy; 25% Ag; 25% of rare earth Re.
The high-entropy ultra-silver solder alloy preferably comprises the following substances in percentage by mole: 30% of a CuP alloy; 25% NiSn alloy; 20% of Ag; 25% of rare earth Re.
The high-entropy ultra-silver solder alloy preferably comprises the following substances in percentage by mole: 20% of a CuP alloy; 30% NiSn alloy; 25% Ag; 25% of rare earth Re.
The high-entropy ultra-silver solder alloy preferably comprises the following substances in percentage by mole: 30% of a CuP alloy; 30% NiSn alloy; 20% of Ag; 20% of rare earth Re.
The high-entropy ultra-silver solder alloy is preferably one of a Cu80P alloy, a Cu83P alloy, a Cu85P alloy and a Cu84P alloy.
The preferred NiSn alloy of the high-entropy super-silver solder alloy is one of Ni25Sn alloy, Ni40Sn alloy and Ni50Sn alloy.
Preferably, the Re element of the high-entropy ultra-silver solder alloy is any one of Ce, Pr, La, Nd or Er.
According to the preparation method of the high-entropy silver solder alloy, a multi-target direct-current magnetron sputtering codeposition power supply is adopted to simultaneously deposit CuP, Re, Ni, Sn and Ag metals or alloys on the surface of a substrate, so that the six-element high-entropy silver solder alloy is prepared.
By adopting the technical scheme, the invention has the beneficial effects that:
the invention belongs to high-entropy ultra-silver solder, the components of the invention are close in mole percentage, and the invention has the high-entropy effect, cocktail effect, lattice distortion effect and slow diffusion effect of high-entropy alloy, can effectively avoid the defects of inclusion, shrinkage porosity, segregation and the like, and provides scientific basis for the research and development of high-strength and high-corrosion-resistant solder;
the high-entropy alloy containing multiple elements is generally considered to have complex microstructure and hard and brittle, but in fact, under the action of high mixed entropy change of a system, the high-entropy alloy consisting of the elements with better physical and chemical compatibility of the brazing alloy of the invention only generates one or more solid solution phases: CuP with Ni, Re; ni, Sn and Ag; CuP, Ag, Ni, etc.; the three mutually form solid solution phases of CuNi, CuRe, AgNi, AgNiSn, CuPAg and the like, and no Ag appears3Sn、Cu6Sn5An isobrittle phase;
the CuP is a brazing filler metal matrix principal component alloy, can be used for connecting all metals and alloys except light alloys such as aluminum, magnesium and the like, has good wettability and fluidity on the surfaces of copper, nickel and stainless steel, and has good conductivity; re is an active element, so that oxides and the like on the surface of a base material can be effectively removed, and the wettability of the brazing filler metal is improved; ni has good affinity with other elements, can reduce the melting temperature of the brazing filler metal, and improves the connection strength of the brazed joint and the use performance of the brazed joint in a harsh environment; sn is used as a melting point reducing element, the melting point is only 232 ℃, the melting temperature of the ultra-silver solder is effectively reduced, and the ultra-silver solder has good intermiscibility; ag has good physical compatibility with NiSn, CuP alloy, Re and the like, and the use performance of a high-entropy alloy system in an alternating damp-heat environment can be remarkably improved by forming a compact oxide film on the surface of the alloy; the invention adds high-content elements with small interaction force between Cu and active principal element atoms, thereby effectively improving the activity coefficient of the active principal elements in a super-silver alloy system. On the other hand, due to the high entropy effect, the element Sn and the like can have higher concentration in a high entropy ultra-silver solder alloy system without generating a brittle intermetallic compound CuSn phase;
the invention can show the excellent physicochemical properties of each component element of P, Ag, Cu, Ni, Sn and Re, and has some synergistic or comprehensive effects which are not possessed by single elements, so that the tensile strength of a brass soldered joint is superior to that of the traditional silver solder joint, and the effect of surpassing the mechanical property of a silver solder connection joint is achieved;
therefore, the invention solves the difficult problems of complex microstructure and hard and brittle performance of the multi-element high-entropy copper-phosphorus brazing filler metal from the thermodynamic angle;
the invention effectively inhibits the occurrence of tissue segregation and component defects in the solder alloy, regulates and controls the components and the tissue structure of the solder, and synergistically improves the mechanical property of the solder alloy, and the tensile strength of the solder brazing brass joint is 330-336MPa, which is higher than 313MPa of BAg54CuZnNi solder 323MPa and BAg56CuNi solder; the shear strength of the connection red copper is 209-213MPa, which is higher than 187MPa of the traditional BAg45CuZn solder.
The melting temperature range of the invention is 620-680 ℃, which is lower than 720-860 ℃ of BAg54CuZnNi solder and 790-830 ℃ of BAg56CuNi solder; the silver content of the invention is lower than 25 percent, is lower than 54 percent of the silver content in BAg54CuZnNi solder and 56 percent of the silver content in BAg56CuNi solder, and the silver content is very low; the wettability of the invention is better;
the invention has lower melting temperature, better wettability, better mechanical property (more than 325 MPa) than the traditional national standard silver solder and innovative effect in the brazing industry.
The invention breaks through the traditional 'dish frying type' exploratory development of the copper-phosphorus brazing filler metal by means of a material genome method and high-entropy alloy definition, and carries out the controllable preparation of the multi-element (more than five-membered) multi-scale copper-phosphorus system ultra-silver brazing filler metal;
the traditional brazing filler metal system comprises the following substances in percentage by mol: sn: 4 to 10 percent; p: 3 to 8 percent; ag: 15 to 25 percent; ni: 2 to 10 percent. The invention breaks through the alloy limit of the traditional copper-phosphorus brazing filler metal system;
the preparation method adopts a multi-target magnetron sputtering method, the multi-target is respectively CuP, Re, Ni, Sn and Ag, the co-deposition of the six-element copper-phosphorus system ultra-silver brazing filler metal film is realized, and the thickness of the foil brazing filler metal is 5-15 mu m;
the silver-rich brazing filler metal has proper melting temperature and uniform structure, and is a super-silver brazing filler metal with excellent high temperature and high conductivity;
the high entropy effect and the slow diffusion effect of the brazing filler metal have an important inhibiting effect on excessive dissolution of an alloy base metal into a brazing seam in the brazing process, the problem of high melting temperature, component segregation and different structure of the copper-phosphorus brazing filler metal alloy is solved, and the performance of the copper-phosphorus brazing filler metal alloy exceeds that of a national standard silver brazing filler metal (GB/T11364-.
The invention breaks through the range of national standard GB/T6418-; the invention provides a new technical approach for the preparation and production of domestic non-standard copper brazing filler metal and ultra-silver brazing filler metal, provides technical support for the innovative connection of related pipelines and rotors in the field of large motors, is mainly used for the high-reliability connection of large motors, positions the prefabricated brazing filler metal at the brazing connection part, and avoids the phenomena of turbulent flow, penetration of brazing filler metal, corrosion and the like in the joint.
Detailed Description
Example 1
This example discloses a high entropy ultra-silver solder alloy, the specific material and mole percentage of each component are shown in table 1.
The preparation method of the high-entropy ultra-silver solder alloy in the embodiment is as follows:
depositing CuP, Re, Ni, Sn, Ag metal or alloy on the surface of the substrate by adopting a direct-current magnetron sputtering codeposition power supply to prepare a six-element high-entropy ultra-silver solder alloy; before being installed, the CuP, Re, Ni, Sn and Ag target material with the purity of 99.99 percent needs to be polished by fine abrasive paper to remove surface oxides, then is cleaned by alcohol and dried, is subjected to pre-sputtering for 5 minutes before direct current magnetron sputtering deposition, separates the CuP, Re, Ni, Sn and Ag target material from a barrier layer by adopting a baffle, removes the oxides and impurities on the surface of the target material and ensures the purity of the subsequent surface deposition metal or alloy; CuP, Re, Ni, Sn and Ag palladium materials are required to be sputtered simultaneously, and specific sputtering parameters are as follows: the voltage power is 0.6-0.9 kV, and the density is 6-26W/cm2Degree of vacuum (0.5 to 2) × 10-2When the process is carried out, argon with the purity of 99.99 percent is introduced, the air pressure of the vacuum chamber is 1.2-2.0Pa, the sputtering power is 120-165W, the deposition time is 3-5 min, and the thickness of the prepared brazing filler metal is 5-15 mu m.
The mechanical properties, melting temperature and wettability of the high-entropy ultra-silver solder alloy of the embodiment are shown in table 2; the method for testing the mechanical property in the embodiment is in accordance with GB/T11363 and 2008 'method for testing the strength of a soldered joint'; the testing method of the wettability in the embodiment is in accordance with GB/T11364-2008 solder wettability testing method; the conductivity (resistivity) in this example was measured according to GB-T3048.2-2007 test method for Electrical Properties of electric wire and Cable, part 2 test for resistivity of metallic Material.
Example 2
The main differences between this example and example 1 are detailed in table 1;
the mechanical properties, melting temperature, wettability and resistivity of the high-entropy ultra-silver solder alloy of the embodiment are shown in table 2.
Example 3
The main differences between this example and example 1 are detailed in table 1;
the mechanical properties, melting temperature, wettability and resistivity of the high-entropy ultra-silver solder alloy of the embodiment are shown in table 2.
Example 4
The main differences between this example and example 1 are detailed in table 1;
the mechanical properties, melting temperature, wettability and resistivity of the high-entropy ultra-silver solder alloy of the embodiment are shown in table 2.
Example 5
The main differences between this example and example 1 are detailed in table 1;
the mechanical properties, melting temperature, wettability and resistivity of the high-entropy ultra-silver solder alloy of the embodiment are shown in table 2.
Watch (A)
Composition list of solder alloys of examples 1 to 5
Watch (A)
List of performance indexes of solder alloys obtained in examples 1 to 5
The data in tables 1 and 2 show that the solder alloy has the unique advantages of low silver content, excellent performance and high connection strength, and realizes the efficient positioning prefabrication and brazing of large motors.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the overall concept of the invention, and these should be considered as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the practicability of the patent.
Claims (8)
1. A high-entropy ultra-silver solder alloy is characterized in that:
the material comprises the following substances in percentage by mole:
20-30% of CuP alloy;
20-30% of NiSn alloy;
20-25% Ag；
20-25% rare earth Re;
the CuP alloy is one of Cu80P alloy, Cu83P alloy, Cu85P alloy and Cu84P alloy;
the NiSn alloy is one of Ni25Sn alloy, Ni40Sn alloy and Ni50Sn alloy.
2. A high entropy ultra-silver solder alloy as claimed in claim 1, wherein:
the material comprises the following substances in percentage by mole:
30% of a CuP alloy;
20% NiSn alloy;
25% Ag；
25% of rare earth Re.
3. A high entropy ultra-silver solder alloy as claimed in claim 1, wherein:
the material comprises the following substances in percentage by mole:
25% of a CuP alloy;
25% NiSn alloy
25% Ag；
25% of rare earth Re.
4. A high entropy ultra-silver solder alloy as claimed in claim 1, wherein:
the material comprises the following substances in percentage by mole:
30% of a CuP alloy;
25% NiSn alloy;
20% Ag；
25% of rare earth Re.
5. A high entropy ultra-silver solder alloy as claimed in claim 1, wherein:
the material comprises the following substances in percentage by mole:
20% of a CuP alloy;
30% NiSn alloy
25% Ag；
25% of rare earth Re.
6. A high entropy ultra-silver solder alloy as claimed in claim 1, wherein:
the material comprises the following substances in percentage by mole:
30% of a CuP alloy;
30% NiSn alloy
20% Ag；
20% of rare earth Re.
7. A high entropy ultra-silver solder alloy as claimed in any one of claims 1 to 6, wherein: the Re element is any one of Ce, Pr, La, Nd or Er.
8. A method for preparing a high entropy ultra-silver solder alloy according to any one of claims 1 to 7, wherein: and simultaneously depositing CuP alloy, NiSn alloy, rare earth Re and metal Ag on the surface of the substrate by adopting a multi-target direct-current magnetron sputtering codeposition power supply to prepare the six-element high-entropy ultra-silver solder alloy.
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| CN115784763B (en) * | 2022-11-15 | 2023-06-02 | 华北水利水电大学 | Boron-doped diamond porous titanium composite film and preparation method thereof |
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| EP0652072A1 (en) * | 1993-11-09 | 1995-05-10 | Matsushita Electric Industrial Co., Ltd. | Solder |
| CN1037825C (en) * | 1995-04-26 | 1998-03-25 | 东南大学 | Copper-base solder-silver substituted solder for electrical vacuum with low melting point, low vapour pressure and ductility |
| US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
| AU2001261952A1 (en) * | 2000-05-24 | 2001-12-03 | Stephen F. Corbin | Variable melting point solders and brazes |
| JP4391276B2 (en) * | 2004-03-12 | 2009-12-24 | 新日鉄マテリアルズ株式会社 | Solder alloy for semiconductor mounting, manufacturing method thereof, solder ball, electronic member |
| US20070071634A1 (en) * | 2005-09-26 | 2007-03-29 | Indium Corporation Of America | Low melting temperature compliant solders |
| CN100443244C (en) * | 2005-10-25 | 2008-12-17 | 哈尔滨工业大学 | Mesothermal copper based solder without cadmium, and preparation method |
| TW201210733A (en) * | 2010-08-26 | 2012-03-16 | Dynajoin Corp | Variable melting point solders |
| JP5777979B2 (en) * | 2011-08-30 | 2015-09-16 | 日本アルミット株式会社 | Solder alloy |
| CN102581514B (en) * | 2012-03-16 | 2015-06-03 | 金华市金钟焊接材料有限公司 | Silver solder containing phosphorus, stannum and rare earth |
| EP2883649B1 (en) * | 2012-08-10 | 2017-04-19 | Senju Metal Industry Co., Ltd | High-temperature lead-free solder alloy |
| CN106041355A (en) * | 2016-07-20 | 2016-10-26 | 安徽华众焊业有限公司 | Copper-based soldering paste |
| CN109108522B (en) * | 2018-09-27 | 2021-01-15 | 华北水利水电大学 | Composite brazing filler metal for brazing high-nitrogen steel and preparation method thereof |
| CN109338200B (en) * | 2018-11-07 | 2021-05-04 | 北京科技大学 | High-temperature high-damping high-entropy alloy and preparation method thereof |
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