CN106041355A - Copper-based soldering paste - Google Patents
Copper-based soldering paste Download PDFInfo
- Publication number
- CN106041355A CN106041355A CN201610573466.XA CN201610573466A CN106041355A CN 106041355 A CN106041355 A CN 106041355A CN 201610573466 A CN201610573466 A CN 201610573466A CN 106041355 A CN106041355 A CN 106041355A
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- CN
- China
- Prior art keywords
- brazing
- copper
- brazing flux
- flux
- base powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of brazing materials and particularly belongs to copper-based soldering paste. A copper-based powder brazing material is prepared from, by mass percentage, 5% of Ag, 81% of Cu, 5.2% of P, 7% of Sn, 1.3% of Ni and 0.5% of rare earth. By adding 4.5%-5.5% of Ag in the copper-based powder brazing material, corrosion of fluoborate to welded parts and brazing equipment can be effectively inhibited, and therefore the using amount of brazing flux in the formula can be increased, efficient active substances obtained from decomposing of the brazing flux are increased, the welding quality is guaranteed, meanwhile, welding slag generated during welding of the brazing flux can be dissolved in water easily, cleaning is convenient, and the application range is wide.
Description
Technical field
The present invention relates to technical field of soldering materials, particularly belong to a kind of copper base brazing cream.
Background technology
Along with the development of modernization industrial automation soldering high efficiency large-scale production, welding workpiece small batch
Producing, weld shape constantly variation complicates.Traditional thread, ring-type, strip weldering is replaced by paste-like soldering material, solder paste
Connecing material and realizing high-efficiency automatic welding production has been trend of the times.China's continuous Introduced From Abroad advanced person automatization pricker in recent years
Weldering production line, such as flame automatic brazing production line, protective atmosphere meshbeltfurnace brazing lines；The most domestic also have many producers certainly
Master develops more advanced automatization's brazing lines, meets the growing market demand.With traditional Cu gold alloy solder
Silk, weld-ring are compared with solder strip, use brazing cream and automatically dropping glue equipment to combine, can enter complex parts and irregular part
Row automation paint, the part to be welded after application enters continuous way soldering oven soldering, thus realizes the continuous of whole welding procedure
Change and automatization.Joint element intensity after welding is high, weld seam is attractive in appearance and corrosion resistance good.
Summary of the invention
It is an object of the invention to provide a kind of copper base brazing cream, overcome the deficiencies in the prior art, at Cu-base powder pricker
By adding 4.5～5.5%Ag in material, can effectively suppress borofluoride butt welding part and the corrosion of brazing equipment, thus
The usage amount of brazing flux can be increased, so that the high-efficiency activated material that brazing flux decomposites increases, it is ensured that welding matter in formula
Amount, the welding slag produced during brazing flux welding simultaneously is soluble in water, and easy to clean, the scope of application is wide.
For solving the problems referred to above, the technical solution used in the present invention is as follows:
A kind of copper base brazing cream, described copper base brazing cream is made up of Cu-base powder solder, brazing flux and macromolecule solvent；
Described above-mentioned material mass percent is:
Cu-base powder solder 53～74%
Brazing flux 20～35%
Macromolecule solvent 6～12%
Described Cu-base powder solder is made up of the raw material of following masses percentage ratio:
Ag:4.5～5.5%
Cu:80～82%
P:5.1～5.5%
Sn:7～8%
Ni:1～3%
Rare earth: 0.3～0.6%
Described brazing flux: fluoboric acid salt.
Further, the described raw material by following masses percentage ratio is made: Cu-base powder solder 62%, brazing flux 27%, height
Molecular solvent 11%.
Further, described Cu-base powder solder is made up of the raw material of following masses percentage ratio: Ag:5%, Cu:81%, P:
5.2%, Sn:7%, Ni:1.3%, rare earth: 0.5%.
Silver is the one of transition metal；Chemical symbol Ag；Silver is to exist with regard to one of metal known and that be used, silver ancient times
With the presence of simple substance in nature, but mostly presented in compound state in silver ore；The stable chemical nature of silver,
Very well, matter is soft for heat conduction, electric conductivity, rich ductility.
At high temperature there is strong corrosivity due to borofluoride, for all being caused by weldering part and brazing equipment
Degree corrosion and destroying, postwelding needs to be carried out part, the corrosivity volatile matter in welding process also can to working environment and
Environmental protection brings series of problems, greatly limits the usage amount of brazing flux.
Found in Cu-base powder solder by adding 4.5～5.5%Ag by research, borofluoride butt welding can be suppressed
Part and the corrosion of brazing equipment.
Compared with prior art, the implementation result of the present invention is as follows for the present invention:
A kind of copper base brazing cream of the present invention, by adding 4.5～5.5%Ag in Cu-base powder solder, can be effective
Suppression borofluoride butt welding part and the corrosion of brazing equipment, such that it is able to increase the usage amount of brazing flux in formula, thus
The high-efficiency activated material making brazing flux decomposite increases, it is ensured that welding quality, and the welding slag produced during brazing flux welding simultaneously is soluble in water,
Easy to clean, the scope of application is wide.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described, but the present invention is not limited only to these examples, for de-
On the premise of present inventive concept, within any improvement of doing all falls within protection scope of the present invention.
Embodiment 1
A kind of copper base brazing cream of the present invention, the described raw material by following masses percentage ratio makes: Cu-base powder solder
62%, brazing flux 27%, macromolecule solvent 11%；Described Cu-base powder solder is made up of the raw material of following masses percentage ratio: Ag:
5%, Cu:81%, P:5.2%, Sn:7%, Ni:1.3%, rare earth: 0.5%.
Embodiment 2
A kind of copper base brazing cream of the present invention, the described raw material by following masses percentage ratio makes: Cu-base powder solder
62%, brazing flux 28%, macromolecule solvent 10%；Described Cu-base powder solder is made up of the raw material of following masses percentage ratio: Ag:
5.5%, Cu:81%, P:5.2%, Sn:6.5%, Ni:1.3%, rare earth: 0.5%.
Embodiment 3
A kind of copper base brazing cream of the present invention, the described raw material by following masses percentage ratio makes: Cu-base powder solder
63%, brazing flux 25%, macromolecule solvent 12%；Described Cu-base powder solder is made up of the raw material of following masses percentage ratio: Ag:
5%, Cu:81%, P:5.2%, Sn:7%, Ni:1.3%, rare earth: 0.5%.
Claims (3)
1. a copper base brazing cream, it is characterised in that: described copper base brazing cream is molten by Cu-base powder solder, brazing flux and macromolecule
Agent forms；
Described above-mentioned material mass percent is:
Cu-base powder solder 53～74%
Brazing flux 20～35%
Macromolecule solvent 6～12%
Described Cu-base powder solder is made up of the raw material of following masses percentage ratio:
Ag:4.5～5.5%
Cu:80～82%
P:5.1～5.5%
Sn:7～8%
Ni:1～3%
Rare earth: 0.3～0.6%
Described brazing flux: fluoboric acid salt.
A kind of copper base brazing cream the most according to claim 1, it is characterised in that: described former by following masses percentage ratio
Material is made: Cu-base powder solder 62%, brazing flux 27%, macromolecule solvent 11%.
A kind of copper base brazing cream the most according to claim 1 and 2, it is characterised in that: described Cu-base powder solder by under
The raw material of row mass percent is made: Ag:5%, Cu:81%, P:5.2%, Sn:7%, Ni:1.3%, rare earth: 0.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610573466.XA CN106041355A (en) | 2016-07-20 | 2016-07-20 | Copper-based soldering paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610573466.XA CN106041355A (en) | 2016-07-20 | 2016-07-20 | Copper-based soldering paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106041355A true CN106041355A (en) | 2016-10-26 |
Family
ID=57188566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610573466.XA Pending CN106041355A (en) | 2016-07-20 | 2016-07-20 | Copper-based soldering paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106041355A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106514041A (en) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | Low-Ag Cu-based medium-temperature solder |
| CN107916347A (en) * | 2017-11-15 | 2018-04-17 | 广西塔锡科技有限公司 | A kind of alloy welding powder and preparation method thereof |
| CN110952017A (en) * | 2019-12-27 | 2020-04-03 | 华北水利水电大学 | High-entropy ultra-silver solder alloy and preparation method thereof |
| CN114986023A (en) * | 2022-06-02 | 2022-09-02 | 杭州华光焊接新材料股份有限公司 | Process for prefabricating low-melting-point brazing filler metal, low-melting-point brazing filler metal and preparation method thereof |
Citations (9)
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|---|---|---|---|---|
| CN1064636A (en) * | 1991-03-14 | 1992-09-23 | 中国有色金属工业总公司昆明贵金属研究所 | The method for welding of copper base soldering paste and copper-made ornament |
| CN1759974A (en) * | 2005-10-25 | 2006-04-19 | 哈尔滨工业大学 | Mesothermal copper based solder without cadmium, and preparation method |
| KR100620368B1 (en) * | 2006-04-26 | 2006-09-06 | 최진수 | Copper phosphorus brazing alloy containing ni-sn element |
| CN101318275A (en) * | 2008-06-04 | 2008-12-10 | 浙江华阳焊料有限公司 | Copper-base alloy tin solder and its use method |
| CN101342644A (en) * | 2007-07-13 | 2009-01-14 | 金华市信和焊材制造有限公司 | High-ductility environment friendly silver-saving medium-temperature brazing filler metal |
| CN101786208A (en) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | Novel active copper-phosphorus brazing alloy |
| CN101972900A (en) * | 2010-10-26 | 2011-02-16 | 南阳防爆集团股份有限公司 | Soldering flux for copper brazing |
| CN103624418A (en) * | 2013-12-12 | 2014-03-12 | 杭州华光焊接新材料股份有限公司 | Low-silver-copper-based brazing filler metal and preparation method thereof |
| CN105081598A (en) * | 2014-05-06 | 2015-11-25 | 烟台市固光焊接材料有限责任公司 | Solder paste and application thereof |
-
2016
- 2016-07-20 CN CN201610573466.XA patent/CN106041355A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1064636A (en) * | 1991-03-14 | 1992-09-23 | 中国有色金属工业总公司昆明贵金属研究所 | The method for welding of copper base soldering paste and copper-made ornament |
| CN1759974A (en) * | 2005-10-25 | 2006-04-19 | 哈尔滨工业大学 | Mesothermal copper based solder without cadmium, and preparation method |
| KR100620368B1 (en) * | 2006-04-26 | 2006-09-06 | 최진수 | Copper phosphorus brazing alloy containing ni-sn element |
| CN101342644A (en) * | 2007-07-13 | 2009-01-14 | 金华市信和焊材制造有限公司 | High-ductility environment friendly silver-saving medium-temperature brazing filler metal |
| CN101318275A (en) * | 2008-06-04 | 2008-12-10 | 浙江华阳焊料有限公司 | Copper-base alloy tin solder and its use method |
| CN101786208A (en) * | 2010-03-25 | 2010-07-28 | 杭州华光焊料有限公司 | Novel active copper-phosphorus brazing alloy |
| CN101972900A (en) * | 2010-10-26 | 2011-02-16 | 南阳防爆集团股份有限公司 | Soldering flux for copper brazing |
| CN103624418A (en) * | 2013-12-12 | 2014-03-12 | 杭州华光焊接新材料股份有限公司 | Low-silver-copper-based brazing filler metal and preparation method thereof |
| CN105081598A (en) * | 2014-05-06 | 2015-11-25 | 烟台市固光焊接材料有限责任公司 | Solder paste and application thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106514041A (en) * | 2016-11-30 | 2017-03-22 | 安徽华众焊业有限公司 | Low-Ag Cu-based medium-temperature solder |
| CN107916347A (en) * | 2017-11-15 | 2018-04-17 | 广西塔锡科技有限公司 | A kind of alloy welding powder and preparation method thereof |
| CN110952017A (en) * | 2019-12-27 | 2020-04-03 | 华北水利水电大学 | High-entropy ultra-silver solder alloy and preparation method thereof |
| CN114986023A (en) * | 2022-06-02 | 2022-09-02 | 杭州华光焊接新材料股份有限公司 | Process for prefabricating low-melting-point brazing filler metal, low-melting-point brazing filler metal and preparation method thereof |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161026 |
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| WD01 | Invention patent application deemed withdrawn after publication |