CN110854008B - 一种托盘及刻蚀机 - Google Patents
一种托盘及刻蚀机 Download PDFInfo
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- CN110854008B CN110854008B CN201911063443.4A CN201911063443A CN110854008B CN 110854008 B CN110854008 B CN 110854008B CN 201911063443 A CN201911063443 A CN 201911063443A CN 110854008 B CN110854008 B CN 110854008B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911063443.4A CN110854008B (zh) | 2019-10-31 | 2019-10-31 | 一种托盘及刻蚀机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911063443.4A CN110854008B (zh) | 2019-10-31 | 2019-10-31 | 一种托盘及刻蚀机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110854008A CN110854008A (zh) | 2020-02-28 |
CN110854008B true CN110854008B (zh) | 2022-06-07 |
Family
ID=69599378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911063443.4A Active CN110854008B (zh) | 2019-10-31 | 2019-10-31 | 一种托盘及刻蚀机 |
Country Status (1)
Country | Link |
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CN (1) | CN110854008B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11233587A (ja) * | 1998-02-09 | 1999-08-27 | Toshiba Ceramics Co Ltd | ウエハ移載用フォーク |
US6676759B1 (en) * | 1998-10-30 | 2004-01-13 | Applied Materials, Inc. | Wafer support device in semiconductor manufacturing device |
JP2009246009A (ja) * | 2008-03-28 | 2009-10-22 | Seiko Epson Corp | 真空処理装置及び真空処理方法 |
JP2012017511A (ja) * | 2010-07-09 | 2012-01-26 | Optorun Co Ltd | 成膜基板ホルダ及び成膜装置 |
CN102468205A (zh) * | 2010-11-18 | 2012-05-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 托盘及具有它的晶片处理设备 |
CN102543810A (zh) * | 2010-12-27 | 2012-07-04 | 无锡华润上华科技有限公司 | 晶圆片承载座 |
CN103184434A (zh) * | 2011-12-31 | 2013-07-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 托盘装置、托盘及半导体处理设备 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5156446B2 (ja) * | 2008-03-21 | 2013-03-06 | 株式会社Sumco | 気相成長装置用サセプタ |
-
2019
- 2019-10-31 CN CN201911063443.4A patent/CN110854008B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11233587A (ja) * | 1998-02-09 | 1999-08-27 | Toshiba Ceramics Co Ltd | ウエハ移載用フォーク |
US6676759B1 (en) * | 1998-10-30 | 2004-01-13 | Applied Materials, Inc. | Wafer support device in semiconductor manufacturing device |
JP2009246009A (ja) * | 2008-03-28 | 2009-10-22 | Seiko Epson Corp | 真空処理装置及び真空処理方法 |
JP2012017511A (ja) * | 2010-07-09 | 2012-01-26 | Optorun Co Ltd | 成膜基板ホルダ及び成膜装置 |
CN102468205A (zh) * | 2010-11-18 | 2012-05-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 托盘及具有它的晶片处理设备 |
CN102543810A (zh) * | 2010-12-27 | 2012-07-04 | 无锡华润上华科技有限公司 | 晶圆片承载座 |
CN103184434A (zh) * | 2011-12-31 | 2013-07-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 托盘装置、托盘及半导体处理设备 |
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CN110854008A (zh) | 2020-02-28 |
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Address after: 215163 No.2 workshop-1-102, No.2 workshop-2-203, zone a, industrial square, science and Technology City, No.189 Kunlunshan Road, high tech Zone, Suzhou City, Jiangsu Province Applicant after: Suzhou Changguang Huaxin Optoelectronic Technology Co.,Ltd. Applicant after: SUZHOU EVERBRIGHT SEMICONDUCTOR LASER INNOVATION RESEARCH INSTITUTE Co.,Ltd. Address before: 215163 Building 2, No.189, Kunlunshan Road, high tech Zone, Suzhou City, Jiangsu Province Applicant before: SUZHOU EVERBRIGHT PHOTONICS TECHNOLOGY Co.,Ltd. Applicant before: SUZHOU EVERBRIGHT SEMICONDUCTOR LASER INNOVATION RESEARCH INSTITUTE Co.,Ltd. |
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